TWI358976B - Substrate of printed circuit board and method for - Google Patents

Description

1358976 _._二' . 4100 June 15th revised Lai page VI, invention description: [Technical field of invention] [0001] The present invention relates to the field of circuit board fabrication technology, and more particularly to a circuit board substrate and having a break A method of manufacturing a circuit board with a poor structure. [Prior Art]

[0002] With the increasing miniaturization and high-speed performance of electronic products, more and more components are soldered on the surface of the circuit board, and the conductive line density and signal transmission amount of the circuit board are required to be larger and larger. To meet this demand, boards have evolved from single-panel to dual-panel and multi-layer boards. Among them, the double-sided circuit board and the multi-layer circuit board have a large wiring area and a high assembly density and are widely used, see the literature: Takahashi, A.; High density multilayer printed circuit board for HITAC M-880; IEEE Trans, on Components , Packaging Technology, 1992 o [0003] As a new type of multilayer circuit board that has emerged in recent years, a circuit board having a stepped structure has a small number of layers in a small number of layers due to its different layers in different regions. The rigidity is small, and the area with a large number of layers has high line density, large thickness and rigidity, so that it can transmit a large amount of information and has appropriate rigid flexibility. [0004] Referring to FIG. 1a, a schematic diagram of a multilayer circuit board 100 having a fault structure is shown. . The multilayer circuit board 100 is formed by a double-sided substrate 11+0 and a single-sided substrate 120. The first conductive line 111 of the double-sided substrate 110 is provided with a mounting area 112 for mounting electronic components. [0005] At present, a circuit board having a stepped structure is usually produced by a build-up method, that is, a layer stacking method. Taking the multilayer circuit board 100 as an example, the conventional manufacturing method package 097114143 Form No. A0101 Page 4 of 30 100321304 Bu 0 1358976 - 3 - 1100. 06.15 [Firstly, the double-sided substrate 110 is provided. The single-sided substrate 120 and the adhesive layer 130 ′′ refer to FIG. 1A and FIG. 2B. The surface of the double-sided substrate 11 is formed with a first conductive line 111, and the first conductive line 111 is provided with a mounting area 112 ′. The adhesive layer 130 is provided with a slit 131 corresponding to the size of the mounting region 112. The single-sided substrate 120 includes a substrate layer 121 and a conductive layer 122. Next, please refer to FIG. 1c, the single-sided substrate 120 is formed by the adhesive layer 130. The substrate layer 121 is pressed onto the surface of the first conductive line hi of the double-sided substrate 11 and the slit 131 is opposite to the mounting area 112. The conductive layer 122 of the single-sided substrate 120 is cut by a laser cutting device or a milling cutter. And the portion of the substrate layer 121 corresponding to the slits 131, so that the mounting region 112 is exposed; finally, the conductive layer is formed on the remaining conductive layer of the single-sided substrate 120. Of course, it is also possible to fabricate via holes penetrating the one-sided substrate 120 and the double-sided substrate 11 and the walls of the via holes. [0006] However, when the single-sided substrate 120 is a hard plate, since the material of the base material layer 121 is mostly a composite material composed of a mesh glass fiber and a polymer resin, the surface flatness of the single-sided substrate 120 is poor. The thickness varies greatly. When φ is used to remove a portion of the conductive layer 122 and a portion of the substrate layer 121 corresponding to the single-sided substrate 120 and the slit 131, the thickness difference is different due to the unevenness of the surface of the single-sided substrate 12, so that the single-sided substrate 120 needs to be different everywhere. Cutting energy, and the laser cutting process uses a certain energy to cut, so the cutting depth will be different everywhere, and it is very likely that the cutting is excessive, that is, a part of the first conductive line corresponding to the mounting area 112 of the double-sided substrate 110 Cut off. If the milling cutter is used instead, the thickness of each side of the single-sided substrate 12 is different, and it is difficult to grasp the insertion depth of the milling cutter, and damage the first conductive line in corresponding to the mounting area 112 of the double-sided substrate 11〇, resulting in the Part of the first conductive line 097114143 Form No. A0101 Page 5 / Total 30 pages 1003213041-0 1358976 On June 15th, 100th, Junzheng Saibai Road was broken, which reduced the pass rate of subsequent circuit board products and wasted production materials. In view of the above, it is necessary to provide a method for fabricating a circuit board substrate and a circuit board having a stepped structure, so as to improve the fabrication accuracy and the pass rate of the circuit board. [Summary of the Invention]

