JP2003198103A - Method for manufacturing printed circuit board - Google Patents
Method for manufacturing printed circuit boardInfo
- Publication number
- JP2003198103A JP2003198103A JP2001393230A JP2001393230A JP2003198103A JP 2003198103 A JP2003198103 A JP 2003198103A JP 2001393230 A JP2001393230 A JP 2001393230A JP 2001393230 A JP2001393230 A JP 2001393230A JP 2003198103 A JP2003198103 A JP 2003198103A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- insulating layer
- layer
- prepreg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、大電流の通電に対
応できるプリント配線板ないしは多層プリント配線板の
製造法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board or a multilayer printed wiring board which can handle a large current.
【0002】[0002]
【従来の技術】大電流(1〜500A程度)が流れるプ
リント配線板には、プリント配線導体に厚さ70μm以
上の金属箔(例えば、電解銅箔や圧延銅箔)からなる導
体を使用して、大電流に耐えるようにしている。このプ
リント配線板は、次のよう製造している。シート状繊維
基材に熱硬化性樹脂を含浸し、その樹脂の硬化を半硬化
状態まで進めたプリプレグを準備する。このプリプレグ
の層の片面又は両面に前記金属箔を重ね、これを加熱加
圧成形により一体化して、金属箔張り積層板とする。そ
して、前記金属箔をエッチング処理してプリント配線導
体を形成する。2. Description of the Related Art For a printed wiring board through which a large current (about 1 to 500 A) flows, a printed wiring conductor made of a metal foil having a thickness of 70 μm or more (for example, electrolytic copper foil or rolled copper foil) is used. , Is designed to withstand large currents. This printed wiring board is manufactured as follows. A sheet-shaped fiber base material is impregnated with a thermosetting resin, and the prepreg is prepared by curing the resin to a semi-cured state. The metal foil is laminated on one side or both sides of the layer of this prepreg and integrated by heat and pressure molding to obtain a metal foil-clad laminate. Then, the metal foil is etched to form a printed wiring conductor.
【0003】上記プリント配線板には半田付により電子
部品を実装するが、半田付とは無関係の箇所には半田が
付着しないように、半田付箇所を除くプリント配線板表
面に半田レジスト被膜を設ける。半田レジスト被膜は、
例えば、エポキシ系レジストインキを塗布あるいは印刷
して、プリント配線導体表面を覆い、また、導体間の凹
部を埋めるように形成する。Electronic components are mounted on the printed wiring board by soldering, and a solder resist film is provided on the surface of the printed wiring board excluding the soldering portion so that the solder does not adhere to the portions unrelated to the soldering. . The solder resist coating is
For example, an epoxy-based resist ink is applied or printed to cover the surface of the printed wiring conductor and to fill the recesses between the conductors.
【0004】[0004]
【発明が解決しようとする課題】しかし、上記で形成可
能な半田レジスト被膜の厚さは、厚くてもせいぜい50
μm程度が限界である。上述したように、大電流が流れ
るプリント配線板は、プリント配線導体の厚さが70μ
m以上あり、場合によっては厚さが100μmを越え、
500μmとなることもあり得る。しかし、上記の半田
レジスト被膜は厚さが薄いので、プリント配線導体の厚
さ方向の面が半田レジストで覆われず露出したまま残っ
てしまう。プリント配線導体上面の半田レジスト被膜と
導体間を埋める半田レジスト被膜とが連続した被膜とな
らず、これは、電蝕の発生や半田レジスト被膜にクラッ
クが入る原因となる。However, the thickness of the solder resist coating which can be formed as described above is 50 at most even if it is thick.
The limit is about μm. As described above, a printed wiring board through which a large current flows has a printed wiring conductor thickness of 70 μm.
m or more, and in some cases the thickness exceeds 100 μm,
It may be 500 μm. However, since the solder resist coating is thin, the surface of the printed wiring conductor in the thickness direction is not covered with the solder resist and remains exposed. The solder resist coating on the upper surface of the printed wiring conductor and the solder resist coating filling the space between the conductors do not form a continuous coating, which causes electrolytic corrosion and cracks in the solder resist coating.
【0005】本発明が解決しようとする課題は、プリン
ト配線導体を厚くして大電流に耐えられるようにしたプ
リント配線板に対して、プリント配線導体上面の半田レ
ジスト被膜と導体間を埋める半田レジスト被膜とを連続
した一連の被膜とできるようにすることである。The problem to be solved by the present invention is, for a printed wiring board in which the printed wiring conductor is made thick to withstand a large current, a solder resist film on the upper surface of the printed wiring conductor and a solder resist for filling the space between the conductors. The coating is to be a continuous series of coatings.
【0006】[0006]
【課題を解決するための手段】上記課題を解決するた
め、本発明に係る方法は、次のような工程を経てプリン
ト配線板を製造する。本発明に係るプリント配線板の製
造法は、片面プリント配線板、両面プリント配線板、内
層にプリント配線を有する多層プリント配線板のいずれ
の製造法も対象とする。In order to solve the above problems, the method according to the present invention manufactures a printed wiring board through the following steps. The method for producing a printed wiring board according to the present invention is applicable to any method for producing a single-sided printed wiring board, a double-sided printed wiring board, or a multilayer printed wiring board having a printed wiring in an inner layer.
