CN112040673B - Circuit board manufacturing method - Google Patents
Circuit board manufacturing method Download PDFInfo
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- CN112040673B CN112040673B CN202010504074.4A CN202010504074A CN112040673B CN 112040673 B CN112040673 B CN 112040673B CN 202010504074 A CN202010504074 A CN 202010504074A CN 112040673 B CN112040673 B CN 112040673B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to the technical field of circuit board manufacturing, and provides a circuit board manufacturing method which comprises the steps of material preparation, primary positioning preparation, heat conduction embedding, fine positioning preparation, press connection and film tearing forming, wherein in the primary positioning preparation step, a primary positioning protective film is attached to the lower base surface of an Mth core plate; in the heat conduction embedding step, embedding the heat conduction block into the heat conduction accommodating groove, and adhering the lower surface of the heat conduction block with the primary positioning protective film so as to enable the lower surface of the heat conduction block to be flush with the lower base surface of the Mth core plate; in the fine positioning preparation step, fine positioning protective films are attached to the upper base surface of the 1 st core plate and the upper surfaces of the heat conduction blocks, and the upper surfaces of the heat conduction blocks are arranged in parallel with the upper base surface of the 1 st core plate. By adopting the method, the risk of open circuit of the circuits manufactured on the upper surface and the lower surface of the interconnection substrate can be reduced; the risk of cracking at the glue filling position between the heat conduction block and the substrate can be reduced; the overflow condition of the upper surface and the lower surface of the interconnection substrate can be improved.
Description
Technical Field
The invention belongs to the technical field of circuit board manufacturing, and particularly relates to a circuit board manufacturing method.
Background
In related industries, aluminum nitride with high thermal conductivity and thermal shock resistance is embedded in a circuit board to meet the high heat dissipation requirement of the circuit board. In the conventional process, aluminum nitride is embedded into a substrate, and then pressed, and then a circuit is formed on the surfaces of the substrate and the aluminum nitride, however, the following problems are inevitably caused:
1) the surface of the aluminum nitride and the surface of the substrate are poor in flatness, so that the formed circuit is easy to open;
2) the glue filling between the aluminum nitride and the substrate is not uniform, and the cracking phenomenon is easy to occur;
3) and the surface of the aluminum nitride is easy to generate glue overflow.
Therefore, the circuit board manufacturing yield of the traditional circuit board manufacturing process is generally low.
Disclosure of Invention
The embodiment of the invention aims to provide a circuit board manufacturing method to solve the technical problems that in the prior art, the levelness of the surface of aluminum nitride and the surface of a substrate is poor, the glue filling position between the aluminum nitride and the substrate is easy to crack, and the glue overflowing condition is easy to occur on the surface of the aluminum nitride.
In order to achieve the purpose, the invention adopts the technical scheme that: a method of manufacturing a circuit board, comprising the steps of:
preparing a material, preparing a heat-conducting block, and preparing a 1 st core plate and a 2 nd core plate … … Mth core plate which are sequentially stacked from top to bottom, wherein M is more than or equal to 2, wherein a heat-conducting accommodating groove which is arranged by penetrating through the upper base surface of the 1 st core plate to the lower base surface of the Mth core plate and is used for accommodating the heat-conducting block is formed in the upper base surface of the 1 st core plate;
preliminary positioning preparation, namely attaching a preliminary positioning protective film to the lower base surface of the Mth core plate;
the heat conduction embedding is carried out, the heat conduction block is embedded into the heat conduction accommodating groove, and the lower surface of the heat conduction block is adhered to the primary positioning protective film, so that the lower surface of the heat conduction block is flush with the lower base surface of the Mth core plate;
a fine positioning preparation step, namely attaching a fine positioning protective film to the upper base surface of the 1 st core plate and the upper surface of the heat conduction block, and enabling the upper surface of the heat conduction block to be flush with the upper base surface of the 1 st core plate;
pressing and connecting, namely pressing and connecting the fine positioning protective film, the 1 st core board, the 2 nd core board … …, the Mth core board and the initial positioning protective film together to enable the 1 st core board, the 2 nd core board … … and the Mth core board to be in compression joint;
and (3) forming a tear film, namely tearing off the fine positioning protective film from the upper base surface of the 1 st core plate, and tearing off the primary positioning protective film from the lower base surface of the M core plate to obtain the interconnection substrate.
In one embodiment, after the tear film forming step, the circuit board manufacturing method further includes the steps of:
and milling an edge and grinding the board, namely performing target milling on the interconnection substrate, and then performing board grinding treatment on the interconnection substrate, wherein the upper base surface and the lower base surface of the interconnection substrate are subjected to board grinding treatment through non-woven fabrics.
In one embodiment, after the edge milling and board grinding step, the circuit board manufacturing method further includes the steps of:
and manufacturing a secondary outer layer circuit, namely manufacturing the secondary outer layer circuit on the upper base surface and the lower base surface of the interconnection substrate respectively, and manufacturing at least one bonding pad in the area corresponding to the upper surface and the lower surface of the heat conduction block respectively.
In one embodiment, after the step of fabricating the sub-outer layer circuit, the method of manufacturing a circuit board further includes the steps of:
and then pressing and molding, namely, overlapping an upper copper foil on the upper side of the interconnection substrate, overlapping a lower copper foil on the lower side of the interconnection substrate, and pressing the upper copper foil, the interconnection substrate and the lower copper foil together so as to enable the upper copper foil, the interconnection substrate and the lower copper foil to be pressed and connected.
