JP5057339B2 - Wiring board manufacturing method - Google Patents

Description

  The present invention relates to a method for manufacturing a wiring board used for mounting electronic components such as semiconductor elements.

  Conventionally, there is a build-up wiring board as a high-density wiring board used for mounting electronic components such as semiconductor elements. A typical build-up wiring board has a thickness of about 10 to 100 μm on both sides of a core substrate made of a glass-resin plate having a thickness of about 0.2 to 2.0 mm, where wiring conductors made of copper foil are formed on both sides. Insulating layers made of the above resin and wiring conductors made of a copper plating film having a thickness of about 5 to 50 μm are alternately laminated. However, although such a general build-up wiring board is capable of high-density wiring, since a glass-resin plate having a thickness of about 0.2 to 2.0 mm is used as the core board, the entire wiring board is used. There was a problem that it was difficult to reduce the thickness.

  Therefore, a method of forming a wiring board only with a buildup layer without using a core board has been proposed. As such a method, for example, Patent Document 1 proposes a method of manufacturing a wiring board for a semiconductor device by forming a buildup layer on a metal plate and then etching away the metal plate. According to the method disclosed in Patent Document 1, a semiconductor device mounting surface is flat and a thin wiring substrate can be provided.

  However, in the method described in Patent Document 1, it is necessary to etch away a metal plate that requires a relatively large thickness, and the etching takes a long time. Therefore, there was a problem to be solved that the production efficiency was low.

  Therefore, the applicant of the present application previously described in Japanese Patent Application No. 2007-199651, a metal foil with a support film in which a metal foil is held on a support film via an adhesive layer is laminated on a support substrate made of a cured product of prepreg. After forming a laminate for a wiring board comprising the metal foil, the insulating layer, and the conductor layer by alternately laminating a plurality of insulating layers and conductor layers on the metal foil of the metal foil with a support film. A method of manufacturing a wiring board by separating the laminate from the support film was proposed.

  According to this method, when separating the laminate for a wiring board from the support film, the laminate can be easily separated in a short time without damaging the laminate by simply peeling between the support film and the metal foil. Accordingly, a thin and high-density wiring board can be efficiently manufactured.

  In this method, in order to further increase the manufacturing efficiency of the wiring board, two prepregs for the supporting board are prepared, and two separation films are visually positioned and arranged in a central portion between them. At the same time, a metal foil with a support film is arranged on the outer principal surface of each prepreg, and then the two prepregs are thermoset and integrated by heating them from above and below, thereby integrating the inside of the support substrate. The two separation films are enclosed in a state where they are overlapped with each other, and a metal foil with a support film is laminated on both outer main surfaces of the support substrate, and a laminate for a wiring substrate is simultaneously formed on both sides, and then separated. Cut out the support substrate corresponding to the part where the films overlap and the laminate for the wiring board on it, and separate them between the separation films After, a method for separating a stack of wiring board from the supporting film is employed.

However, in the above-mentioned method, when two separation films are placed between two prepregs for a supporting substrate, the separation films are positioned by visual observation, and the separation films are accurately placed. The separation film is likely to be displaced without being positioned. When the separation film is displaced, the support substrate and the laminate for the wiring substrate thereon may be cut out and may not be satisfactorily separated when separated between the separation films.
Japanese Patent No. 3635219

  An object of the present invention is to satisfactorily separate a support substrate having a laminate for a wiring board formed on both main surfaces and a laminate for the wiring board on the support substrate between separation films arranged in the support substrate. An object of the present invention is to provide a method for manufacturing a wiring board capable of efficiently manufacturing a thin and high-density wiring board.

