CN110785028A - Manufacturing method of PCB embedded with ceramic chip and PCB - Google Patents
Manufacturing method of PCB embedded with ceramic chip and PCB Download PDFInfo
- Publication number
- CN110785028A CN110785028A CN201911071987.5A CN201911071987A CN110785028A CN 110785028 A CN110785028 A CN 110785028A CN 201911071987 A CN201911071987 A CN 201911071987A CN 110785028 A CN110785028 A CN 110785028A
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- pcb
- ceramic
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- manufacturing
- ceramic chip
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a method for manufacturing a PCB embedded with a ceramic chip and the PCB. According to the invention, the ceramic plate is half-buried in the PCB, the prepreg is added on the upper surface of the ceramic plate for pressing, the upper surface of the PCB can be ensured to be smooth without grinding after pressing, and the copper thickness of the upper surface can be controlled to be 0.010-0.020 mm, so that a precise circuit can be manufactured, namely, the copper foil is pasted on the upper surface of the PCB, the thickness of the copper foil is convenient to control, and the precise circuit is favorably manufactured.
Description
Technical Field
The invention relates to the technical field of PCB (printed circuit board) manufacturing processes, in particular to a PCB manufacturing method with a ceramic chip embedded inside and a PCB.
Background
With the development of intellectualization, miniaturization and portability of the existing power electronic devices, the high-power and high-heat-dissipation devices need to be more in a fine wiring design, a higher-level stack structure and a more efficient heat dissipation design. Usually, grooves are cut between printed circuit boards ("PCBs") and ceramic sheets (mainly, aluminum oxide or aluminum nitride) are embedded into the PCBs, and a prepreg is melted by a pressing process to fill the gaps between the ceramic sheets and the PCBs. And after lamination, a plate grinding process is needed to remove the excess resin overflowing to the surface of the ceramic plate, and then drilling, PTH, outer layer circuit and titanium removing processes are carried out.
In the above process, there are three key places:
1. the prepreg is melted to completely fill the gap between the ceramic chip and the PCB;
2. removing excessive overflowing glue on the ceramic sheet;
3. and removing titanium after the outer layer circuit is etched.
1 and 2, it needs to be greater than 35um to have decided that the copper on the ceramic wafer is thick, could guarantee both to fill up the clearance after, except that overflowing glue can not grind the copper on the ceramic wafer and expose the substrate in the flow, after the PTH again, the copper on the ceramic wafer is thick will be greater than 50um, and this has just decided that it can not do accurate circuit etching. Secondly, the process must go through a titanium removal process, otherwise the lines on the ceramic sheet will be short-circuited.
The existing design is that the upper and lower surfaces of a ceramic chip are the upper and lower surfaces of a final PCB, in order to fill and level up a gap between the ceramic chip and a multilayer PCB, resin of a prepreg must be ensured to overflow the gap, and finally, a grinding mode is used to ensure the flatness between the ceramic chip and the PCB. The grinding process can remove copper from the ceramic wafer, resulting in exposed substrate, or insufficient copper thickness. Therefore, the existing manufacturing method increases the copper thickness on the ceramic wafer to 1OZ or 2OZ, and the copper thickness greater than 1OZ cannot manufacture precise lines (the line width/line distance is less than 0.075 mm).
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a method for manufacturing a PCB embedded with a ceramic chip and the PCB.
In order to achieve the purpose, the invention adopts the following technical scheme:
a manufacturing method of a PCB embedded with a ceramic chip comprises the following steps:
providing a PCB with a slotted hole;
secondly, attaching a high-temperature-resistant fixing layer to the bottom surface of the PCB;
step three, providing ceramic plates with the sizes corresponding to the slotted holes, and placing the ceramic plates in the corresponding slotted holes; one end of the ceramic plate is connected with the fixed layer so as to be fixed in the slot;
step four, sequentially superposing a prepreg and a copper foil on the top surface of the PCB;
placing the PCB on which the prepreg and the copper foil are stacked on a laminating machine for laminating; removing the fixing layer after the pressing is finished so as to form the PCB with the ceramic chip embedded inside;
sixthly, pasting dry films on the top surface and the bottom surface of the PCB with the ceramic chip embedded inside;
processing a copper foil and a prepreg on the top surface of the PCB with the ceramic chip embedded inside to form a window of the laser drilling hole through an exposure machine, a dry film developing machine and an acid etching machine;
processing a laser hole on the top surface of the PCB embedded with the ceramic chip by a laser drilling machine;
and step nine, filling the laser hole with copper plating by adopting a hole filling electroplating mode, thereby realizing the conduction between the top surface copper foil and the embedded ceramic chip of the PCB.
