CN114340228A - PCB and laminating method thereof - Google Patents
PCB and laminating method thereof Download PDFInfo
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- CN114340228A CN114340228A CN202210044422.3A CN202210044422A CN114340228A CN 114340228 A CN114340228 A CN 114340228A CN 202210044422 A CN202210044422 A CN 202210044422A CN 114340228 A CN114340228 A CN 114340228A
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- 238000000034 method Methods 0.000 title claims abstract description 49
- 238000010030 laminating Methods 0.000 title claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 92
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 45
- 239000011889 copper foil Substances 0.000 claims abstract description 36
- 238000004519 manufacturing process Methods 0.000 claims abstract description 31
- 238000002844 melting Methods 0.000 claims abstract description 28
- 230000008018 melting Effects 0.000 claims abstract description 24
- 238000003825 pressing Methods 0.000 claims abstract description 16
- 230000003287 optical effect Effects 0.000 claims abstract description 15
- 238000005520 cutting process Methods 0.000 claims abstract description 11
- 238000004080 punching Methods 0.000 claims abstract description 6
- 238000005553 drilling Methods 0.000 claims abstract description 5
- 238000006087 Brown hydroboration reaction Methods 0.000 claims abstract description 3
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 239000012943 hotmelt Substances 0.000 claims description 10
- 238000007689 inspection Methods 0.000 claims description 5
- 238000003475 lamination Methods 0.000 claims description 5
- 230000037303 wrinkles Effects 0.000 claims description 4
- 238000003698 laser cutting Methods 0.000 claims description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 claims 1
- 238000005530 etching Methods 0.000 description 7
- 230000004927 fusion Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 241000153282 Theope Species 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910001385 heavy metal Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 241000519995 Stachys sylvatica Species 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Abstract
The invention relates to the technical field of printed circuit boards, in particular to a PCB and a laminating method thereof. The invention provides a PCB laminating method, which comprises the following steps: s01: cutting the substrate into a preset size, and making an inner layer pattern on the substrate; s02: detecting and repairing the substrate by using an automatic optical detector; s03: carrying out hot melting positioning hole punching on the substrate; s04: carrying out brown oxidation treatment on the substrate; s05: cutting the first semi-cured sheet, and drilling; s06: placing the first semi-cured sheet between the substrates and performing hot melting; s07: pre-stacking a second prepreg outside the two substrates; s08: cutting a copper foil; s09: typesetting the copper foil, the second prepreg and the substrate; s10: and (6) pressing. The invention provides a PCB and a laminating method thereof, which aim to solve the technical problems of large deviation of an interposer, low production efficiency and serious production pollution in the conventional PCB laminating mode.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a PCB and a laminating method thereof.
Background
In the printed circuit board manufacturing industry, printed circuit boards are classified into single-sided boards, double-sided boards, and multilayer boards according to their structures. The printed circuit board multilayer board is divided into four-layer boards, six-layer boards, eight-layer boards, ten-layer boards and higher-level products; when the number of layers is more than or equal to six layers, the common multilayer board is formed by overlapping a plurality of core boards, so that when the number of layers is more than or equal to six layers, the common multilayer board is formed by overlapping a plurality of core boards, and the design of a laminating structure of partial products requires that the thickness of a medium layer between an inner core board and the inner core board is more than 0.9 MM. In the current printed circuit board industry, the manufacture of the dielectric layer with the thickness can not be finished by pressing a plurality of prepregs in a pressing mode. If a plurality of prepregs are used for pressing the dielectric layer with the thickness, the undesirable phenomena such as deviation of the sliding plate layer and white spots can be caused.
The method commonly adopted in the printed circuit board industry at present is to use a substrate light plate to replace a part of a thick dielectric layer, and then add a single prepreg on two sides of the light plate to be riveted with an inner core plate and then pressed. The specific pressing structure is shown in figure 1. This method has the following disadvantages: firstly, the thickness of the light panel is larger than 0.4MM, so that the light panel cannot be completely melted by hot melting during lamination, and the inner core plate, the prepreg and the light panel cannot be firmly fused by hot melting; therefore, the product can only be riveted by a pure riveting method, and the production efficiency of riveting is lower than that of hot melting, thereby influencing the production efficiency. Secondly, the optical plate used in the method is manufactured by cutting a copper-containing substrate and etching the optical plate, but the optical plate directly provided by a plate manufacturer cannot be used, the optical plate provided by the plate manufacturer is seriously polluted in the production process and the transportation process, and the risk of plate explosion and delamination is easy to occur after pressing; thereby increasing the flow and increasing the copper pollution. Thirdly, in the lamination process, the method can only use a riveting method for lamination, hot melting lamination cannot be used, and the alignment precision of riveting is lower than that of hot melting, so that the quality risk of layer deviation is increased. From the above, the method adopted in the prior art increases additional processes, increases production cost, increases environmental pollution, influences production efficiency, biases the laminated layer and the like.
