JPS6256135A - Composite substrate for electricity - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Technical Field] The present invention can be used in electrical equipment, electronic equipment, computers, communication devices, etc.! This invention relates to a vapor phase composite substrate.

[Background technology]

Conventionally, for electrical composite boards used in electrical equipment that require both high frequency characteristics and heat dissipation, we have used fluororesin laminates, polyphenylene oxide resin laminates, etc. with excellent high frequency characteristics and metals with excellent heat dissipation. The base laminate is connected to the base laminate using a connector or the like, which poses problems in terms of area occupied and cost.

[Purpose of the invention]

An object of the present invention is to provide an electric/electronic composite substrate that can satisfy different characteristics with a single substrate.

[Disclosure of the invention]

The present invention relates to an electric/electronic composite board which is formed by laminating and molding a laminated body in which a resin-impregnated base material is disposed on the upper and lower surfaces of the base material, and metal foil is disposed on the upper and/or lower surfaces of the base material. Since this is a composite board for 11E41C, which is characterized by a parquet-like construction of materials, if each of the parquet-like materials is made of materials with different characteristics, it is possible to obtain different characteristics with a single board. The present invention will be described in detail below.

The base materials used in the present invention include copper, aluminum, iron, nickel, etc. alone, metal plates made of alloys in general, ceramic plates in general, phenolic resin, cresol resin, and epoxy resin.
Resin, unsaturated polyester resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideimide, polyphenylene sulfide, polyphenylene oxide, polysulfone, polybutylene terephthalate,
Polyether ether ketone, fluorinated resin, etc. alone, modified products, mixtures, etc. are added with solvents such as water, methyl alcohol, acetone, cyclohexanone, styrene, etc. as necessary to adjust the viscosity. Resin impregnated and dried in woven fabrics, non-woven fabrics, mats, paper, or combinations of these materials made of inorganic fibers, organic synthetic fibers such as polyester, polyamide, polyvinyl y μco, Acrylic 1 VI 6, and natural fibers such as cotton. A plurality of impregnated base materials and the like are arranged in a parquet style at required locations depending on the required characteristics. Next, the required number of resin-impregnated base materials as in the first stage are placed on the upper and lower surfaces of the base material, and metal foil made of copper, aluminum, iron, nickel alone, alloy, etc. is placed on the upper and lower surfaces. An electrical composite board is obtained by laminating and molding the laminate in which the laminate is disposed. As for the metal foil, an adhesive layer was formed on one side of the foil to improve adhesion), and it is also possible to perform an activation treatment.

An embodiment of the present invention will be described below based on an illustrated embodiment.

Embodiment FIG. 1 is a simplified sectional view showing an embodiment of the present invention. As shown in Figure 1, I/C1050imp x! 525
K next to aluminum plate 1 with xx and thickness of 1JIal
1050 m x 525 x 1 m thick polyphenylene oxide IJR sheet 2 was laid out on a flat aluminum plate 1
A glass cloth with a thickness of 0.18 SIl was impregnated with an epoxy resin containing a hardening agent on the top and bottom surfaces of the base material, which had a size of 1050 m x 1050 M with the resin plate 2, so that the resin foot was 421%. A laminate in which two dried resin-impregnated base materials 3 were placed on each layer and a copper foil 4 with a thickness of micrometers was placed on the upper surface was laminated for 90 minutes at 165°C under a molding pressure of W, and then electrically heated. A composite substrate was obtained.

Comparative Example A 1.6M thick single-sided copper foil-clad glass cloth base epoxy resin laminate was used as a comparative example.

〔Effect of the invention〕

As is clear from Table 1, the heat dissipation properties and high frequency properties of the electrical composite boards and laminates of Examples and Comparative Examples show that the performance of the present invention was good, confirming the superiority of the electrical composite boards of the present invention. .

Chapter 1 Table note This is the value after immersion treatment in warm water of 50"C for a certain period of time.

[Brief explanation of drawings]

FIG. 1 is a simplified sectional view showing one embodiment of the present invention. Reference numeral 1 is an aluminum plate, 2Fi polycarbonate nylene oxide M resin sheet, 3 is a resin-impregnated base material, and 4 is a copper foil.

Claims (2)

[Claims] (1) In an electrical composite board formed by laminating and molding a laminate in which resin-impregnated base materials are arranged on the upper and lower surfaces of the base material, and metal foil is further arranged on the upper and/or lower surfaces, the base material is An electrical composite board characterized by having a parquet-like structure made of materials. (2) The electrical composite board according to claim 1, wherein the base material is composed of a metal plate and a synthetic resin sheet.