JPH0570953B2 - - Google Patents
Info
- Publication number
- JPH0570953B2 JPH0570953B2 JP59239927A JP23992784A JPH0570953B2 JP H0570953 B2 JPH0570953 B2 JP H0570953B2 JP 59239927 A JP59239927 A JP 59239927A JP 23992784 A JP23992784 A JP 23992784A JP H0570953 B2 JPH0570953 B2 JP H0570953B2
- Authority
- JP
- Japan
- Prior art keywords
- laminate
- prepreg
- base material
- resin
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 18
- 239000011162 core material Substances 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000011888 foil Substances 0.000 claims description 12
- 239000004745 nonwoven fabric Substances 0.000 claims description 11
- 239000002759 woven fabric Substances 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 description 12
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 238000005553 drilling Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 239000004744 fabric Substances 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000002966 varnish Substances 0.000 description 3
- 230000005856 abnormality Effects 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
【発明の詳細な説明】
［技術分野］
本発明はドリル加工性に優れた多層印刷配線板
用基板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a multilayer printed wiring board substrate with excellent drillability.
［背景技術］
従来、多層印刷配線板に使用する基板を製造す
るにあたつては、ガラス織布にエポキシ樹脂を含
浸・乾燥させて形成したプリプレグの表裏両面に
銅箔等の金属箔を積層して積層板を作成し、次い
でこの積層板の表裏両面に上記と同構成のプリプ
レグを介して金属箔を積載圧締して多層印刷配線
板用基板を作成しているものであつた。このよう
に従来の基板にあつては、内層コアー材としてガ
ラス織布に樹脂を含浸・乾燥させて形成したプリ
プレグを使用していたため、スルーホール用の孔
あけ加工性が悪く、ドリルの孔あけ刃の寿命が短
く、またスルーホールの内壁面が粗くて品質が劣
るという問題があつた。[Background technology] Conventionally, in manufacturing substrates used in multilayer printed wiring boards, metal foils such as copper foils are laminated on both sides of prepreg, which is formed by impregnating epoxy resin into woven glass cloth and drying it. A laminate was created by doing this, and then metal foil was stacked and pressed on both the front and back sides of the laminate via prepreg having the same structure as described above to create a substrate for a multilayer printed wiring board. In this way, conventional boards use prepreg, which is made by impregnating a glass woven fabric with resin and drying it, as the inner layer core material, which makes it difficult to drill holes for through-holes, making it difficult to drill holes with a drill. There were problems in that the life of the blade was short and the inner wall surface of the through hole was rough, resulting in poor quality.
［発明の目的］
本発明は上記の点に鑑みて成されたものであつ
て、ドリル刃の寿命を長くすることができ、また
基板の品質を向上することができる多層印刷配線
板用基板を提供することを目的とするものであ
る。[Object of the Invention] The present invention has been made in view of the above points, and provides a substrate for a multilayer printed wiring board that can extend the life of a drill blade and improve the quality of the substrate. The purpose is to provide
［発明の開示］
すなわち、本発明の多層印刷配線板用基板は、
樹脂が含浸された不織布のみを基材とする内層コ
アー材１の両面に金属箔２，２を積層して形成さ
れた積層板３の両面に樹脂が含浸された織布を基
材とする外層プリプレグ４，４を介して金属箔７
が設けられた外層材８を積層して成ることを特徴
とするもので、内層コアー材１の基材として不織
布を用いることにより上記目的を達成したもので
ある。[Disclosure of the Invention] That is, the multilayer printed wiring board substrate of the present invention includes:
Inner layer whose base material is only nonwoven fabric impregnated with resin; outer layer whose base material is woven fabric impregnated with resin on both sides of a laminate plate 3 formed by laminating metal foils 2, 2 on both sides of core material 1; Metal foil 7 via prepregs 4, 4
It is characterized by being formed by laminating outer layer materials 8 provided with.The above object is achieved by using a nonwoven fabric as the base material of the inner layer core material 1.