In one embodiment, the heat conducting block is aluminum nitride having a titanium layer, and after the step of fabricating the sub-outer layer circuit and before the step of re-press-molding, the method for manufacturing a wiring board further comprises the steps of:
and removing the titanium layer to make the bonding pads not conductive mutually.
In one embodiment, after the step of re-press-molding, the method for manufacturing a wiring board further comprises the steps of:
manufacturing an outer layer circuit, namely manufacturing the outer layer circuit on the upper surface of the upper copper foil and the lower surface of the lower copper foil respectively;
laser drilling, namely forming at least one upper opening window which is aligned with the bonding pad on the upper surface of the heat conducting block up and down on the upper surface of the upper copper foil, forming at least one lower opening window which is aligned with the bonding pad on the lower surface of the heat conducting block up and down on the lower surface of the lower copper foil, forming an upper communication hole which is communicated with the bonding pad aligned with the upper opening window in each upper opening window, and forming a lower communication hole which is communicated with the bonding pad aligned with the lower opening window in each lower opening window;
and filling electroplating holes, wherein each upper communication hole and each lower communication hole are filled by electroplating, so that the outer layer circuit on the upper surface of the upper copper foil is conducted with each pad on the upper surface of the heat conducting block through each upper communication hole, and the outer layer circuit on the lower surface of the lower copper foil is conducted with each pad on the lower surface of the heat conducting block through each lower communication hole.
In one embodiment, the cross section of the upper opening window is circular, and the radial dimension of the upper opening window is 0.15 +/-0.015 mm;
the cross section of the lower opening window is circular, and the radial dimension of the lower opening window is 0.15 +/-0.015 mm.
In one embodiment, the upper copper foil has a thickness of 1/2OZ or 1/3OZ, and the lower copper foil has a thickness of 1/2OZ or 1/3 OZ.
In one embodiment, the distance between the heat conducting block and any groove wall of the heat conducting accommodating groove is 0.1 ± 0.05 mm.
In one embodiment, the copper thickness of the upper base surface of the 1 st core plate is 1/2OZ or 1OZ, and the copper thickness of the lower base surface of the mth core plate is 1/2OZ or 1 OZ.
The invention has the following beneficial effects:
according to the circuit board manufacturing method provided by the embodiment of the invention, the primary positioning protective film is attached to the lower base surface of the Mth core plate, and then the heat conduction block with high heat conductivity is embedded into the heat conduction accommodating groove so as to position the lower surface of the heat conduction block through the primary positioning protective film, so that the heat conduction block can be limited from falling out of the heat conduction accommodating groove, and the levelness of the lower surface of the heat conduction block and the lower base surface of the Mth core plate can be ensured and improved; then, attaching a fine positioning protective film to the upper base surface of the 1 st core plate and the upper surface of the heat conduction block so as to further position the upper surface of the heat conduction block through the fine positioning protective film, thereby not only ensuring the stability of the position relationship between the heat conduction block and the heat conduction accommodating groove, but also ensuring and improving the levelness of the upper surface of the heat conduction block and the upper base surface of the 1 st core plate; and then, carrying out a press fit connection step, wherein the arrangement of the primary positioning protective film and the fine positioning protective film can effectively improve the glue filling uniformity of the resin filled between the heat conduction block and the heat conduction accommodating groove, avoid the cracking phenomenon at the glue filling position, and effectively prevent the resin from overflowing to the upper surface or the lower surface of the heat conduction block, namely, the glue overflowing phenomenon can be improved.
Therefore, based on the circuit board manufacturing method provided by the embodiment of the invention, the levelness of the upper surface of the heat conduction block and the upper surface of the interconnection substrate and the levelness of the lower surface of the heat conduction block and the lower surface of the interconnection substrate are both better, and if a circuit is manufactured on the upper surface or the lower surface of the interconnection substrate, the risk of an open circuit phenomenon is lower; the glue filling between the heat conduction block and the substrate can be uniform, and the risk of cracking at the glue filling position is effectively reduced; the overflow condition of the upper surface or the lower surface of the interconnection substrate can be effectively improved. Thereby effectively ensuring and improving the manufacturing yield of the circuit board.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a flow chart of a circuit board manufacturing method according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a precise positioning protective film, a 1 st core board, an mth core board, a heat conduction block, and an initial positioning protective film, which are provided before a press-fit connection step and have M equal to 2 according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of an interconnect substrate, upper copper foil and lower copper foil prior to a laser drilling step according to an embodiment of the present invention;
fig. 4 is a schematic cross-sectional view of an interconnect substrate, upper copper foil and lower copper foil after a laser drilling step according to an embodiment of the present invention.
Wherein, in the figures, the respective reference numerals:
10-interconnect substrate, 100-1 st core board, 200-mth core board, 102-heat conducting accommodating tank, 300-prepreg; 400-a heat conducting block; 500-primary positioning protective film, 600-fine positioning protective film; 700-upper copper foil, 701-upper communication hole, 800-lower copper foil, 802-lower communication hole.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The following describes a specific implementation of the present invention in more detail with reference to specific embodiments:
referring to fig. 1, fig. 2, and fig. 3, an embodiment of the present invention provides a method for manufacturing a circuit board, where the method for manufacturing a circuit board includes steps of material preparation, preliminary positioning preparation, heat conduction embedding, fine positioning preparation, press-fit connection, and film tearing and forming.
In the material preparation step, the heat conducting block 400 is prepared, and the 1 st core plate 100 and the 2 nd core plate … … mth core plate 200 are sequentially stacked from top to bottom, where M is greater than or equal to 2, and the upper base surface of the 1 st core plate 100 is provided with the heat conducting accommodating groove 102 which is arranged to penetrate through the lower base surface of the mth core plate 200 and is used for accommodating the heat conducting block 400.
