CN113473747B - Manufacturing method of high-voltage-resistant metal-based circuit board suitable for plug-in mode and circuit board - Google Patents
Manufacturing method of high-voltage-resistant metal-based circuit board suitable for plug-in mode and circuit board Download PDFInfo
- Publication number
- CN113473747B CN113473747B CN202110821018.8A CN202110821018A CN113473747B CN 113473747 B CN113473747 B CN 113473747B CN 202110821018 A CN202110821018 A CN 202110821018A CN 113473747 B CN113473747 B CN 113473747B
- Authority
- CN
- China
- Prior art keywords
- aluminum substrate
- hole
- resin
- medium layer
- double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The embodiment of the invention discloses a manufacturing method of a metal-based circuit board suitable for high-voltage resistance in a plug-in mode and the circuit board, wherein the manufacturing method comprises the following steps: preparing an aluminum substrate, and drilling a resin hole and a riveting hole; filling heat-conducting resin into the resin holes and the riveting holes; pressing a first high-heat-conductivity medium layer on the aluminum substrate; a second high heat conduction medium layer is pasted in a false mode; drilling the aluminum substrate again to penetrate the resin hole and the riveting hole; preparing a double-sided substrate having a PTH hole; filling heat-conducting resin into an etched area of an inner layer circuit of the double-sided substrate and the PTH hole; pre-stacking the aluminum substrate and the double-sided substrate, and riveting; carrying out pressing treatment on the riveted aluminum substrate and the double-sided substrate; and drilling the aluminum substrate and the double-sided substrate after the pressing treatment so as to penetrate through PTH holes of the double-sided substrate. According to the embodiment of the invention, the heat-conducting resin is filled in the resin hole, the resin hole and the PTH hole are drilled back again, and the PTH hole is exposed, so that the problem that the single-side multilayer metal-based circuit board cannot use a plug-in mode is solved.
Description
Technical Field
The invention relates to the field of circuit board production processes, in particular to a manufacturing method of a high-voltage-resistant metal-based circuit board suitable for a plug-in mode and the circuit board.
Background
At present, the design requirement of a product exists, a double-sided substrate needs to be in press fit with an aluminum substrate, the requirement of thermal conductivity is more than 8W/m.k, the withstand voltage DC of a dielectric layer is more than 5000V, and a PTH upper plug-in unit mode needs to be used; however, in the existing manufacturing method and material, the thermal conductivity is lower than 4W/m.k, the hole wall of the single-sided double-layer (multi-layer) aluminum-based circuit board is made of metal aluminum after drilling, if a component with pins is used, the short circuit of the component is inevitably caused, and the mounting mode of the component is limited, and the conventional manufacturing method of the product can only realize the mounting of the component in a patch mode.
In view of the fact that the existing product manufacturing method and material cannot meet the requirements of products, the method for manufacturing the metal-based circuit board suitable for high-pressure resistance in the plug-in mode is provided.
Disclosure of Invention
The invention aims to provide a manufacturing method of a metal-based circuit board suitable for high-voltage resistance in a plug-in mode and the circuit board, and aims to solve the problem that a component and the metal-based circuit board cannot be connected in the plug-in mode.
In order to solve the technical problems, the invention aims to realize the following technical scheme: the method for manufacturing the metal-based circuit board which is suitable for high-voltage resistance in a plug-in mode comprises the following steps:
preparing an aluminum substrate, and drilling the aluminum substrate to form a resin hole and a riveting hole;
filling heat-conducting resin into the resin hole and the riveting hole, so that the aluminum substrate is in a planar state;
laminating a first high-heat-conductivity medium layer on the aluminum substrate in advance;
a second high heat conduction medium layer is temporarily attached to the first high heat conduction medium layer;
drilling the aluminum substrate again to penetrate the resin hole and the riveting hole, wherein a layer of heat-conducting resin is reserved on the wall of the resin hole;
preparing a double-sided substrate after an inner layer circuit is manufactured, and manufacturing a PTH hole on the double-sided substrate;
filling heat-conducting resin into an etching area of the inner-layer circuit of the double-sided substrate and the PTH hole, so that the heat-conducting resin in the etching area is flush with the inner-layer circuit;
pre-stacking the aluminum substrate which is temporarily attached to the second high heat-conducting medium layer with a double-sided substrate, and riveting;
carrying out pressing treatment on the riveted aluminum substrate and the double-sided substrate;
and drilling the aluminum substrate and the double-sided substrate after the pressing treatment so as to expose the hole wall of the PTH hole of the double-sided substrate and communicate with the corresponding resin hole.
