JPS6369106A - Laminate plate for electricity and printed wiring board using the same - Google Patents
Laminate plate for electricity and printed wiring board using the sameInfo
- Publication number
- JPS6369106A JPS6369106A JP61214668A JP21466886A JPS6369106A JP S6369106 A JPS6369106 A JP S6369106A JP 61214668 A JP61214668 A JP 61214668A JP 21466886 A JP21466886 A JP 21466886A JP S6369106 A JPS6369106 A JP S6369106A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- impregnated
- laminate
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005611 electricity Effects 0.000 title 1
- 239000000463 material Substances 0.000 claims description 25
- 239000011347 resin Substances 0.000 claims description 24
- 229920005989 resin Polymers 0.000 claims description 24
- 239000000835 fiber Substances 0.000 claims description 15
- 239000004745 nonwoven fabric Substances 0.000 claims description 15
- 239000011888 foil Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims 2
- 239000010410 layer Substances 0.000 description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229920001721 polyimide Polymers 0.000 description 7
- 239000011889 copper foil Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 239000009719 polyimide resin Substances 0.000 description 4
- 239000002759 woven fabric Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- -1 polyphenylene Polymers 0.000 description 3
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000002952 polymeric resin Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- PEVRKKOYEFPFMN-UHFFFAOYSA-N 1,1,2,3,3,3-hexafluoroprop-1-ene;1,1,2,2-tetrafluoroethene Chemical group FC(F)=C(F)F.FC(F)=C(F)C(F)(F)F PEVRKKOYEFPFMN-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 101150036753 ASMT gene Proteins 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Nonwoven Fabrics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Non-Insulated Conductors (AREA)
- Insulating Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔技術分野〕
本発明は電気ｊａ器、電子機器、通信機器、計算ａ器等
に用いられる［Ｃ用＠暦板及びグリント配４１１基板匝
関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a calendar board for C and a glint 411 board used in electric appliances, electronic devices, communication devices, calculators, etc.
従来より、紙やガフス織布に７二ノー／Ｉ／樹脂、エボ
キＶ樹脂、ポリイミド樹脂を含浸、乾燥させた樹脂含浸
基材の所要枚数と金属箔を重ねた積層体を債層成形して
電気用積層板が製造されているが、この電気用積層板の
誘電率は、エボキＶ樹脂含浸ガラス布を用すた場合で５
．０．ポリイミド樹脂ガラス布の場合には４．０と比較
的大きく、従ってプリント配線板として用いた場合には
高周波特性が不足となり、高周波演算回路？ａ信壜器回
路用には制約が加えられていた。Conventionally, paper or gaff woven fabric is impregnated with 72NO/I/resin, Evoki V resin, or polyimide resin, and a laminate is formed by stacking the required number of resin-impregnated base materials and metal foil on each other and drying them. Electrical laminates are manufactured, and the dielectric constant of these electrical laminates is 5 when using EBOKI V resin-impregnated glass cloth.
．． 0. In the case of polyimide resin glass cloth, it is relatively large at 4.0, so when used as a printed wiring board, the high frequency characteristics are insufficient, and the high frequency arithmetic circuit? Restrictions were added to the a-shin bottle circuit.
〔発明の目的〕゛
本発明は上記事情に遥みて為されたものであり、その目
的とするところは、誘電率が小さく、高周波特性が良好
とをり、プリント配線板として使用した場合に高周波演
算同格、通信機回路の実装が可能で絶微特性に：優れた
電気用積層板及びプリント配線基板を提供することにあ
る。[Object of the Invention] The present invention has been made in view of the above-mentioned circumstances, and its purpose is to have a low dielectric constant and good high frequency characteristics, so that when used as a printed wiring board, high frequency Our objective is to provide excellent electrical laminates and printed wiring boards: arithmetic appositions, communication circuits can be mounted, and the characteristics are extremely high.