It should be noted that the heat conduction block 400 has high heat conduction performance and thermal shock resistance, and the heat conduction block 400 may be a ceramic block such as aluminum nitride or aluminum oxide. In the prepared 1 st core board 100 and 2 nd core board … …, except for the upper base surface of the 1 st core board 100 and the lower base surface of the M th core board 200, the inner layer circuits are prepared on the other upper and lower base surfaces of the 1 st core board 100 and 2 nd core board … … of the M th core board 200 in advance, for example, as shown in fig. 2, when M is 2, the inner layer circuits are prepared on the lower base surface of the 1 st core board 100 and the upper base surface of the M th core board 200 when the material is prepared.
Optionally, the copper thicknesses of the upper base and the lower base of the M-1 core board of the 2 nd core board … …, the lower base of the 1 st core board 100, and the upper base of the M-1 core board 200 are all 1/2OZ or all 1OZ, so that the consistency of the precision of the inner layer circuit on each base can be ensured and improved, and the quality of the inner layer circuit can be further improved.
In addition, in the material preparation step, at least one prepreg 300 is further stacked between the 1 st core board 100 and the 2 nd core board, and between the 2 nd core board and the 3 rd core board … … M-1 st core board and the M-1 rd core board 200, respectively, and the prepreg 300 is used for adhering the core boards at both sides thereof in the press-fit connection step, and can be in a molten state to fill areas such as holes, grooves, gaps, and copper-free areas. The number and unit thickness of the prepregs 300 stacked between the two core boards may be designed according to the needs of glue filling and board thickness, which is not limited in this embodiment. Illustratively, as shown in fig. 2, when M is 2, 2 prepregs 300 are stacked between the 1 st core board 100 and the 2 nd core board.
It should be noted that, when preparing the 1 st core plate 100, the 1 st core plate 100 is provided with the 1 st receiving sub-slot; when preparing the 2 nd core board, the 2 nd core board is opened with the 2 nd accommodating sub-groove … …, when preparing the M th core board 200, the M th core board 200 is opened with the M th accommodating sub-groove, and each semi-solid piece 300 stacked therebetween is also opened with a corresponding semi-solid accommodating sub-groove. When the 1 st core plate 100 and the 2 nd core plate … … are stacked in sequence from top to bottom, the 1 st accommodating sub-slot, the 2 nd accommodating sub-slot … … M accommodating sub-slot, and each half-solid accommodating sub-slot are aligned in the vertical direction and form the heat conducting accommodating slot 102 together. The heat-conducting receiving groove 102 has a sectional size slightly larger than that of the heat-conducting block 400, and the heat-conducting receiving groove 102 can be used to receive the heat-conducting block 400.
In the preliminary positioning preparation step, a preliminary positioning protective film 500 is attached to the lower base surface of the mth core board 200; in the heat conduction embedding step, the heat conduction block 400 is embedded into the heat conduction accommodating groove 102, and the lower surface of the heat conduction block 400 is adhered to the primary positioning protective film 500, so that the lower surface of the heat conduction block 400 is flush with the lower base surface of the mth core board 200.
It should be noted that the primary positioning protection film 500 may be, but not limited to, a high-viscosity metal-based protection film capable of resisting a high temperature of 300 ℃, and when the primary positioning protection film 500 is attached to the lower base surface of the mth core board 200, the adhesive side of the primary positioning protection film 500 covers the lower notch of the heat conducting receiving groove 102. On this basis, with heat conduction piece 400 embedment to heat conduction holding tank 102, and press heat conduction piece 400 downwards, until the lower surface of heat conduction piece 400 completely with the first location protection film 500 adhesion of the lower notch department of heat conduction holding tank 102, afterwards, operating personnel can take gloves to touch the lower surface of heat conduction piece 400 and whether have obvious perk and off normal condition in order to inspect, if have, need in time adjust heat conduction piece 400, set up with the lower base plane parallel and level of ensureing the lower surface of heat conduction piece 400 and Mth core board 200. Therefore, based on the setting of preliminary positioning protection film 500, on the one hand, can avoid heat conduction piece 400 to drop out heat conduction holding tank 102 through the lower notch of heat conduction holding tank 102, thereby can guarantee heat conduction piece 400 and the mutual cooperation relation of heat conduction holding tank 102, on the other hand, still can do benefit to the parallel and level degree of the lower surface of guarantee heat conduction piece 400 and the lower base plane of Mth core board 200, thereby can do benefit to follow-up lower surface at heat conduction piece 400 and the lower base plane preparation of Mth core board 200 not open a way, qualified circuit.
It should be noted that, after the material preparation step and before the initial positioning preparation step, the circuit board manufacturing method further includes a riveting step, in the riveting step, the 1 st core board 100, the 2 nd core board … … M-th core board 200 and the semi-cured sheets 300 therebetween, which are sequentially stacked from top to bottom, are riveted at a time by an eight-axis riveting machine, so that the alignment accuracy of the 1 st core board 100, the 2 nd core board … … M-th core board 200 and the semi-cured sheets 300 therebetween can be ensured and improved, thereby being beneficial to further improving the manufacturing yield.
In the fine positioning preparation step, a fine positioning protective film 600 is attached to the upper base surface of the 1 st core board 100 and the upper surfaces of the heat-conducting blocks 400, and the upper surfaces of the heat-conducting blocks 400 are arranged flush with the upper base surface of the 1 st core board 100.