[0008] A circuit board substrate for fabricating a circuit board having a stepped structure. The circuit board substrate includes a first substrate, an adhesive layer, and a second substrate. The first substrate includes a first substrate layer, and a conductive circuit layer formed on at least one surface of the first substrate layer. The conductive circuit layer is provided with a mounting area. The second substrate includes a second substrate layer and a conductive layer formed on at least one surface of the second substrate layer. The adhesive layer is provided with slits extending through opposite surfaces thereof. The conductive circuit layer and the second substrate layer are respectively attached to opposite surfaces of the adhesive layer, and the mounting area is opposite to the slit. A removal area is provided in the middle of the surface of the conductive layer. The removal zone includes a first removal zone, a second removal zone, and a third removal zone between the first removal zone and the second removal zone and connected to the first removal zone and the second removal zone. a first slot and a second slot extending through the second substrate are formed at opposite ends of the third removal region, and the projection of the first substrate layer coincides with the projection of the mounting region on the first substrate layer, and Located within the projection of the slit in the first substrate layer. The first slit and the second slit are connected to the first removal zone and the second removal zone, and communicate with the slit. [0009] A method for fabricating a circuit board having a stepped structure, comprising the steps of: providing a first substrate, an adhesive layer, and a second substrate, the first substrate comprising a first substrate layer, formed on the first substrate a conductive circuit layer of at least one surface of the layer, the conductive circuit layer is provided with a mounting area, and the second substrate comprises a second 097114143 Form No. A0101 Page 6 / Total 30 Page 1003213041-0 1358976