  The method for manufacturing a wiring board according to the present invention has a rectangular support substrate region set with a first width and a first length at the center, and a rectangular frame-shaped discard outside the support substrate region. First and second prepregs having a proximate region, a first separation film having a second width wider than the first width and a second length shorter than the first length, and the first Providing a second separation film having a third width that is narrower than the width and a third length that is longer than the first length; and the support in the discard margin region in the first and second prepregs At least a pair of first guide holes located opposite to each other in the width direction across the substrate region and at least a pair of second guide holes located opposite to each other in the length direction across the support substrate region. And forming the first separation frame At least a pair of third guide holes corresponding to the first guide holes at both ends in the width direction of the rum and at least corresponding to the second guide holes at both ends in the length direction of the second separation film A step of forming a pair of fourth guide holes; a second guide pin at a position corresponding to the first and third guide holes; and a second position at a position corresponding to the second and fourth guide holes. The first prepreg, the first separation film, the second separation film, and the second prepreg are placed on the laminating jig having a guide pin, and the first and third guides are placed on the first guide pin. After the holes are fitted and the second guide pins are sequentially fitted so that the second and fourth guide holes are fitted, they are stacked and integrated by heating and pressing to form the support substrate region. in The separation region in which the first and second separation films overlap with each other at the second length and the third width, and either the first or second separation film outside the separation region A step of forming a laminate for a support substrate having a joining region in which only one is joined to the cured product of the first and second prepregs, and a region corresponding to the discard margin region from the laminate for the support substrate. By cutting and removing, the step of forming the separation substrate in the central portion and the support substrate with the bonding region remaining outside thereof, and the metal layer and the insulating resin layer are alternately laminated on both sides of the support substrate for wiring A step of forming a laminate for a substrate, and a region corresponding to the joining region is cut and removed from the support substrate and the laminate for a wiring substrate, and then the first and second separation films in the separation region while Separating the cured product of the first prepreg and the laminate for the wiring substrate thereon from the cured product of the second prepreg and the laminate for the wiring substrate thereon, and the first prepreg. Separating the laminate for the wiring board from the cured product and the cured product of the second prepreg.

  According to the method for manufacturing a wiring board of the present invention, guide holes are provided in the first and second prepregs and the first and second separation films for forming the support substrate, and the guide holes are formed in the stacking jig. Thus, the first and second prepregs and the first and second separation films are accurately positioned. Therefore, the support substrate having the laminate for the wiring substrate formed on both main surfaces and the laminate for the wiring substrate on the support substrate can be satisfactorily separated between the separation films arranged in the support substrate. And a high-density wiring board can be efficiently manufactured. Moreover, the length of the first separation film is shorter than the length of the region for the support substrate, and the width of the second separation film is set to be narrower than the width of the region for the support substrate. The separation region where the first and second separation films overlap each other, and only one of the first and second separation films outside the separation region is bonded to the cured product of the first and second prepregs. It is formed so as to have a bonding region. For this reason, separation between the first and second separation films does not occur until a region corresponding to the bonding region is cut and removed after the wiring substrate laminate is formed on both main surfaces of the support substrate.

  Hereinafter, an embodiment of a method for manufacturing a wiring board according to the present invention will be described in detail with reference to FIGS.

  First, as shown in FIG. 1, the first prepreg 1a and the second prepreg 1b to be the support substrate 10, the first separation film 2a and the second separation film 2b sandwiched therebetween, and the support substrate 10 First metal foil 3a with support film and second metal foil 3b with support film, and first metal frame 4a and second metal frame 4b are prepared.

  The prepregs 1a and 1b are for forming the support substrate 10 for supporting the laminate 20 while maintaining the required flatness when the laminate 20 for a wiring board to be described later is manufactured. , And approximately 0.2 to 2.0 mm in thickness, and a substantially rectangular flat plate with a side length of about 400 to 1000 mm. And it has the square support substrate area | region A set by the 1st width W1 and 1st length L1 in the center part, and has the rectangular frame-shaped discard margin area | region B in the outer side. . Examples of the prepregs 1a and 1b include a semi-cured sheet formed by impregnating a woven fabric made of heat-resistant fibers such as glass fibers with a thermosetting resin such as an epoxy resin.

  The separation films 2a and 2b are formed by forming the wiring board laminate 20 on both main surfaces of the support substrate 10, and then separating the support substrate 10 from one main surface side and the other main surface with the separation films 2a and 2b as a boundary. The first separation film 2a has a second width W2 wider than the first width W1 and the first separation film 2a. The second length L2 is shorter than the length L1. The second separation film 2b has a third width W3 that is narrower than the first width W1 and a third length L3 that is longer than the first length L1. The separation films 2a and 2b are preferably made of a metal foil such as a copper foil or a heat resistant film such as a polyethylene terephthalate (PET) film. The thickness of the separation films 2a and 2b is preferably about 1 to 35 μm, for example.

