JPH04170084A - Manufacture of printed wiring board - Google Patents

Abstract

PURPOSE:To manufacture a printed wiring board advantageous in manhour and cost by forming an electronic circuit forming part with an adhesive, and then bonding a conductive material to make an electronic circuit on an electronic circuit by plating. CONSTITUTION:An electronic circuit forming part is formed of an adhesive on the surface of an electrically insulating board, and then a conductive material is bonded, and further an electronic circuit is made on the electronic circuit by plating. As the electrically insulating board used here, phenol resin, cresol resin, or the like can be used, and as the adhesive, the resin used for the above electrically insulating board can be used as it is. As the conductive material, the conductive material at large, which has conductivity like an organic material such as carbon, and graphite, can be used. Furthermore, a circuit with a required thickness is made on the electronic circuit by electrolytic plating or the like. Hereby, there is no necessity of making a laminate plated with a metallic foil nor the necessity of removing the metal foil with which the whole surface is clad other than a necessary electronic circuit by etching, so the manhour and cost can be improved sharply.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing printed wiring boards used in electronic equipment, electrical equipment, computers, communication equipment, etc.

[Conventional technology]

Conventional printed wiring boards start from metal foil-clad laminates,
Electric circuits are formed by removing unnecessary parts from the surface of the laminate using an etching method, but this increases the number of man-hours and costs, and the number of man-hours required to recover metals such as copper removed by etching is also complicated and expensive. is.

[Problem that the invention seeks to solve]

As described in the prior art section, the method of forming an electric circuit from a metal foil-clad laminate using the etching method has problems in terms of man-hours and cost. The present invention has been made in view of the above-mentioned problems in the prior art, and its purpose is to provide a method for manufacturing printed wiring boards that is advantageous in terms of man-hours and cost.

[Means for solving problems]

The present invention is a method for producing a printed wiring board, which comprises forming an electrical circuit portion on the surface of an electrical insulating board with an adhesive, adhering a conductive material, and further forming an electrical circuit on the electrical circuit by plating. Therefore, there is no need to make a metal foil-clad laminate, and there is no need to etch away parts other than the necessary electrical circuits from the metal foil affixed to the entire surface, resulting in a significant reduction in man-hours and costs. The present invention will now be described in detail.

As the electrical insulating board used in the present invention, phenolic resin,
Cresol resin, epoxy resin, unsaturated polyester resin, polyimide, polybutadiene, polyphenylene oxide, polyphenylene sulfide, polyethylene terephthalate, polyethylene butylene terephthalate,
Resin plates made of general synthetic resins such as fluororesin alone, modified products, mixtures, etc., and base materials such as glass fibers, synthetic resin fibers, pulp fibers, ceramic fibers, woven fabrics, nonwoven fabrics, paper, etc. impregnated with these resins. These include resin-impregnated base material laminates, resin-coated metal plates whose metal surfaces are coated with electrically insulating materials, etc.
Any plate having electrical insulation properties may be used, but it is preferable that the plate has a thickness of 0.05 to 2 am from the viewpoint of strength. The upper surface and/or lower surface may be used as the surface of the electrically insulating plate. As the adhesive, the resin used for the electrically insulating board can be used as is, but it is not necessary to use the same type of resin as the electrically insulating board, and it is optional.

The resin used for electrical insulating boards may contain inorganic fillers such as aluminum hydroxide, talc, silica, alumina, calcium carbonate, magnesium carbonate, clay, glass fiber chips, asbestos, wood powder, bulbs, cotton powder, etc. as necessary. of fibrous fillers can be added. Conductive materials include organic conductive materials such as carbon and graphite, metallic conductive materials such as copper powder, silver powder, aluminum powder, brass materials, and ceramic conductive materials such as boronitride. Although any material can be used, micropowder of several microns is preferred.

Screen printing, letterpress printing, and gravure printing are preferably used to form the electrical circuit portion on the surface of the electrical insulating plate using an adhesive, but the method is not particularly limited. After adhering the conductive material, the adhesive is heated and cured as necessary.

Next, by forming a circuit with a necessary thickness on the electric circuit by electrolytic plating or the like, reliability of the electric circuit can be further improved. The present invention will be explained below based on examples.

〔Example〕

A planned electrical circuit was created by screen printing on the top surface of a 0.8 m thick unclad epoxy resin laminate using epoxy resin adhesive. Next, micropowder copper powder was sprinkled over the entire surface of the laminate, and then heated at 160°C for 60 minutes. After heating for a minute to harden the adhesive, remove the copper powder from the laminate with an air blower,
A lint wiring board was obtained by depositing copper to the required thickness on the circuit using electrolytic plating.

[Comparative example]

An electric circuit was formed using an etching method from a single-sided copper-clad epoxy resin laminate having a thickness of 0.8 mm to obtain a printed wiring board.

The performances of the printed wiring boards of Examples and Comparative Examples are shown in Table 1.

Chapter 1 Table Note: This is the ratio when this conventional example is set as 100.

〔Effect of the invention〕

The present invention is constructed as described above. In the method of manufacturing a printed wiring board having the structure described in the claims, the number of man-hours is shortened, the cost is reduced, and furthermore, the recovery process of the etching solution is not required, and the superiority of the present invention has been confirmed. .

Claims (1)

[Claims] (1) A method for manufacturing a printed wiring board, which comprises forming an electrical circuit portion on the surface of an electrical insulating board with an adhesive, adhering a conductive material, and further forming an electrical circuit on the electrical circuit by plating. .