CN104540339B - Without core plate manufacture component, without core plate and centreless board manufacturing method - Google Patents
Without core plate manufacture component, without core plate and centreless board manufacturing method Download PDFInfo
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- CN104540339B CN104540339B CN201410857699.3A CN201410857699A CN104540339B CN 104540339 B CN104540339 B CN 104540339B CN 201410857699 A CN201410857699 A CN 201410857699A CN 104540339 B CN104540339 B CN 104540339B
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- copper foil
- internal layer
- core plate
- layer copper
- prepreg
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Component is manufactured without core plate, including：Support carrier, and be arranged on the support carrier both sides without core plate；The no core plate includes：Interior prepreg, outer prepreg, internal layer copper foil and outer copper foil；The internal layer copper foil both sides set the interior prepreg, and the outer prepreg is set in the outermost internal layer copper foil, and outer copper foil is set in the outer cured sheets；The frame of the internal layer copper foil opens up gap.Using the application without core plate manufacture component, without core plate and a kind of centreless board manufacturing method, support carrier is cleverly provided with, the problem of can effectively overcoming centreless slab warping, improves yields of the production without core plate.
Description
Technical field
The present invention relates to centreless plate technique field, and component is manufactured, without core plate and centreless without core plate more particularly to one kind
Board manufacturing method.
Background technology
As semiconductor package product develops towards high-performance, slimming and inexpensive direction, centreless thin substrate skill has been expedited the emergence of
Art；Due to too thin without core plate, more serious warpage issues can be run into, plate damage are easily caused in manufacturing process, clamp is scrapped asks
Topic.
The content of the invention
Based on this, it is necessary to for warpage issues, there is provided a kind of to manufacture component without core plate.In addition, it there is a need to offer one
Kind is without core plate and a kind of centreless board manufacturing method.
It is a kind of to manufacture component without core plate, including：Support carrier, and be arranged on the support carrier both sides without core plate；
The no core plate includes：Interior prepreg, outer prepreg, internal layer copper foil and outer copper foil；The internal layer copper foil both sides are set
The interior prepreg, the outer prepreg is set in the outermost internal layer copper foil, set in the outer cured sheets outer
Layer copper foil；The frame of the internal layer copper foil opens up gap.
In an embodiment wherein, the inside of the internal layer copper foil sets circle pad, and the round pad is around the internal layer
The frame of copper foil is laid.
In an embodiment wherein, the frame of the outer copper foil opens up gap.
In an embodiment wherein, the frame of the internal layer copper foil opens up gap and the frame of the outer copper foil opens up
Gap is in same vertical face.
In an embodiment wherein, the thickness of the frame of the internal layer copper foil and the outer copper foil is more than in the middle part of it
Thickness.
In an embodiment wherein, the support carrier includes：Insulating trip, set up the carrier in the insulating trip both sides separately
Copper foil.
In an embodiment wherein, the surface coarsening processing of the carrier copper foil.
One kind without core plate, including：Interior prepreg, outer prepreg, internal layer copper foil and outer copper foil；The internal layer copper foil
Both sides set the interior prepreg, the outer prepreg are set in the outermost internal layer copper foil, in the outer solidification
Piece sets outer copper foil；The frame of the internal layer copper foil opens up gap.
In an embodiment wherein, the inside of the internal layer copper foil sets circle pad, and the round pad is around the internal layer
The frame of copper foil is laid.
A kind of centreless board manufacturing method, including：S100：Support carrier is provided；S200：On support carrier in lamination pressing
Layer copper foil, is provided with interior prepreg between each internal layer copper foil layer, outer prepreg is set in the outside of internal layer copper foil, then partly
Outer copper foil is set on the outside of cured sheets and no core plate is made, the frame of the internal layer copper foil opens up gap；S300：Without core plate from
Support carrier separation.
Using the application without core plate manufacture component, without core plate and a kind of centreless board manufacturing method, branch is cleverly provided with
Carrier is supportted, the problem of can effectively overcoming centreless slab warping, improves yields of the production without core plate.