In view of the above, it is desirable to provide a PCB and a method for bonding the same to solve the above problems.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a PCB and a laminating method thereof, aiming at solving the technical problems of large deviation of an interposer, low production efficiency and serious production pollution in the existing PCB laminating mode.
In order to achieve the above object, the present invention provides a PCB stitching method, comprising the steps of:
s01: cutting a substrate into a preset size, and carrying out inner layer graph manufacturing on the substrate;
s02: detecting and repairing open circuit, short circuit, gap and residual copper phenomena of the substrate by using an automatic optical detector;
s03: carrying out hot-melting positioning hole punching operation on the substrate;
s04: carrying out brown oxidation treatment on the substrate;
s05: cutting a first semi-cured sheet, and drilling the first semi-cured sheet at a position corresponding to the hot-melting positioning hole on the substrate;
s06: placing a plurality of layers of the first semi-cured sheets between two adjacent layers of the substrates and carrying out hot melting, wherein the two adjacent layers of the substrates and the plurality of layers of the first semi-cured sheets are mutually adhered and cured into a whole after being subjected to hot melting;
s07: pre-stacking a second prepreg outside two adjacent layers of the substrates;
s08: cutting the copper foil according to the thickness requirement of the copper foil;
s09: placing one copper foil outside each second prepreg, and typesetting the copper foil, the second prepreg and the substrate;
s10: and pressing the copper foil, the second prepreg and the substrate, which are typeset in the step S09, between the copper foil, the second prepreg and the substrate, wherein the plurality of layers of the first prepreg are laminated.
Preferably, the step of S02 includes the following steps:
s21: and (4) transferring and manufacturing the inner layer pattern by using an LDI exposure machine, and controlling the inner layer deflection within 20 micrometers.
Preferably, in S03, an OPE punch machine is used to punch hot-melt positioning holes, the number of the hot-melt positioning holes is two, and the hot-melt positioning holes are opened at two side edges of the substrate.
Preferably, in S05, the first semi-cured sheet is cut by a laser cutting machine.
Preferably, in S06, after the hot melting, an X-RAY inspection machine is used to check whether the layer deviation phenomenon exists, and whether the hot melting is tight.
Preferably, in S09, it is required to check whether the copper foil has a wrinkle or whether the layout has a misalignment.
Preferably, in S10, the press flatness fairness difference is controlled to ± 0.05 mm.
Preferably, in the S10, the maximum pressure is controlled at 17Kg/cm2～21Kg/cm2The temperature-rising rate is controlled to be 1.3 ℃/min to 1.4 ℃/min.
Preferably, the number of the first semi-cured sheets between two adjacent layers of the substrate is 6 to 7.
The invention also provides a PCB formed by the PCB laminating method, which comprises two adjacent layers of substrates, a plurality of layers of first semi-solidified sheets arranged between the two adjacent layers of substrates, a second semi-solidified sheet arranged on the outer sides of the two adjacent layers of substrates and a copper foil arranged on the outer side of the second semi-solidified sheet.
The optical plate is produced by pressing a substrate by a manufacturer, performing in-factory material injection, etching the optical plate, manually inspecting, drilling and riveting holes, and finally putting the optical plate into production. Compared with the prior art, the invention has the following beneficial effects:
1. the invention reduces all the processes for manufacturing the light panel and optimizes the processing technology, thereby improving the production efficiency and reducing the production cost;
2. the invention uses a plurality of first semi-cured sheets to press and replace a light plate, thereby not only optimizing the production flow, but also reducing the cost of raw materials in design;
3. the invention reduces all the processes for manufacturing the light plate and avoids the working procedure of etching the light plate, thereby reducing the generation of copper etching waste liquid and reducing the heavy metal pollution in the production process;
4. the invention replaces riveting process with hot melting, increases the pressing and aligning precision and reduces the deviation of the pressing layer.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic diagram of a prior art laminated PCB with thick dielectric layers;
FIG. 2 is a schematic diagram of a laminated PCB with thick dielectric layers according to a first embodiment of the present invention;
FIG. 3 is a pressing program according to a first embodiment of the present invention;
FIG. 4 is a schematic diagram of a laminated PCB with thick dielectric layers according to a second embodiment of the present invention;
FIG. 5 shows a pressing program according to a second embodiment of the present invention;
fig. 6 is a flowchart of steps of a method for laminating a thick dielectric layer PCB according to an embodiment of the invention.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
The reference numbers illustrate:
100-copper foil, 200-second prepreg, 300-substrate, 400-first prepreg and 500-optical plate.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
First embodiment
Referring to fig. 2, 3 and 6, the present invention provides a PCB and a press-fitting method thereof, including the following steps:
s01: the two substrates 300 are cut into a predetermined size, and the substrate 300 is subjected to inner layer patterning.
