JPH01139629A - Production of thermosetting resin laminated board having low dielectric constant - Google Patents
Production of thermosetting resin laminated board having low dielectric constantInfo
- Publication number
- JPH01139629A JPH01139629A JP29604487A JP29604487A JPH01139629A JP H01139629 A JPH01139629 A JP H01139629A JP 29604487 A JP29604487 A JP 29604487A JP 29604487 A JP29604487 A JP 29604487A JP H01139629 A JPH01139629 A JP H01139629A
- Authority
- JP
- Japan
- Prior art keywords
- glass
- prepreg
- thermosetting resin
- fibers
- dielectric constant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 19
- 239000011347 resin Substances 0.000 title claims abstract description 19
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 12
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 239000000835 fiber Substances 0.000 claims abstract description 17
- 239000003365 glass fiber Substances 0.000 claims abstract description 14
- 239000002759 woven fabric Substances 0.000 claims description 13
- 238000000465 moulding Methods 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 2
- 239000011521 glass Substances 0.000 abstract description 15
- 238000000576 coating method Methods 0.000 abstract description 13
- 239000011248 coating agent Substances 0.000 abstract description 9
- 239000004744 fabric Substances 0.000 abstract description 6
- 229920000642 polymer Polymers 0.000 abstract description 2
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 abstract 1
- 239000000463 material Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 239000002966 varnish Substances 0.000 description 5
- 238000001035 drying Methods 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 238000004381 surface treatment Methods 0.000 description 4
- 230000037303 wrinkles Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- WCVOGSZTONGSQY-UHFFFAOYSA-N 2,4,6-trichloroanisole Chemical compound COC1=C(Cl)C=C(Cl)C=C1Cl WCVOGSZTONGSQY-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 241000758791 Juglandaceae Species 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 235000020234 walnut Nutrition 0.000 description 2
- 238000009941 weaving Methods 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Inorganic Insulating Materials (AREA)
- Insulating Bodies (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、従来のものに比べて誘電率（以下、εという
）が低く、しかも塗布工程が容易という特長を有する熱
硬化性樹脂積層板に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention provides a thermosetting resin laminate having a lower dielectric constant (hereinafter referred to as ε) than conventional products and an easy coating process. It is related to.
（従来技術〕
近年プリント配線板は極めて広範囲の用途に使用され、
このようなプリント配線板を構成する積層板に対する要
求特性も益々多岐にわたっている。このような状況のも
と誘電率に関する要求も数多く、具体的には（８号の伝
達速度の高速化、すなわちコンピューターの演算速度の
高速化を目的とするεの低い積ＷＩ板の開発が強く要求
されている。このような要求に応える為、エポキシ樹脂
等の熱硬化性樹脂とガラスクロス等の基材からなる通常
の積層板に対し、樹脂面ではテフロン、ポリスルホン、
ボリエ、チレン、ポリブタジェン等のεの低い熱可塑性
樹脂やゴム系エラストマーの導入、一方基材面からはテ
フロンクロスやアラミド布、フォーラ布の適用が検討さ
れている。(Prior art) In recent years, printed wiring boards have been used for an extremely wide range of applications.
The characteristics required of the laminates constituting such printed wiring boards are becoming increasingly diverse. Under these circumstances, there are many demands regarding the dielectric constant. Specifically, there is a strong need to develop WI plates with low ε for the purpose of increasing the transmission speed of No. 8, that is, increasing the calculation speed of computers. In order to meet these demands, in contrast to normal laminates made of thermosetting resins such as epoxy resins and base materials such as glass cloth, the resin side is made of Teflon, polysulfone, etc.
Introducing thermoplastic resins and rubber elastomers with low ε such as bolier, tyrene, and polybutadiene, while considering the use of Teflon cloth, aramid cloth, and Fola cloth as base materials.
しかしながら、上記の従来技術による積層板は積層成形
性、加工工程における寸法変化、ドリル加工性、プリン
ト仮としての１δ頼性及び価格等の点で通常の基仮に比
べ劣る部分があり、実用可能な範囲が著しく限定される
欠点があった。However, the above-mentioned conventional laminates are inferior to ordinary substrates in terms of lamination formability, dimensional changes during the processing process, drilling workability, 1δ reliability as a printing temporary, and price, and are not suitable for practical use. The drawback was that the range was extremely limited.