Brief description of the drawings
Fig. 1 manufactures element structure schematic diagram for no core plate proposed by the present invention；
Fig. 2 is the support carrier structure schematic diagram in a kind of embodiment；
Fig. 3 is without core plate structure figure in Fig. 1；
Fig. 4 is the pattern schematic diagram of outer copper foil in Fig. 1；
Fig. 5 is the pattern schematic diagram of internal layer copper foil in Fig. 1；
Fig. 6 is glass structural representation in Fig. 1；
Fig. 7 is the double-deck glass structural representation in a kind of embodiment；
Fig. 8 is manufacture method flow chart proposed by the present invention；
Fig. 9 is the manufacture method flow chart in a kind of embodiment；
Figure 10 is the manufacture method flow chart in another embodiment；
Figure 11 is positioning hole design diagram.
Embodiment
To enable objects, features and advantages of the present invention more obvious understandable, below in conjunction with the accompanying drawings to the tool of the present invention
Body embodiment is described in detail.Many details are elaborated in the following description in order to fully understand the present invention.
But the invention can be embodied in many other ways as described herein, those skilled in the art can without prejudice to
Similar improvement is done in the case of intension of the present invention, therefore the present invention is not limited to the specific embodiments disclosed below.
The present embodiment manufactures component, including support carrier without core plate, and be arranged on support carrier both sides without core plate.
Specifically：
Carrier is supported, is insulator, the insulator can be BT resins, epoxy resin, ABF, polytetrafluoroethylene (PTFE), hydrocarbonization
The materials such as compound ceramics.Due to relatively thin without core plate, plate damage or warpage easily occurs, the support carrier of this programme, Ke Yi are set
Played a supporting role when manufacture is without core plate.
In a present embodiment, support carrier includes：Insulating trip, set up the carrier copper foil in insulating trip both sides, carrier copper separately
Paper tinsel is thicker, and thickness is 12~15 μm, preferably can provide stress for the manufacture without core plate and support.In addition, the both sides of carrier copper foil
Roughening treatment is carried out, the adhesion after pressing can be increased.
In other embodiments, outer copper foil is set in the outside of carrier copper foil, it is whole to support carrier to pass through precompressed
Conjunction is bonded together, and the opposing face of carrier copper foil and outer copper foil passes through roughening treatment, i.e. surface roughening, after can increasing pressing
Adhesion, more facilitate the separation of carrier copper foil and outer copper foil.
The structure of the outer copper foil can be applicable in no core plate, that is, shift to an earlier date the structure setting outer copper foil in insulating trip
On, as the composition structure without core plate, the outer copper foil and carrier copper foil can be subsequently separated by separating technology.
In other embodiments, carrier is supported ice to be used to replace.During being manufactured without core plate, first have to low
Made in 0 ° of operating space, then press no core plate successively in the both sides of ice, after the completion of pressing, improve operating space
Temperature, after ice melts automatically, two can be automatically separated without core plate.The ice is using ice made of pure water, not trace after ice-out,
Will not be to being impacted without core plate.
Without core plate, including：Interior prepreg, outer prepreg, internal layer copper foil and outer copper foil.Specifically, interior semi-solid preparation
The both sides of piece set internal layer copper foil, can set multilayer according to the design needs, that is, set multiple internal layer copper foils, while also will be more
Multiple interior prepregs are set between individual internal layer copper foil, can lamination press together.Finally copper foil on outermost internal layer again
Outer prepreg is set, outer copper foil then is set outside the outer prepreg.The thickness of internal layer copper foil and outer copper foil can be with
Equally, it is all 2~5 μm.
Further, internal layer copper foil offers gap, and the gap is each provided at the edge surrounding of internal layer copper foil, what gap opened up
Direction can vertical internal layer copper foil frame, setting can also be at an angle of, this gap design can effectively reduce lamination and fill out
The problem of glue is without cavity.Furthermore it is also possible to set circle pad in the inside of internal layer copper foil, the circle pad is uniformly arranged on internal layer
The inner side of the frame of copper foil, is set in a ring.Using the design of circle pad, the cavity for being laminated filler can be more effectively reduced.
