CN113473716A

CN113473716A - Printed circuit board manufacturing method and printed circuit board

Info

Publication number: CN113473716A
Application number: CN202110730502.XA
Authority: CN
Inventors: 谢光前; 沙伟强; 叶志峰
Original assignee: Kinwong Electronic Technology Longchuan Co Ltd
Current assignee: Kinwong Electronic Technology Longchuan Co Ltd
Priority date: 2021-06-29
Filing date: 2021-06-29
Publication date: 2021-10-01

Abstract

The invention relates to the technical field of printed circuit boards, and provides a manufacturing method of a printed circuit board and the printed circuit board. The manufacturing method comprises the following steps: providing a copper-based working plate, and manufacturing a copper-based boss and a through accommodating groove on the copper-based working plate; pre-stacking a copper-based working plate, a prepreg and a core plate according to a product stacking picture; embedding the resin module into the accommodating groove, and pressing to obtain a laminated plate; and cutting the laminated board to obtain a single printed circuit board. According to the manufacturing method of the printed circuit board, the copper-based working board is embedded with the resin module, the copper-based working board, the prepreg and the core board share one set of positioning system, the copper-based bosses are completely aligned with the windows of the prepreg and the core board, the situation that the windows of the copper-based bosses, the prepreg and the core board are scrapped due to easy deviation is avoided, the technical problem that the existing printed circuit board is low in manufacturing yield is solved, and therefore the yield of the printed circuit board is improved.

Description

Printed circuit board manufacturing method and printed circuit board

Technical Field

The invention relates to the technical field of printed circuit boards, in particular to a manufacturing method of a printed circuit board and the printed circuit board.

Background

With the continuous development of the electronic communication industry and the vehicle-mounted electronics, the related PCB (Printed Circuit Board) is required to be miniaturized, multifunctional, and capable of being assembled in three dimensions, and the heat dissipation performance is required to be higher and higher.

The existing PCB product with high heat dissipation performance in the industry mainly adopts a PCB embedded with a copper block, when the PCB product with the copper-based boss is manufactured, the copper block is embedded on an FR-4 substrate, the boss of the copper block is exposed, a prepreg and a flexible core board which are provided with windows are sequentially placed, and the laminated board is obtained by riveting, aligning and pressing.

The manufacturing process still has the technical problem of low yield, and particularly, the copper block bosses in the laminated pre-stacked manner are easily deviated from the windows of the flexible core board and the windows of the prepreg, so that the copper block bosses cannot be aligned with the windows of the core board and the prepregs, and the copper block bosses cannot be embedded into the windows of the core board and the prepregs, so that the laminated board is scrapped.

Disclosure of Invention

The invention aims to provide a printed circuit board manufacturing method and a printed circuit board, and aims to solve the technical problem that the existing printed circuit board is low in manufacturing yield.

In order to achieve the purpose, the invention adopts the technical scheme that: a method of making a printed wiring board, comprising:

s100: providing a copper-based working plate, and manufacturing a copper-based boss and a through accommodating groove on the copper-based working plate;

s200: providing a prepreg, and manufacturing a window corresponding to the copper-based boss on the prepreg;

s300: providing a core plate, and manufacturing a window corresponding to the copper-based boss on the core plate;

s400: pre-stacking the copper-based working plate, the prepreg and the core plate according to a product stacking picture;

s500: providing a resin module fitted to the receiving groove;

s600: embedding the resin module into the accommodating groove from one side far away from the copper-based boss, and pressing to obtain a laminated plate;

s700: and cutting the laminated board to obtain a single printed circuit board.

In one embodiment, in step S100, the conveying speed of the copper-based working plate in the etching cylinder is controlled to be 2m/min-2.2m/min, and the up-down pressure is controlled to be 2kg/cm²-2.2kg/cm²Acid etching the copper-based working plate for 2 times, wherein the etching depth is 0.1mm-0.11mm each time; then continuously controlling the conveying speed at 3.5m/min-3.7m/min and the up-down pressure at 2kg/cm²-2.2kg/cm²And acid etching the copper-based working plate once, wherein the etching depth is 0.05mm-0.052mm, and thus obtaining the copper-based boss.