The further technical scheme is as follows: the PCB is a multilayer board, and is sequentially overlapped, riveted and fixed with the prepreg through a plurality of PCB core boards.
The further technical scheme is as follows: the thickness of the ceramic plate is 0.5-2.0 mm, and a copper layer with the thickness of 0.01-0.20 mm is covered on the ceramic plate.
The further technical scheme is as follows: the aperture of the laser hole is 0.075-0.150 mm.
The further technical scheme is as follows: the aperture of the slotted hole is 0.075-0.15 mm; the aperture size of the slotted hole is 0.1-0.2 mm larger than that of the ceramic chip.
The further technical scheme is as follows: the resin content of the prepreg is 68% to 75%, and the thickness is 0.076 to 0.13 mm.
The further technical scheme is as follows: the thickness of the copper foil is 1/3OZ or 1/2 OZ.
The further technical scheme is as follows: the ceramic plate is a cylinder with six surfaces or a square cylinder.
The further technical scheme is as follows: the PCB with the prepreg and the copper foil superposed is placed in a laminating machine and then is subjected to high temperature, high pressure and vacuum to form a laminated PCB; the high temperature is 180-250 ℃ and the high pressure is 150Kp/cm
2-200 Kp/cm
2The vacuum degree is 680mmHg-1000 mmHg.
The further technical scheme is as follows: the number of layers of the multilayer PCB board is 4-20, and the thickness of the multilayer PCB board is 0.5-3.0 mm.
A PCB board is manufactured according to the manufacturing method of the PCB board.
Compared with the prior art, the invention has the beneficial effects that: according to the invention, the ceramic plate is half-buried in the PCB, the prepreg is added on the upper surface of the ceramic plate for pressing, the upper surface of the PCB can be ensured to be smooth without grinding after pressing, and the copper thickness of the upper surface can be controlled to be 0.010-0.020 mm, so that a precise circuit can be manufactured, namely, the copper foil is pasted on the upper surface of the PCB, the thickness of the copper foil is convenient to control, and the precise circuit is favorably manufactured.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented according to the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more apparent, the following detailed description will be given of preferred embodiments.
Drawings
Fig. 1 is a structure diagram of a PCB board of a method for manufacturing a PCB board with a ceramic chip embedded therein according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings and the detailed description.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be connected or detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above should not be understood to necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by one skilled in the art.
The drawing 1 is a drawing of the present invention.
The present embodiment provides a method for manufacturing a PCB board embedded with a ceramic chip, please refer to fig. 1, which includes the following steps:
step one, providing a PCB (printed Circuit Board) 10 with a slotted hole 11;
secondly, attaching a high-temperature-resistant fixing layer to the bottom surface of the PCB 10; preferably, the fixing layer is high-temperature-resistant adhesive paper;
step three, providing a ceramic plate 12 with the size corresponding to the slot 11, and placing the ceramic plate 12 in the corresponding slot 11; one end of the ceramic plate 12 is connected with the fixed layer so as to be fixed in the slot 11;
fourthly, sequentially superposing a prepreg 13 and a copper foil 14 on the top surface of the PCB 10;
placing the PCB 10 on which the prepreg 13 and the copper foil 14 are superposed on a laminating machine for laminating; removing the fixing layer after the pressing is finished to form the PCB 10 with the ceramic chip 12 embedded inside;
sixthly, pasting dry films on the top surface and the bottom surface of the PCB 10 with the ceramic chip 12 embedded inside;
step seven, processing a windowing opening of the laser drilling hole by a copper foil 14 and a prepreg 13 on the top surface of the PCB 10 with the ceramic chip 12 embedded inside through an exposure machine, a dry film developing machine and an acid etching machine;
processing a laser hole 15 on the top surface of the PCB 10 embedded with the ceramic chip 12 by a laser drilling machine;
and step nine, filling copper plating 16 in the laser hole 15 by adopting a hole filling electroplating mode, thereby realizing the conduction between the top surface copper foil 14 and the embedded ceramic plate 12 of the PCB 10.
The PCB 10 is a multilayer board, and a plurality of PCB core boards and prepregs are sequentially stacked and riveted and fixed, and the specifications of the prepregs at the position can be the same as those of the stacked prepregs 13. A slotted hole 11 is milled at a set position of the multilayer PCB 10, and the diameter of the slotted hole 11 is slightly larger than that of the ceramic chip 12. The slot 11 is a through hole or a blind hole, and the slot 11 is a through hole in this embodiment. The upper and lower surfaces of the multi-layer PCB 10 are copper foil layers, and the copper foil and the stacked copper foil may have the same specification. Preferably, the number of layers of the multi-layer PCB panel 10 is 4-20, and the thickness of the multi-layer PCB panel 10 is 0.5-3.0 mm.