【0007】片面プリント配線板の製造法は、まず、シ
ート状繊維基材層に熱硬化性樹脂を保持した絶縁層の片
面に70μm厚以上の金属箔からなるプリント配線導体
を配置した片面プリント配線板を準備する。また、シー
ト状繊維基材に熱硬化性樹脂を含浸し、その樹脂の硬化
を半硬化状態まで進めたプリプレグを準備する。そし
て、前記プリプレグの層に、前記片面プリント配線板を
プリント配線面が外側となるように重ね合せ、前記重ね
合せ構成物を金属製鏡面板に挟み加熱加圧成形により一
体化する。このとき、プリント配線導体の厚さ方向の一
部ないし全体を絶縁層に埋設する。The method for producing a single-sided printed wiring board is as follows. First, a single-sided printed wiring is prepared by arranging a printed wiring conductor made of a metal foil having a thickness of 70 μm or more on one surface of an insulating layer holding a thermosetting resin in a sheet-shaped fiber base material layer. Prepare the board. Further, a prepreg is prepared by impregnating a sheet-shaped fiber base material with a thermosetting resin and curing the resin to a semi-cured state. Then, the single-sided printed wiring board is superposed on the layer of the prepreg so that the printed wiring surface is on the outside, and the superposed component is sandwiched between metal mirror-finished plates to be integrated by heat and pressure molding. At this time, a part or the whole of the printed wiring conductor in the thickness direction is embedded in the insulating layer.
【0008】上記加熱加圧成形時には、片面プリント配
線板の絶縁層が多少なりとも軟化する。従って、絶縁層
上に突出しているプリント配線導体の厚さ方向の一部な
いし全部は、軟化した絶縁層に容易に没入する。絶縁層
の裏面は、前記没入に対応する位置が突出するが、プリ
プレグの層の樹脂が加熱加圧成形時に流動することによ
り前記突出を吸収し、前記没入が支障なく起こるように
している。この結果、絶縁層上のプリント配線導体は、
絶縁層表面からの突出度合いが少なくなるか、絶縁層表
面と同一平面となるので、プリント配線導体上面と導体
間の凹部の段差が小さくなるか又は凹部がなくなり、一
様な連続した半田レジスト被膜の形成ができるようにな
る。During the heat and pressure molding, the insulating layer of the single-sided printed wiring board is softened to some extent. Therefore, a part or all of the printed wiring conductor projecting on the insulating layer in the thickness direction is easily immersed in the softened insulating layer. The back surface of the insulating layer projects at a position corresponding to the immersion, but the resin of the prepreg layer flows during the heat and pressure molding to absorb the projection so that the immersion can occur without trouble. As a result, the printed wiring conductor on the insulating layer is
Since the degree of protrusion from the surface of the insulating layer is reduced or the surface of the insulating layer is flush with the surface of the insulating layer, the step difference between the upper surface of the printed wiring conductor and the conductor is reduced or the recess is eliminated, and a uniform continuous solder resist film is formed. Can be formed.
【0009】次に、両面プリント配線板の製造法は、ま
ず、上記と同様に、絶縁層の片面に70μm厚以上の金
属箔からなるプリント配線導体を配置した片面プリント
配線板を準備する。また、上記と同様に、プリプレグを
準備する。そして、前記プリプレグの層の両側に、それ
ぞれ前記片面プリント配線板をプリント配線面が外側と
なるように重ね合せ、前記重ね合せ構成物を金属製鏡面
板に挟み加熱加圧成形により一体化する。このとき、プ
リント配線導体の厚さ方向の一部ないし全体をそれぞれ
の絶縁層に埋設する。Next, in the method for manufacturing a double-sided printed wiring board, first, as in the above, a single-sided printed wiring board in which a printed wiring conductor made of a metal foil having a thickness of 70 μm or more is arranged on one surface of an insulating layer is prepared. In addition, a prepreg is prepared in the same manner as above. Then, the single-sided printed wiring boards are superposed on both sides of the layer of the prepreg so that the printed wiring surfaces are on the outer sides, and the superposed components are sandwiched between metal mirror surface plates to be integrated by heat and pressure molding. At this time, a part or the whole of the printed wiring conductor in the thickness direction is embedded in each insulating layer.