In one embodiment, in step S100, the accommodating groove which is 0.05mm to 0.075mm larger than the single size side of the resin module is routed on the copper-based working plate.

In one embodiment, after step S100, the whole copper-based working plate is placed on a plate grinding line, and the edge residual flash of the accommodating groove is cleaned.

In one embodiment, before step S400, first riveting holes corresponding to each other in position are disposed in intermediate non-unit areas of the copper-based working plate, the prepreg and the core plate;

in step S400, the pre-stacked copper-based working plate, the prepreg, and the core plate are riveted through the first riveting hole.

In one embodiment, step S300 specifically includes: manufacturing laser holes on the core plate by using a laser drilling machine; cleaning the edge residual glue of the laser holes; cleaning the core plate; conducing the hole wall of the laser hole; filling the laser holes by using VCP technology; manufacturing an outer layer circuit on the core board; checking whether the outer layer circuit has a short circuit by using a on-off test; and cutting a window of the core plate.

In one embodiment, step S500 specifically includes: cutting the copper-clad plate; etching the copper-clad plate to form a resin light plate; sticking a first high-temperature protective film on one surface of the resin light plate; routing the resin light plate into a single resin module; attaching a second high-temperature protective film to the other surface of the resin module, and tearing off the first high-temperature protective film; and (4) browning.

In one embodiment, after step S600, the method further includes: carrying out on-off test on the laminated plate to detect whether a short circuit exists in a circuit of the laminated plate;

and/or after step S600, further comprising: and carrying out four-terminal test on the laminated plate to detect whether gaps or residual copper exist in the circuit of the laminated plate.

In one embodiment, the core board is a flexible core board, and after step S600, depth control routing is performed on the bending area of the laminated board, and the depth control residual thickness is 0.30mm to 0.35 mm.

The present invention also provides a printed wiring board produced by the method for producing a printed wiring board according to any one of the above.

The manufacturing method of the printed circuit board and the printed circuit board provided by the invention have the beneficial effects that: the copper-based working plate is embedded with the resin module, the copper-based working plate, the prepreg and the core plate share one set of positioning system, the copper-based bosses are completely aligned with the windows of the prepreg and the core plate, the windows of the copper-based bosses, the prepreg and the core plate are prevented from being scrapped due to easy deviation, the technical problem that the existing printed circuit board is low in manufacturing yield is solved, and therefore the yield of the printed circuit board is improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

Fig. 1 is a schematic diagram of a boss position in a manufacturing method of a printed circuit board according to an embodiment of the present invention;

fig. 2 is a schematic diagram of a finished product in the manufacturing method of the printed circuit board according to the embodiment of the invention;

fig. 3 is a plan view of the laminate panel of fig. 2;

FIG. 4 is a flow chart of a method for manufacturing a printed circuit board according to an embodiment of the present invention;

FIG. 5 is a schematic diagram of the detailed process of step S100 in FIG. 4;

FIG. 6 is a detailed flowchart of step S200 in FIG. 4

FIG. 7 is a detailed flowchart of step S300 in FIG. 4;

fig. 8 is a detailed flowchart of step S500 in fig. 4.

Wherein, in the figures, the respective reference numerals:

10. a first rivet hole; 20. a bending region; 30. a second riveting hole;

100. a copper-based working plate; 110. copper-based bosses; 120. accommodating grooves;

200. a prepreg;

300. a core board; 310. a dielectric layer; 320. a core board circuit layer;

400. and a resin module.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.

In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

Referring to fig. 1 to 4, a method for manufacturing a printed circuit board includes:

s100: a copper-based work board (100) is provided, and a copper-based boss (110) and a through-receiving groove (120) are formed in the copper-based work board (100). Wherein, the number of the copper-based bosses 110 is several, such as one, two or more. Generally, the number of copper-based lands 110 is plural. The number of the receiving grooves 120 is several, such as one, two, or more.

S200: providing a prepreg 200, and manufacturing a window corresponding to the copper-based boss 110 on the prepreg 200.