In the present embodiment, gap is 0.5~1.5mm, and the gap of circle pad is between 0.2~0.5mm.
In other embodiments, patterned process can also be carried out in the inner surface of outer copper foil, this is patterned small convex
Rise, during filler is laminated, effectively extrude the bubble in filler.
Outer copper foil, outermost is arranged on, shares two outer copper foils.Specifically, outer copper foil offers gap, between being somebody's turn to do
Gap is each provided at the surrounding of internal layer copper foil, and the direction that gap opens up can also be at an angle of setting with the frame of vertical outer copper foil,
This gap design can effectively reduce the problem of lamination filler is without cavity.In addition, opened in internal layer copper foil and outer copper foil
If gap be all disposed within same vertical face, can preferably reduce lamination filler without cavity the problem of.
In other embodiments, the thickness of the frame of internal layer copper foil and outer copper foil is thicker than the thickness at middle part,
The intensity of no core plate can effectively be increased.
In one embodiment, interior prepreg, the outer prepreg of no core plate manufacture component contain glass.
Because the structure of support carrier both sides is identical, for the structure of apparent description this programme, with wherein side
Structure be described.
Specifically, the main component of interior cured sheets and outer cured sheets is resin, and fiberglass layer is contained in resin.Interior cured sheets
Fiberglass layer thickness be 10~25 μm, the gel content of resin is more than 75%；The glass thickness of outer cured sheets is at least than interior cured sheets
Glass thickness it is big 8 μm, and the resin gel content of outer cured sheets be less than 65%.By the resin content of differentiation and, can be effective
Stress of plate interior distribution is controlled, reduces angularity.
Embodiment one
Embodiment two
Embodiment three
Wherein depth of camber refers to the difference in height at no core plate plate both ends；The value that warpage is difference in height divided by plate is grown, with generation
The warpage degree of dash board.
Above example represents, controls the glass thickness difference of outer cured sheets and interior cured sheets to be more than 8 μm, can effectively control
For warpage below 1%, depth of camber difference is not higher than 5mm.And glass difference in thickness is bigger, warpage is lower.
Matched by the glass thickness to different layers prepreg and resin gel content with asymmetry regulation, can be simple, low
Into the local reduction for realizing centreless slab warping.
In addition, double-deck glass structure can also be provided with outer cured sheets.Double-deck glass structure includes the first fiberglass layer and the
Two fiberglass layers, wherein the first fiberglass layer, in outside, the second fiberglass layer is in inner side, thickness ratio the second glass thickness of the first fiberglass layer
Degree is big, and difference in thickness is more than 8 μm.
The big I of glass difference in thickness is adjusted according to the quantity and distribution density of laser blind hole, and drilling hole amount is more, point
Cloth density is bigger, and difference in thickness should be bigger.Double-deck glass can more effectively reduce the angularity of no core plate compared with individual layer glass.
Component is manufactured based on above-mentioned no core plate and without core plate, it is also proposed that a kind of centreless board manufacturing method, including：
S100：Support carrier is provided, the support carrier includes：Insulating trip, set up the carrier copper foil in insulating trip both sides separately, its
Middle carrier copper foil includes the carrier copper foil and outer copper foil combined, and outer copper foil thickness ratio carrier copper foil thickness is small.Add
If support carrier can increase offer beaer when no core plate makes, support preferably can be provided for the manufacture without core plate.
S200：Lamination presses copper foil on support carrier, is provided with interior prepreg between each copper foil layer, no core plate is made.
S300：Without core plate from support carrier separation.
Using this method, two can be produced once without core plate, doubled than traditional mode of production efficiency, and be relatively thin nothing
Core plate makes a thick supporter, alleviates centreless slab warping problem.
In above-mentioned steps S200, this includes interior prepreg, outer prepreg, internal layer copper foil and outer layer copper without core plate
Paper tinsel.Specifically, cured sheets outside last layer are first pasted in the layers of copper on support carrier two sides, then sticks internal layer copper foil, and according to need
The number of plies wanted controls the internal layer copper foil number of plies added, and between the two internal layer copper foils that are connected accompanies cured sheets at least one layer.
