JPH05337710A - Manufacture of multilayer printed circuit board - Google Patents

Abstract

PURPOSE:To enhance the positional accuracy in a pattern by driving a pin first at the side of a reference point and, after opening a hole, driving another opposite side pin made smaller than a hole gap size as far as a proportion equivalent to a variation and then performing drilling work. CONSTITUTION:A laminated body which is made up by installing two epoxy resin impregnated glass fiber prepreg sheets on both upper and lower surfaces of two internal layer materials obtained after forming each circuit on both sides of a glass fiber base material double-side coppered laminate of epoxy, and further installing copper foil at the outermost side, is heated, pressurized and molded, thereby manufacturing a 6-layered printed circuit board. A pin is first driven at the side of a reference point at the time of designing a circuit of this multilayer printed circuit board and, after opening a hole, another opposite side pin made smaller than a hole gap size is driven, and then drilling work is carried out, thereby manufacturing this multilayer PCB.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a multilayer wiring board used in electric equipment, electronic equipment, communication equipment, computing equipment and the like.

[0002]

2. Description of the Related Art In a conventional multi-layer wiring board, the inner layer circuit is shrunk and contracted by the secondary molding, so that the pitch of the reference holes for setting in the NC drill machine etc. also fluctuates. When the pin is pushed in by the same two-hole simultaneous pin driving machine, it is pushed while destroying the periphery of the hole. As a result, the pin is set up at a position different from the original position, thus degrading the positional accuracy of drilling.

[0003]

As described in the prior art, the conventional multi-layer wiring board has a drawback in that the positional accuracy of drilling is low. The present invention has been made in view of the above problems in the prior art, and an object of the present invention is to provide a method for manufacturing a multi-layer wiring board with good positional accuracy for making holes.

[0004]

According to the present invention, a pin is first driven into a reference point side during circuit design to open a hole, and then a pin on the opposite side having a size smaller than the inter-hole size corresponding to the variation is driven and then drilled. The above object can be achieved by the method for manufacturing a multilayer wiring board characterized by the above. The present invention will be described in detail below.

The resin used for the laminate for inner layer material, prepreg and outer layer material used in the present invention includes epoxy resin type, phenol resin type, unsaturated polyester resin type, vinyl ester resin type, polyphenylene oxide resin type and silicone resin. System, polyphenylene sulfide resin system, polyethylene terephthalate resin system, polybutylene terephthalate resin system, polyimide resin system, polybutadiene resin system, fluororesin system, etc. alone, modified products, and general resins such as mixtures can be used, and if necessary Accordingly, an inorganic powder filler such as talc, clay, silica, calcium carbonate or aluminum hydroxide, or a fibrous filler such as glass fiber, asbestos fiber, pulp fiber, synthetic fiber or ceramic fiber may be contained. As the base material,
Inorganic fibers such as glass and asbestos, organic fibers such as polyester, polyamide, polyacryl, polyvinyl alcohol, polyimide and fluororesin, and natural fibers such as cotton can be used as woven fabrics, non-woven fabrics, mats and papers.
The metal foil is copper, aluminum, brass, nickel,
A single, alloy, or composite metal foil of iron or the like can be used. As the outer layer material, a single-sided metal foil-clad laminate, a double-sided metal foil-clad laminate, the above metal foil or the like can be used. Thus, the pins are first punched at the reference point side in the circuit design of the multilayer wiring board obtained by laminating and molding the above materials with a press, a vacuum press, a double belt molding machine, etc., and then made smaller than the inter-hole size corresponding to the variation. A hole is drilled after the pin on the opposite side is driven. 20-100 equivalent to variation
It is desirable to look at the micron.

The present invention will be described below based on examples.

[0007]

[Example] A glass cloth base material having a thickness of 0.6 mm and two inner layer materials obtained by forming a circuit on both sides of a double-sided copper-clad epoxy resin laminated board, and an epoxy resin-impregnated glass cloth having a thickness of 0.1 mm on the upper and lower surfaces of the inner layer material. Thickness of 0.03 on the outermost side through two prepregs
Molding pressure of 40Kg for laminates with 5mm copper foil
/ Cm ² at 165 ° C. for 90 minutes under heat and pressure to obtain a 6-layer wiring board. First, a pin is driven into the reference point side of the multilayer wiring board when designing a circuit, and then a hole is formed, which is 50 microns smaller than the hole-to-hole dimension. Then, a pin on the opposite side was driven and then punched to obtain a multilayer wiring board.

[0008]

[Comparative Example] A multilayer wiring board was obtained in the same manner as in Example, except that the diameter of the pin on the opposite side was made the same as the hole-to-hole dimension and then drilling was performed.

Table 1 shows the results of the maximum deviation between the pattern and the hole in the vicinity of the reference guide of the multilayer wiring boards of Examples and Comparative Examples in microns.

[0010]

[Table 1]

[0011]

The present invention is constructed as described above.
In the method for manufacturing a multilayer wiring board having the structure described in the claims, there is an effect that the positional accuracy is improved.

Claims (1)

[Claims] 1. A multilayer wiring board characterized in that after a pin is first driven into a reference point side in circuit design and a hole is formed, a pin on the opposite side having a size smaller than the inter-hole size corresponding to the variation is driven and then a hole is formed. Manufacturing method.