本発明者はεの低い熱硬化性樹脂積層板を得んとして研
究した結果、基材としてフッ素樹脂繊維とガラス繊維と
からなる織布を使用する事により、Ｃの低い積層板が得
られ、かつ基材にガラス繊維が交織されている為、基材
がフッ素樹脂繊維のみのものに比べ塗布工程時のシワ、
クルジがなく成形加工後の寸法変化もおさえられるとの
知見を得、更にこの知見に基づき種々研究を進めて本発
明を完成するに至ったものである。その目的とするとこ
ろは、εが低く通常と全く同様な工程でプリント配線板
への加工が可能で、かつ通常と同等の信顛性を有する積
層板を提供するにある。As a result of research aimed at obtaining a thermosetting resin laminate with a low ε, the present inventor found that a laminate with a low C was obtained by using a woven fabric made of fluororesin fiber and glass fiber as a base material. In addition, since the base material is woven with glass fibers, there are fewer wrinkles and wrinkles during the application process compared to those where the base material is only fluororesin fibers.
It was discovered that there is no curvature and dimensional changes after molding can be suppressed, and based on this knowledge, various studies were conducted and the present invention was completed. The purpose is to provide a laminate with a low ε, which can be processed into a printed wiring board in exactly the same process as a normal one, and which has the same reliability as a normal one.
本発明は、フッ素樹脂繊維とガラス繊維とからなる織布
に熱硬化性樹脂を含浸して得たプリプレグを、単独で又
は他のプリプレグと組み合わせて、積層成形する事を特
徴とする低誘電率熱硬化性樹脂積層板の製造方法である
。The present invention is characterized in that a prepreg obtained by impregnating a woven fabric made of fluororesin fibers and glass fibers with a thermosetting resin is laminated and molded either alone or in combination with other prepregs. This is a method for manufacturing a thermosetting resin laminate.
本発明で用いられる織布のフッ素樹脂繊維は４７ノ化工
チレン重合体（ＰＴＦＥ） 、エチレン４フツ化エチレ
ン共重合体（ＥＴＦＥ）、４フツ化エチレン６フツ化プ
ロピレン共重合体（ＦＥＰ）、種々の４フン化エチレン
パーフルオロアルキルビニルエーテル（ＰＦＡ）等の繊
維の単繊維或いは単繊維を複数本束ねたストランドを織
っているものであるが、フッ素樹脂として毒よＰＴＦＥ
が好ましい。又、織布のガラス繊維部は織布の塗布工程
を容易せしめ、成形加工後の寸法変化をおさえるという
目的、すなわちフッ素樹脂繊維を補強する意味合いで用
いられるものであるがら、通常用いられるＥガラスで、
さしつかえない、しかし本発明の目的とする所が低ε積
Ｎ板であるので、出来ればＤガラスを用いた方が良い。The fluororesin fibers of the woven fabric used in the present invention include 47-modified tyrene polymer (PTFE), ethylene tetrafluoroethylene copolymer (ETFE), tetrafluoroethylene hexafluoropropylene copolymer (FEP), and various others. It is made by weaving single fibers or strands made by bundling multiple single fibers of tetrafluorinated ethylene perfluoroalkyl vinyl ether (PFA), but as a fluororesin, it is poisonous.PTFE
is preferred. In addition, the glass fiber portion of the woven fabric is used for the purpose of facilitating the coating process of the woven fabric and suppressing dimensional changes after molding, that is, reinforcing the fluororesin fibers. in,
However, since the object of the present invention is a low ε product N plate, it is better to use D glass if possible.
なお交織するガラスの量であるが、多過ぎるとεが高く
なるし、少な過ぎると塗布工程の容易さ、加工後の寸法
変化の小ささなとの良さが表れなくなる為、その加減が
必要である。例えば、基材のε３．０を目指すならＥガ
ラスでフッ素樹脂繊維７７〜８０ｖｏｌ ％、Ｄガラス
でフッ素樹脂繊維５３〜６３ｖｏｌ ％である。又、交
織の仕方であるが、−木の糸にフッ素樹Ｉｌｉ″ｉ繊維
もガラス繊維も混しっている混紡タイプが理怨であるが
、ガラス繊維糸を縦糸、横糸ともに数本おきに入れ、織
る形でもさしつがえない。Regarding the amount of glass to be mixed, it is necessary to adjust the amount because if it is too large, the ε will be high, and if it is too small, the ease of the coating process and the small dimensional change after processing will not be realized. be. For example, if you are aiming for ε3.0 for the base material, the fluororesin fibers should be 77 to 80 vol % for E glass, and 53 to 63 vol % for D glass. Also, regarding the method of mixed weaving, - the blended type in which wood threads are mixed with fluorocarbon fibers and glass fibers is the most common type, but the glass fiber threads are mixed every few threads in both the warp and the weft. It can also be used in a woven or woven form.