【0010】上記加熱加圧成形時には、片面プリント配
線板の絶縁層が多少なりとも軟化する。従って、絶縁層
上に突出しているプリント配線導体の厚さ方向の一部な
いし全部は、軟化した絶縁層に容易に没入する。それぞ
れの絶縁層の裏面は、前記没入に対応する位置が突出す
るが、絶縁層に挟まれたプリプレグの層の樹脂が加熱加
圧成形時に流動することにより前記突出を吸収し、前記
没入が支障なく起こるようにしている。プリプレグの層
は、硬化して絶縁層となり2枚の片面プリント配線板を
一体化する。この結果、絶縁層上のプリント配線導体
は、絶縁層表面からの突出度合いが少なくなるか、絶縁
層表面と同一平面となるので、プリント配線導体上面と
導体間の凹部の段差が小さくなるか又は凹部がなくな
り、一様な連続した半田レジスト被膜の形成ができるよ
うになる。During the heat and pressure molding, the insulating layer of the single-sided printed wiring board is softened to some extent. Therefore, a part or all of the printed wiring conductor projecting on the insulating layer in the thickness direction is easily immersed in the softened insulating layer. The back surface of each insulating layer protrudes at a position corresponding to the immersion, but the resin of the layer of the prepreg sandwiched by the insulating layers absorbs the protrusion by flowing during the heat and pressure molding, and the immersion is hindered. I'm trying to happen without. The layer of the prepreg is cured to become an insulating layer, which integrates the two single-sided printed wiring boards. As a result, the degree of protrusion of the printed wiring conductor on the insulating layer from the surface of the insulating layer is reduced, or the printed wiring conductor is flush with the surface of the insulating layer. The concave portions are eliminated, and it becomes possible to form a uniform and continuous solder resist film.
【0011】さらに、多層プリント配線板の製造法は、
まず、上記と同様に、絶縁層の片面に厚さ70μm以上
の金属箔からなるプリント配線導体を配置した片面プリ
ント配線板を準備する。また、上記と同様に、プリプレ
グを準備する。内層用プリント配線板も用意する。そし
て、前記内層用プリント配線板の両側にそれぞれ、前記
プリプレグの層、さらに、前記片面プリント配線板をプ
リント配線面が外側となるように重ね合せ、前記重ね合
せ構成物を金属製鏡面板に挟み加熱加圧成形により一体
化する。このとき、プリント配線導体の厚さ方向の一部
ないし全体をそれぞれの絶縁層に埋設する。Further, the manufacturing method of the multilayer printed wiring board is as follows.
First, similarly to the above, a single-sided printed wiring board is prepared in which a printed wiring conductor made of a metal foil having a thickness of 70 μm or more is arranged on one surface of the insulating layer. In addition, a prepreg is prepared in the same manner as above. Also prepare a printed wiring board for the inner layer. Then, the layers of the prepreg and the single-sided printed wiring board are superposed on both sides of the inner layer printed wiring board so that the printed wiring surface is on the outer side, and the superposed composition is sandwiched between metal mirror surface plates. It is integrated by heat and pressure molding. At this time, a part or the whole of the printed wiring conductor in the thickness direction is embedded in each insulating layer.
【0012】上記加熱加圧成形時には、片面プリント配
線板の絶縁層が多少なりとも軟化する。従って、絶縁層
上に突出しているプリント配線導体の厚さ方向の一部な
いし全部は、軟化した絶縁層に容易に没入する。それぞ
れの絶縁層の裏面は、前記没入に対応する位置が突出す
るが、内層用プリント配線板と絶縁層に挟まれたプリプ
レグの層の樹脂が加熱加圧成形時に流動することにより
前記突出を吸収し、前記没入が支障なく起こるようにし
ている。前記突出が、内層用プリント配線板のプリント
配線を損傷する心配もない。プリプレグの層は、硬化し
て絶縁層となり内層用プリント配線板と2枚の片面プリ
ント配線板を一体化する。この結果、絶縁層上のプリン
ト配線導体は、絶縁層表面からの突出度合いが少なくな
るか、絶縁層表面と同一平面となるので、プリント配線
導体上面と導体間の凹部の段差が小さくなるか又は凹部
がなくなり、一様な連続した半田レジスト被膜の形成が
できるようになる。During the heat and pressure molding, the insulating layer of the single-sided printed wiring board is softened to some extent. Therefore, a part or all of the printed wiring conductor projecting on the insulating layer in the thickness direction is easily immersed in the softened insulating layer. The back surface of each insulating layer protrudes at a position corresponding to the immersion, but the resin of the prepreg layer sandwiched between the printed wiring board for the inner layer and the insulating layer flows during heat and pressure molding to absorb the protrusion. However, the immersion is made to occur without any trouble. There is no concern that the protrusion damages the printed wiring of the printed wiring board for the inner layer. The layer of the prepreg is cured to become an insulating layer, which integrates the inner layer printed wiring board and the two single-sided printed wiring boards. As a result, the degree of protrusion of the printed wiring conductor on the insulating layer from the surface of the insulating layer is reduced, or the printed wiring conductor is flush with the surface of the insulating layer. The concave portions are eliminated, and it becomes possible to form a uniform and continuous solder resist film.