以下本発明を詳細に説明する。基材に使用する
不織布としては、ガラス、アスベスト等の無機繊
維あるいはポリアミド、ポリエステル等の合成樹
脂繊維、紙等の天然繊維の単独もしくは混紡によ
る布や不織布又はマツトであり、繊維を合成樹脂
バインダーで結合させたものや繊維の絡みを利用
したものも含めるものとする。また、樹脂として
はエポキシ樹脂、ポリイミド等を使用することが
でき、これら樹脂の単独もしくは無機充填剤を混
合したものを使用することができるものである。
上記不織布の基材にこれらの樹脂を含浸・乾燥さ
せてプリプレグ６を形成し、このプリプレグ６の
両面に銅箔等の金属箔２を積層して積層板３を作
成する。次いで、この積層板３を表裏面に回路を
形成した後、第１図に示すように積層板３の表裏
両面にそれぞれ外層プリプレグ４，４を介して銅
箔等の金属箔７，７が貼着された外層材８を積載
し、加熱加圧成形して多層印刷配線板用基板を得
るものである。外層プリプレグ４としては、ガラ
ス織布等に樹脂を含浸・乾燥させて形成したプリ
プレグを用いるものである。このように外層プリ
プレグ４を織布で形成し、積層板３の表裏に積層
することによつて、内層コアー材を不織布で作成
したにもかかわらず、配線板としての強度の性能
を確保できるものである。 The present invention will be explained in detail below. The nonwoven fabric used for the base material is cloth, nonwoven fabric, or mat made of inorganic fibers such as glass and asbestos, synthetic resin fibers such as polyamide and polyester, and natural fibers such as paper, alone or in combination, or matte. This also includes those that are bonded and those that utilize the entanglement of fibers. Further, as the resin, epoxy resin, polyimide, etc. can be used, and these resins can be used alone or in combination with an inorganic filler.
A prepreg 6 is formed by impregnating and drying these resins into the nonwoven fabric base material, and a laminate 3 is created by laminating metal foil 2 such as copper foil on both sides of this prepreg 6. Next, after circuits are formed on the front and back sides of this laminate 3, metal foils 7, 7 such as copper foil are pasted on both the front and back sides of the laminate 3 via outer prepregs 4, 4, respectively, as shown in FIG. The attached outer layer material 8 is stacked and heated and press-molded to obtain a substrate for a multilayer printed wiring board. As the outer layer prepreg 4, a prepreg formed by impregnating a glass woven cloth or the like with a resin and drying it is used. By forming the outer layer prepreg 4 of woven fabric and laminating it on the front and back sides of the laminate 3, the strength performance as a wiring board can be ensured even though the inner layer core material is made of non-woven fabric. It is.
しかして、積層板３のコアー材１に使用した基
材として不織布を用いることにより、織布のみを
基材として形成した積層板に比してドリル加工性
に優れており、従つて多層印刷配線板用基板のド
リルの孔あけ刃の寿命が長くなり、又ドリル内壁
面の粗さが良くなつて（内壁面の凹凸が小さくな
り）、スルーホールめつきが確実にでき、またス
ルーホール部の内層接続不良などを起こすことも
なくなり、基板の品質を向上することができるも
のである。また、不織布を基材としたプリプレグ
６を用いることにより、内層コアー材１のコスト
ダウンを図ることができるものである。さらに、
内層コアー材１の孔あけ加工性が良いために、ド
リル加工に代えパンチング加工ができるようにな
り、生産性を向上することができるものである。 Therefore, by using a nonwoven fabric as the base material for the core material 1 of the laminate 3, it is superior in drilling workability compared to a laminate formed using only woven fabric as a base material, and therefore, multilayer printed wiring The life of the drilling blade of the drill for plate substrates has been extended, and the roughness of the inner wall surface of the drill has been improved (the unevenness of the inner wall surface has become smaller). This eliminates the possibility of internal layer connection failures and improves the quality of the board. Further, by using the prepreg 6 made of nonwoven fabric as a base material, it is possible to reduce the cost of the inner layer core material 1. moreover,
Since the inner layer core material 1 has good hole-drilling properties, punching can be performed instead of drilling, and productivity can be improved.
