JPS6218786A - Metal base laminate board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a metal-based laminate used in electrical equipment, electronic equipment, computers, communication equipment, etc.

[Background technology]

Conventionally, metal-based laminates have a circuit layer with a thickness of 0.1jEI or less formed on the upper and/or lower surfaces of a metal plate via a resin layer, but since the circuit layer is thin at 0.1101 or less, it has a relatively low Applications were limited to current and low voltage.

[Purpose of the invention]

An object of the present invention is to provide a metal-based laminate that can be used for high current and high voltage applications.

[Disclosure of the invention]

The present invention is a metal-based laminate, which is characterized by integrating a circuit layer with a thickness of 0.2 to 3 mm on the upper and/or lower surfaces of a metal plate via a resin layer, so that it can handle large currents and high voltages. The present invention will be described in detail below.

Metal plates used in the present invention include plates made of aluminum, iron, Nilaglu, copper, etc. alone, alloys, composites, and surface-treated plates;
A sheet or the like can be used, and is not particularly limited. In addition, openings can be provided at required positions on the metal plate and the metal plate can be used for through-hole circuits, etc. The resin layer includes phenolic resin, cresol lv resin, epoxy resin, unsaturated polyester resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideimide, polysulfone, polybutylene terephthalate, polyether ether, fluorinated resin, polyphenylene. A resin varnish coating layer made of sulfide, polyphenylene oxide, etc. alone, a modified product, or a mixture, or a resin sheet M, or these resins are combined with inorganic fibers such as glass and asbestos, or organic materials such as polyester, polyamide, polyvinyl alcohol, and acrylic.
s One or more resin-impregnated base materials made by impregnating and drying woven fabrics, non-woven fabrics, mats, paper, or combinations of these materials made of natural fibers such as fibers and cotton, and drying them as necessary. . The circuit layer is a metal layer with a thickness of 0.2 to 3 km,
A single or composite product such as a plating layer or a conductive paste layer can be used. As the metal layer, a circuit pattern can be formed by etching using a foil, sheet, or plate of copper, iron, aluminum, Niraglu, etc. alone or an alloy. Or foil, sheet,
It is also possible to create a circuit pattern from a plate by punching or the like and then bond and integrate it with a resin layer on a metal plate. However, the thickness of the circuit layer must be 0.2 to 3 g.6 If the thickness is less than 0.2 a, the conventional thickness is 0.2 g. This is because it cannot be used for large currents and large voltages compared to applications in which circuit layers below IJEI were used, and if there are more than three layers, the reliability of the resin layer between the metal plate and the circuit layer decreases.

The present invention will be explained below based on examples.

Example 1 A laminate in which copper foil with a thickness of 0.2N was placed on the top surface of a steel plate with a thickness of 1.0a through two sheets of epoxy resin-impregnated glass cloth with a thickness of 0.111 was molded under a molding pressure of 40-116". A metal base laminate was obtained by heating and pressing at C for ω minutes.

The printed wiring board obtained by etching the copper foil surface of this metal base laminate to create a circuit pattern can be used as an inverter,
It could be used for large current and large voltage circuit boards such as switching devices.

Example 2 On the T-side of a 1.0 m thick aluminum plate, a thickness of 0.
A laminate in which a copper plate with a thickness of 2.5 at was arranged through three sheets of 1 Al epoxy resin-impregnated Galanu cloth was molded under a molding pressure of 4
A metal base laminate was obtained by heat and pressure molding at 160° C. for 90 minutes. A printed wiring board obtained by processing this metal base laminate in the same manner as in Example 1 could also be used for the same purposes as in Example 1.

Conventional example: The top surface of an aluminum plate with a thickness of 1.0Jl is coated with a thickness of 0.0JL.
Thickness 0.0mm through 1 piece of epoxy resin impregnated gaff cloth.
A laminate on which copper foil of 038jEI was arranged was heated and pressure-molded at 160°C for ω minutes at a molding pressure of 40 axes to obtain a metal base laminate, which was then treated in the same manner as in Example 1 to form a printed wiring board. However, it could not be used for large current and large voltage circuit boards such as inverters and switching devices.

〔Effect of the invention〕

Comparing the metal-based laminates of Examples 1 and 2 and the conventional example, it was found that the printed wiring boards obtained from the metal-based laminates of Examples 1 and 2 could be used for large current and high voltage circuit boards. It was confirmed that printed wiring boards obtained from conventional metal-based laminates could not be used as circuit boards for large currents and high voltages, and that the metal-based laminate of the present invention was superior.

Claims (2)

[Claims] (1) A metal base laminate, characterized in that a circuit layer with a thickness of 0.2 to 3 mm is disposed and integrated on the upper and/or lower surfaces of a metal plate via a resin layer. (2) The metal base laminate according to claim 1, wherein the circuit layer is made of copper.