JPS63290736A - Laminated sheet - Google Patents

Abstract

PURPOSE:To contrive an improvement in dimensional stability and a cost reduction, by laminating a laminated body obtained by arranging a metallic foil on either the top or the bottom of the number of necessary sheets of fluororesin- impregnated glass cloth, for which specific single yarn has been used. CONSTITUTION:A glass base to be used is of single yarn cloth whose weight is (48Xn)+ or -<2> g/m<2> (provided that n=2-6) and surface treatment is performed with a silane coupling agent. Prepreg is formed of the glass base by impregnating the same with fluororesin and drying the same. The fluororesin having the melting point of 200 deg.C or higher is preferable. A plurality of sheets of the prepreg formed like this are laminated and a laminated sheet is formed by sticking a metallic foil to both sides or one side of the laminated sheet. Any of a copper foil or an aluminum foil or a brass foil or an iron foil or a stainless steel foil or a nickel foil or a silicon steel foil can be adopted for the metallic foil. The laminated sheet is favorable in adhesion between the glass base and impregnating resin, superior in dimensional stability and heat resistance and moreover it is capable of keeping costs down.

Description

[Detailed description of the invention] 〔Technical field〕 The present invention relates to a laminate for use in printed wiring boards.

[Background technology]

Conventionally, laminates for printed wiring boards have been manufactured by laminating resin-impregnated base materials formed by impregnating and drying a glass cloth base material with epoxy resin or polyimide resin, but the dielectric base of this laminate is 4.5 when a 1% resin-impregnated base material is used, and 4.0 for a glass/polyimide system, which is relatively large. Therefore, when used as a printed wiring board, The characteristics for high frequencies were insufficient; there were restrictions on the implementation of high-frequency arithmetic circuits using high-frequency clocks and communication equipment circuits.

- For this reason, the present inventors have already developed a laminate with a low dielectric constant and good cavity frequency characteristics by forming the final layer with a glass cloth base material impregnated with a fluororesin, but the glass cloth is impregnated with In order to improve adhesion to the resin and ensure heat resistance, for example, glass cloth with a thickness of about ~ωμ and ~ωV is used, but such glass cloth is expensive, and the laminated board Not only did this increase the cost, but it also had poor dimensional stability due to its small thickness.

[Purpose of the invention]

The present invention has been made in view of the above circumstances, and its purpose is to provide a printed wiring board with excellent heat resistance, Wt stunning properties, low dielectric constant, and good high frequency characteristics. Not only is it possible to mount high-frequency arithmetic circuits and communication circuits in various cases, but it also has excellent dimensional stability and can produce products with exactly the same plate thickness tolerance, dielectric constant, dielectric loss tangent, etc. as conventional products. Moreover, it is possible to provide a laminate that can reduce costs.

[Disclosure of the invention]

The laminate of the present invention is a laminate formed by laminating and integrating a required number of fluororesin-impregnated guff cloths with metal foil on the upper and/or lower surfaces thereof, and the weight of the gaff cloth is (s x n ) Vy, (however, n, 2 to 6
), which is characterized by being surface-treated and made of nine-single yarn cloth, and with this structure, the above object can be achieved.

The present invention will be explained in detail below.

The glass substrate used in the present invention has a weight of (48×n 2
The essential condition is that it is a single yarn cloth of pd, (however, 1l = 2 to 6). Other requirements for this glass substrate are that the density is 0 to 60 in length, I to ω in width, and a single yarn plain weave cloth can be suitably adopted.

This glass substrate has been surface-treated with a silane coupling agent. Since a thick glass cloth is used as the silane coupling agent, Ph5i(OR)3
Preferably, the main ingredient is A prepreg is formed by impregnating this glass base material with a fluororesin and drying it. As the fluororesin, trifluorochloroethylene resin (C
TFE% melting point 210-212°C), tetrafluoroethylene resin (TFE, melting point 320-335°C), tetrafluoroethylene-hexafluoropylene copolymer resin (F'EP, melting point 260-280°C), Fufluorinated ethylene superfluorovinyl ether copolymer resin (PFA% melting point 302~
310°C], tetrafluoroethylene-ethylene copolymer resin (ETFE, melting point 260-270°C), and a melting point of 200°C or higher is preferable. A plurality of prepregs thus formed are laminated, A laminate is formed by pasting metal foil on both sides or one side.Metal foils include copper foil, aluminum foil, brass foil, iron foil, stainless steel foil, nickel foil, silicon steel foil, etc. Can be adopted.