本発明は所要枚数の樹脂含浸基材の上面及び又は下面に
金属箔を配設した積層体を一体化してなる電気月間層板
において、樹脂含浸基材の少くとも１枚が、樹脂含浸フ
ッ紫樹脂繊維不織布であることを特徴とする電気用積層
板、及び少くとも１枚の樹脂含浸フッ素樹脂繊維不織布
を層間に有する電気用積層板をベースとする所要枚数の
内層材の上面及び又は下面に樹脂層を介在せしめて外層
材を配設したｆｌ！暦体を一体化してなることを特徴と
するプリント配線基板で、高周波特性に優れたフッ素樹
脂層のため閃層板及びプリント配線基板の高層波特性を
向上させることができたもので以下本発明の詳細な説明
する。The present invention provides an electric monthly laminate formed by integrating a required number of resin-impregnated base materials with metal foil arranged on the upper and/or lower surfaces thereof, in which at least one of the resin-impregnated base materials is made of resin-impregnated fluorine. An electrical laminate characterized by being made of a resin fiber nonwoven fabric, and a required number of inner layer materials based on the electrical laminate having at least one resin-impregnated fluororesin fiber nonwoven fabric between the layers, on the upper and/or lower surfaces. fl that has an outer layer material with a resin layer interposed! This is a printed wiring board that is characterized by an integrated calendar body, and is able to improve the high-frequency characteristics of the flash plate and printed wiring board due to the fluororesin layer that has excellent high frequency characteristics. Detailed description of the invention.
本発明に用いる樹脂含浸基材の樹脂としては、ツエノー
ｐ樹脂、クレゾール樹脂、エポキシ樹脂、不飽和ポリエ
ステ／Ｌ’′ｓｉ脂、メラミン樹脂、ポリイミド、ポリ
ゲタジエン、メリアミド、ポリアミドイミド、ポリスル
フォン、ボリフェニレンサμツアイド、ポリフェニレン
オキサイド、ポリブチレンテレフタレート、ポリニー５
’／ｌ／エーテルケトン、フッ素樹脂等の単独、変性物
、混合物等が用いられ必要に応じて粘度調整に水、メチ
ｙアｙコ−ｐ、アセトン、Ｖクロヘキサノン、スチレン
等の溶媒を添加し念もので、基材としては、ガラス、ア
スベスト等の無機繊維中ポリエステル１ポリアミド、ポ
リビニμアμコーμ、アクリ〃等の有機合成繊維や木＃
ｉＳ等の天然繊維からなる織布、不織布、マット或は紙
等であるが、所要枚数用いられるポ材の少くとも１枚に
ついてはフッ素樹脂繊維不織布を用いることが必要であ
る。フッ＊樹脂繊維不織布を形成しでいるフッ素樹脂と
しては三フフ化塩化エチレン碑脂（融点２１０〜２１２
℃）、四フブイヒエチレン（９点３２７°Ｃ）、四フッ
化エチレンー六フッ化プロピレン共重合体樹脂（Ｍ点２
７０”Ｃ）、四フッ化エチレンーパーフμオロビニμニ
ー５ｈル＃ｅ重合体樹脂（融点３０２〜３１０’Ｃ）な
どのような融点が２００℃以上のものが好ましい。フッ
素樹脂繊維不織布については特に限定するものではない
が、好ましくは厚さがＯ，Ｓ〜２１Ｍ、通電度が７５〜
３００ｃｃ／ｄ、秒のものを用いることが望ましい、又
、フッ素樹脂繊維不織布に含浸させるｍ脂については前
記樹脂含浸基材の樹脂をそのまま用いることができる。Examples of resins for the resin-impregnated base material used in the present invention include Zeno-P resin, cresol resin, epoxy resin, unsaturated polyester/L''si resin, melamine resin, polyimide, polygetadiene, meliamide, polyamideimide, polysulfone, and polyphenylene. Satsuide, polyphenylene oxide, polybutylene terephthalate, polynye 5
'/l/ Etherketone, fluororesin, etc. alone, modified products, mixtures, etc. are used, and if necessary, solvents such as water, methyl y-co-p, acetone, V-chlorohexanone, styrene, etc. are added to adjust the viscosity. As a precaution, base materials include inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester 1-polyamide, polyvinyl resin, acrylic, and wood.