Further, the pre-pressing of a first high thermal conductive medium layer on the aluminum substrate includes:
tearing off the protective film on one surface of the first high-thermal-conductivity medium layer;
the first high-thermal-conductivity medium layer is temporarily attached to the aluminum substrate;
tearing off the protective film on the other side of the first high heat-conducting medium layer;
carrying out pressing treatment on a copper foil and the first high-thermal-conductivity dielectric layer which is stuck on the aluminum substrate in a false mode;
and carrying out circuit etching treatment on the copper foil on the pressed aluminum substrate so as to etch away the copper foil.
Further, the pseudo-sticking of a second high thermal conductive medium layer on the first high thermal conductive medium layer includes:
tearing off the protective film on one surface of the second high-thermal-conductivity medium layer;
the second high heat conduction medium layer is temporarily attached to the first high heat conduction medium layer;
after the aluminum substrate is drilled again to penetrate the resin hole and the riveting hole, the method comprises the following steps:
and tearing off the protective film on the other side of the second high heat-conducting medium layer.
Furthermore, the first high-heat-conductivity medium layer is made of a glass-fiber-free high-heat-conductivity medium material, and the thickness parameter is controlled to be 90-110 μm.
Furthermore, the second high heat-conducting medium layer is made of glass-fiber-free high heat-conducting medium materials, and the thickness parameter is controlled to be 140-160 microns.
Further, the parameters of the fake sticker are set as: the temperature parameter is controlled at 110-130 ℃, and the pressure parameter is controlled at 5kg/cm2。
Further, the parameters of the pressing in the pressing treatment of the riveted aluminum substrate and the double-sided substrate are set as follows: the heating rate is adjusted to 2-3 ℃/min, and the curing time is more than 40 min.
Further, the drilling of the aluminum substrate and the double-sided substrate after the pressing treatment to expose the PTH hole walls of the double-sided substrate and communicate with the corresponding resin holes includes:
and drilling the aluminum substrate and the double-sided substrate after the pressing treatment by using a CCD (charge coupled device) drilling machine, wherein the diameter of a drill used in the CCD drilling machine is smaller than the aperture of the resin hole so as to retain the heat-conducting resin on the inner wall of the PTH hole.
Further, before the filling of the heat conductive resin into the resin hole to make the aluminum substrate in a planar state, the method includes:
pasting a barrier film at the bottom of the aluminum substrate to plug the resin holes;
after the filling of the heat conductive resin into the resin hole to make the aluminum substrate in a planar state, the method includes:
tearing off the barrier film;
performing glue skiving and overflowing treatment on the aluminum substrate after the film is torn so as to skive heat conduction resin overflowing to the surface of the aluminum substrate when the hole is plugged;
and grinding the aluminum substrate after the glue overflow is cut.
The embodiment of the invention also provides a metal-based circuit board suitable for high-pressure resistance in a plug-in mode, wherein: the circuit board is manufactured by the manufacturing method.
The embodiment of the invention provides a manufacturing method of a metal-based circuit board suitable for high-voltage resistance in a plug-in mode and the circuit board, wherein the manufacturing method comprises the following steps: preparing an aluminum substrate, and drilling the aluminum substrate to form a resin hole and a riveting hole; filling heat-conducting resin into the resin hole and the riveting hole, so that the aluminum substrate is in a planar state; laminating a first high-thermal-conductivity medium layer on the aluminum substrate in advance; a second high heat conduction medium layer is temporarily attached to the first high heat conduction medium layer; drilling the aluminum substrate again to penetrate the resin hole and the riveting hole; preparing a double-sided substrate after an inner layer circuit is manufactured, and manufacturing a PTH hole on the double-sided substrate; filling heat-conducting resin into an etching area of the inner-layer circuit of the double-sided substrate and the PTH hole, so that the heat-conducting resin in the etching area is flush with the inner-layer circuit; pre-stacking the aluminum substrate which is temporarily attached to the second high heat-conducting medium layer with a double-sided substrate, and riveting; carrying out pressing treatment on the riveted aluminum substrate and the double-sided substrate; and drilling the aluminum substrate and the double-sided substrate after the pressing treatment so as to expose the hole wall of the PTH hole of the double-sided substrate and communicate with the corresponding resin hole.
