JP2006297613A - Metal foil clad laminated sheet and manufactured method of multilayered printed wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a metal foil clad laminated sheet excellent in withstand voltage characteristics and heat resistance constituted by using a specific metal foil in the metal foil clad laminated sheet, and a multilayered printed wiring board. <P>SOLUTION: In the metal foil clad laminated sheet, which has an insulating layer with a thickness of 0.06 mm or below, manufactured by laminating the metal foil on plain weave glass cloth impregnated with a thermosetting resin composition and subsequently heating and pressing the formed laminate, the untreated surface (glossy surface) of the metal foil is smoothed by plating treatment so that its surface roughness (Rz) becomes 2.0 μm or below. The manufacturing method of the metal foil clad laminated sheet is characterized by using the metal foil of which the surface is subjected to roughening treatment so as to have a surface roughness (Rz) of 2.0-3.5 mm. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a multilayer printed wiring board used in electrical / electronic equipment, communication equipment, and the like.

  A multilayer board conventionally used in the production of printed wiring boards is made by impregnating a base material such as a glass cloth with a thermosetting resin composition such as an epoxy resin composition, followed by heat drying and semi-curing to produce a prepreg Then, a required number of the prepregs are stacked, and a metal foil such as a copper foil is laminated on one side or both sides thereof, and heated and pressed to form a metal-clad laminate.

  And after etching the metal foil on the surface of the metal-clad laminate to produce a guide mark used when manufacturing a conductor circuit and a printed wiring board on the surface, an inner layer substrate is formed, and then a roughening treatment is performed as necessary. Then, on the inner layer substrate on which the conductor circuit and the like are formed, the required number of prepregs produced in the same manner as described above are stacked on one side or both sides, and a metal foil is disposed on one side or both sides as necessary and laminated. And it manufactures by heating and pressurizing and shape | molding.

  In recent years, with the increase in the density of mounted components, the technology of a component-embedded substrate in which a capacitor and a resistor are built in the substrate has been advanced. The laminate plate that has been used to form the capacitor layer is generally a FR-4 material in which an epoxy resin is impregnated into a glass cloth, and copper foil is pasted on both sides thereof. At this time, attempts have been made to reduce the thickness of the insulating layer of the FR-4 material in order to ensure a high capacitance.

  The metal foil used for the production of a metal-clad laminate of 0.06 mm or less used for the capacitor layer of these multilayer printed wiring boards is generally 70 μm or less of DI (double-side roughening) foil or RT (reverse treatment) foil. It is used for. Further, the metal foil roughening treatment directly applied to the glossy surface is generally 1 to 2 μm.

  In order to stabilize the capacitance, it is common to use a metal foil with a roughness on the substrate side of 1 to 2 μm. However, the peel strength of the metal foil is low, and is defined in IPC-TM650. There was a problem that blistering (delamination) occurred at the interface between the metal foil and the base material during a heat resistance test of solder at 288 ° C. for 10 seconds. When the metal foil has a roughness of 5 μm or more to improve the peeling strength of the metal foil and the heat resistance of the solder at 288 ° C. for 10 seconds, the withstand voltage characteristic is lowered. was there.

  The metal foil constituting the metal-clad laminate is subjected to a roughening process having irregularities for obtaining an anchor effect in order to improve adhesion with the insulating layer. The thinner the insulation layer of the metal-clad laminate, the closer the tip of the metal foil roughening treatment will be, and there will be abnormally grown roughening parts there, or there will be an abnormality on the copper foil surface before the roughening treatment. If protrusions or the like are generated, when a voltage is applied, the copper foil surfaces are locally short-circuited, resulting in a large problem of withstand voltage characteristics and insulation reliability.

  As a result of repeated studies to solve the above problems, the present invention has been made to improve the above problems. The range in which withstand voltage problems in the withstand voltage test can be eliminated and heat resistance can be maintained by optimizing the roughening surface roughness and roughening method of the untreated surface (glossy surface) of the metal foil used for the production of metal-clad laminates. And solved the problem.