[0010] 100 years. 06 months i5 days to replace the # page substrate layer and a conductive layer formed on at least one surface of the second substrate layer, the adhesive layer is provided with a slit penetrating the opposite surfaces thereof; The surface t portion defines a first removal region, a second removal region, and a third removal region between the first removal region and the second removal region and connected to the first removal region and the second removal region, the third removal region The shape and the size are matched with the shape and the size of the mounting area, and the first slot and the second slot extending through the second substrate are formed at opposite ends of the third removal region, and the first slot and the second slot are The edges intersect with the edges of the first removal region and the second removal region; the first substrate, the adhesive layer and the second substrate are sequentially laminated and pressed, and the conductive circuit layer and the second substrate layer are respectively adhered to The opposite surfaces of the adhesive layer, the projection of the third removal region on the first substrate layer coincides with the projection of the mounting region on the first substrate layer, and is located in the projection of the slit in the first substrate layer; Injecting the compound into the grooving or the second grooving to fill the slit and solidify the rubber compound; Cutting along the edges of the first removal region and the second removal region to remove the first substrate and the second substrate corresponding to the first removal region and the second removal region, removing the second substrate corresponding to the third removal region; removing the rubber compound, Thus, a circuit board having a stepped structure is obtained. The manufacturing method of the circuit board with the fault structure of the present invention is defined by including the first removal area, the second removal area, and the predetermined portion by the middle of the surface of the conductive layer of the second substrate before pressing the first substrate and the second substrate a removal area of the third removal area matching the shape and the size of the mounting area, and opening opposite ends of the second removal substrate at opposite ends of the third removal area and respectively connected to the first removal area and the second removal area The grooving and the second grooving are filled in the slit after the pressing, and the first substrate and the second substrate corresponding to the first removal region and the second removal region are removed, so as to remove the first removal region and the second removal region corresponding to the first substrate and the second substrate 097114143 7 pages / total 30 pages 1003213041-0 1358976 [0012] [0014] [0014] After the correction of the _ page board on June 1st, 100, the second substrate corresponding to the third removal area is in an independent state, The second substrate corresponding to the three removal regions is separated from the rubber material, and the rubber material is removed to obtain a circuit board having a fault structure, thereby overcoming the prior art manufacturing method, which is easy to damage when removing the second substrate corresponding to the mounting area. Mounting area The conductive lines inside cause the thickness of the conductive lines to be different, and even the defects of the broken lines. Moreover, since the manufacturing method uses the rubber material to fill the slit, the plating circuit and the etching liquid and the conductive circuit layer in the mounting region are effectively avoided when the circuit board with the fault structure is subsequently plated and the conductive circuit is formed by the wet method. Contact to damage the portion of the conductive circuit layer. Therefore, the manufacturing method of the technical solution can significantly improve the circuit fabrication precision of the circuit board and the product yield rate β. [Embodiment] The circuit with the fault structure provided by the technical solution will be provided below with reference to the embodiments and the accompanying drawings. The method of making the board will be described in detail. The manufacturing method of the circuit board with the fault structure provided by this embodiment includes the following steps: First, the first substrate 2, the second substrate 3, and the puncture layer 4〇〇i are provided. The first substrate 2 is a flexible board or a hard board including at least one layer of conductive lines. It may be a single-panel 'double-panel or multi-layer board. The specific structure depends on the structure of the circuit board having a stepped structure to be fabricated. In this embodiment, the first substrate 200 is a double-sided flexible board, which includes a first substrate layer 210 and first conductive circuit layers 220 and second conductive circuit layers respectively located on opposite surfaces of the first substrate layer 21 230. 097114143 Form No. A0101 Page 8 / Total 30 Page 1003213041-0 1358976 [0015] 100 years _ June 15th according to positive _ page change '·~substrate layer 210 can be early layer insulation substrate' can also be early A composite substrate composed of a layer of a conductive circuit layer and an insulating substrate. In this embodiment, the first substrate layer 210 is a single-layer insulating substrate layer. [0016] The material of the first conductive circuit layer 220 and the second conductive circuit layer 230 may be copper, silver, gold or other common metals. In this embodiment, the first conductive wiring layer 220 and the second conductive wiring layer 230 are formed by exposing, developing, etching, etc. the rolled copper foil. Of course, the copper-clad substrate having the double-sided copper foil can be directly provided, and then the first conductive wiring layer 220 and the second conductive wiring layer can be formed by laying a dry film, exposing, developing, etching, etc. on the surface of the copper foil on both sides. 230. The first conductive wiring layer 220 is provided with a mounting area 221. [0017] Referring to FIG. 2 and FIG. 3 together, the mounting area 221 is used for subsequently mounting the electronic components on the surface of the circuit board by using a surface mount process, and the shape and size thereof are determined according to actual needs. In this embodiment, the mounting area 221 has a rectangular shape and is located in the middle of the first conductive wiring layer 220.

[0018] The second substrate 300 may be a hard substrate or a soft substrate, and the structure thereof is determined according to a circuit board having a stepped structure which is actually required to be fabricated. In this embodiment, the second substrate 300 is a single-sided hard board, and includes a second substrate layer 310 and a conductive layer 320 formed on the surface of the second substrate layer 310, having a first surface 301 and first Surface 301 is opposite second surface 302. The first surface 301 corresponds to the surface of the second substrate layer 310, and the second surface 302 corresponds to the surface of the conductive layer 320. [0019] The second substrate layer 310 may be a single-layer insulating substrate, or may be a composite substrate composed of a single-layer conductive wiring layer and an insulating substrate. In this embodiment, the second substrate layer 300 is a composite insulating substrate composed of a single layer of insulating resin and glass fibers 097114143. Form No. A0101 Page 9 of 30 pages 1003213041-0 1358976 [0022] [0022] 097114143