The ceramic sheet 12 has a thickness of 0.5-2.0 mm and the ceramic sheet 12 is covered with a copper layer having a thickness of 0.01-0.20 mm. The copper layer serves to conduct the multi-layer PCB board 10.
Preferably, the laser aperture 15 has a diameter of 0.075-0.150 mm. Wherein, the laser hole 15 is a blind hole, and the inside is communicated with the ceramic plate 12.
Preferably, the aperture of the slot 11 is 0.075-0.15 mm. The size of the aperture of the slot hole 11 is 0.1-0.2 mm larger than that of the ceramic sheet 12 so that the ceramic sheet 12 can be inserted into the slot hole 11.
Preferably, the prepreg 13 has a resin content of 68% to 75% and a thickness of 0.076 to 0.13mm
Preferably, the copper foil 14 has a thickness of 1/3OZ or 1/2 OZ.
Preferably, the ceramic plate 12 is a cylinder with six sides or a square cylinder, which can be better matched with the slot 11.
The PCB superposed with the prepreg 13 and the copper foil 14 is placed in a laminating machine and then is subjected to high temperature, high pressure and vacuum to form a laminated PCB 10. The high temperature is 180-250 ℃ and the high pressure is 150Kp/cm
2-200Kp/cm
2The vacuum degree is 680mmHg-1000mmHg, and the ceramic wafer can be well embedded in the PCB under the condition of pressing, so that the ceramic wafer is seamless and has good contact.
A PCB board is manufactured according to the manufacturing method of the PCB board. The specific structure is shown in fig. 1.
According to the invention, the ceramic sheet 12 is half-buried in the PCB 10, the prepreg 13 is additionally arranged on the upper surface of the ceramic sheet 12 for pressing, the flatness of the upper surface of the PCB 10 can be ensured without a grinding process after pressing, and the copper thickness of the upper surface can be controlled to be 0.010-0.020 mm, so that a precise circuit can be manufactured. Namely, the copper foil 14 is adhered on the upper surface of the PCB 10, and the thickness of the copper foil 14 is convenient to control, thereby being beneficial to making a precise circuit.
The technical contents of the present invention are further illustrated by the examples only for the convenience of the reader, but the embodiments of the present invention are not limited thereto, and any technical extension or re-creation based on the present invention is protected by the present invention. The protection scope of the invention is subject to the claims.
Claims (10)
1. A manufacturing method of a PCB embedded with a ceramic chip is characterized by comprising the following steps:
providing a PCB with a slotted hole;
secondly, attaching a high-temperature-resistant fixing layer to the bottom surface of the PCB;
step three, providing ceramic plates with the sizes corresponding to the slotted holes, and placing the ceramic plates in the corresponding slotted holes; one end of the ceramic plate is connected with the fixed layer so as to be fixed in the slot;
step four, sequentially superposing a prepreg and a copper foil on the top surface of the PCB;
placing the PCB on which the prepreg and the copper foil are stacked on a laminating machine for laminating; removing the fixing layer after the pressing is finished so as to form the PCB with the ceramic chip embedded inside;
sixthly, pasting dry films on the top surface and the bottom surface of the PCB with the ceramic chip embedded inside;
processing a copper foil and a prepreg on the top surface of the PCB with the ceramic chip embedded inside to form a window of the laser drilling hole through an exposure machine, a dry film developing machine and an acid etching machine;
processing a laser hole on the top surface of the PCB embedded with the ceramic chip by a laser drilling machine;
and step nine, filling the laser hole with copper plating by adopting a hole filling electroplating mode, thereby realizing the conduction between the top surface copper foil and the embedded ceramic chip of the PCB.
2. The method for manufacturing a PCB embedded with a ceramic sheet according to claim 1, wherein the PCB is a multi-layer board, and a plurality of PCB core boards and prepregs are sequentially stacked and riveted for fixing.
3. The method as claimed in claim 2, wherein the ceramic sheet has a thickness of 0.5-2.0 mm, and the ceramic sheet is covered with a copper layer having a thickness of 0.01-0.20 mm.
4. The method for manufacturing a PCB embedded with ceramic chips as claimed in claim 3, wherein the aperture of the laser hole is 0.075-0.150 mm.
