CN104582256B - Centreless board member - Google Patents
Centreless board member Download PDFInfo
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- CN104582256B CN104582256B CN201410857747.9A CN201410857747A CN104582256B CN 104582256 B CN104582256 B CN 104582256B CN 201410857747 A CN201410857747 A CN 201410857747A CN 104582256 B CN104582256 B CN 104582256B
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Abstract
A kind of centreless board member, including：Support carrier, and be arranged on the support carrier both sides without core plate；The no core plate includes：Interior prepreg, outer prepreg, internal layer copper foil and outer copper foil；The internal layer copper foil both sides set the interior prepreg, and the outer prepreg is set in the outermost internal layer copper foil, and outer copper foil is set in the outer cured sheets；Contain glass in the interior prepreg and the outer prepreg.Using the scheme of the application, adjusted and matched with asymmetry by the glass thickness and resin gel content of the inside/outside prepreg to different layers, can simply, be achieved at low cost the reduction of centreless slab warping.
Description
Technical field
The present invention relates to centreless plate technique field, more particularly to a kind of centreless board member.
Background technology
As semiconductor package product develops towards high-performance, slimming and inexpensive direction, centreless thin substrate skill has been expedited the emergence of
Art；Since no core plate is too thin, more serious warpage issues can be run into, plate damage, asking of scrapping of snap-gauge are be easy to cause in manufacturing process
Topic.
The content of the invention
Based on this, it is necessary to for warpage issues, there is provided a kind of centreless board member.
A kind of centreless board member, including：Support carrier, and be arranged on the support carrier both sides without core plate；It is described
No core plate includes：Interior prepreg, outer prepreg, internal layer copper foil and outer copper foil；Described in the internal layer copper foil both sides are set
Interior prepreg, the outer prepreg is set in the outermost internal layer copper foil, and outer layer copper is set in the outer cured sheets
Paper tinsel；Contain glass in the interior prepreg and the outer prepreg.
In one of which embodiment, the glass layer thickness of the interior cured sheets is 10~25 μm, the gel content of resin
More than 75%.
In one of which embodiment, the glass thickness of interior cured sheets is big described in the glass thickness ratio of the outer cured sheets
8 μm, and the resin gel content of the outer cured sheets is less than 65%.
Double-deck glass structure is equipped with one of which embodiment, in the outer cured sheets.
In one of which embodiment, the bilayer glass structure includes the first fiberglass layer and the second fiberglass layer, described
On the outside, second fiberglass layer is in inner side, the second glass thickness described in the thickness ratio of first fiberglass layer for first fiberglass layer
Degree is big.
In one of which embodiment, the second fiberglass layer thickness difference is more than described in the thickness ratio of first fiberglass layer
8μm。
In one of which embodiment, the frame of the internal layer copper foil opens up gap.
In one of which embodiment, the frame of the outer copper foil opens up gap.
In one of which embodiment, the frame of the internal layer copper foil opens up gap and the frame of the outer copper foil is opened
If gap is in same vertical face.
Using the scheme of the application, by the glass thickness and resin gel content of the inside/outside prepreg to different layers with
Asymmetry adjusts matching, can simply, be achieved at low cost the reduction of centreless slab warping.
Brief description of the drawings
Fig. 1 manufactures element structure schematic diagram for no core plate proposed by the present invention；
Fig. 2 is the support carrier structure schematic diagram in a kind of embodiment；
Fig. 3 is without core plate structure figure in Fig. 1；
Fig. 4 is the pattern schematic diagram of outer copper foil in Fig. 1；
Fig. 5 is the pattern schematic diagram of internal layer copper foil in Fig. 1；
Fig. 6 is glass structure diagram in Fig. 1；
Fig. 7 is the double-deck glass structure diagram in a kind of embodiment；
Fig. 8 is manufacture method flow chart proposed by the present invention；
Fig. 9 is the manufacture method flow chart in a kind of embodiment；
Figure 10 is the manufacture method flow chart in another embodiment；
Figure 11 is location hole design diagram.
Embodiment
To enable objects, features and advantages of the present invention more obvious understandable, below in conjunction with the accompanying drawings to the tool of the present invention
Body embodiment is described in detail.Many details are elaborated in the following description in order to fully understand the present invention.