本発明においては、織布は物理的或いは化学的表面処理
を施したものを使用する。In the present invention, a woven fabric subjected to physical or chemical surface treatment is used.
フッ素樹脂繊維の表面処理としては、スパッタエンチン
グプラズマ処理、コロナ処理等の物理的表面処理やケミ
カルエツチング法、クラフト重合法等の化学的表面処理
を行う。又、ガラス繊維の処理としては、硫酸を用い、
その後シラン系カップリング剤（東し、製ｒｓｚ ６０
３２ Ｊ等）を用いる。The surface treatment of the fluororesin fibers includes physical surface treatments such as sputter etching plasma treatment and corona treatment, and chemical surface treatments such as chemical etching and kraft polymerization. In addition, for the treatment of glass fibers, sulfuric acid is used,
After that, a silane coupling agent (RSZ 60 manufactured by Azuma Shi, Ltd.) was used.
32 J, etc.).
なお、これらの処理は逆に行ってもかまわない。Note that these processes may be performed in reverse.
かかる処理により、基材と樹脂の接着力が向上し、積層
板としての特性、特に吸湿性や吸湿耐熱性、ドリル加工
時の穴壁粗さやメツキ時におけるメンキ液のしみ込み性
や耐ブローホール性が改善される。This treatment improves the adhesive strength between the base material and the resin, and improves the properties of the laminate, especially moisture absorption and heat resistance, hole wall roughness during drilling, penetration of coating fluid during plating, and blowhole resistance. sex is improved.
次に積層板の製造方法について述べる。Next, a method for manufacturing the laminate will be described.
プリプレグは前記処理したフッ素樹脂繊維とガラス繊維
とからなる織布に熱硬化性樹脂フェスを含浸乾燥して作
製する。The prepreg is produced by impregnating and drying a thermosetting resin face into a woven fabric made of the treated fluororesin fibers and glass fibers.
、ｆｉ’ｉ層板はこのプリプレグを必要数枚重ね合わせ
積層成形する事により得られる。この際のプリプレグの
１＋＋４成は板厚等の要求品質に応して決めるが、必要
に応して一般のプリプレグと本発明によるプリプレグを
組み合わせても差し支えない。例えば多層プリント配線
板において、低εを必要とする層にのみ本発明によるプ
リプレグを使用し、その他の層には通常のプリプレグを
使用しても良い。, fi'i laminates can be obtained by stacking and laminating a required number of prepregs. In this case, the 1++4 composition of the prepreg is determined depending on the required quality such as plate thickness, but if necessary, the general prepreg and the prepreg according to the present invention may be combined. For example, in a multilayer printed wiring board, the prepreg according to the present invention may be used only in layers requiring low ε, and ordinary prepreg may be used in other layers.
なお、本発明においては熱硬化性樹脂ワニス中に無機フ
ィラーい例えばシリカ、アルミナ、ガラスバルーン等あ
るいは本発明で用いられるものと同しフッ素樹脂の粉末
等を配合する事が出来る。In the present invention, inorganic fillers such as silica, alumina, glass balloons, etc., or powder of the same fluororesin as used in the present invention can be blended into the thermosetting resin varnish.
特に、ガラスバルーン及びフッ素樹脂粉末はεを低くす
るので好ましい。In particular, glass balloons and fluororesin powder are preferred because they lower ε.
本発明で得られる熱効果性樹脂積層板は、通常の積層板
に比較してεが低いという特（牧を有している。The heat-effect resin laminate obtained by the present invention has a characteristic that ε is lower than that of ordinary laminates.
また、本発明によ乙織布はフッ素樹脂繊維とガラス繊維
の交織である為、基材がフッ素樹脂繊維のみの場合に比
べて塗布工程時のシワ、クルミがなく、成形加工後の寸
法変化率も小さいという長所を持つ。In addition, since the woven fabric according to the present invention is a mixture of fluororesin fiber and glass fiber, there are no wrinkles or walnuts during the coating process compared to when the base material is only fluororesin fiber, and there is no dimensional change after molding. It has the advantage of having a small rate.
その上、本発明による積層板は通常の積層板ないしコン
ポジット材と同等に穴明け、メツキ、半田処理等の加工
が可能である事がらεの低いプリント配線板の工業的な
製造に好適である。Furthermore, the laminate according to the present invention can be processed by drilling, plating, soldering, etc. in the same way as ordinary laminates or composite materials, making it suitable for industrial production of printed wiring boards with low ε. .