According to the embodiment of the invention, the resin hole is filled with the heat-conducting resin, the resin hole and the PTH hole are drilled back again and the PTH hole is exposed, so that the phenomenon of short circuit of the component can not be caused when the component with the pin is inserted into the PTH hole in the later period, and the problem that the single-sided multilayer metal-based circuit board cannot use the plug-in mode is further solved; on the other hand, the glass-fiber-free high-heat-conductivity medium material is pressed into the aluminum substrate and the double-sided substrate in a twice pressing mode, so that the problem that the high-heat-conductivity medium material cannot resist high pressure due to thin thickness after pressing is solved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic flow chart of a manufacturing method of a metal-based circuit board suitable for high-voltage resistance in a plug-in manner according to an embodiment of the present invention;
fig. 2 is a sub-flow schematic diagram of a manufacturing method of a metal-based circuit board suitable for high-voltage resistance in a plug-in mode according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the specification of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
With reference to fig. 1, an embodiment of the present invention provides a method for manufacturing a metal-based circuit board suitable for high-voltage resistance in an interposer manner, including the following steps:
s1, preparing an aluminum substrate, and drilling the aluminum substrate to form a resin hole and a riveting hole;
s2, filling heat-conducting resin into the resin holes and the riveting holes to enable the aluminum substrate to be in a planar state;
s3, laminating a first high-thermal-conductivity medium layer on the aluminum substrate in advance;
s4, a second high heat-conducting medium layer is attached to the first high heat-conducting medium layer in a false mode;
s5, drilling holes in the aluminum substrate again to penetrate through the resin holes and the riveting holes, wherein a layer of heat-conducting resin is reserved on the walls of the resin holes;
s6, preparing a double-sided substrate after an inner layer circuit is manufactured, and manufacturing a PTH hole on the double-sided substrate;
s7, filling heat-conducting resin into the etched area of the inner-layer circuit of the double-sided substrate and the PTH hole, so that the heat-conducting resin in the etched area is flush with the inner-layer circuit;
s8, pre-stacking the aluminum substrate which is temporarily attached to the second high heat-conducting medium layer with the double-sided substrate, and riveting;
s9, performing pressing treatment on the riveted aluminum substrate and the double-sided substrate;
and S10, drilling the aluminum substrate and the double-sided substrate after the pressing treatment so as to expose the PTH hole walls of the double-sided substrate and communicate with the corresponding resin holes.
The reference numerals of the steps in this embodiment are only for convenience of description, and do not represent the limitation of the execution sequence of the steps, and in actual application, the execution sequence of the steps may be adjusted or performed simultaneously as needed, and these adjustments or substitutions all belong to the protection scope of the present invention.
In one embodiment, the thickness of the first high thermal conductivity medium layer is controlled to be 90 μm to 110 μm.
In one embodiment, the thickness of the second high thermal conductivity medium layer is controlled to be 140 μm to 160 μm.
In this embodiment, the first high thermal conductivity medium layer and the second high thermal conductivity medium layer are made of glass-fiber-free high thermal conductivity medium materials, that is, glass-fiber-free insulation materials, and the glass-fiber-free high thermal conductivity medium materials with the thermal conductivity up to 12W/m.k are selected to replace glass fibers, so that the design requirement that the thermal conductivity is greater than 8W/m.k can be realized.
Due to the low fluidity of the high heat-conducting medium material, if a one-time pressing mode is adopted, the thicknesses of the first high heat-conducting medium layer and the second high heat-conducting medium layer are uneven and are too thin, so that the high voltage resistance DC can not be ensured to be more than 5000V; on the other hand, depending on the material properties, the thickness of the dielectric layer needs to be 250 μm or more in order to achieve high voltage resistance. High heat conduction fillers such as boron and silicon are added into the high heat conduction medium, so the gel window is very narrow, and through the steps S3 and S9 in the embodiment, the glass fiber-free high heat conduction medium material is pressed into the aluminum substrate and the double-sided substrate by adopting a twice pressing mode, so that the problem that the high pressure cannot be resisted due to the fact that the thickness of the high heat conduction medium material is thin after pressing is solved.
The parameters of the stitching in step S9 are set to: the heating rate is adjusted to be 2-3 ℃/min, the curing time is more than 40min, and because the etching area on the double-sided substrate is filled with the heat-conducting resin, namely the surface of the double-sided substrate is in a planar state, when the first high heat-conducting medium layer and the second high heat-conducting medium layer are laminated on the double-sided substrate, the first high heat-conducting medium layer and the second high heat-conducting medium layer can not generate loss, and the thickness and uniformity of the first high heat-conducting medium layer and the second high heat-conducting medium layer are further ensured. In this embodiment, the total thickness of the first high thermal conductive medium layer and the second high thermal conductive medium layer reaches 250 μm, which can achieve the purpose of high pressure resistance. In the actual production process, the pressing parameters of the pressing equipment can be correspondingly adjusted.