According to claim 1 of the present invention, the metal-clad laminate is manufactured by impregnating a plain woven glass cloth having a base material thickness of 0.06 mm or less with a thermosetting resin composition, laminating with a metal foil, and heating and pressing. In the method for producing a metal-clad laminate produced in this way, the untreated surface (glossy surface) of the metal foil is smoothed to a surface roughness (Rz) of 2.0 μm or less by plating, and the roughened surface roughness (Rz). A metal foil having a thickness of 2.0 to 3.5 μm is used.
A method for manufacturing a multilayer printed wiring board according to claim 2 of the present invention is characterized in that one layer of an inner layer circuit board using the metal-clad laminate according to claim 1 is included in a constituent material. .

  The untreated surface (glossy surface) of the metal foil of the present invention is made a uniform surface with a roughness (Rz) of 2.0 μm or less by plating treatment, and the roughening treatment roughness (Rz) is 2.0 to 3. A multilayer printed wiring board using a metal-clad laminate characterized by being applied to 5 μm can provide a multilayer printed wiring board having excellent withstand voltage characteristics and heat resistance.

  The metal-clad laminate and multilayer printed wiring board according to the present invention have a base material thickness of 0.06 mm or less, and a surface roughness (Rz) of 2.0 μm by plating the untreated surface (glossy surface) of the metal foil. Etching a metal-clad laminate prepared by heating and pressurizing using a metal foil that has been smoothed below and subjected to a roughening treatment with a roughness (Rz) of 2.0 to 3.5 μm on its surface It is obtained by laminating a predetermined number of prepregs prepared by impregnating a thermosetting resin composition on a glass cloth having a thickness of 200 μm or less and an inner layer circuit board having a conductor circuit formed on the surface, followed by heating and pressing.

  The untreated surface (glossy surface) of the metal foil used for the production of the metal-clad laminate is smoothed to a surface roughness (Rz) of 2.0 μm or less by plating, and the surface is roughened (Rz). It is important to use a metal foil subjected to a roughening treatment of 2.0 to 3.5 μm.

  Generally, the glossy surface of the electrolytic metal foil has irregularities, and when roughening treatment is directly applied to the glossy surface, abnormal precipitation or the like is observed in the roughening treatment. It has been confirmed that the unevenness of the glossy surface causes variation in the growth of the roughened shape and induces abnormal precipitation. For these reasons, it is necessary to smooth the surface roughness (Rz) to 2.0 μm or less by plating the untreated surface (glossy surface) of the metal foil.

  In the case of a metal foil having a roughening treatment roughness (Rz) of 1 to 2 μm applied to the untreated surface, the surface is subjected to rust prevention treatment and silane coupling treatment as necessary, but the anchor effect cannot be obtained, so pulling is performed. Peeling strength is low, and soldering at 288 ° C. for 10 seconds float heat resistance test specified in IPC-TM650 tends to cause blistering (delamination) at the interface between the metal foil and the substrate. Further, in the case of a metal foil having a roughening treatment roughness of 5 μm or more, there is a problem that a withstand voltage failure occurs in a withstand voltage test.

  The thermosetting resin composition used preferably has high Tg and high thermal decomposition temperature characteristics from the viewpoint of heat resistance and reliability. In addition, it is preferable to manufacture a resin component necessary for obtaining a predetermined plate thickness in an appropriate range.

As described in Patent Document 1, “Roughening without an abnormal precipitation state is possible by adjusting the surface roughness (Rz) to 0.5 to 3.0 μm by physical polishing”. It cannot be said that it has been changed, and it can be said that it is insufficient for improving the withstand voltage characteristics.
JP 2004-249480 A

As the thermosetting resin composition used in the present invention, both the thermosetting resin composition used for the production of the metal-clad laminate and the thermosetting resin composition used for the production of the prepreg, an epoxy resin system, a phenol resin system, Thermosetting resins in general, such as polyimide resins, unsaturated polyester resins, polyphenylene ether resins, and the like, modified products, and mixtures can be used.
In addition, the kind of the thermosetting resin composition used for manufacture of a metal-clad laminate and the thermosetting resin composition used for manufacture of a prepreg may be the same, or may differ.

  The thermosetting resin composition contains a thermosetting resin as an essential component, and can contain a curing agent, a curing accelerator, an inorganic filler, a solvent, and the like of the thermosetting resin as necessary. . Note that a thermosetting resin with low self-curing property such as an epoxy resin needs to contain a curing agent for curing the resin.