The material may be a woven fabric, a non-woven fabric, a mat, or a paper made of natural fibers such as iS, but it is necessary to use a fluororesin fiber non-woven fabric for at least one of the required number of po materials. The fluororesin that forms the fluororesin fiber non-woven fabric is trifluorochlorinated ethylene resin (melting point 210-212
°C), tetrafluoroethylene (9 points 327 °C), tetrafluoroethylene-hexafluoropropylene copolymer resin (M point 2
Polymer resins with a melting point of 200°C or higher are preferable, such as 70"C), tetrafluoroethylene perfluorinated polymer resin (melting point 302 to 310'C), etc. There are no particular limitations on fluororesin fiber nonwoven fabrics. Preferably, the thickness is O,S~21M, and the conductivity is 75~
It is preferable to use a resin with a flow rate of 300 cc/d, seconds, and the resin of the resin-impregnated base material can be used as it is as the m-lipid to be impregnated into the fluororesin fiber nonwoven fabric.
樹脂含浸フッ素樹脂繊維不織布は所要枚数の樹脂含浸基
材の全部に用いてもよく、又、所髪枚数積層された中央
部のみ、或は最外層のみ、更には通常の樹脂含浸基材と
交互に債廖した状態で用いてもよく任意である。金属箔
としては銅、鉄、アルミニウム、ニッケル、亜鉛等の単
独、合金箔が用いられ、必要に応じて接着性をより向上
させる為、金属箔の片面に接着剤層を設けておくことも
できる。The resin-impregnated fluororesin fiber nonwoven fabric may be used for all of the required number of resin-impregnated base materials, or it may be used only for the central part of the laminated layers, or only for the outermost layer, or alternatively, alternately with the regular resin-impregnated base material. Optionally, it may be used in a state in which it is in debt. As the metal foil, single or alloy foils of copper, iron, aluminum, nickel, zinc, etc. are used, and if necessary, an adhesive layer can be provided on one side of the metal foil to further improve adhesion. .
プリント配＃１基板の内層材間或は内層材と外層材との
間に介在せしめる樹脂層としては樹脂含浸基材、樹脂フ
ィμム、樹脂Ｓ／ −）、樹脂塗有局等の単独、併用が
用いられ特に限定するものではないが、好ましくは樹脂
含浸基材を用いることがより厚みｍ度を向上させること
ができるので望ましいことである。外層材としては金属
箔或は片面金属箔張積層板専を用いることができ特に限
定するものではない。The resin layer interposed between the inner layer materials or between the inner layer material and the outer layer material of the printed wiring #1 board may be a resin impregnated base material, a resin film, a resin S/-), a resin coating station, etc. alone, Although there are no particular limitations on the use of these materials in combination, it is preferable to use a resin-impregnated base material because the thickness can be further improved. As the outer layer material, metal foil or a single-sided metal foil-clad laminate can be used, but there is no particular limitation.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施例１
四フッ化エチレンパー７１Ｖオロビニルエーテル共重合
体からなる厚みＩＩＥＩ、通気ｒｌ １ｓｏｃｃ／ｃ！
、秒のフッ素樹脂繊維不織布に硬化剤含有エポキシ樹脂
ワニスを含浸、乾燥して樹脂］ｔ５５重量％（以下単に
％と記す）、硬化時間２００秒（１６０℃）のエボキＶ
樹脂含浸フッ素樹脂繊維不織布（以下プリプレグ人と記
す）を得た。別に厚み０．１５８のガラス織布に上記硬
化剤含有エポキシ樹脂フェスを含浸、乾燥して樹脂量５
０％、硬化時間２００秒（１６０″Ｃ）のエボキＶ樹脂
含浸ガフス織布（以下プリプレグＢと記す）を得た。次
にプリプレグ人の上、下面にデリグレグＢを夫々２枚づ
つ介在させてから厚さ０．０１８ｍの鋼箔を配設した積
層体を成形圧力４０ ｉｐｄ 、 ｉ ｙｏ″Ｃで９０
分間積層成形して電気用＠層板を得た。Example 1 Made of tetrafluoroethylene per 71V orovinyl ether copolymer, thickness IIEI, ventilation rl 1 socc/c!