S02: the open circuit, short circuit, notch and residual copper phenomena of the substrate 300 are detected and repaired by an automatic optical detector.
Specifically, S02 includes the following steps:
s21: and (4) transferring and manufacturing the inner layer pattern by using an LDI exposure machine, and controlling the inner layer deflection within 20 micrometers. Wherein the pattern transfer means transferring a photographic master pattern onto the copper-clad substrate. In addition, the inner layer deviation control can be realized by setting the layer deviation precision of the LDI exposure machine, and other inner layer flows are processed according to a control method of a multilayer board. Wherein, layer offset refers to the difference of concentricity between layers of the PCB which originally requires alignment.
S03: the substrate 300 is subjected to the operation of hot-melt positioning hole punching.
Preferably, in S03, the OPE punch is used to punch the heat-fusion positioning holes, and the number of the heat-fusion positioning holes is two, and the heat-fusion positioning holes are opened at both side edges of the substrate. The hot melting positioning holes arranged at the edges of the two sides of the substrate can be melted quickly because the area of the substrate, at the periphery of the edge of the substrate, of the hot melting positioning holes is smaller, and the edge of the substrate and the edge of the first semi-cured sheet can be prevented from cracking after the hot melting of the hot melting positioning holes at the edge of the substrate is completed.
S04: the substrate 300 is browned. The browning treatment of the substrate 300 requires adjustment of corresponding browning parameters according to the copper thickness of the product.
S05: the first semi-cured sheet 400 is cut, and holes are drilled in the first semi-cured sheet 400 at positions corresponding to the hot-melt positioning holes in the substrate 300 of the first semi-cured sheet 400.
Preferably, the first semi-cured sheet 400 is slit using a laser cutter in S05.
S06: the 6 layers of the first semi-cured sheets 400 are placed between the two adjacent layers of the substrates 300 and are hot-melted, and the two adjacent layers of the substrates and the 6 layers of the first semi-cured sheets 400 are solidified into a whole after being hot-melted. During fusion, corresponding hot melting parameters are required to be adjusted according to the material and the model of the prepreg.
Specifically, in S06, after the heat fusion, the X-RAY inspection machine is used to check whether there is a layer deviation phenomenon, and whether the heat fusion is tight is checked. The X-RAY inspection machine is a testing device which uses low-energy X-RAYs to quickly detect the internal quality of an inspected article and foreign objects therein without damaging the inspected article, and displays an image of the inspected article through a computer.
S07: a second prepreg 200 is pre-stacked on the outermost two substrates 300. Here, the outermost two-layer substrate 300 means that there is no substrate 300 adjacent to it any more above or below the substrate 300, i.e., one end thereof is the multi-layer first semi-cured sheet 400 and the other end thereof is the second cured sheet 200.
S08: the copper foil 100 is cut according to the thickness requirement of the copper foil 100.
S09: one copper foil 100 is stacked outside the second prepreg 200, and the copper foil 100, the second prepreg 200, and the substrate 300 are laid out. Specifically, in S09, it is checked whether the copper foil 100 has wrinkles or whether the layout has misalignment. The lay-out herein means that the copper foil 100, the second prepreg 200 and the substrate 300 are sequentially stacked in the order of the copper foil 100, the second prepreg 200, the substrate 300, the second prepreg 200 and the copper foil 300 and centrally aligned. It is worth mentioning that the substrate 300 in this step is the substrate 300 after hot melting, wherein a plurality of layers of the first semi-cured sheets 400 are sandwiched between every two adjacent substrates 300.
S10: and laminating the copper foil 100, the second prepreg 200, the substrate 300 and the multiple layers of the first prepreg 400 arranged therebetween, which are typeset in the step S09.
Wherein in S10, the fair difference of the flatness of the press is controlled to be +/-0.05 mm, and the maximum pressure is controlled to be 17Kg/cm2～21Kg/cm2The temperature-rising rate is controlled to be 1.3 ℃/min to 1.4 ℃/min. Specifically, in this embodiment, the rate of temperature rise is controlled to be 1.3 ℃/min, and the maximum pressure is 20Kg/cm2. It should be noted that, in the pressing process, the pressure is in a changing process of increasing and then decreasing, and the specific pressing program refers to fig. 5.