Exemplified by manufacturing five layers without core plate, support carrier two sides is outer copper foil, is added on outer copper foil half outside one layer
Cured sheets, carry out one step press；Add three layers of internal layer copper foil successively again, have semi-solid preparation in one layer between every two layers of internal layer copper foil
Piece, and one layer of internal layer copper foil is often added, with regard to carrying out one step press.Finally, in the outer cured sheets in one layer of upper berth of third layer internal layer copper foil,
And the layer overlay outer copper foil in outer cured sheets, then carry out last time pressing.After pressing, by separating technology, propping up
Support carrier to peel off, obtain two piece of five laminate of up-down structure identical.
The both sides of interior prepreg set internal layer copper foil, can set multilayer according to the design needs, that is, set multiple internal layers
Copper foil, while multiple interior prepregs are also set between multiple internal layer copper foils, can lamination press together.Finally in outermost
Outer prepreg is set again on the internal layer copper foil of side, outer copper foil then is set in the outer prepreg.
In one embodiment, the pressing condition of internal layer copper foil and outer copper foil differs.
Specifically, it is 140~180 DEG C to press internal layer copper foil and the pressing maximum temperature of interior cured sheets, and pressing time is
60min~100min, and maximal pressure force value is in 30~50kgf/cm2；The outer cured sheets of pressing and the maximum temperature of outer copper foil are
220~260 DEG C, pressing time is more than 110min, and maximal pressure force value is in 30~50kgf/cm2.It is to be pressed according to this programme below
Specific experiment data：
Example IV
Embodiment 5
Embodiment 6
In bonding processes, interior prepreg uses pre-pressing with internal layer copper foil, and outer layer is closed using total head, pressing-in temp and pressure
The time is closed to improve.Compared with the pressing of routine, using the interior prepreg solidification path after the pressing parameter pressing in this programme
Degree only accounts for the 70~95% of conventional parameter, and closing parameter using total head again in the bonding processes of final outer layer is pressed, and is reduced each
The overall residual stress of internal layer prepreg, reduce the warpage of no core plate.
In one embodiment, internal layer copper foil offers gap, and the gap is each provided at the surrounding of internal layer copper foil, and gap opens up
Direction can vertical internal layer copper foil frame, setting can also be at an angle of, this gap design can effectively reduce lamination
The problem of filler is without cavity.Furthermore it is also possible to set circle pad in the inside of internal layer copper foil, the circle pad is uniformly arranged on interior
The inner side of the frame of layer copper foil, is set in a ring.Using the design of circle pad, the cavity for being laminated filler can be more effectively reduced.
In the present embodiment, gap is 0.5~1.5mm, and the gap of circle pad is between 0.2~0.5mm.
In other embodiments, patterned process can also be carried out in the inner surface of outer copper foil, this is patterned small convex
Rise, during filler is laminated, the effective bubble extruded in filler.
Outer copper foil, outermost is arranged on, shares two outer copper foils.Specifically, outer copper foil offers gap, between being somebody's turn to do
Gap is each provided at the surrounding of internal layer copper foil, and the direction that gap opens up can also be at an angle of setting with the frame of vertical outer copper foil,
This gap design can effectively reduce the problem of lamination filler is without cavity.
In addition, the thickness of the frame of internal layer copper foil and outer copper foil can set thickness, it can effectively increase no core plate
Intensity.
In one embodiment, in the support carrier that step S100 is provided, the support carrier is directly by carrier copper foil and outside
Layer copper foil superposition is made, and the structure of the outer copper foil can be applicable in no core plate, i.e., the structure setting of outer copper foil is existed in advance
On insulating trip, as the composition structure without core plate；Carrier copper foil be also applicable in another side without in core plate, as outermost
Outer copper foil.
In the embodiment, step S400 is also included after step S300：Carrier copper foil is carried out to subtract copper.Specifically, when
After being separated to support carrier, support carrier is in two without one of core plate, it is necessary to there is being carried out without core plate for support carrier
Subtract copper, generally 2~5mm, consistency of thickness of be two without core plate.