It should be noted that, the fine positioning protection film 600 may be, but is not limited to, a high-viscosity metal-based protection film capable of resisting a high temperature of 300 ℃, and when the fine positioning protection film 600 is attached to the upper base surface of the 1 st core board 100, the adhesive side of the fine positioning protection film 600 covers the upper notch of the heat conducting accommodating groove 102 and is adhered to the upper surface of the heat conducting block 400. Therefore, through the arrangement of the fine positioning protective film 600, on one hand, the heat conduction block 400 can be further limited from being released from the matching relation with the heat conduction accommodating groove 102 through the upper notch of the heat conduction accommodating groove 102, and can act together with the primary positioning protective film 500, so that the heat conduction block 400 is fixedly arranged relative to the heat conduction accommodating groove 102, thereby being beneficial to maintaining the state stability of the heat conduction block 400 in the subsequent press-fit connection step, avoiding the heat conduction block 400 from shaking, and further being beneficial to improving the manufacturing yield; on the other hand, the leveling degree of the upper surface of the heat-conducting block 400 and the upper base surface of the 1 st core board 100 can be guaranteed, so that the subsequent manufacturing of non-open and qualified circuits on the upper surface of the heat-conducting block 400 and the upper base surface of the 1 st core board 100 can be facilitated.
In the press-bonding step, the fine positioning protective film 600, the 1 st core board 100, the 2 nd core board … …, the mth core board 200 and the preliminary positioning protective film 500 are collectively press-bonded, so that the 1 st core board 100, the 2 nd core board … … and the mth core board 200 are press-bonded.
It should be noted that, in the process of collectively pressing the fine positioning protective film 600, the 1 st core board 100, the 2 nd core board … …, the mth core board 200 and the preliminary positioning protective film 500, the semi-cured sheets 300 therebetween are transformed into a molten state, and each semi-cured sheet 300 not only can enable the 1 st core board 100, the 2 nd core board … … and the mth core board 200 to be sequentially pressed, but also can fill the gap between the heat conducting accommodating groove 102 and the heat conducting block 400. In the process of filling the gap between the heat-conducting accommodating groove 102 and the heat-conducting block 400, the resin will not overflow to the upper surface of the heat-conducting block 400 because the fine positioning protective film 600 covers the upper notch of the heat-conducting accommodating groove 102 and is adhered to the upper surface of the heat-conducting block 400; similarly, since the primary positioning protective film 500 covers the lower notch of the heat conducting accommodating groove 102 and is adhered to the lower surface of the heat conducting block 400, the resin will not overflow to the lower surface of the heat conducting block 400; because of the fixed setting of heat conduction holding tank 102 relatively of heat conduction piece 400 under the combined action of smart location protection film 600 and primary location protection film 500, the resin can evenly fill the gap between heat conduction holding tank 102 and the heat conduction piece 400, and can not rock and lead to the filler phenomenon to appear in the department of glue filling because of heat conduction piece 400 in the solidification process. Therefore, based on the arrangement of the fine positioning protection film 600 and the preliminary positioning protection film 500, the filling condition of the gap between the heat-conducting accommodating groove 102 and the heat-conducting block 400 can be effectively improved in the press-fit connection step, especially the filling uniformity of the resin filled between the heat-conducting block 400 and the heat-conducting accommodating groove 102 can be improved, especially the cracking phenomenon at the filling position can be avoided, and especially the resin can be effectively prevented from overflowing to the upper surface and the lower surface of the heat-conducting block 400.
In the tear film forming step, the fine positioning protective film 600 is torn from the upper base surface of the 1 st core board 100, and the preliminary positioning protective film 500 is torn from the lower base surface of the M-th core board 200, to obtain the interconnect substrate 10.
It should be noted that after the 1 st core board 100, the 2 nd core board … … and the M-th core board 200 are pressed and bonded, and the gap between the heat conducting accommodating groove 102 and the heat conducting block 400 is filled with glue, the fine positioning protective film 600 is peeled from the upper base surface of the 1 st core board 100, and the primary positioning protective film 500 is peeled from the lower base surface of the M-th core board 200, so as to facilitate subsequent processes such as circuit manufacturing on the upper base surface and the lower base surface of the interconnection substrate 10. When the primary positioning protective film 500 and the fine positioning protective film 600 are torn off, the film should be torn off from the corners, the board surface should be pressed by one hand, and the primary positioning protective film 500 and the fine positioning protective film 600 are slowly torn off by one hand, so that the crack phenomenon at the glue filling position where the heat conduction block 400 is embedded is further prevented.
In summary, in the circuit board manufacturing method according to the embodiment of the present invention, the primary positioning protective film 500 is attached to the lower base surface of the mth core board 200, and then the heat conduction block 400 with high thermal conductivity is embedded into the heat conduction accommodation groove 102, so as to position the lower surface of the heat conduction block 400 through the primary positioning protective film 500, thereby not only preventing the heat conduction block 400 from falling out of the heat conduction accommodation groove 102, but also ensuring and improving the flatness between the lower surface of the heat conduction block 400 and the lower base surface of the mth core board 200; then, attaching a fine positioning protective film 600 to the upper base surface of the 1 st core plate 100 and the upper surface of the heat conduction block 400, so as to further position the upper surface of the heat conduction block 400 through the fine positioning protective film 600, thereby not only ensuring the stability of the position relationship between the heat conduction block 400 and the heat conduction accommodating groove 102, but also ensuring and improving the levelness of the upper surface of the heat conduction block 400 and the upper base surface of the 1 st core plate 100; and then, performing a press-fit connection step, wherein in the step, the arrangement of the primary positioning protective film 500 and the fine positioning protective film 600 can effectively improve the glue filling uniformity of the resin filled between the heat conduction block 400 and the heat conduction accommodating groove 102, avoid the cracking phenomenon at the glue filling position, and effectively prevent the resin from overflowing to the upper surface or the lower surface of the heat conduction block 400, i.e. improve the glue overflowing phenomenon.
