JPH0265193A - Multilayer printed board with built-in metal core - Google Patents
Multilayer printed board with built-in metal coreInfo
- Publication number
- JPH0265193A JPH0265193A JP21811088A JP21811088A JPH0265193A JP H0265193 A JPH0265193 A JP H0265193A JP 21811088 A JP21811088 A JP 21811088A JP 21811088 A JP21811088 A JP 21811088A JP H0265193 A JPH0265193 A JP H0265193A
- Authority
- JP
- Japan
- Prior art keywords
- metal core
- prepregs
- glass
- built
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 title claims abstract description 30
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 30
- 239000011521 glass Substances 0.000 claims abstract description 34
- 229920005989 resin Polymers 0.000 claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 22
- 239000000945 filler Substances 0.000 claims abstract description 15
- 239000004745 nonwoven fabric Substances 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 9
- 238000004898 kneading Methods 0.000 claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 18
- 229910052802 copper Inorganic materials 0.000 abstract description 11
- 239000010949 copper Substances 0.000 abstract description 11
- 239000011889 copper foil Substances 0.000 abstract description 7
- 239000004744 fabric Substances 0.000 abstract description 6
- 238000005476 soldering Methods 0.000 abstract description 6
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 6
- 238000010030 laminating Methods 0.000 abstract description 4
- 239000011888 foil Substances 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 abstract description 2
- 238000013459 approach Methods 0.000 abstract 1
- 238000005336 cracking Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 235000011962 puddings Nutrition 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000009824 pressure lamination Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
Abstract
Description
【発明の詳細な説明】
〔概 要〕
金属コア内蔵型多層プリント基板に関し、該プリント基
板の金属コアのクリアランスホール部に於いて、加圧積
層されたプリプレグの樹脂に亀裂が発生するのを防１ヒ
するのを目的とし、金属コアの両面に、ガラスフィラー
と樹脂を混練した材料をガラス不織布に含浸して形成し
たプリプレグを、加圧加熱積層して形成したことて構〔
産業上の利用分野〕
本発明は金属コア内蔵型多層プリント基板に関する。[Detailed Description of the Invention] [Summary] Regarding a multilayer printed circuit board with a built-in metal core, this invention prevents the occurrence of cracks in the resin of prepreg laminated under pressure in the clearance hole portion of the metal core of the printed circuit board. A prepreg made by impregnating a glass non-woven fabric with a material made by kneading glass filler and resin is laminated on both sides of a metal core under pressure and heat for the purpose of one heat treatment.
INDUSTRIAL APPLICATION FIELD The present invention relates to a multilayer printed circuit board with a built-in metal core.
信号線や電源となる銅板を内蔵したプリント基板や、プ
リント基板の熱放散を良好にするために銅板を内蔵した
金属コア内蔵型多層プリント基板が開発されている。Printed circuit boards with built-in copper plates for signal lines and power supplies, and multilayer printed circuit boards with built-in metal cores that have copper plates built in to improve the heat dissipation of printed circuit boards, have been developed.
従来の金属コア内蔵型多層プリント基板は第２図（ａ）
に示すように信号線、電源あるいは熱放散用となる厚さ
０．５ｍｍ程度の銅板１＾、ＩＢ、ＩＣ，１０に第２図
（ｂ）に示すように、後の工程で形成するスルーホール
と接続を採らないようにするだめのクリアランスホール
２の孔加工を施し、更に第２図（Ｃ）に示すように、該
クリアランスホールの孔加工を施した銅板ＩＡ、ＩＢ、
ＩＣ，１０の両面にガラス繊維を布状に繊ったガラス
織布にエポキシ樹脂を含浸させたプリプレグ３を積層し
た後、最上層および最下層にｉ同箔４を設置し、これら
のｉ同板１、フ゛すプレグ３および銅箔４を加圧加熱積
層する。A conventional multilayer printed circuit board with a built-in metal core is shown in Figure 2 (a).
As shown in Fig. 2(b), there are through-holes to be formed in a later process in the copper plate 1^, IB, IC, 10 with a thickness of about 0.5 mm for signal lines, power supply or heat dissipation, as shown in Fig. 2(b). As shown in FIG. 2(C), the copper plates IA, IB,
After laminating prepreg 3, which is a glass fabric made of glass fiber woven into a cloth-like shape and impregnated with epoxy resin, on both sides of the IC, 10, an i-double foil 4 is placed on the top and bottom layers. The plate 1, the fiss preg 3 and the copper foil 4 are laminated under pressure and heat.