It is worth mentioning that the gel time of the first prepreg 400 is 20S less than the gel time of the second prepreg 200, which is the normal gel time of the same type of prepreg. The gel time of the first prepreg is 20 seconds less than that of the prepreg of the same type, and the flow of resin can be reduced, so that the uniformity is improved, and risks such as sliding plates are avoided. Specifically, in the present embodiment, the second prepreg 200 has a model number of 7682, the gel time thereof is 130 seconds, and the gel time of the first prepreg 400 is 110 seconds. In addition, the gel time of the first prepreg 400 is changed according to the gel time of the second prepreg 200 of different types. Further, in the present embodiment, the resin content of the first semi-cured sheet 400 was 43%.
Referring to fig. 2, the present invention further provides a PCB laminated by the above-mentioned PCB laminating method, including two substrates 300, 6 layers of first prepregs 400 disposed between the two substrates 300, a second prepreg 200 disposed outside the two substrates 300, and a copper foil 100 disposed outside the second prepreg 200.
Second embodiment
Referring to fig. 4, 5 and 6, the present invention provides a PCB and a press-fitting method thereof, including the following steps:
s01: the two substrates 300 are cut into a predetermined size, and the substrate 300 is subjected to inner layer patterning.
S02: the open circuit, short circuit, notch and residual copper phenomena of the substrate 300 are detected and repaired by an automatic optical detector.
Specifically, S02 includes the following steps:
s21: and (4) transferring and manufacturing the inner layer pattern by using an LDI exposure machine, and controlling the inner layer deflection within 20 micrometers. In addition, the inner layer deviation control can be realized by setting the layer deviation precision of the LDI exposure machine, and other inner layer flows are processed according to a control method of a multilayer board.
S03: the substrate 300 is subjected to the operation of hot-melt positioning hole punching.
Preferably, in S03, the OPE punch is used to punch the heat-fusion positioning holes, and the number of the heat-fusion positioning holes is two, and the heat-fusion positioning holes are opened at both side edges of the substrate.
S04: the substrate 300 is browned. The browning treatment of the substrate 300 requires adjustment of corresponding browning parameters according to the copper thickness of the product.
S05: the first semi-cured sheet 400 is cut, and holes are drilled in the first semi-cured sheet 400 at positions corresponding to the hot-melt positioning holes in the substrate 300 of the first semi-cured sheet 400.
Preferably, the first semi-cured sheet 400 is slit using a laser cutter in S05.
S06: the 7 layers of the first prepreg 400 are stacked between the two adjacent substrates 300 and thermally fused, and the two adjacent substrates and the 7 layers of the first prepreg 400 are thermally fused and then cured into a whole. During fusion, corresponding hot melting parameters are required to be adjusted according to the material and the model of the prepreg.
Specifically, in S06, after the heat fusion, the X-RAY inspection machine is used to check whether there is a layer deviation phenomenon, and whether the heat fusion is tight is checked.
S07: a second prepreg 200 is pre-stacked on the outermost two substrates 300.
S08: the copper foil 100 is cut according to the thickness requirement of the copper foil 100.
S09: one copper foil 100 is placed outside each second prepreg 200, and the copper foil 100, the second prepreg 200, and the substrate 300 are laid out.
Specifically, in S09, it is checked whether the copper foil 100 has wrinkles or whether the layout has misalignment.
S10: and laminating the copper foil 100, the second prepreg 200, the substrate 300 and the multiple layers of the first prepreg 400 arranged therebetween, which are typeset in the step S09.
Wherein in S10, the fair difference of the flatness of the press is controlled to be +/-0.05 mm, and the maximum pressure is controlled to be 17Kg/cm2～21Kg/cm2The temperature-rising rate is controlled to be 1.3 ℃/min to 1.4 ℃/min. Specifically, in this example, the rate of temperature rise was controlled to 1.4 ℃/min, and the maximum pressure was 21Kg/cm2. Please refer to fig. 5 for a specific pressing program.
Referring to fig. 4, the present invention further provides a PCB laminated by the above-mentioned PCB laminating method, including two layers of substrates 300, 7 layers of first prepregs 400 disposed between two adjacent layers of substrates 300, a second prepreg 200 disposed outside the two layers of substrates 300, and a copper foil 100 disposed outside the second prepreg 200.