以下本発明を実施例に基づいて具体的に説明す
る。 The present invention will be specifically described below based on examples.
実施例
内層コアー材として75ｇ／m2のガラス不織布に
エポキシ樹脂ワニスを含浸・乾燥させて700ｇ／
m2のプリプレグを得た。このプリプレグ１枚の両
側に0.070mmの銅箔を置き、金属プレート間には
さんで圧力40Kg／cm2、温度170℃で100分積層成形
し、厚さ0.5mmの銅張積層板を得、この積層板の
表面に回路を形成しておく。Example: As the inner layer core material, 700g/ m2 of glass nonwoven fabric was impregnated with epoxy resin varnish and dried.
m2 prepreg was obtained. A 0.070 mm copper foil was placed on both sides of this prepreg sheet, sandwiched between metal plates, and laminated and molded for 100 minutes at a pressure of 40 Kg/cm 2 and a temperature of 170°C to obtain a 0.5 mm thick copper clad laminate. A circuit is formed on the surface of this laminate.
一方、200ｇ／m2のガラス織布にエポキシ樹脂
ワニスを含浸・乾燥させて400ｇ／m2の樹脂含浸
プリプレグを得、このプリプレグを上記銅張積層
板の両側に各２枚ずつ重ね、さらにその外側に
0.035mm厚の銅箔を重ね、上記積層板と同じ条件
で積層成形して厚さ1.4mmの４層印刷配線板用基
板を得た。 On the other hand, a 200 g/m 2 glass woven fabric was impregnated with epoxy resin varnish and dried to obtain a 400 g/m 2 resin-impregnated prepreg, and two sheets of this prepreg were stacked on each side of the copper-clad laminate, and then to the outside
Copper foils with a thickness of 0.035 mm were stacked and laminated and molded under the same conditions as the above laminate to obtain a 4-layer printed wiring board substrate with a thickness of 1.4 mm.
次に、上記で得られた多層印刷配線板用基板の
耐熱性とドリルで孔あけした際のスルーホール内
壁の粗さを検査した。その経過、260℃半田20秒
フロートにおいて異常なく、また内層コアー材の
内壁面の粗さは10000ヒツトで10μであつた。 Next, the heat resistance of the multilayer printed wiring board substrate obtained above and the roughness of the inner wall of the through hole when the hole was drilled were examined. There was no abnormality during the soldering process at 260°C for 20 seconds, and the roughness of the inner wall surface of the inner core material was 10μ after 10,000 hits.
従来例
内層コアー材として200ｇ／m2のガラス織布に
エポキシ樹脂ワニスを含浸・乾燥させて400ｇ／
m2の樹脂含浸プリプレグを得た。このプリプレグ
２枚の両側に0.070mmの銅箔を置き、金属プレー
ト間にはさんで圧力40Kg／cm2、温度170℃で100分
積層成形し、厚さ0.5mmの銅張積層板を得た。次
に、この銅張積層板の両側に上記と同構成のプリ
プレグを各２枚ずつ重ね、さらにその外側に
0.035mm厚の銅箔を重ね、上記積層板と同じ条件
で積層成形して圧さ1.4mmの４層印刷配線板用基
板を得た。Conventional example: As the inner layer core material, 400 g/ m2 of glass woven fabric is impregnated with epoxy resin varnish and dried.
m 2 of resin-impregnated prepreg was obtained. Copper foil of 0.070 mm was placed on both sides of these two sheets of prepreg, sandwiched between the metal plates, and laminated and molded for 100 minutes at a pressure of 40 Kg/cm 2 and a temperature of 170°C to obtain a copper-clad laminate with a thickness of 0.5 mm. . Next, two sheets of prepreg with the same structure as above are stacked on each side of this copper-clad laminate, and then
Copper foils with a thickness of 0.035 mm were stacked and laminated and molded under the same conditions as the above laminate to obtain a four-layer printed wiring board substrate with a thickness of 1.4 mm.