次いで第２図（Ｃ）に示すように加圧加熱積層したプリ
ント基板を貫通するスルーホール５を形成し、該スルー
ホール５内に無電解銅メツキおよび電解銅メツキにより
スルーホール内導体６を形成して金属コア内蔵型プリン
ト基板を形成している。Next, as shown in FIG. 2(C), a through hole 5 is formed through the printed circuit board laminated under pressure and heat, and a conductor 6 in the through hole is formed in the through hole 5 by electroless copper plating and electrolytic copper plating. A printed circuit board with a built-in metal core is formed.
ところで上記したプリント基板の金属コアとなる銅板１
八、 ＩＢ、 ＩＣ，１０の厚さは、０．５ ｍｍ程度
の厚さがあり、これらＳ同キ反ＩＡ、ＩＢ、ＩＣ，ＩＤ
、プリプレグおよび銅箔４を加圧積層した場合、第２
図（Ｃ）に示すように、クリアランスホール２部に於い
て、プリプレグより加圧されてガラス布より滲み出た樹
脂の占める容積が、４０〜５０μｍの薄い銅箔を中間層
として用いた金属コア内蔵型でない通常の多層プリント
基板に比較して大になる。By the way, the copper plate 1 that becomes the metal core of the printed circuit board mentioned above
8. The thickness of IB, IC, 10 is about 0.5 mm, and these S and IA, IB, IC, ID
, when the prepreg and copper foil 4 are laminated under pressure, the second
As shown in Figure (C), in the second part of the clearance hole, the volume occupied by the resin that oozed out from the glass cloth under pressure from the prepreg is 40 to 50 μm, which is a metal core using a thin copper foil as an intermediate layer. It is larger than a normal multilayer printed circuit board that is not built-in.
この積層時に於けるプリプレグのガラス布より滲み出た
樹脂の熱膨張係数は、銅板１の熱膨張係数より大である
ため、その後のプリント基板に電子部品を実装するため
の半田付けの際のプリント基板の加熱時と該プリント基
板が常温になる間の温度差によって、前記銅板１と樹脂
の間の熱膨張係数の差によってクリアランスホール２部
に於ける樹脂の内部に亀裂を発生する問題を生じる。The coefficient of thermal expansion of the resin exuding from the prepreg glass cloth during this lamination is larger than that of the copper plate 1, so it is difficult to print during soldering to mount electronic components on the printed circuit board. Due to the temperature difference between when the board is heated and when the printed circuit board reaches room temperature, the difference in thermal expansion coefficient between the copper plate 1 and the resin causes a problem of cracks occurring inside the resin in the clearance hole 2 part. .
本発明は上記した問題点を除去し、金属コア内蔵型多層
プリント基板に於けるように、厚さの分厚い金属コアを
用いた場合に於いて、金属コアのクリアランスホール部
の樹脂に亀裂が入らないようにした多層金属コア内蔵型
プリント基板の提供を目的とする。The present invention eliminates the above-mentioned problems and prevents cracks from forming in the resin in the clearance hole portion of the metal core when a thick metal core is used, such as in a multilayer printed circuit board with a built-in metal core. The purpose of the present invention is to provide a printed circuit board with a built-in multilayer metal core that avoids the occurrence of oxidation.
［課題を解決するための手段〕
上記目的を達成する本発明のプリン） ７Ｓ板は、金属
コアの両面に、ガラスフィラーと樹脂を混練した材料を
ガラス不織布に含浸して形成したプリプレグを、加圧加
熱積層して形成したことで構成する。[Means for Solving the Problems] The pudding of the present invention that achieves the above objects) The 7S plate is made by applying prepreg, which is formed by impregnating glass nonwoven fabric with a material obtained by kneading glass filler and resin, on both sides of a metal core. It is constructed by laminating layers under pressure and heat.
本発明のプリント基板は、プリプレグとしてガラス不織
布にガラスフィラーと熱硬化性樹脂を混練した材料を含
浸させて形成し、このプリプレグを用いることで、積層
時にガラス不織布より滲み出たガラスフィラーと熱硬化
性樹脂の混合物の熱膨張係数の値が、樹脂自体の熱膨張
係数の値より低（なり、金属コアの熱膨張係数に近接し
た値となるため、電子部品の実装の際の半田付は作業時
に於いて金属コアのクリアランスホール部に於ける樹脂
に亀裂を発生することが少なくなる。The printed circuit board of the present invention is formed by impregnating a glass nonwoven fabric with a material obtained by kneading a glass filler and a thermosetting resin as a prepreg, and by using this prepreg, the glass filler that oozes out from the glass nonwoven fabric during lamination can be removed by thermosetting. The coefficient of thermal expansion of the mixture of plastic resins is lower than the coefficient of thermal expansion of the resin itself (and is close to the coefficient of thermal expansion of the metal core), so soldering when mounting electronic components is difficult. Occasionally, cracks are less likely to occur in the resin at the clearance hole portion of the metal core.