  In addition, when a thermosetting resin composition is an epoxy resin type | system | group, the balance of an electrical property and adhesiveness is favorable and preferable. Examples of the epoxy resin contained in the epoxy resin-based resin composition include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolac type epoxy resin, bisphenol A novolac type epoxy resin, and bisphenol F novolak. Type epoxy resin, cresol novolac type epoxy resin, diaminodiphenylmethane type epoxy resin, and epoxy resin made flame retardant by halogenating a part of hydrogen atoms in these epoxy resin structures.

  Examples of the curing agent contained in the epoxy resin-based resin composition include amide-based curing agents such as dicyandiamide and aliphatic polyamide, amine-based curing agents such as ammonia, triethylamine, and diethylamine, phenol novolac resins, and cresols. Examples thereof include phenolic curing agents such as novolak resin and p-xylene-novolak resin, and acid anhydrides.

  The inorganic filler that can be contained in the thermosetting resin composition includes inorganic powder fillers such as silica, calcium carbonate, aluminum hydroxide, and talc, glass fibers, pulp fibers, synthetic fibers, and ceramic fibers. Examples of the solvent that can be contained in the thermosetting resin composition include amides such as N, N-dimethylformamide, ethers such as ethylene glycol monomethyl ether, acetone, Examples thereof include ketones such as methyl ethyl ketone, alcohols such as methanol and ethanol, and aromatic hydrocarbons such as benzene and toluene.

  A method for impregnating the glass cloth with the thermosetting resin composition is not particularly limited, and a general method is applicable. In addition, after impregnating the thermosetting resin composition in the glass cloth, you may heat-dry as needed.

  As the metal foil used in the present invention, copper, aluminum, brass, nickel, etc. can be used alone, alloy, composite metal foil, a single-sided metal-clad laminate in which metal foil is laminated and formed instead of metal foil, A double-sided metal-clad laminate can also be used.

  In addition, this metal foil is not limited to use only for preparation of a metal-clad laminate, and may be used by being laminated on one side or both sides of the laminate in which an inner layer substrate and a prepreg are laminated. The thickness of the metal foil is generally 70 mm or less when used for the production of a metal-clad laminate, and 0.003 when laminated on one or both sides of the laminate obtained by laminating the inner layer substrate and the prepreg. The range of ~ 0.035 mm is common.

  The conditions for heating and pressurizing when manufacturing the metal-clad laminate and the conditions for heating and pressurizing after laminating the inner layer substrate and the prepreg are appropriately adjusted under conditions for curing the thermosetting resin composition and heated. However, if the pressure of the pressurization is high, the dimensional shrinkage of the conductor circuit may vary greatly. Therefore, it is preferable to pressurize as low pressure as possible within the range satisfying the moldability. Note that it is preferable to perform heating and pressing in a reduced-pressure atmosphere of 300 Torr or less because moldability is improved.

  The method for etching the metal foil on the surface of the metal-clad laminate is not particularly limited, and a general method can be applied depending on the metal foil and the etching resist used for the etching.

Example 1
As the thermosetting resin composition, an epoxy resin resin composition composed of the following two types of epoxy resins, a curing agent, a curing accelerator and a solvent was used.
Epoxy resin 1: 50 parts by weight of bisphenol A novolak type epoxy resin [Dainippon Ink Chemical Co., Ltd., using Epicron N868 (trade name)].
Epoxy resin 2: Brominated bisphenol A type epoxy resin [Sumitomo Chemical Co., Ltd., using ESB-400 (trade name)] 50 parts by weight.
Curing agent: 40 parts by weight of bisphenol A novolak resin [manufactured by Japan Epoxy Resin Co., Ltd., YLH-129 (trade name)].
Curing accelerator: 1 part by weight of 1-cyanoethyl-2-phenylimidazole.
Solvent: 90 parts by weight of methyl ethyl ketone.

When this resin composition is glass cloth (# 106 type: weight 25 g / m ² ), the amount of the thermosetting resin composition after drying is 100 parts by weight in total of the thermosetting resin composition and the glass cloth. , Adjusted to 70 parts by weight, impregnated, and dried at a maximum temperature of 165 ° C. to prepare a prepreg.