5. The method for manufacturing the PCB embedded with the ceramic chip as claimed in claim 4, wherein the aperture of the slot hole is 0.075-0.15 mm; the aperture size of the slotted hole is 0.1-0.2 mm larger than that of the ceramic chip.
6. The method for manufacturing a PCB board with embedded ceramic chip according to claim 5, wherein the prepreg has a resin content of 68-75% and a thickness of 0.076-0.13 mm.
7. The method for manufacturing a PCB embedded with ceramic chips as claimed in claim 6, wherein the thickness of the copper foil is 1/3OZ or 1/2 OZ.
8. The method for manufacturing a PCB embedded with a ceramic chip as claimed in claim 7, wherein the ceramic chip is in the shape of a cylinder with six sides or a square cylinder.
9. The method for manufacturing the PCB embedded with the ceramic chip as claimed in claim 2, wherein the number of the layers of the multi-layer PCB is 4-20, and the thickness of the multi-layer PCB is 0.5-3.0 mm.
10. A PCB board manufactured by the method of manufacturing a PCB board according to any one of claims 1 to 9.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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CN201911071987.5A CN110785028A (en) | 2019-11-05 | 2019-11-05 | Manufacturing method of PCB embedded with ceramic chip and PCB |
PCT/CN2020/087754 WO2021088336A1 (en) | 2019-11-05 | 2020-04-29 | Fabrication method for pcb having internally embedded ceramic piece, and pcb thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201911071987.5A CN110785028A (en) | 2019-11-05 | 2019-11-05 | Manufacturing method of PCB embedded with ceramic chip and PCB |
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CN110785028A true CN110785028A (en) | 2020-02-11 |
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CN201911071987.5A Pending CN110785028A (en) | 2019-11-05 | 2019-11-05 | Manufacturing method of PCB embedded with ceramic chip and PCB |
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WO (1) | WO2021088336A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021088336A1 (en) * | 2019-11-05 | 2021-05-14 | 景旺电子科技(龙川)有限公司 | Fabrication method for pcb having internally embedded ceramic piece, and pcb thereof |
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EP2101550A1 (en) * | 2008-03-14 | 2009-09-16 | Asetronics AG | Insulated metal substrate with an implant |
CN103987187A (en) * | 2014-05-19 | 2014-08-13 | 深圳市景旺电子股份有限公司 | PCB inlaid with copper block and manufacturing method thereof |
CN108419361A (en) * | 2018-05-15 | 2018-08-17 | 景旺电子科技(龙川)有限公司 | Bury copper billet printed circuit board and preparation method thereof |
CN108650781A (en) * | 2018-06-20 | 2018-10-12 | 景旺电子科技(龙川)有限公司 | A kind of heat-radiating substrate and preparation method thereof embedding copper-based IMS |
Family Cites Families (3)
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TW201041093A (en) * | 2009-05-15 | 2010-11-16 | High Conduction Scient Co Ltd | Section-difference type ceramics base copper-clad laminate set and manufacturing method thereof |
CN107222983B (en) * | 2017-06-09 | 2019-05-03 | 深圳市景旺电子股份有限公司 | A kind of pcb board and production method of embedded AlN ceramic insulating radiation module |
CN110785028A (en) * | 2019-11-05 | 2020-02-11 | 景旺电子科技(龙川)有限公司 | Manufacturing method of PCB embedded with ceramic chip and PCB |
-
2019
- 2019-11-05 CN CN201911071987.5A patent/CN110785028A/en active Pending
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2020
- 2020-04-29 WO PCT/CN2020/087754 patent/WO2021088336A1/en active Application Filing
Patent Citations (4)
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EP2101550A1 (en) * | 2008-03-14 | 2009-09-16 | Asetronics AG | Insulated metal substrate with an implant |
CN103987187A (en) * | 2014-05-19 | 2014-08-13 | 深圳市景旺电子股份有限公司 | PCB inlaid with copper block and manufacturing method thereof |
CN108419361A (en) * | 2018-05-15 | 2018-08-17 | 景旺电子科技(龙川)有限公司 | Bury copper billet printed circuit board and preparation method thereof |
CN108650781A (en) * | 2018-06-20 | 2018-10-12 | 景旺电子科技(龙川)有限公司 | A kind of heat-radiating substrate and preparation method thereof embedding copper-based IMS |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2021088336A1 (en) * | 2019-11-05 | 2021-05-14 | 景旺电子科技(龙川)有限公司 | Fabrication method for pcb having internally embedded ceramic piece, and pcb thereof |
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