【0013】[0013]
【発明の実施の形態】本発明に係る方法を実施するに当
り、片面プリント配線板は、次のように製造する。シー
ト状繊維基材(ガラス織布、ガラス不織布など)に熱硬
化性樹脂(エポキシ樹脂、フェノール樹脂、ポリイミ
ド、不飽和ポリエステルなど)を含浸し、その樹脂の硬
化を半硬化状態まで進めたプリプレグを準備する。この
プリプレグの層の片面又は両面に厚さ70μm以上の金
属箔を重ね、これを加熱加圧成形により一体化して、片
面金属箔張り積層板とする。そして、前記金属箔をエッ
チング処理してプリント配線導体を形成する。金属箔
は、電解銅箔や圧延銅箔である。上記片面金属箔張り積
層板を成形するとき、間に離型フィルムを挟んで2枚の
片面金属箔張り積層板を擬似的に両面金属箔張り積層板
として成形し、離型フィルムを介して2枚の片面金属箔
張り積層板を一体化したままで、プリント配線導体を形
成するためのエッチング処理に供することができる。エ
ッチング処理後に、離型フィルムの層で剥がして2枚の
片面プリント配線板とする。片面金属箔張り積層板は、
厚さ方向の層構成が非対称であるためそりが大きくなり
やすいが、前記のように擬似的に両面金属箔張り積層板
とすれば、そりの小さい状態で取扱うことができる。BEST MODE FOR CARRYING OUT THE INVENTION In carrying out the method according to the present invention, a single-sided printed wiring board is manufactured as follows. A prepreg made by impregnating a sheet-like fiber base material (glass woven fabric, glass non-woven fabric, etc.) with a thermosetting resin (epoxy resin, phenol resin, polyimide, unsaturated polyester, etc.) and curing the resin to a semi-cured state. prepare. A metal foil having a thickness of 70 μm or more is overlaid on one side or both sides of the layer of this prepreg, and this is integrated by heat and pressure molding to obtain a single-sided metal foil-clad laminate. Then, the metal foil is etched to form a printed wiring conductor. The metal foil is an electrolytic copper foil or a rolled copper foil. When the above-mentioned one-sided metal foil-clad laminate is molded, two one-sided metal foil-clad laminates are pseudo-molded as a double-sided metal foil-clad laminate with a mold release film sandwiched therebetween, The single-sided metal foil-clad laminate can be subjected to an etching treatment for forming a printed wiring conductor while being integrated. After the etching treatment, the release film is peeled off to obtain two single-sided printed wiring boards. The single-sided metal foil-clad laminate is
Since the layer structure in the thickness direction is asymmetric, the warp tends to be large. However, if the double-sided metal foil-clad laminate is artificially formed as described above, the warp can be handled in a small state.
【0014】(実施の形態1)本発明に係る片面プリン
ト配線板の製造法は、上記のように準備した片面プリン
ト配線板1(絶縁層11上にプリント配線導体12を配
置してある)とプリプレグ2を用い、図1(a)(b)
に示す工程を経て製造する。プリプレグ2の層に、片面
プリント配線板1をプリント配線面が外側となるように
重ね合せ、この重ね合せ構成物を金属製の鏡面板3に挟
み加熱加圧成形により一体化する。プリプレグ2の層と
鏡面板3の間には離型フィルムを配置し、片面プリント
配線板1と鏡面板3の間にも必要に応じて離型フィルム
を配置して、加熱加圧成形を行なう。この段階まで絶縁
層11の熱硬化性樹脂を十分に硬化していない状態に保
ち、前記加熱加圧成形で軟化しやすくしてもよいが、十
分に硬化した熱構成樹脂であっても、加熱加圧によりあ
る程度は軟化するので、いずれにせよ、前記加熱加圧成
形により、プリント配線導体12の厚さ方向の一部ない
し全体を軟化した絶縁層11に没入させる。図1(b)
は、プリント配線導体12を絶縁層11と同一面まで没
入させた状態を示している。この片面プリント配線板に
は、適宜部品取付穴をあけて、表面に半田レジスト被膜
を塗布あるいは印刷により形成する。プリント配線導体
12と絶縁層11の間には段差がなく、半田レジスト被
膜の形成は、被膜の厚さが薄くても良好に実施すること
ができる。(Embodiment 1) A method for manufacturing a single-sided printed wiring board according to the present invention includes a single-sided printed wiring board 1 (a printed wiring conductor 12 is arranged on an insulating layer 11) prepared as described above. 1 (a) (b) using prepreg 2
It is manufactured through the steps shown in. The single-sided printed wiring board 1 is superposed on the layer of the prepreg 2 so that the printed wiring surface is on the outer side, and the superposed composition is sandwiched between the metal mirror surface plates 3 to be integrated by heat and pressure molding. A mold release film is arranged between the layer of the prepreg 2 and the mirror surface plate 3, and a mold release film is arranged also between the one-sided printed wiring board 1 and the mirror surface plate 3 as necessary to perform heat and pressure molding. . Up to this stage, the thermosetting resin of the insulating layer 11 may be kept in an insufficiently cured state so as to be easily softened by the heat and pressure molding. Since it softens to a certain extent by pressurization, in any case, part or the whole of the printed wiring conductor 12 in the thickness direction is immersed in the softened insulating layer 11 by the heat and pressure molding. Figure 1 (b)
Shows a state in which the printed wiring conductor 12 is immersed in the same surface as the insulating layer 11. On this single-sided printed wiring board, component mounting holes are appropriately opened, and a solder resist film is applied or printed on the surface. There is no step between the printed wiring conductor 12 and the insulating layer 11, and the solder resist coating can be formed well even if the coating is thin.