But the invention can be embodied in many other ways as described herein, those skilled in the art can without prejudice to
Similar improvement is done in the case of intension of the present invention, therefore the present invention is not limited to the specific embodiments disclosed below.
The present embodiment manufactures component, including support carrier without core plate, and be arranged on support carrier both sides without core plate.
Specifically：
Carrier is supported, is insulator, which can be BT resins, epoxy resin, ABF, polytetrafluoroethylene (PTFE), hydrocarbonization
The materials such as compound ceramics.Since no core plate is relatively thin, plate damage or warpage easily occurs, the support carrier of this programme, Ke Yi are set
Play a supporting role when manufacture is without core plate.
In a present embodiment, support carrier includes：Insulating trip, sets up the carrier copper foil in insulating trip both sides, carrier copper separately
Paper tinsel is thicker, and thickness is 12~15 μm, preferably can provide stress for the manufacture of no core plate and support.In addition, the both sides of carrier copper foil
Roughening treatment is carried out, the combination power after pressing can be increased.
In other embodiments, outer copper foil is set in the outside of carrier copper foil, it is whole to support carrier to pass through precompressed
Conjunction is bonded together, and the opposing face of carrier copper foil and outer copper foil passes through roughening treatment, i.e. surface roughening, after can increasing pressing
Combination power, the separation of more convenient carrier copper foil and outer copper foil.
The structure of the outer copper foil can be applicable in no core plate, that is, shift to an earlier date the structure setting outer copper foil in insulating trip
On, as the composition structure of no core plate, the outer copper foil and carrier copper foil can be subsequently separated by separating technology.
In other embodiments, carrier is supported ice to be used to replace.During no core plate manufactures, first have to low
Made in 0 ° of operating space, then press no core plate successively in the both sides of ice, after the completion of pressing, improve operating space
Temperature, after ice melts automatically, two can be automatically separated without core plate.The ice is using ice made of pure water, not trace after ice-out,
No core plate will not be impacted.
Without core plate, including：Interior prepreg, outer prepreg, internal layer copper foil and outer copper foil.Specifically, interior semi-solid preparation
The both sides of piece set internal layer copper foil, can set multilayer according to the design needs, that is, set multiple internal layer copper foils, while also will be more
Multiple interior prepregs are set between a internal layer copper foil, can lamination press together.Finally copper foil on outermost internal layer again
Outer prepreg is set, outer copper foil then is set outside the outer prepreg.The thickness of internal layer copper foil and outer copper foil can be with
Equally, it is all 2~5 μm.
Further, internal layer copper foil offers gap, which is each provided at the edge surrounding of internal layer copper foil, what gap opened up
Direction can vertical internal layer copper foil frame, setting can also be at an angle of, this gap design can effectively reduce lamination and fill out
The problem of glue is without cavity.Furthermore it is also possible to set circle pad in the inside of internal layer copper foil, which is uniformly arranged on internal layer
The inner side of the frame of copper foil, is set in a ring.Using the design of circle pad, the cavity for being laminated filler can be more effectively reduced.
In the present embodiment, gap is 0.5~1.5mm, and the gap of circle pad is between 0.2~0.5mm.
In other embodiments, patterned process can also be carried out in the inner surface of outer copper foil, this is patterned small convex
Rise, during filler is laminated, effectively extrude the bubble in filler.
Outer copper foil, is arranged on outermost, shares two outer copper foils.Specifically, outer copper foil offers gap, between being somebody's turn to do
Gap is each provided at the surrounding of internal layer copper foil, and the direction that gap opens up can also be at an angle of setting with the frame of vertical outer copper foil,
This gap design can effectively reduce the problem of lamination filler is without cavity.In addition, opened in internal layer copper foil and outer copper foil
If gap be all disposed within same vertical face, can preferably reduce lamination filler without cavity the problem of.
In other embodiments, the thickness of the frame of internal layer copper foil and outer copper foil is thicker than the thickness at middle part,
The intensity of no core plate can effectively be increased.
In one embodiment, interior prepreg, the outer prepreg of no core plate manufacture component contain glass.
Since the structure of support carrier both sides is identical, for the structure of apparent description this programme, with wherein side
Structure be described.
