JPS62277794A - Manufacture of inner layer circuit board - Google Patents
Manufacture of inner layer circuit boardInfo
- Publication number
- JPS62277794A JPS62277794A JP12145386A JP12145386A JPS62277794A JP S62277794 A JPS62277794 A JP S62277794A JP 12145386 A JP12145386 A JP 12145386A JP 12145386 A JP12145386 A JP 12145386A JP S62277794 A JPS62277794 A JP S62277794A
- Authority
- JP
- Japan
- Prior art keywords
- inner layer
- layer circuit
- weight
- circuit board
- thermosetting resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- 229920001187 thermosetting polymer Polymers 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 229920001971 elastomer Polymers 0.000 claims description 10
- 239000005060 rubber Substances 0.000 claims description 10
- 239000011256 inorganic filler Substances 0.000 claims description 7
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 13
- 239000010949 copper Substances 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- -1 methyl ether ketone Chemical class 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 240000002834 Paulownia tomentosa Species 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- JYGXADMDTFJGBT-VWUMJDOOSA-N hydrocortisone Chemical compound O=C1CC[C@]2(C)[C@H]3[C@@H](O)C[C@](C)([C@@](CC4)(O)C(=O)CO)[C@@H]4[C@@H]3CCC2=C1 JYGXADMDTFJGBT-VWUMJDOOSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 description 1
- 229960002218 sodium chlorite Drugs 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- ILJSQTXMGCGYMG-UHFFFAOYSA-N triacetic acid Chemical compound CC(=O)CC(=O)CC(O)=O ILJSQTXMGCGYMG-UHFFFAOYSA-N 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
五 発明の詳細な説明
（産業上の利用分野）
本発明は、多Ｉ−印桐配線板用内層回路板の製造方法に
関する。Detailed Description of the Invention V. Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a method of manufacturing an inner layer circuit board for a multi-I-Indo paulownia wiring board.
（従来の技術）
内層回路板の製造においては、従来銅叛り積層板が使用
さ几、これをエツチングする事により、内層回路板を侍
てぎた。この内層回路板の両面＜ｆＪ！％硬化性樹脂を
含浸させた基材で銅箔を積層接着し、さらに通常の丈ブ
トラクト法により配線パターンを形成し多層印刷配線板
を製造してきた。(Prior Art) In the manufacture of inner layer circuit boards, a copper laminate was conventionally used, and the inner layer circuit board was etched. Both sides of this inner layer circuit board <fJ! A multilayer printed wiring board has been manufactured by laminating and bonding copper foil with a base material impregnated with a % hardening resin, and then forming a wiring pattern using a conventional length tract method.
（発明が解決しようとする問題点）
内層回路板製造の従来技術では、エツチング精度を満足
するために、銅張り槓１１！板の銅の岸み’ｔｌＯＯμ
ｍ〜１５０μｍ以下に限る必炊かあり、を流容景もこｎ
に伴なって限らｎてくる問題がある。又、従来の技術に
よる内層Ｉａｌ路仮に、熱硬化性ｍ脂全含虎さ−Ｊ？：
た基材で餉箔會槓層接雀する場合、銅箔の厚さが１５０
μｍ程度になると、？３層回路板のエツチングされた銅
箔部分の空隙は充填さｎない。このためスルーホールと
内層間の絶縁不良が発生する問題がある。(Problems to be Solved by the Invention) In the conventional technology for manufacturing inner layer circuit boards, in order to satisfy etching accuracy, copper-clad rams 11! The copper shore of the board'tlOOμ
There is a requirement that the size is limited to 150 μm or less, and the flow view is also included.
There is a problem that comes with the limitation of n. In addition, if the inner layer layer according to the prior art is completely containing thermosetting resin, it is possible to prepare the inner layer according to the prior art. :
When bonding a copper foil layer with a copper foil base material, the thickness of the copper foil is 150 mm.