【0015】プリント配線導体12を没入させた絶縁層
11の反対面は、その対応箇所が突出するが、この突出
があるからこそ、前記没入が支障なく行なわれる。そし
て、プリプレグ2の層の樹脂が加熱加圧成形時に流動し
て前記突出を吸収している。プリプレグ2は、絶縁層1
1を構成するものと同様のプリプレグであってもよい
が、これよりも含まれる樹脂量を多くしておくことが好
ましい。多い樹脂量が、加熱加圧成形時に緩衝材となっ
て、プリント配線導体12の絶縁層11への没入を良好
に進めるのに好都合である。プリプレグ2を重ねて使用
したり、プリプレグ2を厚くすることも有効である。こ
れらの事項は、以下の実施の形態においても同様に採用
することができる。On the opposite surface of the insulating layer 11 in which the printed wiring conductor 12 is immersed, a corresponding portion is projected, and the above-mentioned projection allows the immersion to be performed without trouble. The resin of the layer of the prepreg 2 flows during the heat and pressure molding to absorb the protrusion. The prepreg 2 is the insulating layer 1
Although the same prepreg as that of No. 1 may be used, it is preferable that the amount of resin contained be larger than that. A large amount of resin serves as a cushioning material at the time of heat and pressure molding, which is convenient for favorably immersing the printed wiring conductor 12 into the insulating layer 11. It is also effective to stack the prepregs 2 and to thicken the prepregs 2. These matters can be similarly adopted in the following embodiments.
【0016】(実施の形態2)次に、本発明に係る両面
プリント配線板の製造法は、上記と同様に、片面プリン
ト配線板1とプリプレグ2を用い、図2(a)(b)に
示す工程を経て製造する。プリプレグ2の層の両側にそ
れぞれ、片面プリント配線板1をプリント配線面が外側
となるように重ね合せ、この重ね合せ構成物を金属製の
鏡面板3に挟み加熱加圧成形により一体化する。そし
て、加熱加圧成形により軟化した絶縁層11に、プリン
ト配線導体12の厚さ方向の一部ないし全体を没入させ
る。図2(b)は、プリント配線導体12を絶縁層11
と同一面まで没入させた状態を示している。それぞれ、
プリント配線導体12を没入させた絶縁層11の反対面
は、その対応箇所が突出し、プリプレグ2の層の樹脂が
加熱加圧成形時に流動して前記突出を吸収している。製
造した両面プリント配線板には、適宜、部品取付穴、両
面のプリント配線導体を接続するスルーホールを設け、
表面に半田レジスト被膜を形成する。(Embodiment 2) Next, in the method for manufacturing a double-sided printed wiring board according to the present invention, the single-sided printed wiring board 1 and the prepreg 2 are used in the same manner as described above, and as shown in FIGS. It is manufactured through the steps shown. The single-sided printed wiring boards 1 are superposed on both sides of the layer of the prepreg 2 so that the printed wiring surfaces are on the outside, and the superposed components are sandwiched between the metal mirror-like plates 3 to be integrated by heat and pressure molding. Then, a part or the whole of the printed wiring conductor 12 in the thickness direction is immersed in the insulating layer 11 softened by the heat and pressure molding. In FIG. 2B, the printed wiring conductor 12 is connected to the insulating layer 11.
It shows a state in which the same surface is immersed. Each,
On the opposite surface of the insulating layer 11 in which the printed wiring conductor 12 is immersed, the corresponding portion projects, and the resin of the layer of the prepreg 2 flows during the heat and pressure molding to absorb the projection. The manufactured double-sided printed wiring board is provided with appropriate component mounting holes and through holes for connecting the printed wiring conductors on both sides,
A solder resist coating is formed on the surface.