Therefore, based on the circuit board manufacturing method provided by the embodiment of the present invention, the flatness between the upper surface of the heat conduction block 400 and the upper surface of the interconnection substrate 10 and the flatness between the lower surface of the heat conduction block 400 and the lower surface of the interconnection substrate 10 are both good, and if a circuit is fabricated on the upper surface or the lower surface of the interconnection substrate 10, the risk of an open circuit phenomenon is low; the glue filling between the heat conduction block 400 and the substrate can be uniform, and the risk of cracking at the glue filling position is effectively reduced; the overflow condition of the upper surface or the lower surface of the interconnection substrate 10 can be effectively improved. Thereby effectively ensuring and improving the manufacturing yield of the circuit board.
Referring to fig. 1, 2, and 3, in the present embodiment, after the step of forming the tear film, the method for manufacturing a circuit board further includes a step of milling an edge and grinding the board, in the step of milling the edge and grinding the board, the interconnection substrate 10 is first subjected to target edge milling, and then the interconnection substrate 10 is subjected to board grinding, wherein the upper base surface and the lower base surface of the interconnection substrate 10 are subjected to board grinding through the non-woven fabric.
It should be noted that, by performing target milling on the interconnect substrate 10 and then performing board grinding on the interconnect substrate 10, the resin overflowing to the upper surface and the lower surface of the heat conduction block 400 can be further removed, and the flatness of the upper surface and the lower surface of the interconnect substrate 10 can be further improved, so as to facilitate the subsequent fabrication of non-open-circuit and qualified circuits on the upper surface and the lower surface of the interconnect substrate 10, thereby further ensuring and improving the manufacturing yield of the circuit board. Because the heat-conducting block 400 (especially aluminum nitride) has high rigidity, the upper base surface and the lower base surface of the interconnection substrate 10 are subjected to plate grinding treatment through the non-woven fabric, and the upper base surface and the lower base surface of the interconnection substrate 10 are not subjected to plate grinding treatment through a ceramic or abrasive belt grinding plate, so that the cracking phenomenon at the glue filling position between the heat-conducting block 400 and the substrate can be further avoided, and the manufacturing yield of the circuit board can be further ensured and improved.
Referring to fig. 1, 2, and 3, in the present embodiment, after the edge milling and board grinding step, the method for manufacturing a circuit board further includes a sub-outer-layer circuit manufacturing step, in which sub-outer-layer circuits are respectively manufactured on the upper base surface and the lower base surface of the interconnection substrate 10, and at least one pad is respectively manufactured in the regions corresponding to the upper surface and the lower surface of the heat conducting block 400.
It should be noted here that, a dry film is attached to the upper base surface of the interconnect substrate 10, the upper base surface of the interconnect substrate 10 is subjected to pattern transfer by exposure, then a film for protecting a copper conductor without polymerization reaction is developed by development, then the copper conductor without film protection is etched by an acidic etching solution, and finally the film for protecting the copper conductor is removed by a film removing solution, so that the fabrication of the sub-outer layer circuit on the upper base surface of the interconnect substrate 10 can be completed, similarly, the sub-outer layer circuit is fabricated on the lower base surface of the interconnect substrate 10, and similarly, at least one PAD (copper PAD) is fabricated in the region corresponding to the upper surface and the lower surface of the heat conducting block 400. By adopting the scheme, qualified secondary outer layer circuits which are not open-circuited can be respectively manufactured on the upper base surface of the interconnection substrate 10 and the lower base surface of the interconnection substrate 10, so that the manufacturing yield of the circuit board can be further ensured and improved.
Referring to fig. 1 and 3, in the present embodiment, after the sub-outer layer circuit manufacturing step, the circuit board manufacturing method further includes a re-press molding step, in which an upper copper foil 700 is stacked on the upper side of the interconnection substrate 10, a lower copper foil 800 is stacked on the lower side of the interconnection substrate 10, and the upper copper foil 700, the interconnection substrate 10 and the lower copper foil 800 are pressed together, so that the upper copper foil 700, the interconnection substrate 10 and the lower copper foil 800 are pressed together.
After the second outer layer circuit is manufactured, the upper copper foil 700 is stacked on the upper side of the interconnection substrate 10, at least one prepreg 300 is stacked between the upper side of the interconnection substrate 10 and the upper copper foil 700, the lower copper foil 800 is stacked on the lower side of the interconnection substrate 10, at least one prepreg 300 is stacked between the lower side of the interconnection substrate 10 and the lower copper foil 800, and the stacked whole is pressed for the second time, so that the upper copper foil 700, the interconnection substrate 10 and the lower copper foil 800 are pressed and connected. By adopting the scheme, the multilayer semi-finished plate embedded with the heat conduction block 400 can be manufactured, the manufacturing yield of the multilayer semi-finished plate is higher, the heat dissipation performance is better, and double-sided heat conduction can be realized.
Referring to fig. 1, 2 and 3, in the present embodiment, the heat conduction block 400 is aluminum nitride having a titanium layer, and after the next outer layer circuit manufacturing step and before the re-press molding step, the circuit board manufacturing method further includes a titanium removal processing step, in which the titanium layer is removed to make the pads not conductive.