  Next, a 35 μm-thick copper foil (untreated surface (glossy surface) was smoothed to a thickness of 2.0 μm or less by plating on both sides of the obtained prepreg, and the roughened surface roughness ( Rz) 2.8 μm roughened product) is laminated and laminated, and then this laminate is sandwiched between metal plates and heated and pressed at a maximum temperature of 180 ° C. and a pressure of 3.0 MPa for 90 minutes to form a double-sided copper. A tension laminate was produced.

  Next, a predetermined number of prepregs were stacked on both sides of the obtained double-sided copper-clad laminate and molded by heating and pressing at a maximum temperature of 180 ° C. and a pressure of 2.5 MPa for 90 minutes to produce a multilayer board.

(Example 2)
35 μm copper foil (reverse treatment foil: untreated surface (glossy surface) is smoothed by plating to a surface roughness (Rz) of 2.0 μm or less, and the surface has a roughening roughness (Rz) of 3. A double-sided copper clad laminate was obtained in the same manner as in Example 1 except that a 4 μm roughened product) was placed and laminated, and a multilayer board was further produced.

(Comparative Example 1)
Similar to Example 1 except that 35 μm copper foil (reverse treatment foil: no plating treatment on untreated surface (glossy surface), roughening treatment roughness (Rz) 2 to 3.5 μm) was laminated. Thus, a double-sided copper-clad laminate was obtained, and a multilayer board was further created.

(Comparative Example 2)
Except that a 35 μm copper foil (reverse treatment foil: no plating treatment on untreated surface (glossy surface), roughening treatment roughness (Rz) 1 to 2 μm) was arranged and laminated, the same as in Example 1 A double-sided copper-clad laminate was obtained to create a multilayer board.

(Comparative Example 3)
Except that 35 μm copper foil (reverse treatment foil: no plating treatment on untreated surface (glossy surface), roughening treatment roughness (Rz) 5-6 μm) was arranged and laminated, the same as in Example 1 A double-sided copper-clad laminate was obtained to create a multilayer board.

(Evaluation)
The roughness of the roughening treatment was measured from the cross section of the multilayer board.
The multilayer board obtained in Example 1 and Comparative Examples 1 to 3 was subjected to a solder heat resistance test at a float of 288 ° C. for 10 seconds after moisture absorption treatment (PCT 1.5 hr).

  About the double-sided copper clad laminated board obtained by Example 1 and Comparative Examples 1-3, the copper foil peeling strength was measured based on JIS-C6481.

  The double-sided copper-clad laminate obtained in Example 1 and Comparative Examples 1 to 3 was subjected to a withstand voltage test of ~ 500V and ~ 2000V.

  As shown in Table 1, the heat resistance of Comparative Example 1 is equivalent to that of Example 1 and no abnormality was observed in the 500V withstand voltage test, but an abnormality was confirmed in the 2000V withstand voltage test. The roughening treatment roughness was the same, but Example 1 in which the untreated surface (glossy surface) was smoothed to a surface roughness (Rz) of 2.0 μm or less by plating treatment showed good withstand voltage characteristics. .

  Moreover, since the roughening process roughness was small compared with Example 1, the copper foil peeling strength was low, and abnormality was confirmed by the solder heat resistance and a withstand voltage test.

  Moreover, although the roughening process roughness is large compared with Example 1, and the copper foil peeling strength is strong and it is excellent in solder heat resistance, the above was confirmed by the withstand voltage test of 500V.

Claims (2)

  In a metal-clad laminate having a thickness of 0.06 mm or less, which is produced by impregnating a plain weave glass cloth with a thermosetting resin composition, laminating with a metal foil, and then heating and pressing, an untreated surface of the metal foil (Glossy surface) Metal whose surface roughness (Rz) is smoothed to 2.0 μm or less by plating treatment, and the surface is subjected to roughening treatment with roughness (Rz) of 2.0 to 3.5 mm A method for producing a metal foil-clad laminate comprising using a foil. A method for producing a multilayer printed wiring board, comprising at least one inner layer circuit board using the metal foil laminate of claim 1 as a constituent material.