Using this programme, the insulating trip in support carrier is eliminated, extra waste of material is avoided, improves economic effect
Benefit.
In addition, when separating two without core plate, it can not confirm that it is without core plate in which block to support carrier, it is therefore desirable to artificial mesh
Survey and confirm, greatly reduce operating efficiency.Therefore, there is a need to increases step S300A before step S400：Laser Measuring is provided
Distance meter, two thickness without core plate are measured respectively, thicker is that then this is entered without core plate and walked without core plate with support carrier
Rapid S400.
Specifically, the laser range finder includes Laser emission end and laser pick-off end composition, and Laser emission end and laser connect
Receiving end is separately positioned on the both ends of no core plate, and launches laser from default height from Laser emission end, and laser pick-off end receives
Laser.It is now the thickness without core plate when laser pick-off end does not receive laser signal.Similar, one just adopted without core plate in addition
With identical method to its Thickness sensitivity.Finally by comparing, you can confirm which without core plate is thicker no core plate, be to have branch
Support carrier without core plate.
In one embodiment, step S200 is specifically included：
S200A：Pattern transfer is carried out on the outer copper foil on support carrier two sides, the wherein figure of one side is adjusted for another side
Figure after turnback.
S200C：Prepreg and internal layer copper foil in the addition of the outside of carrier two are supported, and is carried out on the internal layer copper foil of both sides
Pattern transfer, the figure of support carrier side turns the figure after 180 degree for opposite side, and is pressed.
S200D：Repeat step S200B, the number of plies until reaching setting.
Without core plate to bearing semiconductor vigour part, therefore without having needed corresponding circuit trace on core plate.Electricity without core plate
Road floor is the internal layer copper foil and outer copper foil of each floor, is turned between each layer copper foil by bore process to realize.And due to upper
Under be upside-down mounting relation without core plate structure, without the circuit layout on core plate structure be mirror from strip down two pieces on support carrier
As relation, overturn two pieces of circuit layouts without core plate anyway and differ, two sets of flows need to be divided to make, production efficiency compared with
Slowly.And by the way that the Image Reversal of circuit reference will be made in advance, subsequently only need to overturn one of no core plate, two pieces obtain without core plate
The figure arrived is i.e. identical, can carry out subsequent treatment process simultaneously.
Further, also include after step S200A：
S200B, onboard open up positioning hole.Correspondingly, step S200C is specially：Support half in the addition of the outside of carrier two
Cured sheets and internal layer copper foil, and pattern transfer is carried out on the internal layer copper foil of both sides, the figure of support carrier side is opposite side
The figure after 180 degree is rotated, figure is shifted by contraposition reference of positioning hole, and is pressed.
Pattern alignment when positioning hole can help to pattern transfer is opened up, and mark can be played after separation is without core plate and made
With, be easy to by positioning hole distribution distinguish plate figure direction.Need to carry out milling to internal layer copper foil before positioning hole is started
Side, the size on milling side are less than 2~6mm, meanwhile, outer copper foil size is bigger 5~15mm than the size of internal layer copper foil.
Positioning hole is mal-distribution.In addition, positioning hole can also be the positioning datum such as specific telltale mark, it is main
Play reference, and be not limited to the form of positioning hole.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously
Therefore the limitation to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for one of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of manufacture component without core plate, it is characterised in that including：Carrier is supported, and is arranged on the support carrier both sides
Without core plate；
The no core plate includes：Interior prepreg, outer prepreg, internal layer copper foil and outer copper foil；The internal layer copper foil both sides
The interior prepreg is set, the outer prepreg is set in the outermost internal layer copper foil, in the outer prepreg
Outer copper foil is set；The frame of the internal layer copper foil opens up gap, the direction that the gap opens up and the side of the internal layer copper foil
Frame is vertically or angularly set；The inner surface patterned process of the outer copper foil, the patterned kick.
2. no core plate manufacture component according to claim 1, it is characterised in that the inside of the internal layer copper foil sets circle weldering
Disk, the round pad are laid around the frame of the internal layer copper foil.
3. no core plate manufacture component according to claim 2, it is characterised in that between the frame of the outer copper foil opens up
Gap.