It should be noted that, when the heat conduction block 400 is aluminum nitride, the aluminum nitride itself contains a titanium layer, and the titanium layer is a conductor, and therefore, the titanium layer of the aluminum nitride can be removed through the titanium removing step, so as to keep the PADs (copper PADs) on the aluminum nitride in an open circuit state, thereby effectively reducing the risk of short circuit, and further ensuring and improving the manufacturing yield of the circuit board.
Referring to fig. 1, 3 and 4, in the present embodiment, after the step of pressing and forming, the method for manufacturing a circuit board further includes steps of outer layer circuit manufacturing, laser drilling and electroplating hole filling.
In the outer layer circuit fabrication step, outer layer circuits are fabricated on the upper surface of the upper copper foil 700 and the lower surface of the lower copper foil 800, respectively.
It should be noted that, firstly, a dry film is attached to the upper surface of the upper copper foil 700, then, the upper surface of the upper copper foil 700 is subjected to pattern transfer through exposure, then, a film for protecting a copper conductor without polymerization reaction is developed through development, then, the copper conductor without film protection is etched through an acidic etching solution, and finally, the film for protecting the copper conductor is removed through a film removing solution, so that the outer layer circuit manufacturing can be completed on the upper surface of the upper copper foil 700, and similarly, the outer layer circuit is manufactured on the lower surface of the lower copper foil 800. By adopting the scheme, qualified outer layer circuits can be respectively manufactured on the upper surface of the upper copper foil 700 and the lower surface of the lower copper foil 800, so that the manufacturing yield of the circuit board can be further ensured and improved.
In the laser drilling step, firstly, forming at least one upper opening window which is aligned with the bonding pad on the upper surface of the heat conducting block 400 up and down on the upper surface of the upper copper foil 700, forming at least one lower opening window which is aligned with the bonding pad on the lower surface of the heat conducting block 400 up and down on the lower surface of the lower copper foil 800, forming an upper communication hole 701 which is communicated with the bonding pad aligned with the upper opening window in each upper opening window, and forming a lower communication hole 802 which is communicated with the bonding pad aligned with the lower opening window in each lower opening window; in the plating filling step, the upper via holes 701 and the lower via holes 802 are filled by plating so that the outer layer wiring on the upper surface of the upper copper foil 700 is electrically connected to the pads on the upper surface of the heat conduction block 400 via the upper via holes 701, and the outer layer wiring on the lower surface of the lower copper foil 800 is electrically connected to the pads on the lower surface of the heat conduction block 400 via the lower via holes 802.
It should be noted that each of the upper windows is respectively aligned with each PAD (copper PAD) on the upper surface of the heat-conducting block 400 one by one, that is, any PAD (copper PAD) on the upper surface of the heat-conducting block 400 has one corresponding upper window, and the upper copper foil 700 at the position corresponding to the upper window is etched to expose the prepreg 300 in this area, so that, through the arrangement of each upper window, the laser is facilitated to rapidly punch through the prepreg 300 between the upper copper foil 700 and the upper base surface of the interconnection substrate 10 in the upper window to form the upper communication hole 701 aligned with the PAD (copper PAD) accurately and communicated between the upper copper foil 700 and the PAD (copper PAD), that is, through the arrangement of the upper window, the open position of the upper communication hole 701 can be restricted to ensure and improve the alignment precision of the upper communication hole 701 and the PAD (copper PAD), and the aperture of the upper communication hole 701 can be restricted, so that the hole diameter of the upper communication hole 701 is moderate. Accordingly, after the plating filling of the upper via hole 701 is completed, the outer layer wiring on the upper surface of the upper copper foil 700 and the PAD (copper PAD) corresponding to the upper via hole 701 can be effectively and stably electrically connected through the upper via hole 701, and thus the manufacturing yield of the wiring board can be further ensured and improved.
Similarly, each lower opening window is respectively aligned with each PAD (copper PAD) on the lower surface of the heat conducting block 400 one by one, that is, any PAD (copper PAD) on the lower surface of the heat conducting block 400 has one corresponding lower opening window, and the lower copper foil 800 at the corresponding position of the lower opening window is etched to expose the prepreg 300 in the area, so that, through the arrangement of each lower opening window, laser can rapidly penetrate the prepreg 300 between the lower copper foil 800 and the lower base surface of the interconnection substrate 10 in the lower opening window to form the lower communication hole 802 which is aligned with the PAD (copper PAD) accurately and is communicated between the lower copper foil 800 and the PAD (copper PAD), that is, through the arrangement of the lower opening window, the position of the lower communication hole 802 can be restricted to ensure and improve the alignment precision of the lower communication hole 802 and the PAD (copper PAD), and the aperture of the lower communication hole 802 can be restricted, so that the hole diameter of the lower communication hole 802 is moderate. Accordingly, after the plating filling of the lower via hole 802 is completed, the outer layer wiring on the lower surface of the lower copper foil 800 and the PAD (copper PAD) corresponding to the lower via hole 802 can be effectively and stably conducted through the lower via hole 802, thereby further ensuring and improving the production yield of the wiring board.
Optionally, the heat conducting receiving groove 102 is located at the center of the upper base surface of the 1 st core plate 100, and is not offset. With such an arrangement, the position accuracy of the heat-conducting accommodating groove 102 can be favorably ensured and improved, so that the matching accuracy between the heat-conducting accommodating groove 102 and the heat-conducting block 400 is ensured; it is also advantageous to quickly achieve accurate positioning of the heat-conducting block 400, and particularly to accurately position the PADs (copper PADs) on the heat-conducting block 400 in the laser drilling step.