以下に本発明の内容を詳しく述べる為、実施例、比較例
により１．説明する。In order to describe the contents of the present invention in detail below, Examples and Comparative Examples are shown below. explain.
（実施例１）
エポキシ（油化シェルエポキシ製エピコート１００１）
に対しジシアンジアミド３部及び溶剤を加え混合し、こ
の樹脂ワニスをＤガラス１４０ｖｏ１％である厚さ０．
１閣、重量１００ｇ／ｎ（のＰＴＦＥ繊維とガラス繊維
とからなる織布（Ｄガラス：Ｅ−２２５１１０６０本／
２５ ｍ Ｘ ５８本／ ２５ ｒｒａＰＴＦＥ：
１８０Ｄ−３０Ｆｊ１ ８８本／ ２５ ｒｍ Ｘ８５
本／ ２５ ｍｍ Ｘ ８５本／ ２５ ｒｒｍ ）に
、積層成形後の厚さが０．１／ｌｌ１１になるように塗
布乾燥してプリプレグを作製した。次にこのプリプレグ
を１６枚重ね、１７０°Ｃ１３０ｋｇ／ｃｊ、１２０分
加熱加圧して積層板を得た。(Example 1) Epoxy (Epicoat 1001 manufactured by Yuka Shell Epoxy)
3 parts of dicyandiamide and a solvent were added and mixed, and this resin varnish was coated with D glass 140vol 1% and a thickness of 0.
Woven fabric made of PTFE fiber and glass fiber (D glass: E-22511060 pieces/
25 m x 58 pieces/25 rraPTFE:
180D-30Fj1 88 pieces/25 rm X85
A prepreg was prepared by applying and drying the mixture onto a 25 mm x 85 books/25 rrm so that the thickness after laminated molding would be 0.1/11. Next, 16 sheets of this prepreg were stacked and heated and pressed at 170° C. and 130 kg/cj for 120 minutes to obtain a laminate.
（実施例２）
実施例１で使用した樹脂ワニスをＥガラス量４Ｑｖｏｌ
％である厚さ０．１ ｍ、重量１０２ ｇ／ｒｒｆの
ＰＴＦＥ繊維とガラス繊維とからなる織布（Ｅガラス：
Ｅ −２２５１１０６０本／’２５ｍｎ＋Ｘ５８本／
２５ｎ＋ｍ、、ＰＴＦＥ ： １８０ Ｄ−３０Ｆｉ１
８８本／ ２５ ｍｍ ）に積層成形後の厚さが０．
１ ｍになるように塗布乾燥してプリプレグを作製した
。次にこのプリプレグを１６枚重ね、実施例ｉと同様に
加熱加圧して積層板を得た。(Example 2) The resin varnish used in Example 1 was mixed with an E glass amount of 4Qvol.
A woven fabric (E glass:
E-22511060 pieces/'25mn+X58 pieces/
25n+m, PTFE: 180 D-30Fi1
The thickness after lamination molding is 0.88 pieces/25 mm).
A prepreg was prepared by coating and drying to a thickness of 1 m. Next, 16 sheets of this prepreg were stacked and heated and pressed in the same manner as in Example i to obtain a laminate.
（比較例１）
実施例１で使用した樹脂ワニスを厚さ０．１ ｍｍ、重
ｆｉｔ１０５ｇ／ｒｒｆのガラス織布（Ｅガラス二Ｅ−
２２５１１０６０本／２５ｍｍＸ５８本／ ２５ ｍｍ
）に積層成形後の厚さが０．１ ｔｒｍになるよう塗
布乾燥してプリプレグを作製した０次にこの口°リプレ
グを１６枚重ね、実施例１と同様に加熱加圧して積層板
を得た。(Comparative Example 1) The resin varnish used in Example 1 was coated with a glass woven fabric (E glass two E-
22511060 pieces/25mmX58 pieces/25mm
) was coated and dried to a thickness of 0.1 trm after lamination molding to produce a prepreg. 16 sheets of this prepreg were then stacked and heated and pressed in the same manner as in Example 1 to obtain a laminate. Ta.
（比較例２）
実施例１で使用した樹脂ワニスを厚さ０．１閣、重量ｔ
００ｇ／ボのＰＴＦＥ織布（１８０Ｄ−３０Ｆｉ１８８
本／ ２５ ｍ Ｘ ２５本／ ２５ ｍ ）に積層成
形後の厚さが０．１ ｍになるよう塗布乾燥してプリプ
レグを作製した０次にこのプリプレグを１６枚重ね、実
施例１と同様に加熱加圧して積層板を得た。(Comparative Example 2) The resin varnish used in Example 1 had a thickness of 0.1 cm and a weight of t.