, a fluororesin fiber non-woven fabric of 200 seconds is impregnated with an epoxy resin varnish containing a curing agent and dried to produce a resin]t55% by weight (hereinafter simply referred to as %) and a curing time of 200 seconds (160°C).
A resin-impregnated fluororesin fiber nonwoven fabric (hereinafter referred to as prepreg) was obtained. Separately, a glass woven fabric with a thickness of 0.158 was impregnated with the above hardening agent-containing epoxy resin face, and dried to produce a resin amount of 5.
A guff fabric impregnated with Evoki V resin (hereinafter referred to as prepreg B) with a curing time of 0% and a curing time of 200 seconds (160''C) was obtained.Next, two sheets of Delegreg B were interposed on the top and bottom surfaces of the prepreg layer. A laminate on which steel foil with a thickness of 0.018 m was arranged was molded at a molding pressure of 40 ipd and an iyo″C of 90°C.
Laminate molding was performed for minutes to obtain an electrical @laminated plate.
実施例２
グリプレグ８３枚の各層間にプリプレグ人を夫々１枚づ
つ介在せしめ、更に最外層の上、下面に厚さ０．０１８
Ｍの銅箔を夫々配設した積層体を実施例１と同様に積層
成形して電気用積層板を得た。Example 2 One sheet of prepreg was interposed between each layer of 83 sheets of Gripreg, and a thickness of 0.018 mm was placed on the upper and lower surfaces of the outermost layer.
A laminate having M copper foils disposed thereon was laminated and molded in the same manner as in Example 1 to obtain an electrical laminate.
実施例３
グリプレグ８３枚の上、下面にプリプレグ人を夫々１枚
づつ介在させてから厚さ０．０３５ ＪＥＩＩの銅箔を
配設した積層体ｔ−実施例１と同様に積層成形してＫｆ
ｉ用積層積層板た。Example 3 A laminate t in which one prepreg layer was interposed on the upper and lower surfaces of 83 sheets of Gripreg, and then 0.035 JEII copper foil was placed on the top and bottom surfaces of 83 Gripreg sheets.
Laminated laminate board for i.
実施例４
実施例１と同じフッ素樹脂繊維不織布にポリイミド樹脂
〔ローヌデーフ７社製、商品名ケルイミド６０１〕を含
浸、乾燥して樹脂ｆｉ５５％、硬化時間５００秒（１６
０’Ｃ）のポリイミド樹脂含浸フッ素樹脂繊維不織布（
以下グリプレグＣと記す）を得た。Example 4 The same fluororesin fiber nonwoven fabric as in Example 1 was impregnated with polyimide resin [manufactured by Rhonedef 7, trade name: Kelimide 601] and dried to give a resin fi of 55% and a curing time of 500 seconds (16
0'C) polyimide resin-impregnated fluororesin fiber nonwoven fabric (
(hereinafter referred to as Gripreg C) was obtained.
別に厚み０．１５１１のガラス織布に上記ポリイミド樹
脂を含浸、乾燥して樹脂量５０％、硬化時間（１６０”
Ｃ）のポリイミド樹脂含浸ガラス繊布（以下プリプレグ
Ｄと記す］を得た。次にプリプレグＣの上、下面にグリ
グレグＤｔ−夫々２枚づつ介在させてから厚さ０．０１
８ｍの銅箔を配設した積層体を成形圧力４０ ｋｖ’ｄ
、 ２００ ”Ｃｆ ２００分間ａ＞ａｓｍｔ、て＊
気用潰層板を得た。Separately, a glass woven fabric with a thickness of 0.1511 was impregnated with the above polyimide resin and dried to reduce the amount of resin to 50% and harden time (160").
