JPS63172641A - Copper-clad laminated board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] Purpose of the Invention (Field of Industrial Application) The present invention provides a low dielectric constant copper-clad laminate with excellent high frequency characteristics. I do it.

(Conventional technology) In recent years, the development of electronic devices has been remarkable, and printed wiring machines and their material, copper-clad V4-layer boards, have become diverse. It's been requested. In particular, copper-clad laminates with excellent dielectric properties have been developed for use in the frequency range.

Conventionally, copper-clad laminates with excellent dielectric properties have been copper-clad V4Fj boards based on low dielectric constant resins such as polyester resins, polybutadiene resins, and Teflon resins. However, all of the above resins are thermoplastic resins, and have problems with product heat resistance, moldability during IlJ construction, workability, plating adhesion, etc., and are generally difficult to use widely. there were.

Another type of copper-clad laminate with excellent dielectric properties is a substrate with a low alkaline content [glass, quartz glass or Kevlar IB].
A copper-clad laminate manufactured by coating and impregnating a thermosetting resin on a woven fabric or non-woven fabric made of M, and this copper-clad laminate is
Although it has excellent properties such as a low dielectric constant, good heat resistance and dimensional stability, it has the disadvantage of increasing the cost of the product.

In addition, since the dielectric constant of the thermosetting resin applied as a resin is lower than that of E glass, which is generally used as a 1.1 material, it is possible to increase the dielectric constant of the thermosetting resin applied to the base material. Although it is possible to lower the dielectric constant even with thermosetting resin copper-clad laminates, this method of increasing resin fireflies in the prepreg has a practical problem because the prepreg tends to shift during molding.

(Problems to be Solved by the Invention) The present invention has been made in order to eliminate the drawbacks of the conventional low dielectric constant copper clad laminates mentioned above. We strive to provide superior copper-clad laminates.
It is something that

[Structure of the Invention] (Means and Effects for Solving the Problems) In order to quickly achieve the above object, the inventor of the present invention has made a bond that has undergone extensive investigation and is a glass sealing material made of epoxy resin varnish containing an organic filler. It was discovered that if used for coating and impregnating, a copper-clad laminate with no slippage during molding and excellent dielectric properties could be obtained.
This completes the present invention. That is, the present invention
A plurality of sheets of prepreg obtained by coating a glass substrate with an epoxy resin varnish containing an organic filler, impregnating it, and drying it;
This is a copper-clad V4-layer board, characterized in that copper foil is integrally formed on at least 6 sides of the plurality of prepregs by heating and pressing.

And a copper-clad laminate, characterized in that the organic filler contained in the epoxy resin varnish has an average particle size of 1 to 8 μm, and is contained in an amount of υJ of 5 to 40% by weight relative to the epoxy resin varnish. .

As the organic filler used in the present invention, any organic filler having an average particle size of 1 to 8 μI can be used.
Specifically, polyamide resin.

Thermoplastic resins such as polypropylene resin, polystyrene resin, polyvinyl chloride resin, polyamide resin, and polyester resin, and thermosetting resins such as phenol resin, epoxy resin, and melamine resin in the form of beads, powder, and other shapes. These can be used alone or in a mixture of two or more. The average particle size of this organic filler is 1
If it is within the range of ~8 μm, the average diameter of the glass fibers constituting the glass cloth or glass nonwoven fabric is smaller than 8 to 10 μm, so the m'is filler is likely to be impregnated into the J gaps of the glass fibers together with the resin. . If the average particle size exceeds 8 μm, the impregnating properties for glass fibers will deteriorate, which is not preferable. If it is less than 1 μm, the viscosity of the filler-containing varnish becomes high, and the filler particles secondary agglomerate, resulting in uneven impregnation of the glass fibers, which is not preferable. The blending ratio of organic filler is 5 to 40% of the epoxy resin varnish.
It is preferable to contain it by weight%. Content is 5% by weight
If it is less than this, displacement tends to occur during molding, and the effect of reducing the dielectric constant is small, which is not preferable.

If the content exceeds 40% of worms, impregnating properties with glass fibers will deteriorate, which is not preferable. Therefore, it is preferable to limit it within the above range.

As the glass material used in the present invention, in addition to E glass commonly used for glass woven fabrics, glass nonwoven fabrics, etc., all types of glass silk fabrics and nonwoven fabrics can be used.