次に、従来例の多層印刷配線板用基板の耐熱性
とドリルで孔あけした際のスルーホール内壁の粗
さを検査した。その結果、耐熱性は異常なく、ま
た内層コアー材の内壁面の粗さは10000ヒツトで
15μであつた。 Next, the heat resistance of the conventional multilayer printed wiring board substrate and the roughness of the inner wall of the through hole when the hole was drilled were examined. As a result, there was no abnormality in heat resistance, and the roughness of the inner wall surface of the inner core material was 10,000 hits.
It was 15μ.
［発明の効果］
上記のように本発明は、樹脂が含浸された不織
布のみを基材とする内層コアー材の両面に金属箔
を積層して積層板を形成し、この積層板に樹脂が
含浸された織布を基材とする外層プリプレグを介
して金属箔が貼着された外層材を積層したので、
基板の耐熱性を損なうことなくドリル加工性を上
げることができ、ドリルの孔あけ刃の寿命を長く
することができる上に、スルーホール内壁面の粗
さが良くなつて多層印刷配線板の品質を向上する
ことができるものである。[Effects of the Invention] As described above, the present invention forms a laminate by laminating metal foil on both sides of an inner core material whose base material is only a nonwoven fabric impregnated with a resin, and this laminate is impregnated with a resin. The outer layer material with metal foil attached was laminated through the outer layer prepreg, which is made of woven fabric as a base material.
Drill workability can be improved without compromising the heat resistance of the board, the life of the drill bit can be extended, and the roughness of the inner wall surface of the through hole can be improved, improving the quality of multilayer printed wiring boards. This is something that can be improved.
第１図は本発明一実施例の概略分解断面図、第
２図は同上の積層板の一部切欠断面図ｂである。
１は内層コアー材、２は金属箔、３は積層板、
７は金属箔、８は外層材である。
FIG. 1 is a schematic exploded sectional view of one embodiment of the present invention, and FIG. 2 is a partially cutaway sectional view b of the same laminated plate. 1 is an inner layer core material, 2 is a metal foil, 3 is a laminate,
7 is a metal foil, and 8 is an outer layer material.
Claims (1)
層コアー材の両面に金属箔を積層して形成された
積層板の両面に樹脂が含浸された織布を基材とす
る外層プリプレグを介して金属箔が設けられた外
層材を積層して成ることを特徴とする多層印刷配
線板用基材。1 Through the outer prepreg layer, which has a resin-impregnated woven fabric as a base material, on both sides of the laminate, which is formed by laminating metal foil on both sides of an inner layer core material whose base material is only a resin-impregnated nonwoven fabric. A base material for a multilayer printed wiring board characterized by laminating outer layer materials provided with metal foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23992784A JPS61117883A (en) | 1984-11-14 | 1984-11-14 | Multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23992784A JPS61117883A (en) | 1984-11-14 | 1984-11-14 | Multilayer printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61117883A JPS61117883A (en) | 1986-06-05 |
| JPH0570953B2 true JPH0570953B2 (en) | 1993-10-06 |
Family
ID=17051907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23992784A Granted JPS61117883A (en) | 1984-11-14 | 1984-11-14 | Multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61117883A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61174796A (en) * | 1985-01-30 | 1986-08-06 | 新神戸電機株式会社 | Manufacture of multilayer circuit board |
| JPS6338298A (en) * | 1986-08-04 | 1988-02-18 | 松下電工株式会社 | Multilayer printed interconnection board |
| JPH0831693B2 (en) * | 1990-04-25 | 1996-03-27 | 新神戸電機株式会社 | Multilayer printed wiring board |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51661A (en) * | 1974-06-21 | 1976-01-06 | Matsushita Electric Works Ltd | DOBARISE KISOBAN |