  For example, the metal foils 3a and 3b with support film have a width equal to the third width W3 and a length equal to the second length L2, and the metal foil 11 is adhered to the support film 5 on the adhesive layer ( (Not shown). The support film 5 has a thickness of about 10 to 100 μm and effectively prevents the metal foil 11 from being broken or wrinkled, and facilitates handling of the metal foil 11. The support film 5 is preferably made of a heat resistant resin such as a polyester resin. Specific examples include a polyethylene terephthalate (PET) film.

  The metal foil 11 is for providing a conductor layer that is a starting point in the production of a wiring board. The metal foil 11 is preferably made of a highly conductive metal such as copper (copper foil). As thickness of the metal foil 11, about 1-35 micrometers is mentioned, for example. Thereby, when this metal foil 11 is removed by etching, it can be removed by etching in a short time. Moreover, it is not necessary to remove all the metal foil 11 having such a thickness, and the metal foil 11 can be suitably used as a part of a wiring conductor by etching into a predetermined pattern. On the other hand, when the thickness of the metal foil 11 is thinner than 1 μm, the strength of the metal foil 11 is lowered, and workability when a plurality of insulating layers and conductor layers are alternately laminated on the metal foil 11 may be lowered. If the thickness is larger than 35 μm, the thickness becomes unnecessarily thick, and the time required for etching removal becomes longer, which is not preferable.

  The pressure-sensitive adhesive layer is preferably made of a heat-resistant pressure-sensitive adhesive material such as a silicone resin-based resin, an acrylic resin-based resin, or a polyorganosiloxane resin-based material in order to withstand the heat load applied during the production of the wiring board. The pressure-sensitive adhesive layer has a thickness of about 0.01 to 1.0 μm and an adhesive strength of 1 to 10 N in order to separate from the support film 5 without damaging the wiring board laminate 20 described later. / M is preferable.

  The metal frames 4a and 4b are for use as a charge supply electrode for plating when manufacturing a laminate 20 for a wiring board to be described later, and the outer circumference is the same as that of the prepregs 1a and 1b. Yes, the size of the inner circumference is slightly larger than the metal foils 3a, 3b with support film. Moreover, thickness is about 12-35 micrometers. The metal frames 4a and 4b are preferably made of a highly conductive metal such as copper.

  In the present invention, at least a pair of first guide holes H1 that are opposed to each other in the width direction with the support substrate region A interposed therebetween are formed in the discard margin region B of the prepregs 1a and 1b, and the support substrate region A is sandwiched between them. Then, at least a pair of second guide holes H2 facing in the length direction are formed. The first separation film 2a is formed with third guide holes H3 corresponding to the first guide holes H1 at both ends in the width direction, while the second separation film 2b has a length thereof. A fourth guide hole H4 corresponding to the second guide hole H2 is formed at both ends in the direction. Furthermore, a fifth guide hole H5 corresponding to the first guide hole H1 and a sixth guide hole H6 corresponding to the second guide hole H2 are also formed in the metal frames 4a and 4b. The guide holes H1 to H6 may be formed by using drilling, laser processing, etching processing, or the like.

  Next, as shown in FIG. 2, the first guide pin P1 is provided at a position corresponding to the first guide hole H1, and the second guide pin P2 is provided at a position corresponding to the second guide hole H2. The first metal frame 4a, the first metal foil 3a with a support film, the first prepreg 1a, the first separation film 2a, the second separation film 2b, and the second prepreg are placed on the stacking jig 40 having the first metal frame 4a. 1b, the second metal foil 3b with a support film and the second metal frame 4b, the first guide hole H1, the third guide hole H3 and the fifth guide hole H5 are connected to the first guide pin P1. The second guide hole H2, the fourth guide hole H4, and the sixth guide hole H6 are stacked so as to be fitted to the second guide pin P2, and in this state, they are stacked from above and below. Heat with pressure.

  At this time, the first metal frame 4a, the first prepreg 1a, the first separation film 2a, the second separation film 2b, the second prepreg 1b, and the second metal frame 4b are provided on these. The first guide hole H1 to the sixth guide hole H6 are fitted into at least one of the first guide pin P1 and the second guide pin P2 and accurately positioned. Therefore, the separation films 2a and 2b do not shift as in the prior art.