IdO Year C June 15 Nuclear Replacement Page The conductive layer 320 is made of copper, silver, gold or other common metals. In this embodiment, it is a rolled copper foil. The adhesive layer 400 is used for bonding the first substrate 200 and the second substrate 300 in a subsequent pressing process, which is an adhesive commonly used in the art, such as an epoxy resin adhesive. The adhesive layer 400 is provided with a slit 410 corresponding to the mounting area 221. The slit 410 can be punched out by a punching device, which can be a through hole of a different shape, such as a circular, rectangular or other multi-cut line shape or the like. The position of the slit 410 relative to the adhesive layer 400 depends on the position of the mounting region 221 relative to the first conductive wiring layer 220, but should satisfy the adhesive layer provided with the slit 410 when the first substrate 200 and the second substrate 300 are subsequently pressed. 400 can completely adhere the first surface 301 of the second substrate layer 310 and the first conductive wiring layer 220. Referring to FIG. 2, FIG. 3 and FIG. 4, the size of the slit 410 is such that when the first surface 301 of the first conductive circuit layer 220 and the second substrate layer 310 are respectively adhered to opposite surfaces of the adhesive layer 400, The projection of the loading region 221 relative to the first substrate layer 210 is within the projection of the slit 410 relative to the first substrate layer 210. Preferably, the cross-sectional shape and size of the slit 410 matches the shape and size of the mounting area 221 . In this embodiment, the adhesive layer 400 is cut into a first adhesive portion 420 and a second adhesive portion 430 disposed opposite to the first adhesive portion 420. The first bonding portion 420 has a first cutting surface 421, and the second bonding portion 430 has a second cutting surface 431 opposite to the first cutting surface 421. The first cutting face 421 cooperates with the second cutting face 431 to form a slit 410. In the second step, a removal area 303 is defined in the middle of the second surface 302 of the second substrate 300. The removal area 30 3 includes a first removal area 3021, a second removal form number A0101, a 10th page, a total of 30 pages, 1003213041- 0

[0023] 1358976: 1 plus year: June 5th is ugly _^ zone 30 22 and located between the first removal zone 3021 and the second removal zone 3022 and is connected to the first removal zone 3021 and the second removal zone 3022 a third removal region 3031, and a first slot 3023 extending through the first surface 301 and the second surface 302 and connected to the first removal region 3021 and the second removal region 3022 at opposite ends of the third removal region 3031 and The second slot 3024.

Referring to FIG. 3 and FIG. 4 together, the definition of the removal region 303 may be formed by etching the surface of the conductive layer 320, or may be directly marked on the second surface 302, as long as it can function as a mark. In this embodiment, the removal region 303 is located in the middle of the conductive layer 320, and a pair of opposite sides is co-edge with a pair of opposite sides of the conductive layer 320. Specifically, the first removal area 3021 has a rectangular shape, and is formed by a first cutting line 3025, a second cutting line 3026, and a third cutting line 3027 which are sequentially connected end to end and one side of the second surface 302. The second removal zone 3022 is formed by a fourth cutting line 3028, a fifth cutting line 3029, a sixth cutting line 3030, and one side of the second surface 302, which are sequentially connected end to end. The third removal zone 3031 intersects the first removal zone 3021 at the second cutting line 3026, and the second removal zone 3022 intersects the fifth cutting line 3029, and the projection relative to the first substrate layer 210 is opposite to the placement area 221 The projections on the first substrate layer 210 coincide. Of course, the removal zone 303 may also not be co-edge with the edge of the second surface 302. [0025] In the third step, the first substrate 200, the adhesive layer 400, and the second substrate 30 0 are sequentially laminated and pressed. Referring to FIG. 3, FIG. 4 and FIG. 5, the first substrate 200, the adhesive layer 400 and the second substrate 300 are laminated and pressed so that the second substrate layer 310 and the first conductive circuit layer 220 are formed. They are respectively adhered to the opposite surfaces of the adhesive layer 400, and the mounting area 221 corresponds to the slit 410 and the third removal area 3031, that is, 097114143 Form No. A0101 Page 11 of 30 1003213041-0 1358976 100 years.06 On the 15th of the month, the projection of the third removal region 3031 with respect to the first substrate layer 210 coincides with the projection of the mounting region 221 on the first substrate layer 210, and the projection of the mounting region 221 to the first substrate layer 210 is performed. Located within the projection of the slit 410 to the first substrate layer 210, the circuit board substrate 700 is thereby obtained. [0027] In the fourth step, the rubber 500 is injected into the first slot 3023 or the second slot 3024 of the circuit board substrate 700 to fill the slit 410 and cure the rubber 500 » [0028] Please refer to the figure together 4, FIG. 5 and FIG. 6, the first substrate 200 and the second substrate