When it comes to about μm? The voids in the etched copper foil portion of the three-layer circuit board are not filled. Therefore, there is a problem of poor insulation between the through hole and the inner layer.
（ｔｔＪＩ籾点を解決するための手段）以上の従来技術
の問題点にかんがみ、幼児の結果本発ＥｉＡを得た。以
下図面に基ついて本発明を説明する。(Means for solving the ttJI paddy point) In view of the problems of the prior art described above, the present EiA was obtained as a result for infants. The present invention will be explained below based on the drawings.
第１図に示すように熱硬化註恒（脂含浸４：板１、孔埋
め用熱峙化注樹脂シート２および貫通孔を持つ金属板３
を積層する。As shown in FIG.
Laminate.
熱硬化性樹脂含浸基板１は、ガラスクロス、合！ｙ、Ｈ
維等が使用さｎる。熱硬化性樹脂シート２は、全体を加
熱加圧した時に金属板に設けた貫通孔を充填するに必要
な厚みま′ｒＳは枚数を使用する。その配付例は、熱硬
化性樹脂２０〜７０重り％無機充填剤１０〜５０重量％
、ゴム２〜３０重量％をメチルエチルケトン、メチルグ
リコール等に溶解混合したフェスを、ポリプロピレン、
トリアセテート、離型処理ポリエステル、ポリフッ化ビ
ニル等のフィルムに所望憤塗布し、５０〜１６０℃、５
〜３０分程度乾燥して半硬化状態にしたものとする。熱
硬化性樹脂にはフェノール樹脂、エポキシ樹脂、ポリイ
ミド４ｔＩ脂、不飽和ポリエステル樹脂、メラミン樹脂
、尿素樹脂等を使用する。無機充填剤は、ガラスファイ
バ、酸化ジルコニウム、珪酸ジルコニウム、アルミナ、
マイカ、炭骸カルシウム等がある。ゴムは、ＮＢＲ，イ
ソプロピレンゴム、クロロプレンゴム、ポリエステルゴ
ムＴｈ便用スる。The thermosetting resin-impregnated substrate 1 is made of glass cloth, composite! y, H
fibers etc. are used. The thermosetting resin sheet 2 has a thickness that is necessary to fill the through hole provided in the metal plate when the entire sheet is heated and pressurized. The distribution example is thermosetting resin 20-70% by weight, inorganic filler 10-50% by weight.
, 2 to 30% by weight of rubber is dissolved and mixed in methyl ethyl ketone, methyl glycol, etc.
Triacetate, release-treated polyester, polyvinyl fluoride, etc. are coated as desired on a film and heated at 50 to 160°C.
It should be dried for about 30 minutes to a semi-cured state. As the thermosetting resin, phenol resin, epoxy resin, polyimide 4tI resin, unsaturated polyester resin, melamine resin, urea resin, etc. are used. Inorganic fillers include glass fiber, zirconium oxide, zirconium silicate, alumina,
Examples include mica and charcoal calcium. Rubbers include NBR, isopropylene rubber, chloroprene rubber, and polyester rubber.
貫通孔を持つ金属板３は、パンチ、ドリル成るいは化学
的エツチングによりて貫通孔を設けるが、熱伝４注の良
い金属例えは鉄−ニッケル合金、銅、銅合金全使用する
。孔明けで発生するパリは表面の研摩によって除去する
。The metal plate 3 having through holes is formed by punching, drilling, or chemical etching, and metals with good heat conductivity such as iron-nickel alloy, copper, and copper alloy are all used. The debris generated during drilling is removed by polishing the surface.
第２図に示すように、第１図を構成する各基板１．２．
３の両端部に位置合わせ用の基準孔７を設け、その両端
孔間隔を各基板共通とする。As shown in FIG. 2, each of the substrates 1.2.
Reference holes 7 for positioning are provided at both ends of the substrate 3, and the distance between the holes at both ends is the same for each board.