Specifically, the main component of interior cured sheets and outer cured sheets is resin, and fiberglass layer is contained in resin.Interior cured sheets
Glass layer thickness be 10~25 μm, the gel content of resin is more than 75%；The glass thickness of outer cured sheets is at least than interior cured sheets
Glass thickness it is 8 μm big, and the resin gel content of outer cured sheets be less than 65%.By the resin content of differentiation and, can be effective
Stress of plate interior distribution is controlled, reduces angularity.
Embodiment one
Embodiment two
Embodiment three
Wherein depth of camber refers to the difference in height at no core plate plate both ends；Warpage is difference in height divided by the value of plate length, with generation
The warpage degree of dash board.
Above example represents, controls the glass thickness difference of outer cured sheets and interior cured sheets to be more than 8 μm, can effectively control
For warpage below 1%, depth of camber difference is not higher than 5mm.And glass difference in thickness is bigger, warpage is lower.
Adjusted and matched with asymmetry by the glass thickness to different layers prepreg and resin gel content, can be simple, low
Into the local reduction for realizing centreless slab warping.
In addition, double-deck glass structure can also be equipped with outer cured sheets.Double-deck glass structure includes the first fiberglass layer and the
Two fiberglass layers, wherein the first fiberglass layer is on the outside, the second fiberglass layer is in inner side, thickness ratio the second glass thickness of the first fiberglass layer
Degree is big, and difference in thickness is more than 8 μm.
The big I of glass difference in thickness is adjusted according to the quantity and distribution density of laser blind hole, and drilling hole amount is more, point
Cloth density is bigger, and difference in thickness should be bigger.Double-deck glass can more effectively reduce the angularity of no core plate compared with individual layer glass.
Component is manufactured based on above-mentioned no core plate and without core plate, it is also proposed that a kind of centreless board manufacturing method, including：
S100：Support carrier is provided, which includes：Insulating trip, sets up the carrier copper foil in insulating trip both sides separately, its
Middle carrier copper foil includes the carrier copper foil and outer copper foil combined, and outer copper foil thickness ratio carrier copper foil thickness is small.Add
If support carrier can increase offer beaer when no core plate makes, support preferably can be provided for the manufacture of no core plate.
S200：Lamination presses copper foil on support carrier, is equipped with interior prepreg between each copper foil layer, no core plate is made.
S300：No core plate is separated from support carrier.
Using this method, two can be produced once without core plate, doubled than traditional mode of production efficiency, and be relatively thin nothing
Core plate makes a thick supporter, alleviates centreless slab warping problem.
In above-mentioned steps S200, this includes interior prepreg, outer prepreg, internal layer copper foil and outer layer copper without core plate
Paper tinsel.Specifically, cured sheets outside last layer are first pasted in the layers of copper on support carrier two sides, then sticks internal layer copper foil, and according to need
The number of plies wanted controls the internal layer copper foil number of plies added, and between the two internal layer copper foils that are connected accompanies cured sheets at least one layer.
Exemplified by manufacturing five layers without core plate, support carrier two sides is outer copper foil, is added on outer copper foil half outside one layer
Cured sheets, carry out one step press；Add three layers of internal layer copper foil successively again, have semi-solid preparation in one layer between every two layers of internal layer copper foil
Piece, as soon as and often add a layer internal layer copper foil, carry out one step press.Finally, in the outer cured sheets in one layer of upper berth of third layer internal layer copper foil,
And the layer overlay outer copper foil in outer cured sheets, then carry out last time pressing.After pressing, by separating technology, propping up
Support carrier to peel off, obtain two piece of five identical laminate of up-down structure.
The both sides of interior prepreg set internal layer copper foil, can set multilayer according to the design needs, that is, set multiple internal layers
Copper foil, while multiple interior prepregs are also set between multiple internal layer copper foils, can lamination press together.Finally in outermost
Outer prepreg is set again on the internal layer copper foil of side, outer copper foil then is set in the outer prepreg.
In one embodiment, the pressing condition of internal layer copper foil and outer copper foil differs.
Specifically, it is 140~180 DEG C to press internal layer copper foil and the pressing maximum temperature of interior cured sheets, and pressing time is
60min~100min, and maximal pressure force value is in 30~50kgf/cm2；The outer cured sheets of pressing and the maximum temperature of outer copper foil are
220~260 DEG C, pressing time is more than 110min, and maximal pressure force value is in 30~50kgf/cm2.It is to be pressed according to this programme below
Specific experiment data：
Example IV
Embodiment 5
Embodiment 6
In bonding processes, interior prepreg uses pre-pressing with internal layer copper foil, and outer layer is closed using total head, pressing-in temp and pressure
The time is closed to improve.Compared with conventional pressing, using the interior prepreg solidification path after the pressing parameter pressing in this programme
Degree only accounts for the 70~95% of conventional parameter, and closing parameter using total head again in the bonding processes of final outer layer is pressed, and is reduced each
The residual stress of internal layer prepreg entirety, reduces the warpage of no core plate.