After the 300 and the adhesive layer 400 are pressed together, the first slit 3023 and the second slit 3024 communicate with the slit 410. The rubber material 500 is used to fill the slit 410 to cover the first conductive circuit layer 220 corresponding to the mounting region 221, thereby preventing subsequent wet processing. When the conductive layer 320 forms a conductive line, the etching liquid is along the first slit 3023 and The second slit 3024 enters the first conductive layer 220 corresponding to the affixing area 221 of the mounting area 221 . The size 500 can be filled in by printing or by other means common in the art, preferably in a level that is just as level as the second surface 302. The compound 500 is made of an adhesive material which is curable by ultraviolet light or micro heat and which is easily peeled off after curing. In this embodiment, the rubber 500 is selected from the ultraviolet curing compound commonly used in the art, and fills the first slit 3023, the second slit 3024, and the slit 410 [0029]. The fifth step is along the first removal region 3021. And cutting the edge of the second removal region 3022 to remove the first substrate 200 and the second substrate 300 corresponding to the first removal region 3021 and the second removal region 3022, and removing the second substrate 300 corresponding to the third removal region 3031. 097114143 Form No. A0101 Page 12 of 30 100321304 Bu 0 1358976 [0030]

, loo year.od is self-correcting_page Please refer to FIG. 4 and FIG. 7 together, since one edge of the first removal area 3021 and the second removal area 3022 is respectively co-edge with one side of the second surface 3〇2, therefore, The first substrate 200 and the second substrate 300 corresponding to the first removal region 3021 can be cut along the first cutting line 3025, the second cutting line 3026 and the third cutting line 3027 or the laser cutting is removed, and the second removal area 3022 corresponds to The first substrate 200 and the second substrate 300 may be removed by cutting or laser cutting along the fourth cutting line 3028, the fifth cutting line 3 029, and the sixth cutting line 3030. Wherein 'the type of laser should be selected according to the material of the second substrate layer 310. In general, the erbium-doped yttrium aluminum garnet Nd:YAG laser emits a short laser wave length, which is in the ultraviolet band and has a high pulse frequency, which can be used to cut the conductive layer and the insulating layer. Of course, a hybrid laser system may also be selected, that is, the conductive layer is cut by Nd:YAG laser to cut the insulating layer by (: 〇 2 laser. In the present embodiment, the first removal area 3021 is cut by Nd:YAG laser. And the first substrate 200 and the second substrate 300 corresponding to the second removal region 3022. [0031] Please refer to FIG. 4, FIG. 6 and FIG. 7 together, because the third removal region 3031 is provided with the first removal region 3021. The first cutting groove 3023 and the second cutting groove 3024 are connected to one edge, that is, the second cutting line 3026 and the second cutting line 3022, and thus are along the second cutting line 3026 and the fourth cutting line. After the first substrate 200 and the second substrate 300 corresponding to the first removal region 3021 and the second removal region 3022 are removed, the second substrate 3 corresponding to the third removal region 3031 will be in an independent state, and after the rubber 500 is cured. The adhesiveness is poor. In this case, the second substrate 200 corresponding to the third removal region 3031 is directly separated from the rubber 500 to remove the portion of the second substrate 200. [0032] In the fifth step, the rubber is removed. , thereby producing a circuit board with a fault structure 600 〇 097114143 Form No. A0101 No. 13 / Total 30 pages 1003213041-0 1358976 " 100 years of June 15th section for the replacement #页[0033] Please refer to Figure 7 and Figure 8, because the rubber 5 易 is easy to peel after curing, therefore, directly tear off The compound 500 can be used.