S300: a core plate 300 is provided, and a window corresponding to the copper-based boss 110 is formed in the core plate 300.

S400: and pre-stacking the copper-based working plate 100, the prepreg 200 and the core plate 300 according to a product stack diagram. The product overlay is an overlay of the printed wiring board, and may include more than two core boards 300. The core board 300 may be a double-sided board, and the core board circuit layers 320 on both sides of the core board 300 are connected by a dielectric layer 310. The dielectric layer 310 is typically selected from the prepreg 200.

S500: a resin module 400 fitted to the receiving groove 120 is provided.

Among them, the resin module 400 may be a thermosetting resin module of epoxy resin, a thermoplastic resin module of polyimide, a thermosetting resin module impregnated with a reinforcing material, or a thermoplastic resin module impregnated with a reinforcing material. Specifically, the resin module 400 is an FR-4 module, an ABF module, a BT resin module.

S600: the resin module 400 is inserted into the receiving groove 120 from the side away from the copper-based bosses 110 and press-fitted to obtain a laminated board.

S700: and cutting the laminated board to obtain a single printed circuit board.

In the traditional manufacturing method of the printed circuit board, the copper blocks are movably embedded in the slots of the resin board, and because the copper-based bosses 110 are large in quantity and small in size and machining errors exist in the size of the copper-based bosses 110, the copper blocks are manually embedded in the resin board, and the position deviation of the copper-based bosses 110 is easily caused. The prepreg 200, the core board 300 and the resin board share one set of positioning system, and the prepreg 200 and the core board 300 are positioned and stacked on the resin board according to the positioning system, rather than being positioned and stacked on the resin board by referring to the position of the copper-based boss 110, so that the windows of the prepreg 200 and the core board 300 and the copper-based boss 110 of the copper block are easy to deviate, and the product is scrapped. Moreover, since the slots for embedding the copper blocks are formed in the resin board, during the laminating process of the core board 300, the prepreg 200 and the resin board, the prepreg 200 in a molten state can be squeezed into the slots for embedding the copper blocks in the resin board, and the prepreg 200 is consumed, so that a laminating cavity is formed at the position of the copper-based boss 110 after laminating due to insufficient glue filling, and further, liquid medicine enters the inner layer of the printed circuit board during subsequent circuit etching to cause product scrapping.

In the manufacturing method of the printed circuit board described in this embodiment, the resin module 400 is embedded on the copper-based working board 100, the positions of the copper-based working board 100 and the copper-based bosses 110 are fixed, and the copper-based working board 100, the prepregs 200 and the core board 300 share one set of positioning system, so that the windows of the copper-based bosses 110, the prepregs 200 and the core board 300 are completely aligned, the windows of the copper-based bosses 110, the prepregs 200 and the core board 300 are prevented from being scrapped due to easy deviation, and the technical problem of low yield in the conventional printed circuit board manufacturing is solved, so that the yield of the printed circuit board is improved.

In addition, the printed circuit board is manufactured by the manufacturing method of the printed circuit board, a copper block embedding groove is not required to be formed in the resin board, the prepreg 200 in a molten state is not required to be consumed in the process of pre-stacking and pressing the copper-based working board 100, the prepreg 200 and the core board 300 according to the product stacking composition, and product scrapping caused by insufficient glue filling at the position of the copper-based boss 110 is avoided.

In one embodiment, referring to step S104 of FIG. 5, in step S100, the conveying speed of the copper-based work plate 100 in the etching cylinder is controlled to be 2m/min-2.2m/min, and the up-down pressure is controlled to be 2kg/cm²-2.2kg/cm²Acid etching the copper-based working plate for 1002 times, wherein the etching depth is 0.1mm-0.11mm each time; then continuously controlling the conveying speed at 3.5m/min-3.7m/min and the up-down pressure at 2kg/cm²-2.2kg/cm²And acid etching the copper-based working plate 100 once to obtain the copper-based boss 110, wherein the etching depth is 0.05mm-0.052 mm.

Compared with the mode of processing the copper-based bosses 110 on the small copper blocks, the copper-based bosses 110 are formed on the copper-based working plate 100 in a mode of removing materials through multiple times of etching, the copper-based bosses 110 with stable size can be obtained in batch, the automation level is high, and the yield is high.