00g/bo PTFE woven fabric (180D-30Fi188
A prepreg was prepared by coating and drying it on a book (25 m x 25 books/25 m) so that the thickness after lamination molding was 0.1 m.Next, 16 sheets of this prepreg were stacked, and the same process as in Example 1 was carried out. A laminate was obtained by heating and pressing.
各側で得られた。積層板について誘電率（ε）等の特性
を測定し、その結果を第１表に示す。obtained on each side. Properties such as dielectric constant (ε) were measured for the laminate, and the results are shown in Table 1.
注１）塗布状態
Ｏ；良い
×：悪い（シワ、クルミが発生）
注２）塗布時基材の寸法変化率は張力５ｋｇｆ／ｍｍ”
塗布速度１．０ ｍ／ｓｉｎの条件で塗布した時の塗布
前後の寸法変化率である。Note 1) Coating condition O: Good ×: Bad (wrinkles and walnuts occur) Note 2) Dimensional change rate of the base material during coating is tension 5 kgf/mm"
This is the dimensional change rate before and after coating when coating was performed at a coating speed of 1.0 m/sin.
Claims (1)
樹脂を含浸して得たプリプレグを単独で、又は他のプリ
プレグと組み合わせて積層成形する事を特徴とする低誘
電率熱硬化性樹脂積層板の製造方法。A low dielectric constant thermosetting resin laminate characterized by laminating and molding a prepreg obtained by impregnating a woven fabric made of fluororesin fiber and glass fiber with a thermosetting resin, either alone or in combination with other prepregs. Method of manufacturing the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29604487A JPH01139629A (en) | 1987-11-26 | 1987-11-26 | Production of thermosetting resin laminated board having low dielectric constant |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29604487A JPH01139629A (en) | 1987-11-26 | 1987-11-26 | Production of thermosetting resin laminated board having low dielectric constant |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01139629A true JPH01139629A (en) | 1989-06-01 |
Family
ID=17828376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29604487A Pending JPH01139629A (en) | 1987-11-26 | 1987-11-26 | Production of thermosetting resin laminated board having low dielectric constant |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01139629A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0424997A (en) * | 1990-05-15 | 1992-01-28 | Matsushita Electric Works Ltd | Manufacture of multilayer printed board |
| EP0622178A1 (en) * | 1993-04-05 | 1994-11-02 | 4B Plastics, Inc. | Thermoset reinforced corrosion resistant laminates |
| WO2002043081A1 (en) * | 2000-11-27 | 2002-05-30 | Daikin Industries, Ltd. | Electrical insulating plate, prepreg laminate and method for producing them |
| JP2008034724A (en) * | 2006-07-31 | 2008-02-14 | Shin Etsu Polymer Co Ltd | Manufacturing method of low dielectric wiring board |
| CN109910403A (en) * | 2019-04-12 | 2019-06-21 | 中国电子科技集团公司第三十八研究所 | A kind of preparation method of microwave complex media plate and microwave complex media plate obtained |
-
1987
- 1987-11-26 JP JP29604487A patent/JPH01139629A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0424997A (en) * | 1990-05-15 | 1992-01-28 | Matsushita Electric Works Ltd | Manufacture of multilayer printed board |
| EP0622178A1 (en) * | 1993-04-05 | 1994-11-02 | 4B Plastics, Inc. | Thermoset reinforced corrosion resistant laminates |
| WO2002043081A1 (en) * | 2000-11-27 | 2002-05-30 | Daikin Industries, Ltd. | Electrical insulating plate, prepreg laminate and method for producing them |
| JP2002160316A (en) * | 2000-11-27 | 2002-06-04 | Daikin Ind Ltd | Electric insulating plate, prepreg laminated body, and method for manufacturing them |
| JP2008034724A (en) * | 2006-07-31 | 2008-02-14 | Shin Etsu Polymer Co Ltd | Manufacturing method of low dielectric wiring board |
| CN109910403A (en) * | 2019-04-12 | 2019-06-21 | 中国电子科技集团公司第三十八研究所 | A kind of preparation method of microwave complex media plate and microwave complex media plate obtained |
| CN109910403B (en) * | 2019-04-12 | 2021-01-29 | 中国电子科技集团公司第三十八研究所 | Preparation method of microwave composite dielectric plate and prepared microwave composite dielectric plate |
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