In the actual production process, the first high heat-conducting medium layer is also bonded with protective films positioned on the upper side and the lower side, and the protective films play roles in protecting and supporting the first high heat-conducting medium layer. Similarly, the upper side and the lower side of the second high thermal conductive medium layer are respectively bonded with a protective film.
Referring to fig. 2, step S3 includes:
s31, tearing off the protective film on one surface of the first high-thermal-conductivity medium layer;
s32, pseudo-sticking the first high-thermal-conductivity medium layer on the aluminum substrate;
s33, tearing off the protective film on the other side of the first high heat-conducting medium layer;
s34, carrying out pressing treatment on the copper foil and the first high-thermal-conductivity dielectric layer which is stuck on the aluminum substrate;
s35, performing circuit etching treatment on the copper foil on the pressed aluminum substrate to etch away the copper foil;
s36, carrying out plate cutting treatment on the etched aluminum substrate to cut off the excessive glue, namely the waste edge after lamination;
and S37, carrying out plate grinding treatment on the aluminum substrate by adopting a conventional plate grinding process.
Wherein, step S32 is to paste the first high thermal conductive medium layer onto the aluminum substrate through the film sticking machine, and the parameters of the film sticking machine are set as: the temperature parameter is controlled at 110-130 ℃, and the pressure parameter is controlled at 5kg/cm2。
Because the first high heat conduction medium layer does not have glass fiber support, the first high heat conduction medium layer and the second high heat conduction medium layer are directly drilled, when a through hole corresponding to a resin hole and a riveting hole in the aluminum substrate is drilled, the first high heat conduction medium layer is easily broken when the protective film is removed in the drilling process, and then the first high heat conduction medium layer is scrapped.
In step S33, the first high thermal conductive medium layer and the copper foil are sufficiently bonded together by laminating the copper foil on the first high thermal conductive medium layer; the copper foil is arranged on the upper side of the laminated first high heat conduction medium layer, and the aluminum substrate is arranged on the lower side of the laminated first high heat conduction medium layer to serve as a support, so that the first high heat conduction medium layer is good in uniformity and free of loss in the laminating process.
In step S34, an etching process is performed by a general etching machine.
Further, step S2 is preceded by:
s11, carrying out plate grinding treatment on the drilled aluminum substrate;
and S12, attaching a barrier film to the bottom of the aluminum substrate after the plate grinding treatment to prevent the heat-conducting resin from flowing out of the resin holes when the resin holes are plugged by the heat-conducting resin.
And the heat-conducting resin is plugged into the resin hole and the riveting hole through a vacuum hole plugging machine, wherein the heat-conducting resin is required to be in a full and cavity-free state.
In the present embodiment, step S2 is followed by:
s21, tearing off the barrier film;
s22, performing glue skiving and overflowing treatment on the aluminum substrate after film stripping to skive heat conducting resin overflowing to the surface of the aluminum substrate during hole plugging;
and S23, grinding the aluminum substrate after the glue overflow is cut.
In step S22, a tape sander is used to perform a flash-off process, and after flash-off, the thermal conductive resin is flush with the surface of the aluminum substrate without a bump.
In one embodiment, step S4 includes:
s41, tearing off the protective film on one side of the second high-thermal-conductivity medium layer;
s42, pseudo-sticking the second high-thermal-conductivity medium layer on the first high-thermal-conductivity medium layer;
after step S5, the method further includes the following steps:
and S51, tearing off the protective film on the other side of the second high heat-conducting medium layer.
The device and parameters used in the fake sticker processing in this embodiment are the same as those used in step S32, and therefore are not described again.
In step S7, the etched areas of the double-sided substrate are filled by means of silk-screen resin so that the double-sided substrate surface is in a horizontal state. The heat-conducting resin is filled in the etching area of the inner layer circuit of the double-sided substrate, so that the loss of high heat-conducting materials caused by the fact that the high heat-conducting medium materials permeate into the etching area during secondary pressing is avoided, and the voltage resistance of the product is reduced.