In one embodiment, internal layer copper foil offers gap, which is each provided at the surrounding of internal layer copper foil, and gap opens up
Direction can vertical internal layer copper foil frame, setting can also be at an angle of, this gap design can effectively reduce lamination
The problem of filler is without cavity.Furthermore it is also possible to set circle pad in the inside of internal layer copper foil, which is uniformly arranged on interior
The inner side of the frame of layer copper foil, is set in a ring.Using the design of circle pad, the cavity for being laminated filler can be more effectively reduced.
In the present embodiment, gap is 0.5~1.5mm, and the gap of circle pad is between 0.2~0.5mm.
In other embodiments, patterned process can also be carried out in the inner surface of outer copper foil, this is patterned small convex
Rise, during filler is laminated, the effective bubble extruded in filler.
Outer copper foil, is arranged on outermost, shares two outer copper foils.Specifically, outer copper foil offers gap, between being somebody's turn to do
Gap is each provided at the surrounding of internal layer copper foil, and the direction that gap opens up can also be at an angle of setting with the frame of vertical outer copper foil,
This gap design can effectively reduce the problem of lamination filler is without cavity.
In addition, the thickness of the frame of internal layer copper foil and outer copper foil can set thickness, it can effectively increase no core plate
Intensity.
In one embodiment, in the support carrier that step S100 is provided, the support carrier is directly by carrier copper foil and outside
Layer copper foil superposition is made, and the structure of the outer copper foil can be applicable in no core plate, i.e., the structure setting of outer copper foil is existed in advance
On insulating trip, the composition structure as no core plate；Carrier copper foil be also applicable in another side without in core plate, as outermost
Outer copper foil.
In the embodiment, step S400 is further included after step S300：Carrier copper foil is carried out to subtract copper.Specifically, when
After being separated to support carrier, support carrier is in two without one of core plate, it is necessary to there is being carried out without core plate for support carrier
Subtract copper, generally 2~5mm, two consistency of thickness without core plate for being.
Using this programme, the insulating trip in support carrier is eliminated, extra waste of material is avoided, improves economic effect
Benefit.
In addition, when separating two without core plate, it can not confirm that it is without core plate in which block to support carrier, it is therefore desirable to artificial mesh
Survey and confirm, greatly reduce work efficiency.For this reason, there is a need to increases step S300A before step S400：Laser Measuring is provided
Distance meter, measures two thickness without core plate respectively, and thicker is that then this is entered without core plate and is walked without core plate with support carrier
Rapid S400.
Specifically, which includes Laser emission end and laser pick-off end composition, and Laser emission end and laser connect
Receiving end is separately positioned on the both ends of no core plate, and launches laser from default height from Laser emission end, and laser pick-off end receives
Laser.It is at this time the thickness of no core plate when laser pick-off end does not receive laser signal.Similar, in addition one just adopted without core plate
With identical method to its Thickness sensitivity.Finally by comparing, you can confirm which without core plate is thicker no core plate, be to have branch
Support carrier without core plate.
In one embodiment, step S200 is specifically included：
S200A：Pattern transfer is carried out on the outer copper foil on support carrier two sides, the wherein figure of one side is another side tune
Figure after turnback.
S200C：Prepreg and internal layer copper foil in the addition of the outside of carrier two are supported, and is carried out on the internal layer copper foil of both sides
Pattern transfer, the figure of support carrier side turns the figure after 180 degree for opposite side, and is pressed.
S200D：Repeat step S200B, the number of plies until reaching setting.
Without core plate to bearing semiconductor vigour part, therefore without having needed corresponding circuit trace on core plate.Electricity without core plate
Road floor is the internal layer copper foil and outer copper foil of each floor, is turned between each layer copper foil by bore process to realize.And due to upper
Under be upside-down mounting relation without core plate structure, without the circuit layout on core plate structure be mirror from strip down two pieces on support carrier
As relation, overturn two pieces of circuit layouts without core plate anyway and differ, two sets of flows need to be divided to make, production efficiency compared with
Slowly.And by the way that the Image Reversal of circuit reference will be made in advance, subsequently only need to overturn one of no core plate, two pieces obtain without core plate
The figure arrived is i.e. identical, can be carried out at the same time subsequent treatment process.