Referring to fig. 1 and 4, in the present embodiment, the cross-sectional shape of the upper opening window is circular, and the radial dimension of the upper opening window is 0.15 ± 0.015 mm; the cross section of the lower opening window is circular, and the radial dimension of the lower opening window is 0.15 +/-0.015 mm.
It should be noted that, by setting the cross-sectional shape of the upper opening window to be circular and setting the radial dimension of the upper opening window to be 0.15 ± 0.015mm, not only can the occurrence of a situation that the outer layer circuit on the upper surface of the upper copper foil 700 and the PAD (copper PAD) corresponding to the upper communication hole 701 cannot be effectively conducted due to the small aperture of the upper communication hole 701 be avoided, but also the risk of insufficient plating filling due to the large aperture of the upper communication hole 701 can be effectively reduced, so that the stability and reliability of conduction between the outer layer circuit on the upper surface of the upper copper foil 700 and the PAD (copper PAD) corresponding to the upper communication hole 701 can be further ensured and improved, that is, the manufacturing yield of the circuit board can be further ensured and improved.
Similarly, the cross-sectional shape of the lower opening window is circular, and the radial dimension of the lower opening window is set to 0.15 ± 0.015mm, which not only can avoid the occurrence of the situation that the outer layer circuit of the lower surface of the lower copper foil 800 and the PAD (copper PAD) corresponding to the lower communication hole 802 cannot be effectively conducted due to the undersize of the aperture of the lower communication hole 802, but also can effectively reduce the risk of insufficient electroplating filling due to the oversized aperture of the lower communication hole 802, thereby further ensuring and improving the stability and reliability of conduction between the outer layer circuit of the lower surface of the lower copper foil 800 and the PAD (copper PAD) corresponding to the lower communication hole 802, and further ensuring and improving the manufacturing yield of the circuit board.
Referring to fig. 1, 3 and 4, in the present embodiment, the upper copper foil 700 has a thickness of 1/2OZ or 1/3OZ, and the lower copper foil 800 has a thickness of 1/2OZ or 1/3 OZ.
Here, by setting the thickness of the upper copper foil 700 to 1/2OZ or 1/3OZ, not only the copper thickness of the upper copper foil 700 can be made sufficient, but also a precise outer layer circuit can be formed on the upper surface of the upper copper foil 700, that is, the quality of the circuit board can be improved. Similarly, by setting the thickness of the lower copper foil 800 to 1/2OZ or 1/3OZ, not only the copper thickness of the lower copper foil 800 can be made sufficient, but also a precise outer layer circuit can be formed on the lower surface of the lower copper foil 800, that is, the quality of the circuit board can be further improved.
Referring to fig. 1 and 2, in the present embodiment, a distance between the heat-conducting block 400 and any one of the walls of the heat-conducting accommodating groove 102 is 0.1 ± 0.05 mm.
It should be noted that, through the arrangement of this embodiment, when the heat conducting block 400 is accommodated in the heat conducting accommodating groove 102 and placed in the middle, the distance between each side surface of the heat conducting block 400 and the groove wall corresponding to the heat conducting accommodating groove 102 is about 0.1mm, and therefore, on one hand, it can be avoided that the difficulty in matching the heat conducting block 400 and the heat conducting accommodating groove 102 is large, even the core plate surface is broken, and/or resin remains, even the resin overflows to the upper surface and the lower surface of the heat conducting block 400 due to the too small distance between each side surface of the heat conducting block 400 and the groove wall corresponding to the heat conducting accommodating groove 102; on the other hand, the phenomenon of loose and offset of the heat-conducting block 400 and/or the phenomenon of void due to insufficient resin filling caused by too large distance between each side surface of the heat-conducting block 400 and the corresponding groove wall of the heat-conducting accommodating groove 102 can be avoided. Therefore, by adopting the scheme, the limit matching of the heat conduction block 400 and the heat conduction accommodating groove 102 can be realized quickly and conveniently, the matching precision is high, and the embedding efficiency of the heat conduction block 400 can be improved to a certain extent; it is also advantageous to further improve the filling quality of the resin between the heat-conducting block 400 and the heat-conducting accommodating groove 102. Thereby further ensuring and improving the manufacturing yield of the circuit board.
Alternatively, the sectional shape of the heat conduction block 400 is a rectangular arrangement. By adopting the scheme, on one hand, the cross section shape of the heat conduction block 400 can correspond to the shape of the circuit board, so that the heat dissipation effect of the heat conduction block 400 on the circuit board can be balanced; on the other hand, can further do benefit to fast, accurate, conveniently realize heat conduction piece 400 and heat conduction holding tank 102's spacing cooperation to further improve heat conduction piece 400's embedding efficiency. Thereby further ensuring and improving the manufacturing yield of the circuit board.
Referring to fig. 1 and 2, in the present embodiment, the copper thickness of the upper base surface of the 1 st core board 100 is 1/2OZ or 1OZ, and the copper thickness of the lower base surface of the mth core board 200 is 1/2OZ or 1 OZ.
Here, by setting the copper thickness of the upper base surface of the 1 st core board 100 to 1/2OZ or 1OZ, not only the copper thickness of the upper base surface of the 1 st core board 100 can be made sufficient, but also a precise sub-outer layer circuit can be formed on the upper base surface of the 1 st core board 100, that is, the quality of the circuit board can be improved. Similarly, by setting the copper thickness of the lower base surface of the mth core board 200 to 1/2OZ or 1OZ, not only the copper thickness of the lower base surface of the mth core board 200 can be made sufficient, but also a precise sub-outer layer circuit can be manufactured on the lower base surface of the mth core board 200, i.e., the quality of the circuit board can be further improved.