第３図に示すように、第１図に示すと同じ各板の積層を
行い、その上下に岸さ５ｍｍの鉄あるいはステンレス板
４を重ね、さらにその上下に耐熱性クッションボードｓ
ｔ−寅ねてプレスの絵の偏在を吸収する。貫通孔を有す
る金属板の一つを電源層とし、他を接地層とするが、プ
レスの際に相互に偏在しないように、かつ各基鈑全体に
蟇直方向の一動圧縮が掛かるように軟鉄のガイドピン６
を前記基準孔７に通す。この第３図に示す構成をしｒ、
後、通常の積層８Ｉ製造条件で全体を加熱加圧する。As shown in Fig. 3, the same plates as shown in Fig. 1 are laminated, iron or stainless steel plates 4 with a height of 5 mm are stacked on top and bottom, and heat-resistant cushion boards 4 are placed on top and bottom of this.
t-Tora and absorb the uneven distribution of press pictures. One of the metal plates with through holes is used as a power layer, and the other as a ground layer, but soft iron is used so that they are not unevenly distributed during pressing, and so that the entire board is subjected to single-motion compression in the vertical direction. guide pin 6
is passed through the reference hole 7. With the configuration shown in FIG. 3,
Thereafter, the entire structure is heated and pressurized under normal lamination 8I manufacturing conditions.
（作用）
貫通孔を設けた金属板３に接する熱硬化性シートは、貫
通孔内に流入する結果として無空洞（ボイドレス）で硬
化する。また、従来の製造方法におけるようにＭｒｆＪ
のプレス時の空隙による絶縁性低下を考慮する必要がな
く、任意に電流容量に見合りた厚さの金属板を選ぶこと
ができる。(Function) The thermosetting sheet in contact with the metal plate 3 provided with the through holes is cured void-free as a result of flowing into the through holes. Also, as in the conventional manufacturing method, MrfJ
There is no need to consider deterioration in insulation properties due to voids during pressing, and a metal plate with a thickness commensurate with the current capacity can be arbitrarily selected.
熱硬化性樹脂シートの無機充填剤及びゴム成分を工、加
熱加圧時の流動性全調整するために箔７ＪＤするもので
ある。したがって、無機充填剤１０京量％以下、ゴム成
分２重量％以下で昏工流勧速度が大きくなり、空気を抱
き込んだまま金属板の孔内に充填さｎるから好まシ＜な
い。また、逆に％機充填剤５０重Ｍ％以上、ゴム３０重
賞％以上では流動性が悪（なるため金属板の孔内端部ま
で十分に゛流入しなくなる。また、無機充填剤は、スル
ーホール孔明は後の壁面を粗面化し、スルーホールのめ
っぎ金属層と壁面との接着力向上に寄与しており１０ｘ
ｉ％以上必要である◇さらにゴム成分は、シートの塗工
乾燥工程において樹脂がフィルムの５ねりに追従するた
めに脩加するものであって、均一な厚さのシートを作る
上で効果があり５へ１０京量％市゛加することが好プし
い。The inorganic filler and rubber components of the thermosetting resin sheet are treated with foil 7JD in order to completely adjust the fluidity during heating and pressing. Therefore, if the inorganic filler is less than 10 quintillion % by weight and the rubber component is less than 2% by weight, the flow rate will increase and the holes in the metal plate will be filled with air trapped, which is not preferred. On the other hand, if the filler is 50 wt. The through-hole drilling roughens the back wall surface and contributes to improving the adhesive strength between the plated metal layer of the through-hole and the wall surface.
◇Furthermore, the rubber component is added in order for the resin to follow the curvature of the film during the sheet coating and drying process, and is effective in making a sheet with a uniform thickness. It is preferable to add 10 quintillion percent to 5.
