JPH05283861A - Manufacture of multilayer printed-circuit board - Google Patents

Abstract

PURPOSE:To prevent positional deviation of an outer layer material and an inner layer material by opening a laminated board for the inner layer material according to the shrinkage factor of a special range, and heat-pressure-molding it together with prepreg and the outer layer material. CONSTITUTION:A laminated board for an inner layer material is opened in a position according to shrinkage factor of 0.01-0.1% at the time of secondary molding. That is, if it is opened with less than 0.01% of the factor, a deviation easily occurs, while if it exceeds 0.1% of the factor, the deviation also easily occurs. Inner layer materials for BVH, IVH are used as the laminated board for the inner layer material, and those of landless specification are particularly effective and preferable. As the heat pressure molding, a press, a vacuum press, a double-belt molding machine, etc., can be employed, but not particularly limited. As resin used for the laminated board for the inner layer material, the prepreg, and the outer layer material, general resins such as, epoxy resin, phenol resin or fluorine resin alone, or their modified materials, or their mixture can be used.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer printed wiring board used in electric equipment, electronic equipment, communication equipment, computing equipment and the like.

[0002]

2. Description of the Related Art A conventional multilayer printed wiring board has a prepreg on an upper surface and / or a lower surface of an inner layer material on which a circuit is formed in advance.
It is obtained by disposing the outer layer material into a body, so-called secondary molding.
Dimensional changes occur in the circuit position of the inner layer material due to the heat at the time of the next molding, and when the circuit is formed in the outer layer material, the positional relationship with the inner layer material is displaced, which is a problem especially in the multilayer printed wiring board with BVH and IVH. Was becoming.

[0003]

As described in the prior art, the conventional multilayer printed wiring board has a drawback that the circuit positional relationship between the outer layer material and the inner layer material after the secondary molding is likely to be displaced. . The present invention has been made in view of the above problems in the prior art, and an object of the present invention is to provide a highly accurate method for manufacturing a multilayer printed wiring board.

[0004]

According to the present invention, a laminated plate for an inner layer material is provided with holes corresponding to a shrinkage rate of 0.01 to 0.1% at the time of secondary molding, and is heated and pressed together with a prepreg and an outer layer material. The above object can be achieved because of the method for manufacturing a multilayer printed wiring board characterized by being molded. The present invention will be described in detail below.

The resin used for the laminate for inner layer material, prepreg and outer layer material used in the present invention includes epoxy resin type, phenol resin type, unsaturated polyester resin type, vinyl ester resin type, polyphenylene oxide resin type and silicone resin. System, polyphenylene sulfide resin system, polyethylene terephthalate resin system, polybutylene terephthalate resin system, polyimide resin system, polybutadiene resin system, fluororesin system, etc. alone, modified products, and general resins such as mixtures can be used, and if necessary Accordingly, an inorganic powder filler such as talc, clay, silica, calcium carbonate or aluminum hydroxide, or a fibrous filler such as glass fiber, asbestos fiber, pulp fiber, synthetic fiber or ceramic fiber may be contained. As the base material,
Inorganic fibers such as glass and asbestos, organic fibers such as polyester, polyamide, polyacryl, polyvinyl alcohol, polyimide and fluororesin, and natural fibers such as cotton can be used as woven fabrics, non-woven fabrics, mats and papers.
As metal foil, copper, aluminum, brass, nickel,
A single, alloy, or composite metal foil of iron or the like can be used. As the outer layer material, a single-sided metal foil-clad laminate, a double-sided metal foil-clad laminate, the above metal foil or the like can be used. It is necessary to open holes in the laminate for the inner layer material at positions corresponding to shrinkage rates of 0.01 to 0.1% at the time of secondary molding. That is, the shrinkage rate is 0.
If the opening is less than 01%, deviation is likely to occur, and the shrinkage ratio is 0.
This is because if it exceeds 1%, deviation is likely to occur. In the case of the inner layer material for BVH and IVH as the laminated plate for the inner layer material, and further in the case of the landless specification, it is particularly effective and preferable. As the heat and pressure molding, a press, a vacuum press, a double belt molding machine or the like can be used, and it is not particularly limited.

The present invention will be described below based on examples.

[0007]

Example A glass cloth base material double-sided copper-clad epoxy resin laminated board having a thickness of 0.6 mm has a shrinkage ratio of 0.
Two epoxy resin impregnated glass cloth prepregs with a thickness of 0.1 mm are respectively placed on the upper and lower surfaces of the inner layer material obtained by forming a circuit corresponding to 04%, and the outermost thickness is 0.035 m.
Molding pressure of 40 Kg / c
m ^2, 165 to obtain a four-layer printed wiring board is heated pressure molding for 90 minutes at ° C..

[0008]

[Comparative Example] 4 was processed in the same manner as in Example except that an inner layer material obtained by forming a circuit was used without considering the shrinkage rate of 0.04%.
A layer printed wiring board was obtained.

Table 1 shows the performance of the multilayer printed wiring boards of Examples and Comparative Examples.

[0010]

[Table 1]

[0011]

The present invention is constructed as described above.
In the method for manufacturing a multilayer printed wiring board having the structure described in the claims, there is an effect of eliminating the positional deviation between the outer layer material and the inner layer material.

Claims (2)

[Claims] 1. A shrinkage factor of 0.01 to 0.
A method for manufacturing a multilayer printed wiring board, characterized in that a hole corresponding to 1% is formed, and heat and pressure molding is performed together with a prepreg and an outer layer material. 2. A laminated board for an inner layer material is BVH and / or IVH.
The method for manufacturing a multilayer printed wiring board according to claim 1, wherein the method is an inner layer material for use.