Wherein, the depth of the copper-based boss 110 is 0.25mm-0.26 mm. The shape of the copper-based projection 110 is not limited to a square projection, but may be a circular projection or other irregular projections.

In one embodiment, in step S100, the accommodating groove 120 with a size 0.05mm to 0.075mm larger than a single side of the resin module 400 is routed on the copper-based work board 100, so that the resin module 400 can be smoothly installed in the accommodating groove 120, and a gap between the resin module 400 and a groove wall of the accommodating groove 120 is appropriate.

The one-sided shape means that each side, that is, the shape of the receiving groove 120 is the same as the shape of the resin module 400, and each side of the receiving groove 120 is 0.05mm to 0.075mm larger than the size of each side of the resin module 400.

Specifically, referring to step S106 in fig. 5, after step S100, the copper-based work plate 100 is placed on a plate grinding line to clean the edge burrs of the accommodating groove 120.

The traditional manufacturing method needs to manufacture a plurality of copper blocks with small unit sizes, also needs to carry out burring processing on the copper blocks with the small unit sizes, and a production department needs to manufacture a special carrier to assist in processing the burring of a single copper block and needs to use a special browning carrier to assist in manufacturing a browning process of the copper block by the single copper block.

In the method for manufacturing the printed circuit board described in this embodiment, the single large-sized copper-based working board 100 is ground without manufacturing a grinding board carrier and a browning fixture, and only a horizontal grinding line is used, and the resin module 400 does not need to be ground and browned like a copper block. Therefore, the manufacturing method of the printed circuit board can reduce the investment of a carrier when the single copper block needs to be ground by horizontal lines to form the burrs and the brown oxide lines, can finish the board grinding of the copper-based working board 100 only by normal whole board grinding lines and brown oxide lines without the carrier, and simultaneously cancels the work of manually placing the copper block on the carrier, grinding the burrs and taking the copper block from the carrier after brown oxide, thereby greatly improving the production efficiency.

The burrs may be referred to as flashes, burrs or flashes.

In one embodiment, referring to fig. 5, step S100 specifically includes:

and S101, cutting. A copper substrate with a proper thickness is selected and cut into a copper-based working plate 100 with a proper size. For example, the thickness of the copper base plate is 1mm, 1.5mm or 2mm, and the size of the copper base work plate 100 is 450mm × 200mm, 468mm × 250mm or 500mm × 300 mm.

S102, drilling a hole on the copper base. And LDI positioning holes, routing positioning holes, a first riveting hole 10 and a second riveting hole 30 are drilled in the copper-based working plate 100. Wherein, ldi (laser direct imaging) refers to a laser direct imaging technology. The first riveting hole 10 and the second riveting hole 30 are used for subsequent riveting with the core board 300 and the prepreg 200, and the core board 300 and the prepreg 200 have the first riveting hole 10 and the second riveting hole 30 with corresponding positions.

S103, outer layer circuit. The copper-based working plate 100 is positioned by using the LDI positioning holes, and then the copper-based boss 110 pattern and the protective film layer pattern are formed on the copper-based working plate 100 by adopting LDI exposure.

And S104, etching the boss.

And S105, routing. The housing groove 120 is processed according to the set outer dimensions of the resin module 400. The size of the receiving groove 120 is 0.05mm to 0.075mm larger than the one-sided size of the resin module 400.

And S106, grinding the plate. Alternatively, the non-woven fabric grinding line is used for production, and only the edge of the accommodating groove 120 is required to be completely removed.

And S107, browning. Optionally, the brown oxide is produced at a browning speed of 1.5-2.0 m/min. At the moment, the whole copper-based working plate 100 is passed through the browning line without adding a browning carrier, so that the production process is simplified, and the production efficiency is improved.

S108, baking the board. Water vapor remains on the copper-based working plate 100 after baking and browning.

In one embodiment, referring to fig. 6, step S200 specifically includes:

s201, cutting. Specifically, the worker automatically cuts the prepreg 200 having the same size as the copper-based work board 100 using a cutting machine.