[0034] The circuit board 6 of the present embodiment having a stepped structure may further include the steps of: coating, exposing, developing, and etching the conductive layer on the surface of the conductive layer 320 to form a conductive line. In addition, the method further includes: forming a through hole penetrating the conductive layer 320 and the second conductive circuit layer 230, and plating the through hole hole wall to turn on the conductive layer 32 and the second conductive circuit layer 230, so that the second conductive circuit layer Signal transmission can be achieved between 230 and conductive layer 320. If the via hole wall plating process is performed after the formation of the wiring pattern of the conductive layer 320, the surface of the conductive layer 320, the first conductive wiring layer 220, and the second conductive wiring layer 230 should be pasted before the hole wall plating. Dry film to protect the line pattern. [0035] In summary, the present invention has been in compliance with the requirements of the invention patent 遂 提 patent application. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by those skilled in the art in light of the spirit of the present invention are intended to be included in the scope of the following claims. [Simplified Description of the Drawings] [0036] Figure la is a prior art one having a fault structure Schematic diagram of the structure of the soft and hard board. [0037] FIG. 1b is a schematic structural view of the first substrate, the second substrate, and the adhesive layer of the soft and hard bonding board shown in FIG. [0038] FIG. 1c is a schematic view of a first substrate in which a first substrate is pressed and cut in a conventional manufacturing method of the soft and hard bonding plate shown in FIG. 2 is a first substrate, a second substrate, and an adhesive 097114143 provided in an embodiment of the present technical solution. Form No. A0101 Page 14/Total 30 Page 1003213041-0 1358976 June i5·Day Correction Schematic diagram of the structure. 3 is a perspective view of the second substrate shown in FIG. 2 after the first slit and the second slit are provided. 4 is a schematic structural view of a circuit board substrate obtained by laminating a first substrate, an adhesive layer, and a second substrate shown in FIG. 5 is a cross-sectional view of the circuit board substrate shown in FIG. 4 taken along line V-V. 6 is a schematic view of the circuit board substrate shown in FIG. 5 after filling the rubber compound.

7 is a schematic view showing the structure shown in FIG. 6 after the second substrate corresponding to the third removal region is removed. 8 is a schematic diagram of a circuit board having a stepped structure fabricated by an embodiment of the present technical solution. [Main component symbol description] [0046] Multilayer circuit board: 1 00 [0047] Double-sided substrate: 110

[0048] Single-sided substrate: 120 [0049] First conductive line: 111 [0050] Mounting area: 112, 221 [0051] Adhesive layer: 130 [0052] Cutting: 1 31, 41 0 [0053] Substrate Layer: 121 [0054] Conductive layer: 122, 320 097114143 Form No. A0101 Page 15 / Total 30 pages 1003213041-0 1358976 " 100 years. June 15th Nuclear _«百 [0055] First substrate: 200 [ 0056] Second substrate: 300 [0057] Adhesive layer: 400 [0058] First substrate layer: 210 [0059] First conductive circuit layer: 220 [0060] Second conductive circuit layer: 230 [0061] Second base Material layer: 310 [0062] First surface: 301 [0063] Second surface: 302 [0064] First adhesive portion: 420 [0065] Second adhesive portion: 430 [0066] First cutting surface: 421 [0067] Second cutting surface: 431 · [0068] Removal area: 303 [0069] First removal area: 3021 [0070] Second removal area: 3022 [0071] Third removal area: 3031 [0072] First slot: 3023 [0073] Second slot: 3024 097114143 Form number A0101 Page 16 / Total 30 page 1003213041-0 1358976 [0075] [0075] [0078] [0079]

[0082] 100 years. 06 months ί5 day correction page first cutting line: 3025 second cutting line: 3026 third cutting line: 3027 fourth cutting line: 3028 fifth cutting line: 3029 sixth cutting line: 3030 Board Substrate: 700 Compound: 50 0 Board: 600

097114143 Form No. A0101 Page 17 of 30 1003213041-0

Claims (1)