The optical plate 500 is manufactured by pressing the substrate 300 by a manufacturer, cutting the material in a factory, etching the optical plate 500, manually checking, drilling and riveting holes, and finally putting the optical plate into production, wherein the cost obtained by the method is far higher than the cost of directly pressing the prepreg in the factory. Compared with the prior art, the invention has the following beneficial effects:
1. the invention reduces all the processes for manufacturing the light panel 500 and optimizes the processing technology, thereby improving the production efficiency and reducing the production cost;
2. the invention uses a plurality of first semi-curing sheets 400 to press and replace the light plate 500, thereby not only optimizing the production flow, but also reducing the cost of raw materials in design;
3. the invention reduces all the processes for manufacturing the light plate 500 and avoids the process of etching the light plate 500, thereby reducing the generation of copper etching waste liquid and reducing heavy metal pollution in the production process;
4. the invention replaces riveting process with hot melting, increases the pressing and aligning precision and reduces the deviation of the pressing layer.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A PCB laminating method is characterized by comprising the following steps:
s01: cutting at least two substrates into preset sizes, and carrying out inner layer graph manufacturing on the substrates;
s02: detecting and repairing open circuit, short circuit, gap and residual copper phenomena of the substrate by using an automatic optical detector;
s03: carrying out hot-melting positioning hole punching operation on the substrate;
s04: carrying out brown oxidation treatment on the substrate;
s05: cutting a first semi-cured sheet, and drilling the first semi-cured sheet at a position corresponding to the hot-melting positioning hole on the substrate;
s06: stacking a plurality of layers of the first semi-cured sheets between two adjacent layers of the substrates and carrying out hot melting, wherein the two adjacent layers of the substrates and the plurality of layers of the first semi-cured sheets are solidified into a whole after being subjected to hot melting;
s07: pre-stacking a second prepreg outside the substrate on the outermost layer;
s08: cutting the copper foil according to the thickness requirement of the copper foil;
s09: placing one copper foil outside each second prepreg, and typesetting the copper foil, the second prepreg and the substrate;
s10: and pressing the copper foil, the second prepreg, the substrate and the plurality of layers of the first prepreg between the copper foil and the second prepreg which are typeset in the step S09.
2. The method for stitching a thick dielectric layer PCB according to claim 1, wherein the step S02 comprises the steps of:
s021: and (4) transferring and manufacturing the inner layer pattern by using an LDI exposure machine, and controlling the inner layer deflection within 20 micrometers.
3. The method for laminating a thick dielectric layer PCB according to claim 1, wherein in S03, an OPE punching machine is used to punch hot-melt positioning holes, the number of the hot-melt positioning holes is two, and the hot-melt positioning holes are arranged at two side edges of the substrate.
4. A laminating method for a thick dielectric layer PCB according to claim 1, wherein in S05, the first semi-cured sheet is cut by a laser cutting machine.
5. A laminating method for thick dielectric layer PCB according to claim 1, wherein in S06, after hot melting, using X-RAY inspection machine to check whether there is layer deviation and check whether the hot melting is tight.
6. A laminating method for thick dielectric layers of PCBs as claimed in claim 1, wherein in S09, it is required to check whether the copper foils have wrinkles and whether the layout has dislocation.
7. The method for laminating a thick dielectric layer PCB according to claim 1, wherein in S10, the press flatness fairness difference is controlled within a range of +/-0.05 mm.
8. The method for stitching a thick dielectric layer PCB according to claim 1, wherein in S10, the maximum pressure is controlled to be 17Kg/cm2～21Kg/cm2The temperature-rising rate is controlled to be 1.3 ℃/min to 1.4 ℃/min.
9. The method for laminating a thick dielectric layer PCB according to any one of claim 1, wherein the number of the first semi-cured sheets between two adjacent layers of the substrate is 6 to 7.
10. A PCB formed by the method of PCB lamination according to any one of claims 1 to 9, comprising at least two layers of the substrates, a plurality of layers of the first prepreg disposed between two adjacent layers of the substrates, the second prepreg disposed outside the outermost layer of the substrates, and a copper foil disposed outside the second prepreg.
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| CN110785027A (en) * | 2019-10-31 | 2020-02-11 | 日彩电子科技(深圳)有限公司 | PCB laminating method |
| CN111405768A (en) * | 2020-04-16 | 2020-07-10 | 惠州市科迪盛科技有限公司 | Method for manufacturing multilayer printed circuit board |
| CN112888196A (en) * | 2020-12-28 | 2021-06-01 | 珠海市深联电路有限公司 | Novel prepreg pressing and fixing method and lamination |
| CN113473716A (en) * | 2021-06-29 | 2021-10-01 | 景旺电子科技(龙川)有限公司 | Printed circuit board manufacturing method and printed circuit board |
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