A polyimide resin-impregnated glass fabric (hereinafter referred to as prepreg D) of C) was obtained.Next, two sheets each of Grigreg Dt were interposed on the upper and lower surfaces of prepreg C, and the thickness was 0.01.
A laminate with 8 m of copper foil was molded under a pressure of 40 kv'd.
, 200 ”Cf 200 minutes a>asmt, te*
A crushed lamellar plate was obtained.
実施例５
実施例１で得たｖ１気用積層板の上、下銅箔に電電回路
を形成し、所要位置にスルホ−ｙを形成してなる内層材
の上、下面にプリプレグＢｔ夫々２枚づつ介在させてか
ら厚さ０．０１８Ｒの銅箔を配設した積層体を成形圧力
４０ ｋ周、 １７０”Ｑで７０分閲潰層成形して４層
のプリント配線基板を得た。Example 5 Electrical circuits were formed on the upper and lower copper foils of the v1 air laminate obtained in Example 1, and two sheets of prepreg Bt were each placed on the upper and lower surfaces of the inner layer material formed by forming sulfo-y at the required positions. A 4-layer printed wiring board was obtained by interposing the laminate with copper foil having a thickness of 0.018R and crushing layer molding for 70 minutes at a molding pressure of 40 k round and 170''Q.
比較例１
グリプレグ８８枚の上、下面に厚さ０．０１８１ＥｉＦ
。Comparative Example 1 Thickness 0.0181EiF on the top and bottom surfaces of 88 Gripregs
.
鋼箔を夫々配設した積層体を成形圧力荀ｗ／ｃｉ、１７
０°Ｃで９０分間積層成形して電気用積層板を得た。The laminated body on which the steel foils were respectively formed was molded under pressure w/ci, 17
Laminate molding was performed at 0°C for 90 minutes to obtain an electrical laminate.
比較例２
比較例１で得られた電気用積層板をベースとする内層材
の上、下面にグリプレグＢを夫々２枚づつ介在させてか
ら厚さ０．０１８１ＥＩの銅箔を配設した積層体を成形
圧力４０壁’ｄ、 １７０°Ｃで７０分間積層成形して
４暦のプリント配線基板を得た。Comparative Example 2 A laminate in which two sheets of Gripreg B were interposed on the upper and lower surfaces of the inner layer material based on the electrical laminate obtained in Comparative Example 1, and then copper foil with a thickness of 0.0181EI was provided. This was laminated and molded at a molding pressure of 40°C for 70 minutes at 170°C to obtain a printed wiring board with a diameter of 4.
実施例１乃至５と比較例１及び２の！！電気用積層板び
プリント配線基板の誘を率は第１表のようである。Examples 1 to 5 and Comparative Examples 1 and 2! ! The dielectric constants of electrical laminate printed wiring boards are shown in Table 1.
第 １ 表
〔発明の効果〕
本発明にあっては、フッ素樹脂繊維不織布に樹脂フェス
を含浸、乾燥して形成した樹脂含浸基材を用いているの
で、誘電率が小さく、高周波特性が良好となり、プリン
ト配線板として使用した場合に高周波クロックを用いた
高周波演算回路、通信機回路の実装が可能となるもので
ある。Table 1 [Effects of the Invention] Since the present invention uses a resin-impregnated base material formed by impregnating a fluororesin fiber nonwoven fabric with a resin face and drying it, the dielectric constant is small and high frequency characteristics are good. When used as a printed wiring board, it becomes possible to implement high-frequency arithmetic circuits and communication circuits using high-frequency clocks.
Claims (3)
属箔を配設した積層体を一体化してなる電気用積層板に
おいて、樹脂含浸基材の少くとも１枚が、樹脂含浸フッ
素樹脂繊維不織布であることを特徴とする電気用積層板
。(1) In an electrical laminate formed by integrating a laminate in which a required number of resin-impregnated substrates are provided with metal foil on the upper and/or lower surfaces, at least one of the resin-impregnated substrates is made of resin-impregnated fluororesin. An electrical laminate characterized by being made of a fiber nonwoven fabric.