実施例１
■ エポキシ＆ＩＢｆｌエピコート１００１（シェル化
学製）６ＯＮｍ％、エポキシ樹脂エピコー）１５２（シ
ェル化学製）５重量％、硬化剤ジシアンジアミド２重蓋
％、硬化促進剤キエアゾールＣＩＩＺ（四国化ｈ！ｉ、
製）（ｌＬｔ重量％、無機フィラージルコニウムシリケ
イトミクロパックス２０Ａ（白水化手製）２０京量％、
ゴムとしてＮＢＲニツボール１４３２Ｊ（日本ゼオン製
）８重対％および架橋剤としてフェノール樹脂ヒタノー
ル２４００（日型化成製）５重量％をメチルエテルケト
ンとメチルグリコールの２：１混曾浴液に浴解し、粘度
５０００ ｃｐｓＶｃｍ整する。Example 1 ■ Epoxy & IBfl Epicort 1001 (made by Shell Chemical) 6ONm%, epoxy resin Epicor) 152 (made by Shell Chemical) 5% by weight, curing agent dicyandiamide double cap%, curing accelerator Chierazol CIIZ (Shikokuka h!i) ,
) (lLt weight %, inorganic filler zirconium silicate Micropax 20A (made by Hakusui Ka) 20 quintillion weight %,
NBR Nitsubol 1432J (manufactured by Nippon Zeon) as a rubber and 5% by weight of phenolic resin Hytanol 2400 (manufactured by Nikkei Kasei) as a crosslinking agent were dissolved in a 2:1 mixed bath solution of methyl ether ketone and methyl glycol. , the viscosity was adjusted to 5000 cpsVcm.
■ この溶液を２軸延伸ポリプロピレンフイルム（厚さ
５５μｍ）に１００〜１２０μｍ塗゛布し、１４０℃で
１０分間乾燥し、熱硬化性樹脂シートを作成する。(2) Apply 100 to 120 μm of this solution onto a biaxially stretched polypropylene film (thickness: 55 μm) and dry at 140° C. for 10 minutes to prepare a thermosetting resin sheet.
■ 厚さ０．３關の銅板（ＪＩＳグレートＣ−１１００
Ｐ）を直径２．２關φのドリルで孔明けし、電源層用銅
板と接地層用銅板を作成する。■ Copper plate with a thickness of 0.3 mm (JIS grade C-1100
P) is drilled with a drill having a diameter of 2.2 mm to create a copper plate for the power layer and a copper plate for the ground layer.
孔明は条件は回転数２５．００ Ｏｒｐｍ送り速度９Ｑ
Ｑｍｒｏ／分である。また同時に基準孔も孔明けする。For Komei, the conditions are rotation speed 25.00 Orpm feed rate 9Q
Qmro/min. At the same time, a reference hole is also drilled.
■ ベルトテンダーで研暦後、過硫酸アンモニウム水溶
液（２００ｇ／Ｊ、Ｒ，Ｔ）［１分間浸漬後水洗する。■ After testing with a belt tender, ammonium persulfate aqueous solution (200g/J, R, T) [soak for 1 minute, then rinse with water.
■ 接着力向上の銅表面処理として亜塩素酸ソーダ３０
ｇ／ｌ、リンｒ１１３ナトリウム１０ｇ／ｌ、水酸化
す） ＋７ウム１８ｇ／７ｔの溶液を９０℃に加温し、
鋼板ｔ−３分間浸漬する。■ Sodium chlorite 30 as a copper surface treatment to improve adhesion
g/l, phosphorus r113 sodium 10g/l, hydroxide) +7um 18g/7t solution was heated to 90°C,
Steel plate t-Immerse for 3 minutes.
■ 流水洗を５分間行った後、１３０℃で４０分間乾燥
する。■ After washing with running water for 5 minutes, dry at 130°C for 40 minutes.