【0017】(実施の形態3)本発明に係る多層プリン
ト配線板の製造法は、上記と同様に、片面プリント配線
板1とプリプレグ2を用い、さらに、内層用プリント配
線板5を準備して、図3(a)(b)に示す工程を経て
製造する。内層用プリント配線板5は、プリント配線導
体と絶縁層表面とが同一面となっている上記実施の形態
1、2で製造したようなプリント配線板であってもよい
し、プリント配線導体が絶縁層表面から突出したプリン
ト配線板であってもよいが、好ましくは前者である。内
層用プリント配線板5の両側にそれぞれ、プリプレグ2
の層、さらに、片面プリント配線板1をプリント配線面
が外側となるように重ね合せ、この重ね合せ構成物を金
属製の鏡面板3に挟み加熱加圧成形により一体化する。
そして、加熱加圧成形により軟化した絶縁層11に、プ
リント配線導体12の厚さ方向の一部ないし全体を没入
させる。図3(b)は、プリント配線導体12を絶縁層
11と同一面まで没入させた状態を示している。それぞ
れ、プリント配線導体12を没入させた絶縁層11の反
対面は、その対応箇所が突出し、プリプレグ2の層の樹
脂が加熱加圧成形時に流動して前記突出を吸収してい
る。内層用プリント配線板5のプリント配線導体がその
絶縁層表面と同一面であると、前記絶縁層11の突出に
よる影響を受けにくいので都合がよい。製造した多層プ
リント配線板には、適宜、部品取付穴、内層と表面の間
あるいは両表面の間のプリント配線導体を接続するスル
ーホールを設け、表面に半田レジスト被膜を形成する。(Third Embodiment) In the method for manufacturing a multilayer printed wiring board according to the present invention, the single-sided printed wiring board 1 and the prepreg 2 are used, and the inner layer printed wiring board 5 is prepared in the same manner as described above. , And is manufactured through the steps shown in FIGS. The inner layer printed wiring board 5 may be the printed wiring board manufactured in the above-described first and second embodiments in which the printed wiring conductor and the surface of the insulating layer are on the same surface, or the printed wiring conductor is insulated. A printed wiring board protruding from the layer surface may be used, but the former is preferable. Prepregs 2 are provided on both sides of the inner layer printed wiring board 5, respectively.
Layer, and further, the single-sided printed wiring board 1 is superposed such that the printed wiring surface is on the outside, and the superposed composition is sandwiched by the metal mirror plate 3 to be integrated by heat and pressure molding.
Then, a part or the whole of the printed wiring conductor 12 in the thickness direction is immersed in the insulating layer 11 softened by the heat and pressure molding. FIG. 3B shows a state in which the printed wiring conductor 12 is immersed in the same surface as the insulating layer 11. On the opposite surface of the insulating layer 11 in which the printed wiring conductor 12 is immersed, the corresponding portion projects, and the resin of the layer of the prepreg 2 flows during the heat and pressure molding to absorb the projection. It is convenient that the printed wiring conductor of the inner layer printed wiring board 5 is flush with the surface of the insulating layer because it is unlikely to be affected by the protrusion of the insulating layer 11. The manufactured multilayer printed wiring board is provided with component mounting holes, through holes for connecting printed wiring conductors between the inner layer and the surface or between the both surfaces, and a solder resist film is formed on the surface.
【0018】(実施の形態4)大電流を通電することに
より発熱量が多くなるので、上記プリント配線板は、絶
縁層を構成する熱硬化性樹脂中に非導電性の無機充填材
を配合することにより絶縁層の熱伝導性を高め、放熱性
をよくするとよい。無機充填材は、シリカ、タルク、水
酸化アルミニウム、水酸化マグネシウム等の微粒粉末で
ある。(Embodiment 4) Since a large amount of heat is generated by passing a large current, in the above-mentioned printed wiring board, a thermosetting resin forming an insulating layer contains a non-conductive inorganic filler. Therefore, the thermal conductivity of the insulating layer may be improved and the heat dissipation may be improved. The inorganic filler is fine powder of silica, talc, aluminum hydroxide, magnesium hydroxide or the like.
【0019】(実施の形態5)上記各発明の実施の形態
による片面プリント配線板、両面プリント配線板、多層
プリント配線板は、いずれもプリント配線導体による表
面凹凸が小さいので、一様な連続した半田レジスト被膜
を良好に形成することができる。このことは、さらに、
当該表面に薄層の電気部品を良好に付与できることも意
味する。すなわち、上記プリント配線板表面に絶縁層を
付加しても、その絶縁層表面は凹凸がなく滑らかであ
り、当該絶縁層表面への薄層の電気部品(コイル、コン
デンサ等)形成を精度よく実施することができる。前記
プリント配線板表面への絶縁層の付加は、プリプレグの
加熱加圧成形による一体化、樹脂フィルムの貼付け、絶
縁塗料の印刷又は塗布などにより実施できる。また、前
記電気部品の形成は次のような技術により実施できる。
例えば、前記絶縁層に一体化した金属箔のエッチング加
工技術、また、前記絶縁層への無電解メッキや蒸着技
術、さらには、前記絶縁層への導電塗料による印刷又は
塗布技術である。(Embodiment 5) The single-sided printed wiring board, the double-sided printed wiring board, and the multilayer printed wiring board according to the above-described embodiments of the present invention all have a small surface unevenness due to the printed wiring conductors, and therefore have a uniform continuous shape. The solder resist film can be formed well. This means that
It also means that a thin-layer electric component can be satisfactorily applied to the surface. That is, even if an insulating layer is added to the surface of the printed wiring board, the surface of the insulating layer is smooth and has no irregularities, and thin-layer electrical components (coils, capacitors, etc.) can be accurately formed on the surface of the insulating layer. can do. The addition of the insulating layer to the surface of the printed wiring board can be carried out by integration of the prepreg by heat and pressure molding, sticking of a resin film, printing or coating of an insulating paint. The formation of the electric component can be performed by the following technique.