以下、図面を用いて本発明の一実施例につき詳細に説明
する。Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings.
第１図は本発明の金属コア内蔵型多層プリント基板の断
面図である。FIG. 1 is a sectional view of a multilayer printed circuit board with a built-in metal core according to the present invention.
図示するようにクリアランスホールＩＩが形成された厚
さが０．５ｍｍ程度の銅板よりなる金属コア１２の両面
には、本発明のガラス不織布にガラスフィラーと熱硬化
性樹脂の混練した材料を含浸して形成したプリプレグ１
３が設置され、これらのプリプレグ１３の最上層、およ
び最下層に銅箔１４が設置され、これら金属コア１２、
プリプレグ１３および銅箔Ｉ４が加熱加圧積層されて金
属コア内蔵型多層プリント基板が形成されている。As shown in the figure, both surfaces of a metal core 12 made of a copper plate with a thickness of about 0.5 mm and in which clearance holes II are formed are impregnated with a material obtained by kneading the glass nonwoven fabric of the present invention with a glass filler and a thermosetting resin. Prepreg 1 formed by
3 is installed, copper foil 14 is installed on the top layer and the bottom layer of these prepregs 13, and these metal cores 12,
The prepreg 13 and the copper foil I4 are laminated under heat and pressure to form a multilayer printed circuit board with a built-in metal core.
このプリプレグの製造は、ガラス不織布（ガラスフィラ
ーが布状に織られておらず、ガラスペーパーの状態に成
っている）に、ガラスフィラーを熱硬化性樹脂に混練し
た材料を含浸させて形成されている。このガラスフィラ
ーは、ガラスフィラメントを砕いたもので、直径が５〜
９μｍで、平均の長さが４０μｍの形状を呈しており、
表面に化学処理をして樹脂との密着性を良好にするため
のシラン系カップリング処理剤による処理を施しており
、かつ低誘電率でＪｉｓ規格で単位Ｅと称するＥガラス
を用いて形成している。This prepreg is manufactured by impregnating a glass nonwoven fabric (glass filler is not woven into a cloth, but in the form of glass paper) with a material in which glass filler is kneaded with thermosetting resin. There is. This glass filler is made from crushed glass filament, and has a diameter of 5 to 5.
It has a shape of 9 μm and an average length of 40 μm,
The surface is chemically treated with a silane coupling treatment agent to improve adhesion with the resin, and it is formed using E glass, which has a low dielectric constant and is referred to as unit E in the JIS standard. ing.
また従来のようにガラス織布を用いて、このガラス織布
にエポキシ樹脂を含浸させたプリプレグに代わって、ガ
ラス不織布を用いた理由は、加圧積層時にガラス織布で
は、ガラスフィラーが分散され難く、ガラス織布を用い
た際に生じるフィルターの働きを防市するためである。In addition, the reason why a glass non-woven fabric was used instead of the conventional prepreg made by impregnating a glass woven fabric with an epoxy resin is that the glass filler is dispersed in the glass woven fabric during pressure lamination. This is to prevent the filter from working properly when using glass woven cloth.
このようにすれば、該金属コアのクリアランスホール１
１部に於ける樹脂は、ガラスフィラーが混合分散された
樹脂となり、その熱膨張係数は金属コア１２と近接した
熱膨張係数となるため、部品実装時の半田付は作業の時
点で、プリント基板が加熱されてその後常温まで冷却さ
れてもクリアランスホール部に於いて亀裂を発生し難く
なる。In this way, the clearance hole 1 of the metal core
The resin in part 1 is a resin in which glass filler is mixed and dispersed, and its thermal expansion coefficient is close to that of the metal core 12, so soldering during component mounting is done on the printed circuit board at the time of work. Even if the material is heated and then cooled to room temperature, cracks are less likely to occur in the clearance hole portion.
またガラスフィラーが樹脂に混合分散されているため、
形成されるプリン）５板の機械的強度も向トする。In addition, since the glass filler is mixed and dispersed in the resin,
The mechanical strength of the formed pudding plate is also improved.