の 淳さ５ｆｆｌＩｔ＋のステンレス製金型上に離型用
のテトラ−フィルム’ｔ−ｔき、更に電源層銅板を置き
、その上にポリプロピレンフィルムｋｍり除いた■で作
成した樹脂シートｔ−重ねる。A tetra-film for mold release was placed on a stainless steel mold with a thickness of 5ffl+, a copper plate for the power supply layer was further placed, and a resin sheet made by removing the polypropylene film was layered on top of it.
更にガラス布エポキシプリプレグＧＥＡ−６２７Ｎ（２
９にさ０．１＋１１０１１ 日立化成Ｈ）ｔｌ−２枚ｅ
く。Furthermore, glass cloth epoxy prepreg GEA-627N (2
9 to 0.1+11011 Hitachi Chemical H) tl-2 pieces e
Ku.
次に上記樹脂シート、接地層用′＠板、テトラ−フィル
ムの順に重ね、ステンレス製金型を置く、この時位＃付
せ用のピンを挿入し℃おく。Next, the above-mentioned resin sheet, ground layer board, and Tetra film were stacked in this order, and a stainless steel mold was placed. At this time, a # attaching pin was inserted and kept at ℃.
■ プレス条件として１３５℃、４０）Ｃｇ／電圧で４
０分間、後１７０℃に温度を上げ５０分間プレスし、一
体化する。 ・
■ この内層回路板の両側にガラス布エポキシプリプレ
グＧＥＡ−６２７Ｎを２枚配置し、更にその表面に厚さ
３５μｍの鋼箔を！き、１７０℃４０ｋｇ／ａｏＩで９
０分間プレスして内層回路入り鋼張り積層板を作成する
。■ Pressing conditions: 135℃, 40)Cg/voltage: 4
After 0 minutes, the temperature was raised to 170°C and pressed for 50 minutes to integrate.・ ■ Two sheets of glass cloth epoxy prepreg GEA-627N are placed on both sides of this inner layer circuit board, and a 35 μm thick steel foil is further placed on the surface! 9 at 170℃ 40kg/aoI
Press for 0 minutes to create a steel-clad laminate with an inner layer circuit.
■ 公知のナツトラクト法で配線パターンを形成し４層
の多層印刷配線板全作反する。二の配線板の内層回路と
スルーホール間の距離はＣＬ６ｍｍであるが、Ｂ、Ｄ、
Ｖ、はＭＩＬ熱備撃試験（ＭＩＬ−５ＴＤ−２０２Ｅ−
１０７Ｃ−ＣｏｎｄＢ） ２００ ｔイクル後で７ｋＶ
以上と良好であった。またＤＣ５Ｖで５ＯＡの！、流を
サイズ０．３ｍｍＸ ３００ｍｍＸ ５００ ｍの金属
層を持つ内層回路板に流しても＊度上昇（１５℃以下で
あった。■ Wiring patterns are formed using the well-known Nattract method, which is contrary to all four-layer multilayer printed wiring boards. The distance between the inner layer circuit and the through hole of the second wiring board is CL6mm, but B, D,
V, MIL heat attack test (MIL-5TD-202E-
107C-CondB) 7kV after 200 t cycles
The results were good. Also 5OA with DC5V! Even when the current was passed through an inner layer circuit board having a metal layer with a size of 0.3 mm x 300 mm x 500 m, the temperature rose (15°C or less).
実施例２
■ エポキシ樹脂、エピコート１００１（シェル化学）
５０重倉％、エピコート１５２（シェル化学）５ＭＪ％
、硬化剤、ジシアンジアミド１．７重ｉ％、ベンジルジ
メチルアミン０゜３重量％、無機充填剤、ガラスファイ
バーＡＧＰ−０１ＢＺ（旭シｚ −ヘ３ ） ２３重ｉ
ｔ％、ゴム、ＮＢＲニツポールＤＮ４０１（日本ゼオン
）１５重量％、架橋剤、フェノール樹脂５Ｐ−１２６（
スケネクタデイ化学）５重量％全メチルエテルケトンと
メチルグリコールの２：１混台溶液に溶解し、粘度５０
００ｃｐｓに調整する。Example 2 ■ Epoxy resin, Epicote 1001 (Shell Chemical)
50 Jukura%, Epicote 152 (Shell Chemical) 5MJ%
, curing agent, 1.7% by weight of dicyandiamide, 0.3% by weight of benzyldimethylamine, inorganic filler, glass fiber AGP-01BZ (Asahi Z-He 3) 23% by weight
t%, rubber, NBR Nitzpol DN401 (Nippon Zeon) 15% by weight, crosslinking agent, phenolic resin 5P-126 (
Schenectaday Chemical) Dissolved in a 2:1 mixed solution of 5% by weight total methyl ether ketone and methyl glycol, with a viscosity of 50%.
