JPH05129757A - Printed wiring board - Google Patents

Abstract

PURPOSE:To obtain a printed wiring board excellent in productivity by a method wherein a required electric circuit is formed of conductive wire through machine processing. CONSTITUTION:An electric circuit is formed of copper wire 0.5mm in diameter through machine processing on both the surfaces of a glass cloth base material flexible epoxy resin laminated board 0.6mm in thickness to obtain an inner material. Then, two epoxy resin glass prepregs 0.1mm in thickness are provided to the upside and/or the underside of the inner material, a copper foil 0.035mm in thickness is provided thereon as an outermost layer to form a laminate body, the laminate body is thermocompressed with a forming pressure of 30kg/cm<2> at a temperature of 160 deg.C for a 120 minutes to obtain a four-layered printed wiring board. By this setup, a printed wiring board excellent in productivity can be obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board used for electric equipment, electronic equipment, communication equipment, computing equipment and the like.

[0002]

2. Description of the Related Art In a conventional printed wiring board, a flat portion of an electric circuit portion is subjected to a metal foil etching treatment or a conductive paste printing treatment, and a through hole portion is opened by punching or drilling, and then the inside of the opening is plated. Or conducting treatment by filling conductive paste etc., but etching treatment,
There is a problem in that productivity is low due to the complexity of drilling, plating, and heat treatment.

[0003]

As described in the prior art, the conventional printed wiring board has a drawback of low productivity. The present invention has been made in view of the above-mentioned problems in the related art, and an object thereof is to provide a printed wiring board having excellent productivity.

[0004]

DISCLOSURE OF THE INVENTION The present invention has achieved the above object because it is a printed wiring board characterized in that a required electric circuit portion is formed of a conductive wire material by sewing machine processing. The invention will be described in detail.

The printed wiring board used in the present invention has a resin layer of epoxy resin type, phenol resin type, unsaturated polyester resin type, silicon resin type, polyphenylene sulfide resin type, polyethylene terephthalate resin type,
Polybutylene terephthalate resin-based, polyimide resin-based, polybutadiene resin-based, fluororesin-based, etc. alone, modified products, and general resins such as mixtures can be used, and if necessary, talc, clay, silica, calcium carbonate, water. Inorganic powder fillers such as aluminum oxide and fibrous fillers such as glass fibers, asbestos fibers, pulp fibers, synthetic fibers and ceramic fibers can be contained. As the substrate, use woven fabric, non-woven fabric, mat, paper, etc. of inorganic fibers such as glass and asbestos, organic fibers such as polyester, polyamide, polyacrylic, polyvinyl alcohol, polyimide, fluororesin and natural fibers such as cotton. You can As the outer layer material, a single-sided metal-clad laminate, a laminate having a circuit formed on only one side of a double-sided metal-clad laminate, or a single, alloy, or composite metal foil of copper, aluminum, brass, nickel, iron, or the like can be used. As the inner layer material, it is possible to use a required number of inner layer materials formed into a circuit on the electrical laminate of the above materials. Regarding the electric circuit part, the required electric circuit is formed by sewing the conductive fiber such as metal fiber, conductive ceramic fiber, conductive resin fiber, and conductive wire material such as metal wire rod, and the sewing process can be processed into prepreg. Although it is desirable, the material of the hard plate can be made flexible, or the hard plate can be processed by making a hole in advance. The processing of the sewing machine may be performed on the entire electric circuit portion by the above-mentioned processing method, or may be performed only on a necessary portion by the above-mentioned processing method and other portions may be by a conventional method such as an etching treatment.
The electric circuit portion includes an inner layer material circuit, an outer layer material circuit, a through hole portion, and the like.

The present invention will be described below based on examples.

[0007]

[Examples] An inner layer material was obtained by forming an electric circuit by sewing with a copper wire having a diameter of 0.5 mm on both surfaces of a 0.6 mm-thick glass cloth substrate flexible epoxy resin laminated plate.
Next, a laminate in which two 0.1 mm thick epoxy resin glass prepregs are arranged on the upper surface and / or the lower surface of the inner layer material, and a 0.035 mm thick copper foil is further arranged on the outermost side thereof, A four-layer printed wiring board was obtained by laminating and molding at 160 ° C. for 120 minutes at a molding pressure of 30 kg / cm ² .

[0008]

[Comparative Example] The same procedure as in the Example except that an inner layer material obtained by forming an electric circuit by etching treatment was used on both surfaces of a glass cloth substrate double-sided copper-clad epoxy resin laminate having a thickness of 0.6 mm. Thus, a 4-layer printed wiring board was obtained.

The performance of the printed wiring boards of Examples and Comparative Examples is as shown in Table 1.

[0010]

[Table 1] * Productivity is the ratio when the conventional productivity is 100.

[0011]

The present invention is constructed as described above.
The printed wiring board having the structure described in the claims has an effect of improving productivity.

Claims (1)

[Claims] 1. A printed wiring board in which a required electric circuit portion is formed of a conductive wire material by a sewing process.