The epoxy resin used in the present invention may be any epoxy resin having two or more epoxy groups in one molecule,
Commercially available epoxy resins can be used. Examples include bisphenol A type epoxy resin, bisphenol I type epoxy resin, novolac type epoxy resin, brominated epoxy resin, etc., and these can be used alone or as a mixture of two or more types. These epoxy resins are dissolved in a solvent together with an organic filler, a hardening agent, etc. to form an epoxy resin varnish.

The prepreg used in the present invention can be obtained by applying, impregnating, and semi-nursing an epoxy resin varnish consisting of the above-mentioned organic filler and epoxy resin onto the above-mentioned glass substrate by a conventional method.

A plurality of prepreg sheets obtained in this way are laminated, copper foil is overlaid on at least one side of the laminated prepreg, and heat and pressure are applied to form an integral vi face to form a single-sided copper-clad, double-sided copper-clad, or multilayer copper-clad laminate. can be manufactured. The method for manufacturing the copper-clad laminate is not particularly limited, and any method may be used. This copper clad laminate is used for electronic equipment,
It can be widely used in communication equipment, etc.

(Examples) Next, the present invention will be specifically explained by examples, but the present invention is not limited by these examples.

Example 1 Bisphenol A type epoxy resin (Ei 4
800/eQ) 100I 31 m parts of dicyandiamide, 0.1 parts by weight of ω part of 2-ethyl-4-methylimidazole, and 60 parts by weight of acetone were added and dissolved with stirring, and then averaged as the right 11'lJ filler. Particle size is 2μ
An epoxy resin varnish was prepared by adding 50 parts by weight of a cured epoxy resin powder of m. Next, the epoxy resin varnish was applied and impregnated onto a 180 μl thick glass woven cloth.
It was dried at a temperature of 0° C. to obtain a prepreg having a resin content of 51 wt ω % including a filler. Stack these 7 sheets of prepreg and place 1 piece of copper foil with a size of 35 μl on the upper and lower sides.
Stack the sheets and heat at 110℃, 40 to 90/cm2
The mixture was heated and pressurized for a minute to produce a copper-clad laminated h'root with a grain thickness of 1.6 am. The electrical properties of this copper-clad laminate were tested, and the results are shown in Table 1. There was no slippage during molding, and the electrical properties were excellent, confirming the effects of the present invention.

Example 2 In Example 1, instead of the cured epoxy resin with an average particle size of 2 μm used as the organic filler, a cured epoxy resin with an average particle size of 7 μm was used as the organic filler.
A copper-clad laminate was manufactured in the same manner as in Example 1 except that polypropylene powder of m was used, and the fiber properties were tested in the same manner. The results are also shown in Table 1, and there was no slippage during molding, and the electrical properties were excellent, confirming the effects of the present invention.

Comparative Example 1 A copper-clad laminate was manufactured in the same manner as in Example 1 except that silica powder (Aerosil) with an average particle size of 2 μm was used as an inorganic filler instead of an organic filler, and The properties of the fibers were tested in the same manner, and the results are shown in Table 1.

Comparative Example 2 In Example 1, an epoxy resin varnish containing no organic filler was mixed and applied and impregnated onto a 180μ thick glass woven fabric to produce a prepreg with a resin content of 41% by weight as conventionally done. . Eight sheets of this prepreg were stacked together to produce a copper-clad laminate in the same manner as in Example 1, and the properties were tested. The results are shown in Table 1.

Table 1 [Effects of the Invention] As is clear from the above explanation and Table 1, the copper-clad laminate of the present invention has the ability to prevent misalignment during molding by using an epoxy resin varnish containing an organic filler. It has excellent electrical properties, can be used for general purposes, and can be used in applications where electrical properties are particularly required, making it industrially useful.

Claims (1)

[Scope of Claims] 1 A plurality of sheets of prepreg obtained by coating a glass substrate with an epoxy resin varnish containing an organic filler, impregnating and drying the same, and a copper foil laminated on at least one side of the plurality of sheets of prepreg. , a copper-clad laminate characterized by being integrally molded under heating and pressure. 2. The copper-clad laminate according to claim 1, wherein the organic filler has an average particle size of 1 to 8 μm and is contained in a proportion of 5 to 40% by weight based on the epoxy resin varnish.