In conclusion, by the circuit board manufacturing method, the circuit board capable of double-sided efficient heat conduction and heat dissipation can be manufactured, the heat dissipation performance is good, the circuit board manufacturing yield is high, and the circuit board manufacturing quality is good.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (6)
1. A method for manufacturing a circuit board, comprising the steps of:
preparing a material, preparing a heat-conducting block, and preparing a 1 st core plate and a 2 nd core plate … … Mth core plate which are sequentially stacked from top to bottom, wherein M is more than or equal to 2, an upper base surface of the 1 st core plate is provided with a heat-conducting accommodating groove which is arranged by penetrating through a lower base surface of the Mth core plate and is used for accommodating the heat-conducting block, and the heat-conducting block is a ceramic block;
preliminary positioning preparation, namely attaching a preliminary positioning protective film to the lower base surface of the Mth core plate;
the heat conduction embedding is carried out, the heat conduction block is embedded into the heat conduction accommodating groove, and the lower surface of the heat conduction block is adhered to the primary positioning protective film, so that the lower surface of the heat conduction block is flush with the lower base surface of the Mth core plate;
a fine positioning preparation step, namely attaching a fine positioning protective film to the upper base surface of the 1 st core plate and the upper surface of the heat conduction block, and enabling the upper surface of the heat conduction block to be flush with the upper base surface of the 1 st core plate;
pressing and connecting, namely pressing and connecting the fine positioning protective film, the 1 st core board, the 2 nd core board … …, the Mth core board and the initial positioning protective film together to enable the 1 st core board, the 2 nd core board … … and the Mth core board to be in compression joint;
forming a tear film, tearing the fine positioning protective film from the upper base surface of the No. 1 core board, and tearing the primary positioning protective film from the lower base surface of the No. M core board to obtain an interconnection substrate;
milling an edge and grinding a plate, namely performing target milling on the interconnection substrate, and then performing plate grinding treatment on the interconnection substrate, wherein the upper base surface and the lower base surface of the interconnection substrate are subjected to plate grinding treatment through non-woven fabric;
manufacturing a secondary outer layer circuit, namely manufacturing the secondary outer layer circuit on the upper base surface and the lower base surface of the interconnection substrate respectively, and manufacturing at least one pad in the area corresponding to the upper surface and the lower surface of the heat conduction block respectively;
then pressing and molding, namely, overlapping an upper copper foil on the upper side of the interconnection substrate, overlapping a lower copper foil on the lower side of the interconnection substrate, and pressing the upper copper foil, the interconnection substrate and the lower copper foil together to enable the upper copper foil, the interconnection substrate and the lower copper foil to be in compression joint;
manufacturing an outer layer circuit, namely manufacturing the outer layer circuit on the upper surface of the upper copper foil and the lower surface of the lower copper foil respectively;
laser drilling, namely forming at least one upper opening window which is aligned with the bonding pad on the upper surface of the heat conducting block up and down on the upper surface of the upper copper foil, forming at least one lower opening window which is aligned with the bonding pad on the lower surface of the heat conducting block up and down on the lower surface of the lower copper foil, forming an upper communication hole which is communicated with the bonding pad aligned with the upper opening window in each upper opening window, and forming a lower communication hole which is communicated with the bonding pad aligned with the lower opening window in each lower opening window;
and filling electroplating holes, wherein each upper communication hole and each lower communication hole are filled by electroplating, so that the outer layer circuit on the upper surface of the upper copper foil is conducted with each pad on the upper surface of the heat conducting block through each upper communication hole, and the outer layer circuit on the lower surface of the lower copper foil is conducted with each pad on the lower surface of the heat conducting block through each lower communication hole.
2. The method for manufacturing a wiring board according to claim 1, wherein the heat conductive block is aluminum nitride having a titanium layer, and further comprising, after the step of forming the sub-outer layer wiring and before the step of re-press-molding, the steps of:
and removing the titanium layer to make the bonding pads not conductive mutually.
3. The manufacturing method of the circuit board according to claim 1, wherein the cross-sectional shape of the upper opening window is circular, and the radial dimension of the upper opening window is 0.15 ± 0.015 mm;
the cross section of the lower opening window is circular, and the radial dimension of the lower opening window is 0.15 +/-0.015 mm.
4. The method for manufacturing a wiring board according to claim 1, wherein the upper copper foil has a thickness of 1/2OZ or 1/3OZ, and the lower copper foil has a thickness of 1/2OZ or 1/3 OZ.
5. The method for manufacturing a wiring board according to any one of claims 1 to 4, wherein a distance between the heat-conducting block and any one of the groove walls of the heat-conducting accommodating groove is 0.1 ± 0.05 mm.
6. The wiring board manufacturing method according to any one of claims 1 to 4, wherein the copper thickness of the upper base surface of the 1 st core board is 1/2OZ or 1OZ, and the copper thickness of the lower base surface of the Mth core board is 1/2OZ or 1 OZ.
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| CN114666969B (en) * | 2020-12-23 | 2024-03-01 | 健鼎（无锡）电子有限公司 | Circuit board structure and manufacturing method thereof |
| CN113163627B (en) * | 2021-03-29 | 2023-05-05 | 景旺电子科技(珠海)有限公司 | Circuit board manufacturing method |
| CN113490351B (en) * | 2021-07-30 | 2022-12-13 | 江西志浩电子科技有限公司 | Circuit board manufacturing method for preventing lamination glue overflow |
| CN114615830B (en) * | 2022-02-18 | 2023-06-09 | 江门崇达电路技术有限公司 | Method for improving lamination glue overflow of copper-embedded circuit board |
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