For example, it is a technique for etching a metal foil integrated with the insulating layer, a technique for electroless plating or vapor deposition on the insulating layer, and a technique for printing or applying a conductive paint on the insulating layer.
【0020】上記のように絶縁層表面に薄層の電気部品
を形成したプリント配線板は、発明の実施の形態3にお
いて用いる内層用プリント配線板5としても採用するこ
とができる。これによって、大電流に対応し、絶縁層中
に電気部品を内蔵する多層プリント配線板を製造するこ
とも可能になる。The printed wiring board having the thin-layer electric component formed on the surface of the insulating layer as described above can also be employed as the inner layer printed wiring board 5 used in the third embodiment of the invention. As a result, it becomes possible to manufacture a multilayer printed wiring board which accommodates a large current and has electric components built in the insulating layer.
【0021】[0021]
【発明の効果】上述のように、本発明に係る方法によれ
ば、大電流に耐えるようにプリント配線導体の厚さを厚
くした場合にも、プリント配線導体上面と絶縁層表面の
段差を小さくし又は段差をなくして、プリント配線板表
面に半田レジスト被膜を良好に形成することができる。As described above, according to the method of the present invention, even when the thickness of the printed wiring conductor is increased to withstand a large current, the step difference between the upper surface of the printed wiring conductor and the surface of the insulating layer is reduced. It is possible to favorably form the solder resist coating on the surface of the printed wiring board by eliminating steps or steps.
【図1】本発明に係る製造法の実施の形態を説明する断
面図である。FIG. 1 is a cross-sectional view illustrating an embodiment of a manufacturing method according to the present invention.
【図2】本発明に係る製造法の他の実施の形態を説明す
る断面図である。FIG. 2 is a sectional view illustrating another embodiment of the manufacturing method according to the present invention.
【図3】本発明に係る製造法のさらに他の実施の形態を
説明する断面図である。FIG. 3 is a cross-sectional view illustrating still another embodiment of the manufacturing method according to the present invention.
1は片面プリント配線板 11は絶縁層 12はプリント配線導体 2はプリプレグ 3は鏡面板 4は離型フィルム 5は内層用プリント配線板 1 is a single-sided printed wiring board 11 is an insulating layer 12 is a printed wiring conductor 2 is prepreg 3 is a mirror plate 4 is a release film 5 is a printed wiring board for the inner layer
───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 5E343 AA02 AA15 AA16 AA39 BB02 BB14 BB15 BB21 ER50 GG14 GG20 5E346 AA06 AA12 AA15 BB01 BB15 CC04 CC09 CC10 CC31 DD02 DD31 EE02 EE06 EE07 EE09 GG28 HH11 HH21 ─────────────────────────────────────────────────── ─── Continued front page F-term (reference) 5E343 AA02 AA15 AA16 AA39 BB02 BB14 BB15 BB21 ER50 GG14 GG20 5E346 AA06 AA12 AA15 BB01 BB15 CC04 CC09 CC10 CC31 DD02 DD31 EE02 EE06 EE07 EE09 GG28 HH11 HH21
Claims (6)
した絶縁層の片面に70μm厚以上の金属箔からなるプ
リント配線導体を配置した片面プリント配線板を準備す
る工程、 シート状繊維基材に熱硬化性樹脂を含浸し、その樹脂の
硬化を半硬化状態まで進めたプリプレグを準備する工
程、 前記プリプレグの層に、前記片面プリント配線板をプリ
ント配線面が外側となるように重ね合せる工程、 前記重ね合せ構成物を金属製鏡面板に挟み加熱加圧成形
により一体化すると共にプリント配線導体の厚さ方向の
一部ないし全体を絶縁層に埋設する工程を経ることを特
徴とするプリント配線板の製造法。1. A step of preparing a single-sided printed wiring board in which a printed wiring conductor made of a metal foil having a thickness of 70 μm or more is arranged on one surface of an insulating layer holding a thermosetting resin in a sheet-shaped fiber base material layer, sheet-shaped fiber Step of preparing a prepreg in which a base material is impregnated with a thermosetting resin and curing of the resin is progressed to a semi-cured state, and the single-sided printed wiring board is overlaid on the layer of the prepreg so that the printed wiring surface is on the outside. A step of combining, a step of sandwiching the superposed composition between metal mirror-finished plates to integrate by heat and pressure molding, and a step of burying a part or the whole of a printed wiring conductor in a thickness direction in an insulating layer. Manufacturing method of printed wiring board.