| JPS5133163A (en) * | 1974-08-15 | 1976-03-22 | Sumitomo Bakelite Co | Tasobanno seizohoho |
| JPS5187770A (en) * | 1975-01-31 | 1976-07-31 | Matsushita Electric Works Ltd | TASOPURINTOHAISENBANNO SEIZOHO |
| JPS5189154A (en) * | 1975-01-31 | 1976-08-04 | ||
| JPS5260962A (en) * | 1975-11-14 | 1977-05-19 | Matsushita Electric Works Ltd | Method of producing copper surface layer board |
| JPS5574190A (en) * | 1978-11-29 | 1980-06-04 | Sharp Corp | Photoelectro-converting semiconductor device |
| JPS5574199A (en) * | 1978-11-28 | 1980-06-04 | Mitsubishi Gas Chemical Co | Method of fabricating multilayer printed circuit board |
| JPS57129000A (en) * | 1981-02-03 | 1982-08-10 | Mitsubishi Gas Chemical Co | Method of producing multilayer printed circuit board |
| JPS5823760A (en) * | 1981-08-05 | 1983-02-12 | Takeda Chem Ind Ltd | Crushed rind of fruit of citrus |
| JPS58122862A (en) * | 1982-01-15 | 1983-07-21 | 松下電工株式会社 | Manufacture of composite copper lined laminated board |
| JPS58151093A (en) * | 1982-03-02 | 1983-09-08 | 日本無機繊維工業株式会社 | Glass paper for printed circuit board |
| JPS58210691A (en) * | 1982-05-31 | 1983-12-07 | 松下電工株式会社 | Method of producing metal foil-lined laminated board |
| JPS59125699A (en) * | 1983-01-06 | 1984-07-20 | 松下電工株式会社 | Method of producing multilayer printed circuit board |
| JPS6158733A (en) * | 1984-08-31 | 1986-03-26 | 東芝ケミカル株式会社 | Inner layer board for multilayer substrate |
-
1984
- 1984-11-14 JP JP23992784A patent/JPS61117883A/en active Granted
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51661A (en) * | 1974-06-21 | 1976-01-06 | Matsushita Electric Works Ltd | DOBARISE KISOBAN |
| JPS5133163A (en) * | 1974-08-15 | 1976-03-22 | Sumitomo Bakelite Co | Tasobanno seizohoho |
| JPS5187770A (en) * | 1975-01-31 | 1976-07-31 | Matsushita Electric Works Ltd | TASOPURINTOHAISENBANNO SEIZOHO |
| JPS5189154A (en) * | 1975-01-31 | 1976-08-04 | ||
| JPS5260962A (en) * | 1975-11-14 | 1977-05-19 | Matsushita Electric Works Ltd | Method of producing copper surface layer board |
| JPS5574199A (en) * | 1978-11-28 | 1980-06-04 | Mitsubishi Gas Chemical Co | Method of fabricating multilayer printed circuit board |
| JPS5574190A (en) * | 1978-11-29 | 1980-06-04 | Sharp Corp | Photoelectro-converting semiconductor device |
| JPS57129000A (en) * | 1981-02-03 | 1982-08-10 | Mitsubishi Gas Chemical Co | Method of producing multilayer printed circuit board |
| JPS5823760A (en) * | 1981-08-05 | 1983-02-12 | Takeda Chem Ind Ltd | Crushed rind of fruit of citrus |
| JPS58122862A (en) * | 1982-01-15 | 1983-07-21 | 松下電工株式会社 | Manufacture of composite copper lined laminated board |
| JPS58151093A (en) * | 1982-03-02 | 1983-09-08 | 日本無機繊維工業株式会社 | Glass paper for printed circuit board |
| JPS58210691A (en) * | 1982-05-31 | 1983-12-07 | 松下電工株式会社 | Method of producing metal foil-lined laminated board |
| JPS59125699A (en) * | 1983-01-06 | 1984-07-20 | 松下電工株式会社 | Method of producing multilayer printed circuit board |
| JPS6158733A (en) * | 1984-08-31 | 1986-03-26 | 東芝ケミカル株式会社 | Inner layer board for multilayer substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61117883A (en) | 1986-06-05 |
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