S202, laser windowing and drilling. Specifically, the worker produced using a UV laser cutter, the window size of the prepreg 200 was 0.075mm larger than the size of the copper-based boss 110 on one side. Meanwhile, the first riveting hole 10 and the second riveting hole 30 are processed in the prepreg 200.

In one embodiment, referring to fig. 7, step S300 specifically includes:

s301, cutting. In which a worker cuts out the core plate 300 having the same size as that of the copper-based work plate 100 using an automatic shearing machine. Alternatively, the core plate 300 having the same size as the copper-based work plate 100 may be directly purchased, and this step may be omitted.

S302, a laser drilling machine is used to fabricate laser holes on the core board 300. Wherein, the aperture of the radium perforation is 0.12mm, 0.125mm or 0.13 mm.

S303, cleaning the edge residual glue of the laser holes. Specifically, plasma is used to clean the cull.

And S304, cleaning the core plate 300.

S305, converting the hole wall of the laser hole into a conductor.

S306, filling the laser holes by using a VCP (Vertical carrier plating) technology. Wherein, the hole filling cavity is less than or equal to 25 percent, the flatness of the bonding pad is ensured, and the sinking depth of the bonding pad is less than or equal to 25 mu m.

S307, manufacturing an outer layer circuit on the core board 300. The film is manufactured by using conventional production parameters, the phenomena of dry film bubbles, wrinkles, copper exposure and the like are not allowed to occur, the upper and lower layers are not allowed to be staggered after exposure, and whether the phenomena of open short circuit, poor exposure, incomplete development and the like exist after development is totally detected.

And S308, acid etching of the outer layer. Wherein, when the outer layer circuit is formed by non-acid etching, this step can be omitted.

S309, checking whether the outer layer line has a short circuit or not by using a switching test. If the outer layer circuit is inspected to have a short circuit by using Automatic Optical Inspection (AOI), the machine will have numerous false errors when the AOI scans to the laser hole position, which results in that the process cannot be normally produced. In the embodiment, whether the outer-layer circuit has a short circuit is checked by using the on-off test, so that heavy workload caused by a large number of false errors can be avoided, meanwhile, the on-off test can also accurately find out bad positions, subsequent repair and scrapping are facilitated, and the working efficiency is improved.

And S310, cutting a window of the core plate 300. Specifically, a window is cut by a UV cutting machine, and the size of the window is 0.075mm larger than that of the single side of the size of the copper-based boss 110. Meanwhile, the first rivet hole 10 and the second rivet hole 30 are cut in the core plate 300.

S311, browning. Specifically, the flexible core plate with the plate thickness of 0.05mm and the copper thickness of two sides of 1oz needs to be produced by using a traction plate for the brown oxidation because the flexible core plate is thinner.

In one embodiment, referring to fig. 8, step S500 specifically includes:

s501, cutting the copper-clad plate.

S502, etching the copper-clad plate to form the resin light plate. Specifically, the copper-clad plate is directly etched to the resin light plate through an acid etching horizontal line by adopting double-sided etching.

S503, pasting a first high-temperature protection film on one surface of the resin light plate. Optionally, automatic film pasting is realized by using an automatic film pasting machine.

And S504, routing the resin optical plate into a single resin module 400. Optionally, the production is made using a controlled deep gong machine.

And S505, attaching a second high-temperature protective film to the other surface of the resin module 400, and tearing off the first high-temperature protective film.

And S506, browning. The browning parameter was set to 3.5m/min production and the main function was to clean the resin module 400.

Thus, the resin module 400 having a plurality of small unit sizes can be mass-produced and rapidly manufactured by the above steps.

In one embodiment, referring to fig. 3, before step S400, first rivet holes 10 are disposed in corresponding positions in the middle non-unit areas of the copper-based working plate 100, the prepreg 200, and the core plate 300.

In step S400, the pre-stacked copper-based work sheet 100, prepreg 200, and core sheet 300 are caulked through the first caulking hole 10.