  And by such heating and pressurization, as shown in FIG. 3, for the support substrate in which the first prepreg 1a, the first separation film 2a, the second separation film 2b, and the second prepreg 1b are integrated. The laminated body 10P is formed, and further, the first metal frame 4a and the first metal foil 3a with the support film and the second metal foil 3b with the support film and the second metal frame 4b are embedded in both main surfaces of the laminate 10P. Is done.

  In addition, in the laminated body 10P for the support substrate, the first separation film 2a and the second separation film 2b are mutually in the center portion of the support substrate region A with the second length L2 and the third width W3. The overlapping separation region C is formed, and only one of the first separation film 2a and the second separation film 2b is formed on the outer side thereof as a cured product of the first prepreg 1a and the second prepreg 1b. A joined region D is formed. In the separation region C, the two separation films 2a and 2b overlap each other and are in close contact with each other, but are not adhered to each other. In the joining region D, the two separation films 2a and 2b do not overlap each other, and only one of them is sandwiched between both the cured product of the first prepreg 1a and the cured product of the second prepreg 1b. It is joined in the state which was made, and it does not peel in the meantime.

  Next, as shown in FIG. 4, by cutting and removing a region corresponding to the disposal margin region B from the laminate 10P in which the metal frames 4a and 4b and the metal foils 3a and 3b with the supporting film are embedded on both main surfaces. Then, the support substrate 10 in which the metal frames 4a and 4b and the metal foils 3a and 3b with the support film are embedded on both main surfaces is formed in a state where the separation region C is left in the center and the bonding region D is left outside. At this time, outside the separation region C, there is a joining region D in which only one of the first separation film 2a and the second separation film 2b is joined to the cured product of the first prepreg 1a and the second prepreg 1b. Since it remains, as will be described later, after forming the wiring board laminate 20 on both main surfaces of the support substrate 10, the first separation film until the region corresponding to the bonding region D is cut off and removed. No separation occurs between 2a and the second separation film 2b. Here, the region corresponding to the disposal margin region B is cut and removed in the disposal margin region B due to the pressure and heating when forming the laminated body 10P, such as the protrusion or deformation of the resin in the disposal margin region B. This is because the portion is removed to adjust the shape of the outer periphery of the support substrate 10 and the support substrate 10 is made to have a predetermined size to facilitate the manufacture of the wiring substrate according to the present invention.

  Next, as shown in FIG. 5, an interlayer insulation layer is formed on the surface of the metal foil 11 and the surfaces of the metal frames 4 a and 4 b laminated on both main surfaces of the support substrate 10 and the exposed main surface of the support substrate 10. One insulating layer 21 is laminated. The first insulating layer 21 is made of an electrically insulating material in which an inorganic insulating filler such as silica or talc is dispersed in a thermosetting resin such as an epoxy resin or a bismaleimide triazine resin. Alternatively, an electrically insulating material in which a glass cloth is impregnated with a thermosetting resin may be used.

  Such a first insulating layer 21 is, for example, an exposed metal obtained by pasting a mixture obtained by dispersing an inorganic insulating filler into an uncured material of a thermosetting resin such as an epoxy resin or a bismaleimide triazine resin. It is formed by applying heat on the surface of the foil 11, the exposed surfaces of the metal frames 4 a and 4 b, and the exposed main surface of the support substrate 10, followed by thermosetting. Moreover, it is not limited to this, For example, what made the said mixture into a film form, and the prepreg which impregnated uncured thermosetting resin to the glass cloth, the surface of the exposed metal foil 11, the exposed metal frame You may form by sticking on the surface of 4a, 4b, and the main surface of the exposed support substrate 10, and making it thermoset.

  Next, a via opening V for exposing a part of the metal foil 11 is formed in the first insulating layer 21. The opening V is formed by, for example, laser processing. Alternatively, the mixture for the first resin layer 21 may be photosensitive, and may be formed by subjecting it to exposure / development processing using a photolithography technique, but is not limited thereto. Absent.