Adjust to 00cps.
■ 実施例１の■〜のまでと同様に行う。(2) Perform in the same manner as (1) to (2) in Example 1.
■ プレス条件として１３０℃、３０ｋｇ／ａＩ１１１
４０分後１７５℃に温度を上げ４０分間プレスし一体化
する。■ Pressing conditions: 130℃, 30kg/aI111
After 40 minutes, the temperature was raised to 175°C and pressed for 40 minutes to integrate.
■ 実施例１の■〜■までと同様に行う。(2) Perform in the same manner as (1) to (4) in Example 1.
この配線板の内層回路とスルホホール間の距離はα６ｍ
ｍであるが、Ｂ、Ｄ、ＶはＭＩＬｆＰ４’４１ｒ撃試験
（ＭＩＬ−３ＴＤ−２０２Ｅ−１０７Ｃ−ＣｏｎｄＢ）
２００ ？イクル後で７ ｋＶｐ４上と良好であった
。また、ＤＣ５Ｖで５ＯＡの電流を、サイズα５ｒｎｍ
Ｘ ３０ Ｑｍｍ×３０ Ｑｍ＋ｎの金属層を持つ内層
回路板に流しても温度上昇９１５℃以下であった。The distance between the inner layer circuit and sulfohole of this wiring board is α6m
m, but B, D, and V are MILfP4'41r impact test (MIL-3TD-202E-107C-CondB)
200? After cycling, the voltage was 7 kVp4 or above, which was good. In addition, a current of 5OA at DC5V, size α5rnm
Even when it was poured onto an inner layer circuit board having a metal layer of x 30 Qmm x 30 Qm+n, the temperature rise was 915°C or less.
（発明の効果）
本発明により、内層回路板における電諒層及び接地ノロ
の庫さは任意に選択可能となり、電流容量が大きい印刷
配線板にも対応出来る。付随して、回路内に発生した熱
の放熱効果も生じる。(Effects of the Invention) According to the present invention, the thickness of the electrical layer and the grounding layer in the inner layer circuit board can be arbitrarily selected, and it is possible to correspond to a printed wiring board with a large current capacity. Concomitantly, a heat dissipation effect of the heat generated within the circuit also occurs.
本発明により、加熱加圧の際、熱硬化性シートはシート
中に織布等の基材がない為、溶融した樹脂が垂直方向に
流動しやすくなり、貫通孔に含まｎる気泡が容易に排出
される。According to the present invention, when heated and pressurized, since the thermosetting sheet does not have a base material such as woven fabric in the sheet, the molten resin can easily flow in the vertical direction, and air bubbles contained in the through holes can be easily removed. be discharged.
１・・・・・・熱硬化性樹脂含浸基板、２・・・・・・
熱硬化性樹脂シート、
３・・・・・・貫通孔を持つ金属板、
４・・・・・・鉄板あるいはステンレス板、５・・・・
・・クッションボード、
６・・・・・・ガイドビン、
７・・・・・・基準孔。
第１図
納２図1...Thermosetting resin impregnated substrate, 2...
Thermosetting resin sheet, 3...Metal plate with through holes, 4...Iron plate or stainless steel plate, 5...