した絶縁層の片面に70μm厚以上の金属箔からなるプ
リント配線導体を配置した片面プリント配線板を準備す
る工程、 シート状繊維基材に熱硬化性樹脂を含浸し、その樹脂の
硬化を半硬化状態まで進めたプリプレグを準備する工
程、 前記プリプレグの層の両側に、それぞれ前記片面プリン
ト配線板をプリント配線面が外側となるように重ね合せ
る工程、 前記重ね合せ構成物を金属製鏡面板に挟み加熱加圧成形
により一体化すると共にプリント配線導体の厚さ方向の
一部ないし全体を絶縁層に埋設する工程を経ることを特
徴とするプリント配線板の製造法。2. A step of preparing a single-sided printed wiring board in which a printed wiring conductor made of a metal foil having a thickness of 70 μm or more is arranged on one surface of an insulating layer in which a sheet-shaped fiber base material layer holds a thermosetting resin, sheet-shaped fibers A step of preparing a prepreg in which a base material is impregnated with a thermosetting resin and curing of the resin has progressed to a semi-cured state, and the one-sided printed wiring board has the printed wiring surface on the outside on both sides of the layer of the prepreg. A step of superposing the printed wiring conductors in a thickness direction and burying a part or the whole of the printed wiring conductor in an insulating layer. Characteristic printed wiring board manufacturing method.
プリント配線板の表面に、絶縁層を介して薄層の電気部
品ならびに導体を付加するプリント配線板の製造法。3. A method for manufacturing a printed wiring board, wherein a thin-layer electric component and a conductor are added to the surface of the printed wiring board manufactured through the process according to claim 1 or 2 via an insulating layer.
した絶縁層の片面に70厚μm以上の金属箔からなるプ
リント配線導体を配置した片面プリント配線板を準備す
る工程、 シート状繊維基材に熱硬化性樹脂を含浸し、その樹脂の
硬化を半硬化状態まで進めたプリプレグを準備する工
程、 内層用プリント配線板を準備する工程、 前記内層用プリント配線板の両側にそれぞれ、前記プリ
プレグの層、さらに、前記片面プリント配線板をプリン
ト配線面が外側となるように重ね合せる工程、 前記重ね合せ構成物を金属製鏡面板に挟み加熱加圧成形
により一体化すると共に片面プリント配線板のプリント
配線導体の厚さ方向の一部ないし全体を絶縁層に埋設す
る工程を経ることを特徴とするプリント配線板の製造
法。4. A step of preparing a single-sided printed wiring board in which a printed wiring conductor made of a metal foil having a thickness of 70 μm or more is arranged on one surface of an insulating layer holding a thermosetting resin on a sheet-shaped fiber base material layer, sheet-shaped A step of preparing a prepreg obtained by impregnating a fiber base material with a thermosetting resin and curing the resin to a semi-cured state, a step of preparing an inner layer printed wiring board, on both sides of the inner layer printed wiring board, respectively. A layer of the prepreg, and a step of superimposing the single-sided printed wiring board so that the printed wiring surface is on the outer side, and the superposed component is sandwiched between metal mirror-faced plates to be integrated by heat and pressure molding and a single-sided printed wiring. A method of manufacturing a printed wiring board, comprising a step of burying a part or the whole of a printed wiring conductor of the board in a thickness direction in an insulating layer.
3のいずれかに記載の方法により製造したプリント配線
板を用いることを特徴とする請求項4記載のプリント配
線板の製造法。5. An inner layer printed wiring board according to claim 1.
The method for manufacturing a printed wiring board according to claim 4, wherein the printed wiring board manufactured by the method according to any one of claims 3 to 5 is used.
プリント配線板の表面に、絶縁層を介して薄層の電気部
品ならびに導体を付加するプリント配線板の製造法。6. A method of manufacturing a printed wiring board, wherein a thin-layer electric component and a conductor are added to the surface of the printed wiring board manufactured through the process according to claim 4 or 5 via an insulating layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001393230A JP2003198103A (en) | 2001-12-26 | 2001-12-26 | Method for manufacturing printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001393230A JP2003198103A (en) | 2001-12-26 | 2001-12-26 | Method for manufacturing printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2003198103A true JP2003198103A (en) | 2003-07-11 |
Family
ID=27600270
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001393230A Pending JP2003198103A (en) | 2001-12-26 | 2001-12-26 | Method for manufacturing printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2003198103A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008053654A (en) * | 2006-08-28 | 2008-03-06 | Clover Denshi Kogyo Kk | Printed wiring board and its manufacturing process |
JP2011513965A (en) * | 2008-02-29 | 2011-04-28 | エルジー イノテック カンパニー,リミティド | Printed circuit board and manufacturing method thereof |
-
2001
- 2001-12-26 JP JP2001393230A patent/JP2003198103A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008053654A (en) * | 2006-08-28 | 2008-03-06 | Clover Denshi Kogyo Kk | Printed wiring board and its manufacturing process |
JP2011513965A (en) * | 2008-02-29 | 2011-04-28 | エルジー イノテック カンパニー,リミティド | Printed circuit board and manufacturing method thereof |
US8590144B2 (en) | 2008-02-29 | 2013-11-26 | Lg Innotek Co., Ltd. | Method of manufacturing printed circuit board |
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