Therefore, the middle non-unit areas of the copper-based working plate 100, the prepreg 200 and the core plate 300 are riveted and positioned through the first riveting holes 10, the core plate 300 can be more firmly combined with the prepreg 200 and the copper-based working plate 100 or with the rest layers of core plates 300, and local deformation, displacement and wrinkling caused by pulling and extrusion of a film sticking machine are not easy to occur in the film sticking process, so that the pressing yield is greatly improved. Therefore, in step S400, the copper-based working board 100, the prepreg 200, and the core board 300 are riveted, so that the problems of misalignment and wrinkling caused by local deformation of the core board 300 during the film attaching process can be effectively solved, and the product yield is improved.

In addition, second riveting holes 30 corresponding in position are further formed in the edge positions of the copper-based working plate 100, the prepreg 200 and the core plate 300, so that the copper-based working plate 100, the prepreg 200 and the core plate 300 are riveted more firmly.

The copper-based working plate 100, the prepreg 200 and the core plate 300 are riveted and positioned by the first riveting hole 10 and the second riveting hole 30 at the same time.

In one embodiment, in the method for manufacturing a printed circuit board, after step S400 and before step S600, a high temperature resistant film is attached to the surface having the copper-based bumps 110 to protect the flexible core board 300. Specifically, the manual film sticking machine is used for automatically sticking the film, the film sticking speed and the film sticking pressure need to be controlled in the film sticking process, and the flexible core board 300 is prevented from deforming and dislocating due to the fact that the film sticking speed is too high and the pressure is too high.

Step S600 specifically includes:

in step S601, the resin module 400 is fitted into the accommodation groove 120 from the side away from the copper-based bosses 110.

Step S602, a high temperature resistant film is attached to the surface of the laminate plate away from the copper-based boss 110 to fix the resin module 400.

Step S603, press-fitting the laminate.

Step S604, tearing off the high temperature resistant films on the two sides of the laminated plate, and cutting off the excessive glue on the copper-based boss 110. Specifically, the overflow glue on the copper-based boss 110 is polished clean by using a ceramic and non-woven fabric grinding plate.

And step S605, drilling, and producing according to the drilling requirement of the conventional PCB. If the holes drilled in the copper-based working plate 100 need to be drilled in sections, the holes with the diameter larger than 3.0mm need to be covered by hardboards for production, and deviated holes and hole opening burrs are not allowed.

Step 606, the copper plate is plated.

In step S607, the entire panel is thickened.

Step S608, outer layer circuit.

In step S609, the outer layer is etched. After etching, AOI detects open circuit, short circuit and other bad phenomena.

And step S610, solder mask. The bendable ink is used for production, a 36T white screen is used for printing once, the thickness of the ink is controlled according to the requirements of customers, the side etching of the developing ink and the appearance of a board surface are strictly controlled by the white ink.

And step S611, characters. And manufacturing according to the conventional PCB production requirement.

And step S612, gold precipitation. The PCB is manufactured according to the conventional PCB production requirement, the thickness of gold and the thickness of nickel need to meet the customer requirement, and white paper is needed after gold deposition in order to prevent large gold surface from being scratched.

In one embodiment, after step S600, the method for manufacturing a printed circuit board further includes: carry out the on-off test with the pressboard to whether there is the short circuit in the circuit of detecting the pressboard, replace using AOI test, reducible report a large amount of operating time that wrong false point was confirmed, improve production efficiency.

In one embodiment, after step S600, the method for manufacturing a printed circuit board further includes: and carrying out four-terminal test on the laminated plate to detect whether a gap or residual copper exists in the circuit of the laminated plate. The four-terminal test is to judge whether a circuit has a gap or residual copper according to the resistance value of the resistor according to the four-terminal resistance measurement principle.

In one embodiment, in the method for manufacturing a printed circuit board, after step S600 and before depth control, a high temperature protective film is attached to the surface of the laminated board having the copper-based bosses 110 by using a manual film attaching machine to ensure that the through holes on the printed circuit board maintain a sealed state.

In one embodiment, the core board 300 is a flexible core board 300, and in the method for manufacturing the printed circuit board, after the step S600, depth control routing is performed on the bending area 20 of the laminated board, and the remaining depth control thickness is 0.30mm to 0.35 mm. Therefore, the manufactured printed circuit board has the bending area 20, can be bent, and has the characteristics of soft and hard combination and high heat dissipation.