...Cushion board, 6...Guide bin, 7...Reference hole. Figure 1 Figure 2
Claims (1)
に熱硬化性樹脂２０〜７０重量％、無機充填剤１０〜５
０重量％、ゴム２〜３０重量％より成る熱硬化性樹脂を
重ね、さらにその両側面の一方に貫通孔を有する熱伝導
性金属板を他方に貫通孔を有する熱伝導性金属板を重ね
て、全体を加熱加圧することを特徴とする内層回路板の
製造方法。1. 20-70% by weight of thermosetting resin and 10-5% inorganic filler on both sides of the substrate impregnated with thermosetting resin.
A thermosetting resin consisting of 0% by weight and 2 to 30% by weight of rubber is layered, and a thermally conductive metal plate with through holes is layered on one side of both sides, and a thermally conductive metal plate with through holes is layered on the other side. , a method for manufacturing an inner layer circuit board, characterized by heating and pressurizing the entire board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12145386A JPS62277794A (en) | 1986-05-27 | 1986-05-27 | Manufacture of inner layer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12145386A JPS62277794A (en) | 1986-05-27 | 1986-05-27 | Manufacture of inner layer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62277794A true JPS62277794A (en) | 1987-12-02 |
Family
ID=14811507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12145386A Pending JPS62277794A (en) | 1986-05-27 | 1986-05-27 | Manufacture of inner layer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62277794A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6454154B1 (en) | 2000-05-31 | 2002-09-24 | Honeywell Advanced Circuits, Inc. | Filling device |
| US6506332B2 (en) | 2000-05-31 | 2003-01-14 | Honeywell International Inc. | Filling method |
| US6793852B2 (en) | 2000-05-31 | 2004-09-21 | Ttm Advanced Circuits, Inc. | Scavenging method |
| US6800232B2 (en) | 2000-05-31 | 2004-10-05 | Ttm Advanced Circuits, Inc. | PCB support plate method for PCB via fill |
| US6832714B2 (en) | 2000-05-31 | 2004-12-21 | Ttm Advanced Circuits, Inc. | Heated filling device |
| US6855385B2 (en) | 2000-05-31 | 2005-02-15 | Ttm Advanced Circuits, Inc. | PCB support plate for PCB via fill |
-
1986
- 1986-05-27 JP JP12145386A patent/JPS62277794A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6454154B1 (en) | 2000-05-31 | 2002-09-24 | Honeywell Advanced Circuits, Inc. | Filling device |
| US6506332B2 (en) | 2000-05-31 | 2003-01-14 | Honeywell International Inc. | Filling method |
| US6793852B2 (en) | 2000-05-31 | 2004-09-21 | Ttm Advanced Circuits, Inc. | Scavenging method |
| US6797224B2 (en) | 2000-05-31 | 2004-09-28 | Ttm Advanced Technologies, Inc. | Heated filling method |
| US6800232B2 (en) | 2000-05-31 | 2004-10-05 | Ttm Advanced Circuits, Inc. | PCB support plate method for PCB via fill |
| US6832714B2 (en) | 2000-05-31 | 2004-12-21 | Ttm Advanced Circuits, Inc. | Heated filling device |
| US6840425B2 (en) | 2000-05-31 | 2005-01-11 | Ttm Advanced Circuits, Inc. | Scavenging system |
| US6855385B2 (en) | 2000-05-31 | 2005-02-15 | Ttm Advanced Circuits, Inc. | PCB support plate for PCB via fill |
| US6921505B2 (en) | 2000-05-31 | 2005-07-26 | Ttm Advanced Circuits, Inc. | Hole filling using an etched hole-fill stand-off |
| US6995321B2 (en) | 2000-05-31 | 2006-02-07 | Honeywell Advanced Circuits | Etched hole-fill stand-off |
| US7066378B2 (en) | 2000-05-31 | 2006-06-27 | Ttm Advanced Circuits, Inc. | Filling device |
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