第１図は本発明のプリンｌ−基板の断面図、第２図（ａ
）より第２図（Ｃ）までは従来のプリン板の製造工程の
説明図である。
ト基
図に於いて、
１１はクリアランスホール、１２は金属コア、１３はプ
リプレグ、１４は銅箔を示す。
〔発明の効果〕
以上の説明から明らかなように本発明によれば、電子部
品の実装時に於ける半田付は作業の時点で、クリアラン
スホール部に熱歪みを生じない高信頼度の金属コア内蔵
型多層プリント基板が得られる効果がある。
一漬喧
Ｃ目りツアラ゛１小−′し
、参発ヨ目のフ１ｊ〉ト甚板の領。
第１図
＜ＬＬＩ ピ 冒FIG. 1 is a cross-sectional view of the printed circuit board of the present invention, and FIG.
) to FIG. 2(C) are explanatory diagrams of the conventional printing board manufacturing process. In the basic diagram, 11 is a clearance hole, 12 is a metal core, 13 is a prepreg, and 14 is a copper foil. [Effects of the Invention] As is clear from the above description, according to the present invention, a highly reliable metal core is built in that does not cause thermal distortion in the clearance hole portion during soldering work when mounting electronic components. This has the effect of producing a molded multilayer printed circuit board. Ichizuke C-eye tour ゛1small-', starting from the starting point 1j〉It is the territory of the board. Figure 1
Claims (1)
混練した材料をガラス不織布に含浸して形成したプリプ
レグ（１３）を、加圧加熱積層して形成したことを特徴
とする金属コア内蔵型多層プリント基板。A multilayer with built-in metal core, characterized in that prepreg (13), which is formed by impregnating glass nonwoven fabric with a material obtained by kneading glass filler and resin, is laminated on both sides of a metal core (12) under pressure and heat. Printed board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63218110A JPH0744344B2 (en) | 1988-08-30 | 1988-08-30 | Method for manufacturing multilayer printed circuit board with built-in metal core |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63218110A JPH0744344B2 (en) | 1988-08-30 | 1988-08-30 | Method for manufacturing multilayer printed circuit board with built-in metal core |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0265193A true JPH0265193A (en) | 1990-03-05 |
| JPH0744344B2 JPH0744344B2 (en) | 1995-05-15 |
Family
ID=16714786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63218110A Expired - Fee Related JPH0744344B2 (en) | 1988-08-30 | 1988-08-30 | Method for manufacturing multilayer printed circuit board with built-in metal core |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0744344B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2689360A1 (en) * | 1992-03-25 | 1993-10-01 | Dyconex Ag | A method of manufacturing printed cards, and printed cards obtained by said method. |
| JP2005276936A (en) * | 2004-03-23 | 2005-10-06 | Mitsubishi Electric Corp | Printed wiring board and its production process |
| JPWO2004091268A1 (en) * | 2003-04-07 | 2006-07-06 | イビデン株式会社 | Multilayer printed wiring board |
| JP2007273648A (en) * | 2006-03-30 | 2007-10-18 | Furukawa Electric Co Ltd:The | Printed wiring board and its manufacturing method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104582256B (en) * | 2014-12-31 | 2018-04-20 | 广州兴森快捷电路科技有限公司 | Centreless board member |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61296799A (en) * | 1985-06-25 | 1986-12-27 | 日本電気株式会社 | Multilayer printed wiring board |
| JPS62169495A (en) * | 1986-01-22 | 1987-07-25 | 三菱瓦斯化学株式会社 | Manufacture of multilayer printed board |
| JPS639193A (en) * | 1986-06-30 | 1988-01-14 | 新神戸電機株式会社 | Manufacture of metal foil cladded laminated board with metalcore |
-
1988
- 1988-08-30 JP JP63218110A patent/JPH0744344B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61296799A (en) * | 1985-06-25 | 1986-12-27 | 日本電気株式会社 | Multilayer printed wiring board |
| JPS62169495A (en) * | 1986-01-22 | 1987-07-25 | 三菱瓦斯化学株式会社 | Manufacture of multilayer printed board |
| JPS639193A (en) * | 1986-06-30 | 1988-01-14 | 新神戸電機株式会社 | Manufacture of metal foil cladded laminated board with metalcore |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2689360A1 (en) * | 1992-03-25 | 1993-10-01 | Dyconex Ag | A method of manufacturing printed cards, and printed cards obtained by said method. |
| JPWO2004091268A1 (en) * | 2003-04-07 | 2006-07-06 | イビデン株式会社 | Multilayer printed wiring board |
| JP2005276936A (en) * | 2004-03-23 | 2005-10-06 | Mitsubishi Electric Corp | Printed wiring board and its production process |
| JP2007273648A (en) * | 2006-03-30 | 2007-10-18 | Furukawa Electric Co Ltd:The | Printed wiring board and its manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0744344B2 (en) | 1995-05-15 |
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