Further, further included after step S200A：
S200B, onboard opens up location hole.Correspondingly, step S200C is specially：Support half in the addition of the outside of carrier two
Cured sheets and internal layer copper foil, and pattern transfer is carried out on the internal layer copper foil of both sides, the figure of support carrier side is opposite side
The figure after 180 degree is rotated, figure is shifted by contraposition reference of location hole, and is pressed.
Pattern alignment when location hole can help to pattern transfer is opened up, and mark can be played after separation is without core plate and made
With easy to distinguish the figure direction of plate by the distribution of location hole.Need to carry out milling to internal layer copper foil before location hole is started
Side, the size on milling side are less than 2~6mm, meanwhile, the big 5~15mm of size of outer copper foil size ratio internal layer copper foil.
Location hole is mal-distribution.In addition, location hole can also be the positioning datum such as specific telltale mark, it is main
Play reference, and be not limited to the form of location hole.
Embodiment described above only expresses the several embodiments of the present invention, its description is more specific and detailed, but simultaneously
Therefore the limitation to the scope of the claims of the present invention cannot be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (8)
- A kind of 1. centreless board member, it is characterised in that including：Carrier is supported, and is arranged on the nothing of the support carrier both sides Core plate；The no core plate includes：Interior prepreg, outer prepreg, internal layer copper foil and outer copper foil；The internal layer copper foil both sides The interior prepreg is set, the outer prepreg is set in the outermost internal layer copper foil, in the outer prepreg Outer copper foil is set, and the frame of the internal layer copper foil offers gap, the direction that the gap opens up and the internal layer copper foil Frame is vertically or angularly set, the inner surface patterned process of the outer copper foil, the patterned protrusion；Half in described Contain glass in cured sheets and the outer prepreg；The main component of the interior prepreg and the outer prepreg is tree Fat, contains fiberglass layer in the resin, and the glass of the glass thickness of the outer prepreg at least than the interior prepreg is thick Spend it is 8 μm big, by the glass thickness to different layers prepreg and resin gel content with asymmetry adjust matching realize the nothing The reduction of core plate warpage.
- 2. centreless board member according to claim 1, it is characterised in that the glass layer thickness of the interior prepreg is 10 ~25 μm, the gel content of resin is more than 75%.
- 3. centreless board member according to claim 2, it is characterised in that described in the glass thickness ratio of the outer prepreg The glass thickness of interior prepreg is 8 μm big, and the resin gel content of the outer prepreg is less than 65%.
- 4. centreless board member according to claim 3, it is characterised in that double-deck glass knot is equipped with the outer prepreg Structure.
- 5. centreless board member according to claim 4, it is characterised in that the bilayer glass structure includes the first fiberglass layer With the second fiberglass layer, on the outside, second fiberglass layer is in inner side, the thickness ratio of first fiberglass layer for first fiberglass layer The second glass layer thickness is big.
- 6. centreless board member according to claim 5, it is characterised in that second described in the thickness ratio of first fiberglass layer Fiberglass layer thickness difference is more than 8 μm.
- 7. centreless board member according to claim 1, it is characterised in that the frame of the outer copper foil opens up gap.
- 8. centreless board member according to claim 7, it is characterised in that the frame of the internal layer copper foil opens up gap and institute The frame for stating outer copper foil opens up gap and is in same vertical face.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410857747.9A CN104582256B (en) | 2014-12-31 | 2014-12-31 | Centreless board member |
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| CN201410857747.9A CN104582256B (en) | 2014-12-31 | 2014-12-31 | Centreless board member |
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| CN104582256B true CN104582256B (en) | 2018-04-20 |
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| CN104540326A (en) * | 2014-12-31 | 2015-04-22 | 广州兴森快捷电路科技有限公司 | Core-less board manufacturing component and manufacturing method for core-less board |
| CN110099507B (en) * | 2019-05-29 | 2022-04-05 | 广东依顿电子科技股份有限公司 | Thick copper circuit board and manufacturing method thereof |
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