Specifically, the depth control gong machine is used for production, and a flat bottom gong knife is used for processing. Firstly, checking whether the air suction capacity of the gong machine is normal, then measuring and calculating the height of each main shaft table board according to a set program, and then placing the surface of the printed circuit board with the copper-based boss 110 downwards and installing the printed circuit board on the table board of the depth control gong machine. And opening the air suction function to enable the printed circuit board to be tightly attached to the table board, measuring and calculating the thickness of the PCB according to a set program, and finally setting the required residual thickness in the depth control gong machine program. The first part is firstly processed by each main shaft, and mass production can be realized after the residual thickness of the first part is qualified. The face of the board is not allowed to be wiped in the processing process.

It is understood that in other embodiments, the step of performing depth-controlled routing in the bending region 20 of the laminated board can be omitted, and in this case, the printed circuit board is a hard board.

The printed circuit board has the copper-based boss 110, has the characteristic of high heat dissipation, and is low in manufacturing cost and high in yield.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.

Claims

1. A method of manufacturing a printed wiring board, comprising:

s500: providing a resin module fitted to the receiving groove;

s700: and cutting the laminated board to obtain a single printed circuit board.

2. The method of manufacturing a printed wiring board according to claim 1, characterized in that: in step S100, the conveying speed of the copper-based working plate in the etching cylinder is controlled to be 2m/min-2.2m/min, and the up-down pressure is controlled to be 2kg/cm²-2.2kg/cm²Acid etching the copper-based work plate 2 times eachThe secondary etching depth is 0.1mm-0.11 mm; then continuously controlling the conveying speed at 3.5m/min-3.7m/min and the up-down pressure at 2kg/cm²-2.2kg/cm²And acid etching the copper-based working plate once, wherein the etching depth is 0.05mm-0.052mm, and thus obtaining the copper-based boss.

3. The method of manufacturing a printed wiring board according to claim 1, characterized in that: in step S100, the accommodating groove 0.05mm to 0.075mm larger than the single side of the size of the resin module is routed on the copper-based working plate.

4. The method of manufacturing a printed wiring board according to claim 3, characterized in that: after the step S100, the whole copper-based working plate is placed on a plate grinding line, and the edge residual flash of the accommodating groove is cleaned.

5. The method of manufacturing a printed wiring board according to claim 1, characterized in that:

before step S400, first riveting holes corresponding to each other in position are formed in the middle non-unit areas of the copper-based working plate, the prepreg and the core plate;

6. The method of manufacturing a printed wiring board according to claim 1, characterized in that: step S300 specifically includes: manufacturing laser holes on the core plate by using a laser drilling machine; cleaning the edge residual glue of the laser holes; cleaning the core plate; conducing the hole wall of the laser hole; filling the laser holes by using VCP technology; manufacturing an outer layer circuit on the core board; checking whether the outer layer circuit has a short circuit by using a on-off test; and cutting a window of the core plate.

7. The method of manufacturing a printed wiring board according to claim 1, characterized in that: step S500 specifically includes: cutting the copper-clad plate; etching the copper-clad plate to form a resin light plate; sticking a first high-temperature protective film on one surface of the resin light plate; routing the resin light plate into a single resin module; attaching a second high-temperature protective film to the other surface of the resin module, and tearing off the first high-temperature protective film; and (4) browning.

8. The method of manufacturing a printed wiring board according to claim 1, characterized in that:

after step S600, the method further includes: carrying out on-off test on the laminated plate to detect whether a short circuit exists in a circuit of the laminated plate;

9. The method of manufacturing a printed wiring board according to any one of claims 1 to 8, characterized in that: and the core board is a flexible core board, and after the step S600, depth control gonging is carried out on the bending area of the laminated board, wherein the depth control residual thickness is 0.30-0.35 mm.

10. A printed wiring board characterized by: the printed wiring board is produced by the method for producing a printed wiring board according to any one of claims 1 to 9.