In one embodiment, step S6 includes the following steps:
s61, selecting a core plate, and cutting according to the design size to form a double-sided substrate;
s62, drilling a peripheral alignment hole and a hole position needing to be used for manufacturing a PTH hole;
s63, performing copper deposition and electroplating on the double-sided substrate according to conventional parameters; wherein, when the whole board is plated with copper and electroplated, the hole site of the PTH hole is plated with a copper layer, and finally the PTH hole is formed;
s64, manufacturing an inner layer circuit of the double-sided substrate according to the conventional manufacturing requirement; the outer layer of the double-sided substrate is protected by a film without a circuit;
and S65, browning the double-sided substrate with the inner-layer circuit according to a conventional manufacturing method, and improving the bonding force of the pressing through browning treatment.
Through step S8, the alignment accuracy of the PTH holes of the double-sided substrate and the corresponding resin holes of the aluminum substrate is controlled to facilitate the smooth proceeding of step S9.
In the present embodiment, step S9 is followed by the following steps:
s91, punching positioning holes in the pressed aluminum substrate and the double-sided substrate, namely the circuit board; wherein, a CCD shooting machine is adopted for punching;
s92, performing edge milling treatment on the excessive glue, namely the waste edge of the circuit board;
s93, pasting a corrosion-resistant high-temperature film on the surface of the aluminum substrate to protect the aluminum surface from being etched;
s94, manufacturing the outer layer circuit of the circuit board according to a conventional manufacturing method;
s95, performing solder mask manufacturing on the outer layer line pavement of the circuit board according to a conventional manufacturing method;
in this embodiment, in step S10, the aluminum substrate and the double-sided substrate after the stitching process are drilled by using a CCD drilling machine, since in step S8, the PTH holes of the double-sided substrate correspond to the corresponding resin holes by riveting, and the heat conductive resin in the resin holes is drilled in step S5, only the PTH holes of the double-sided substrate need to be drilled again to drill the heat conductive resin in the PTH holes, so as to expose the copper plating on the walls of the PTH holes, so that the pins of the component can be in contact conduction with the copper plating on the PTH holes, and the heat conductive resin in the resin holes plays an insulating role and can mount the pins of the component.
In this embodiment, the diameter of the drill used in the CCD drilling machine is smaller than the diameter of the resin hole in step S10, specifically, the diameter of the drill used in the CCD drilling machine is 0.04-0.06mm smaller than the diameter of the resin hole.
In this embodiment, step S10 is followed by the following steps:
s101, routing and manufacturing according to product design requirements;
s102, tearing off the anti-corrosion high-temperature film on the surface of the aluminum substrate;
s103, grinding the outer surface of the aluminum substrate;
s104, carrying out open-short circuit test on the circuit board;
s105, carrying out OSP surface treatment on the surface of the circuit board according to a conventional manufacturing method;
s106, performing appearance inspection on the circuit board;
and S107, after the inspection is qualified, packaging and delivering according to the design packaging requirement.
The embodiment of the invention also provides a high-pressure-resistant metal-based circuit board suitable for a plug-in mode, and the metal-based circuit board is prepared by the manufacturing method.
While the invention has been described with reference to specific embodiments, the invention is not limited thereto, and various equivalent modifications and substitutions can be easily made by those skilled in the art within the technical scope of the invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A manufacturing method of a metal-based circuit board suitable for high-pressure resistance in a plug-in mode is characterized by comprising the following steps:
preparing an aluminum substrate, and drilling the aluminum substrate to form a resin hole and a riveting hole;
filling heat-conducting resin into the resin hole and the riveting hole, so that the aluminum substrate is in a planar state;
laminating a first high-heat-conductivity medium layer on the aluminum substrate in advance;
a second high heat conduction medium layer is temporarily attached to the first high heat conduction medium layer;
drilling the aluminum substrate again to penetrate the resin hole and the riveting hole, wherein a layer of heat-conducting resin is reserved on the wall of the resin hole;
preparing a double-sided substrate after an inner layer circuit is manufactured, and manufacturing a PTH hole on the double-sided substrate;
filling heat-conducting resin into an etching area of the inner-layer circuit of the double-sided substrate and the PTH hole, so that the heat-conducting resin in the etching area is flush with the inner-layer circuit;
pre-stacking the aluminum substrate which is temporarily attached to the second high heat-conducting medium layer with a double-sided substrate, and riveting;
carrying out pressing treatment on the riveted aluminum substrate and the double-sided substrate;
and drilling the aluminum substrate and the double-sided substrate after the pressing treatment so as to expose the hole wall of the PTH hole of the double-sided substrate and communicate with the corresponding resin hole.