4. no core plate manufacture component according to claim 3, it is characterised in that the frame of the internal layer copper foil opens up gap
Gap, which is opened up, with the frame of the outer copper foil is in same vertical face.
5. no core plate manufacture component according to claim 4, it is characterised in that the internal layer copper foil and the outer copper foil
Frame thickness be more than its in the middle part of thickness.
6. manufacture component without core plate according to Claims 1 to 5 any one, it is characterised in that the support carrier bag
Include：Insulating trip, set up the carrier copper foil in the insulating trip both sides separately.
7. no core plate manufacture component according to claim 6, it is characterised in that at the surface coarsening of the carrier copper foil
Reason.
8. one kind is without core plate, it is characterised in that including：Interior prepreg, outer prepreg, internal layer copper foil and outer copper foil；Institute
State internal layer copper foil both sides and the interior prepreg is set, the outer prepreg is set in the outermost internal layer copper foil,
The outer prepreg sets outer copper foil；The frame of the internal layer copper foil opens up gap, the direction and institute that the gap opens up
The frame for stating internal layer copper foil is vertically or angularly set；The inner surface patterned process of the outer copper foil, it is described patterned
Kick.
9. no core plate according to claim 8, it is characterised in that the inside of the internal layer copper foil sets circle pad, described
Circle pad is laid around the frame of the internal layer copper foil.
10. a kind of centreless board manufacturing method, including：
S100：Support carrier is provided；
S200：Lamination presses internal layer copper foil on support carrier, interior prepreg is provided between each internal layer copper foil layer, in internal layer copper
The outside of paper tinsel sets outer prepreg, and outer copper foil is then set on the outside of the outer prepreg and no core plate is made, described
The frame of internal layer copper foil opens up gap, and the direction that the gap opens up and the frame of the internal layer copper foil are vertically or angularly set
Put；The inner surface patterned process of the outer copper foil, the patterned kick；
S300：Without core plate from support carrier separation.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410857699.3A CN104540339B (en) | 2014-12-31 | 2014-12-31 | Without core plate manufacture component, without core plate and centreless board manufacturing method |
| PCT/CN2015/080251 WO2016107059A1 (en) | 2014-12-31 | 2015-05-29 | Coreless plate fabricating member, coreless plate and method for fabricating coreless plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410857699.3A CN104540339B (en) | 2014-12-31 | 2014-12-31 | Without core plate manufacture component, without core plate and centreless board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104540339A CN104540339A (en) | 2015-04-22 |
| CN104540339B true CN104540339B (en) | 2017-11-17 |
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| CN201410857699.3A Active CN104540339B (en) | 2014-12-31 | 2014-12-31 | Without core plate manufacture component, without core plate and centreless board manufacturing method |
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| Country | Link |
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| CN (1) | CN104540339B (en) |
| WO (1) | WO2016107059A1 (en) |
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| CN104540339B (en) * | 2014-12-31 | 2017-11-17 | 广州兴森快捷电路科技有限公司 | Without core plate manufacture component, without core plate and centreless board manufacturing method |
| CN104538320B (en) * | 2014-12-31 | 2018-07-20 | 广州兴森快捷电路科技有限公司 | Centreless board fabrication method |
| CN104540326A (en) * | 2014-12-31 | 2015-04-22 | 广州兴森快捷电路科技有限公司 | Core-less board manufacturing component and manufacturing method for core-less board |
| CN109526138B (en) * | 2018-11-27 | 2024-04-12 | 惠州市金百泽电路科技有限公司 | Rigid glass fiber-free photoelectric printed board and processing method thereof |
| CN112566391B (en) * | 2020-11-24 | 2021-09-21 | 深圳和美精艺半导体科技股份有限公司 | Three-layer plate MSAP process manufacturing method and three-layer plate |
| CN114340228A (en) * | 2022-01-14 | 2022-04-12 | 广东和鑫达电子股份有限公司 | PCB and laminating method thereof |
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| CN104540339A (en) | 2015-04-22 |
| WO2016107059A1 (en) | 2016-07-07 |
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