層間に有する電気用積層板をベースとする所要枚数の内
層材の上面及び又は下面に樹脂層を介在せしめて外層材
を配設した積層体を一体化してなることを特徴とするプ
リント配線基板。(2) A laminate based on an electrical laminate having at least one resin-impregnated fluororesin fiber nonwoven fabric between the layers, and an outer layer material with a resin layer interposed on the upper and/or lower surface of the required number of inner layer materials. A printed wiring board characterized by an integrated body.
許請求の範囲第２項記載のプリント配線基板。(3) The printed wiring board according to claim 2, wherein the resin layer is a resin-impregnated base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61214668A JPH0824011B2 (en) | 1986-09-11 | 1986-09-11 | Electric laminated board and printed wiring board using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61214668A JPH0824011B2 (en) | 1986-09-11 | 1986-09-11 | Electric laminated board and printed wiring board using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6369106A true JPS6369106A (en) | 1988-03-29 |
| JPH0824011B2 JPH0824011B2 (en) | 1996-03-06 |
Family
ID=16659588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61214668A Expired - Lifetime JPH0824011B2 (en) | 1986-09-11 | 1986-09-11 | Electric laminated board and printed wiring board using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0824011B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02268486A (en) * | 1989-04-11 | 1990-11-02 | Mitsubishi Gas Chem Co Inc | Printed wiring board material of low permittivity |
| JPH0382195A (en) * | 1989-08-25 | 1991-04-08 | Matsushita Electric Works Ltd | Electric laminated board |
| JPH0382192A (en) * | 1989-08-25 | 1991-04-08 | Matsushita Electric Works Ltd | Electric laminated board |
| JPH03502075A (en) * | 1988-08-12 | 1991-05-16 | ロジヤース コーポレイシヨン | How to laser drill fluoropolymer materials |
| WO2002043081A1 (en) * | 2000-11-27 | 2002-05-30 | Daikin Industries, Ltd. | Electrical insulating plate, prepreg laminate and method for producing them |
| JP2012231140A (en) * | 2011-04-14 | 2012-11-22 | Sumitomo Bakelite Co Ltd | Laminate, circuit board, and semiconductor package |
| JP2017071686A (en) * | 2015-10-07 | 2017-04-13 | 株式会社森清化工 | Perfluoro rubber molding |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60214941A (en) * | 1984-04-10 | 1985-10-28 | 株式会社 潤工社 | Printed substrate |
-
1986
- 1986-09-11 JP JP61214668A patent/JPH0824011B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60214941A (en) * | 1984-04-10 | 1985-10-28 | 株式会社 潤工社 | Printed substrate |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03502075A (en) * | 1988-08-12 | 1991-05-16 | ロジヤース コーポレイシヨン | How to laser drill fluoropolymer materials |
| JPH02268486A (en) * | 1989-04-11 | 1990-11-02 | Mitsubishi Gas Chem Co Inc | Printed wiring board material of low permittivity |
| JPH0382195A (en) * | 1989-08-25 | 1991-04-08 | Matsushita Electric Works Ltd | Electric laminated board |
| JPH0382192A (en) * | 1989-08-25 | 1991-04-08 | Matsushita Electric Works Ltd | Electric laminated board |
| WO2002043081A1 (en) * | 2000-11-27 | 2002-05-30 | Daikin Industries, Ltd. | Electrical insulating plate, prepreg laminate and method for producing them |
| JP2002160316A (en) * | 2000-11-27 | 2002-06-04 | Daikin Ind Ltd | Electric insulating plate, prepreg laminated body, and method for manufacturing them |
| JP2012231140A (en) * | 2011-04-14 | 2012-11-22 | Sumitomo Bakelite Co Ltd | Laminate, circuit board, and semiconductor package |
| JP2017071686A (en) * | 2015-10-07 | 2017-04-13 | 株式会社森清化工 | Perfluoro rubber molding |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0824011B2 (en) | 1996-03-06 |
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