  Next, as shown in FIG. 6, the second conductor layer 12 for the wiring conductor is formed in a predetermined pattern on the surface of the first insulating layer 21 and in the opening V. The second conductor layer 12 is made of, for example, an electroless copper plating film or an electrolytic copper plating film, and is preferably formed by a known semi-additive method. Since the semi-additive method is excellent in fine wiring, it is suitable for efficiently manufacturing a thin and high-density wiring board. Specifically, the surface of the first insulating layer 21 is first roughened as necessary, and then an electroless copper plating film is deposited on the surface to a thickness of about 0.1 to 2.0 μm. Next, a plating resist layer having an opening corresponding to the second conductor layer 12 is formed on the surface of the electroless copper plating film. The plating resist layer has the opening by sticking a photosensitive resin film on the electroless copper plating film and subjecting the resin film to exposure / development processing using a photolithography technique. Formed. Next, an electrolytic copper plating film is deposited to a thickness of about 5 to 40 μm on the electroless copper plating film exposed in the opening of the plating resist layer. At this time, the metal frames 4a and 4b can be used as charge supply electrodes for supplying a charge for electrolytic plating. Thereby, metal frame 4a, 4b and the cathode of an electroplating apparatus can be electrically connected reliably. Next, after peeling off the plating resist layer, the exposed portion of the electroless copper plating film and the electrolytic copper plating film is etched entirely until the electroless copper plating film between the electrolytic copper plating films disappears to form a second The conductor layer 12 is formed.

  After forming the second conductor layer 12 in this way, as shown in FIG. 7, the second to fourth insulating layers for interlayer insulation are formed on the first insulating layer 21 and the second conductor layer 12. 22 to 24 and third to fifth conductor layers 13 to 15 for wiring conductors are alternately formed, and a fifth insulating layer 25 for solder resist is further formed thereon to form a wiring board. The stacked body 20 is formed.

  The second to fourth insulating layers 22 to 24 for interlayer insulation are made of the same electrical insulating material as that of the first insulating layer 21 and can be formed by the same method as that for the first insulating layer 21. Further, the third to fifth conductor layers 13 to 15 for the wiring conductor are composed of an electroless copper plating film and an electrolytic copper plating film similar to the second conductor layer 12, and are similar to the second conductor layer 12. It is preferable to form by a semi-additive method. Further, the fifth insulating layer 25 for solder resist is made of an electrically insulating material in which an inorganic powder filler such as silica or talc is dispersed in about 40 to 70% by mass in an acrylic modified epoxy resin, for example, an acrylic modified epoxy resin or the like. A photosensitive resin paste in which an inorganic insulating filler such as silica or talc is mixed into a mixture of a photosensitive resin and a photopolymerization initiator is screened on the fourth insulating layer 24 and the fifth conductor layer 15. It is applied to a thickness of about 10 to 40 μm by printing, roll coating, etc., and then formed by exposing and developing to a predetermined pattern using a photolithography technique, followed by ultraviolet curing and heat curing. Is preferred.

  Next, as shown in FIG. 8, after cutting and removing the region corresponding to the bonding region D from the support substrate 10 and the laminate 20 for the wiring substrate, the support substrate 10 is separated from the separation film 2a, as shown in FIG. Separate between 2b. At this time, since the first and second separation films 2a and 2b are accurately positioned by the guide holes H3 and H4 and the guide pins P1 and P2 as described above, they overlap each other in the central portion of the support substrate 10. Since the separation region C is accurately formed without shifting and the bonding region D is accurately formed outside without shifting, the region corresponding to the bonding region D can be accurately cut and removed. Therefore, after cutting and removing the bonding region D, the separation substrate in which the support substrate 10 in which the laminate 20 for the wiring substrate is formed on both main surfaces and the laminate 20 for the wiring substrate thereon are arranged in the support substrate 10. 2a and 2b can be favorably separated from each other, and a thin and high-density wiring board can be efficiently manufactured. In addition, since the separation films 2a and 2b in the separation region C are not bonded to each other, if the outer joining region D is cut and removed, both are easily separated. The cutting method is arbitrary as long as the effect of the present invention is not hindered. For example, the cutting may be performed using a dicing or a router device.

  Next, as shown in FIG. 10, the cut laminate 20 is separated from the support film 5. At the time of this separation, the metal foil 11 is only held on the support film 5 via an adhesive layer (not shown), and therefore, the laminate 20 is damaged only by peeling between the support film 5 and the metal foil 11. And can be easily separated.