100 years, June 15 revised replacement π 1358976 VII, the scope of application: 1. A method for manufacturing a circuit board having a step structure, comprising the steps of providing a first substrate, an adhesive layer and a second substrate, the first The substrate comprises a first substrate layer, a conductive circuit layer formed on at least one surface of the first substrate layer, the conductive circuit layer is provided with a mounting region, the second substrate comprises a second substrate layer and is formed in the second substrate a conductive layer of at least one surface of the substrate layer, the adhesive layer being provided with a slit penetrating through opposite surfaces thereof; A removal region is defined in a middle portion of the surface of the conductive layer, and the removal region includes a first removal region, a second removal region, and is located between the first removal region and the second removal region and is connected to the first removal region and the second removal region. a third removal zone, the shape and the size of the third removal zone are matched with the shape and the size of the mounting zone, and the first slot and the second slot are formed through the second substrate at opposite ends of the third removal zone. The first slot and the second slot are both connected to the first removal zone and the second removal zone; The first substrate, the adhesive layer and the second substrate are sequentially laminated and pressed, and the conductive circuit layer and the second substrate layer are respectively attached to opposite surfaces of the adhesive layer, and the third removal region is on the first substrate. The projection of the layer coincides with the projection of the mounting area on the first substrate layer and is located in the projection of the slit in the first substrate layer; the glue is injected into the first slot or the second slot to fill the slit And curing the rubber; cutting along the edges of the first removal region and the second removal region to remove the first substrate and the second substrate corresponding to the first removal region and the second removal region, and removing the second corresponding to the third removal region Substrate; removing the rubber material to produce a circuit board having a stepped structure. 097114143 Form number Α 0101 Page 18 / Total 30 pages 1003213041-0 1358976 100 years 0& month 15 white shuttle positivity _ page 2. The method of manufacturing a circuit board having a fault structure as described in claim 1 The first substrate and the second substrate are rigid substrates or flexible substrates. 3. The method of manufacturing a circuit board having a stepped structure according to claim 1, wherein the first substrate layer and the second substrate layer are a single-layer insulating substrate or a conductive layer and an insulating layer. Composite substrate composed of materials. 4. The method of manufacturing a circuit board having a stepped structure according to claim 1, wherein the manufacturing method further comprises the step of forming a line on the conductive layer after removing the compound. 5. A circuit board substrate for fabricating a circuit board having a stepped structure, The circuit board substrate includes a first substrate, an adhesive layer and a second substrate which are sequentially pressed, the first substrate includes a first substrate layer, and a conductive circuit layer formed on at least one surface of the first substrate layer, the conductive circuit layer is disposed The second substrate includes a second substrate layer and a conductive layer formed on at least one surface of the second substrate layer, the adhesive layer is provided with a slit penetrating through the opposite surfaces thereof, the conductive layer and the first layer The two substrate layers are respectively attached to the opposite surfaces of the adhesive layer, and the mounting area is opposite to the slit. The improvement is that the middle portion of the surface of the conductive layer is provided with a removal area, and the removal area includes a first removal area and a second removal area. a third removal zone between the first removal zone and the second removal zone and connected to the first removal zone and the second removal zone, wherein the opposite ends of the third removal zone are provided with a first slot extending through the second substrate And a second slit, wherein the projection of the first substrate layer coincides with the projection of the mounting region on the first substrate layer, and is located in the projection of the slit in the first substrate layer, the first slot and the second slot The grooving is performed with the first removal zone and the second removal zone Connected and connected to the incision. 6. The circuit board substrate of claim 5, wherein the first substrate layer and the second substrate layer are a single-layer insulating substrate or a conductive layer and an insulating substrate 097114143. Form No. A0101, page 19 / Total 30 pages 1003213041-0 1358976 100 years. On June 15th, the composite substrate composed of the replacement sheet material was verified. The circuit board substrate of claim 5, wherein the projection of the mounting region on the first substrate layer coincides with the projection of the slit in the first substrate layer. The circuit board substrate of claim 5, wherein the first substrate and the second substrate are rigid substrates or flexible substrates. The circuit board substrate of claim 5, wherein the first grooving, the second grooving and the slit are provided with a rubber material which is easily peeled off after curing. 097114143 Form No. A0101 Page 20 of 30 1003213041-0