The laminate of the present invention can be produced by, for example, stacking a plurality of prepregs, interposing another resin film with a low dielectric constant such as a fluororesin film or polyimide resin as an adhesive layer between the prepregs, and then adhering it to both or one side. The metal foils were stacked with the agent layer interposed in between, and the metal foils were placed between multiple sets of hot platens via molded plates.
0℃ or higher, 20-tso kg/d, 40-10
Manufactured by heating and pressurizing and laminating and integrating in 0 minutes.

This laminate is sequentially subjected to perforation, electroless plating, pattern formation, pattern plating, resist plating, resist removal,
Through-hole plating printed wiring boards are manufactured through processes such as etching, external finishing, and V-mark printing.

Next, one embodiment of the present invention will be specifically described.

Example The surface of a single yarn plain weave cloth with a weight of 96 cm, a density of vertical ω wood, a horizontal cV3 mackerel, and a filament diameter of 7 μm was coated with Ph5i (O
After surface treatment with a silane coupling agent containing R) 3 as the main ingredient, tetrafluoroethylene resin (@Product name Polyflon T)
F'E, manufactured by Daikin Industries, Ltd.] was impregnated and fired to form a prepreg. Next, a TF'E fluororesin film (trade name Nitoflon) with a thickness of 0.04 fj was placed on both sides of the five prepregs and between them, and a film with a thickness of 0.0 fj was placed on both sides.
3511jII steel foil was placed and the molding pressure was 201 g/d.
, laminated for ω minutes at 400°C to a thickness of 0.8 II
A copper-clad calendar board of I was manufactured. Table 1 shows the results of measuring the thickness, dielectric constant, dielectric loss tangent, dimensional change rate (heated at 170°C for ω minutes), heat resistance, and insulation resistance after boiling (2 hours at 100°C) of this copper-clad laminate. Shown below.

Comparative Example After treating the flat surface of a plain weave cloth (108 type) with a weight of 49 fβ and a density of vertical ω ru 匍 n and horizontal weave (type 108) with glue,
Tetrafluoroethylene resin (product name: Polyflon TFEJ,
(manufactured by Daikin Industries, Ltd.)) is impregnated and fired to form a prepreg.

A TFE fluororesin film (Nidoflon J) with a thickness of 0.04 fl was placed on both sides and between the 10 sheets of prepreg, and copper foil with a thickness of 0.035 ff was placed on both sides, and the molding pressure was varied to -1400''C. Laminated for ω minutes to a thickness of 0.
An 8 fl copper clad laminate was manufactured. The dimensional change rate, heat resistance, grade resistance after boiling, etc. of the copper-clad (copper-clad) laminate were measured in the same manner as in Example 1.

〔Effect of the invention〕

As is clear from the results in Table 1, the examples of the present invention are superior to the comparative examples in terms of dimensional stability, heat resistance, and insulation resistance. Furthermore, the plate thickness is Ni! Since they have exactly the same performance in terms of dielectric constant, dielectric loss tangent, etc., they have the advantage of being interchangeable and significantly reducing costs. As described above, the present invention uses a glass base material that has a small dielectric constant, good high frequency characteristics, and has excellent insulation properties that allow mounting of high frequency calculation circuits and communication circuits when used as a printed wiring board. It's heavy B! c (48×n)-97'
tds (However, since it is a single yarn cloth with surface treatment with n = 2 to 6, it has good adhesion to the impregnated resin, has excellent dimensional stability and heat resistance, and can reduce costs. be.

Table 1

Claims (2)

[Claims] (1) In a laminate made by laminating and integrating a required number of fluororesin-impregnated glass cloths with metal foil arranged on the upper and/or lower surfaces, the weight of the glass cloth is (48 x n) ^±^
2 g/m^2 (where n=2 to 6), and is a single yarn cloth that has been surface-treated. (2) The laminate according to claim 1, wherein the surface treatment is silane coupling agent treatment.