  Next, as shown in FIG. 11, an etching process for etching the metal foil (first conductor layer) 11 into a predetermined pattern is performed to form a wiring conductor (pad for external connection) on the surface of the first insulating layer 21. Form. In order to etch the metal foil 11 into a predetermined pattern, for example, an etching resist layer having a shape corresponding to the wiring conductor is formed on the surface of the metal foil 11, and the metal foil 11 exposed from the etching resist layer is removed by etching. Good. The etching resist layer has a shape corresponding to the wiring conductor by sticking a photosensitive resin film on the metal foil 11 and subjecting the resin film to exposure / development processing using a photolithography technique. After the metal foil 11 is etched, it is peeled off.

  Finally, as shown in FIG. 12, a sixth insulating layer 26 for solder resist is formed on the surfaces of the etched metal foil 11 and the first insulating layer 21 to obtain the wiring board 30 according to the present embodiment. . Note that the sixth insulating layer 26 for solder resist is made of the same material as the fifth insulating layer 25 and is formed by the same method as the fifth insulating layer 25. Thus, according to the method for manufacturing a wiring board of the present invention, it is possible to provide a method for manufacturing a wiring board capable of efficiently manufacturing a thin and high-density wiring board. It should be noted that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention.

It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on one Embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on one Embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on one Embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on one Embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on one Embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on one Embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on one Embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on one Embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on one Embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on one Embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on one Embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on one Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1a 1st prepreg 1b 2nd prepreg 2a 1st isolation | separation film 2b 2nd isolation | separation film 10 Support substrate 10P The laminated body for support substrates 20 The laminated body for wiring substrates 30 The wiring substrate 40 Lamination jig A A For support substrates Area B Discard allowance area C Separating area D Joining area H1 First guide hole H2 Second guide hole H3 Third guide hole H4 Fourth guide hole L1 First length L2 Second length L3 Second 3 length P1 first guide pin P2 second guide pin W1 first width W2 second width W3 third width

Claims (1)

  First and second having a rectangular support substrate region set with a first width and a first length in the center and a rectangular frame-shaped discard margin region outside the support substrate region A prepreg; a first separation film having a second width wider than the first width and a second length shorter than the first length; a third width narrower than the first width; A step of preparing a second separation film having a third length longer than the length of 1, and in the width direction with the support substrate region sandwiched between the discard margin regions in the first and second prepregs At least a pair of first guide holes positioned opposite to each other and at least a pair of second guide holes positioned facing each other in the length direction across the support substrate region, and the first separation film At both ends in the width direction of At least a pair of third guide holes corresponding to the first guide holes and at least a pair of fourth guide holes corresponding to the second guide holes at both ends in the length direction of the second separation film. And a stacking jig having a first guide pin at a position corresponding to the first and third guide holes and a second guide pin at a position corresponding to the second and fourth guide holes. The first prepreg, the first separation film, the second separation film, and the second prepreg are fitted into the first guide pin and the first and third guide holes are fitted to the first prepreg, the second separation film, and the second prepreg. After the second and fourth guide holes are sequentially stacked so that the second guide pins are fitted, the second guide pins are stacked and integrated by heating and pressing, and the second guide pins are formed in the central portion of the support substrate region. Length and said The separation region where the first and second separation films overlap each other with a width of 3 and only one of the first and second separation films outside the separation region is the first and second prepregs. A step of forming a laminate for a support substrate having a bonding region bonded to the cured product, and cutting and removing a region corresponding to the discard margin region from the laminate for the support substrate, thereby separating the separation into a central portion. A step of forming a support substrate having a bonding region remaining on the outer region and a bonding region, a step of alternately stacking a conductor layer and an insulating layer on both sides of the support substrate to form a laminate for a wiring substrate, After cutting and removing the region corresponding to the bonding region from the support substrate and the laminate for the wiring substrate, the cured product of the first prepreg and the first and second separation films in the separation region Separating the laminate for the wiring substrate thereon and the cured product of the second prepreg and the laminate for the wiring substrate thereon, and the cured product of the first prepreg and of the second prepreg And a step of separating the laminate for the wiring board from the cured product.

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