2. The method for manufacturing the metal-based circuit board suitable for the plug-in mode high pressure resistance according to claim 1, wherein: the step of laminating a first high-thermal-conductivity medium layer on the aluminum substrate in advance comprises the following steps:
tearing off the protective film on one surface of the first high-thermal-conductivity medium layer;
the first high-thermal-conductivity medium layer is temporarily attached to the aluminum substrate;
tearing off the protective film on the other side of the first high heat-conducting medium layer;
carrying out pressing treatment on a copper foil and the first high-thermal-conductivity dielectric layer which is stuck on the aluminum substrate in a false mode;
and carrying out circuit etching treatment on the copper foil on the pressed aluminum substrate so as to etch away the copper foil.
3. The method for manufacturing the metal-based circuit board with high voltage resistance in a plug-in mode according to claim 2, wherein the step of pseudo-pasting a second high thermal conductive medium layer on the first high thermal conductive medium layer comprises:
tearing off the protective film on one surface of the second high-thermal-conductivity medium layer;
the second high heat conduction medium layer is temporarily attached to the first high heat conduction medium layer;
after the aluminum substrate is drilled again to penetrate the resin hole and the riveting hole, the method comprises the following steps:
and tearing off the protective film on the other side of the second high heat-conducting medium layer.
4. The method for manufacturing the metal-based circuit board suitable for the plug-in mode high pressure resistance according to claim 1, wherein: the first high heat-conducting medium layer is made of a glass-fiber-free high heat-conducting medium material, and the thickness parameter is controlled to be 90-110 mu m.
5. The method for manufacturing the metal-based circuit board suitable for the plug-in mode high pressure resistance according to claim 1, wherein: the second high heat-conducting medium layer is made of a glass-fiber-free high heat-conducting medium material, and the thickness parameter is controlled to be 140-160 mu m.
6. The method for manufacturing the metal-based circuit board suitable for the plug-in mode high pressure resistance according to any one of claims 2 to 3, wherein the parameters of the dummy paste are set as follows: the temperature parameter is controlled at 110-130 ℃, and the pressure parameter is controlled at 5kg/cm2。
7. The method for manufacturing the metal-based circuit board suitable for the plug-in mode high pressure resistance according to claim 1, wherein: the parameters of the pressing in the pressing treatment of the riveted aluminum substrate and the double-sided substrate are set as follows: the heating rate is adjusted to be 2-3 ℃/min, and the curing time is more than 40 min.
8. The method for manufacturing the metal-based circuit board suitable for the plug-in mode high pressure resistance according to claim 1, wherein: the aluminum substrate and the double-sided substrate after the pressing treatment are drilled to expose the PTH hole wall of the double-sided substrate and communicate with the corresponding resin hole, and the method comprises the following steps:
and drilling the aluminum substrate and the double-sided substrate after the pressing treatment by using a CCD (charge coupled device) drilling machine, wherein the diameter of a drill used in the CCD drilling machine is smaller than the aperture of the resin hole.
9. The method for manufacturing a metal-based circuit board suitable for high-pressure plug-in type applications as claimed in claim 1, wherein the step of filling the resin hole with a heat-conducting resin before the aluminum substrate is in a planar state comprises:
pasting a barrier film at the bottom of the aluminum substrate to plug the resin holes;
after the filling of the heat conductive resin into the resin hole to make the aluminum substrate in a planar state, the method includes:
tearing off the barrier film;
performing glue skiving and overflowing treatment on the aluminum substrate after the film is torn so as to skive heat conduction resin overflowing to the surface of the aluminum substrate when the hole is plugged;
and grinding the aluminum substrate after the glue overflow is cut.
10. A metal-based wiring board suitable for high-voltage resistance in a plug-in manner, characterized in that it is produced by the production method according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110821018.8A CN113473747B (en) | 2021-07-20 | 2021-07-20 | Manufacturing method of high-voltage-resistant metal-based circuit board suitable for plug-in mode and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110821018.8A CN113473747B (en) | 2021-07-20 | 2021-07-20 | Manufacturing method of high-voltage-resistant metal-based circuit board suitable for plug-in mode and circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113473747A CN113473747A (en) | 2021-10-01 |
| CN113473747B true CN113473747B (en) | 2022-06-14 |
Family
ID=77881412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110821018.8A Active CN113473747B (en) | 2021-07-20 | 2021-07-20 | Manufacturing method of high-voltage-resistant metal-based circuit board suitable for plug-in mode and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113473747B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206329932U (en) * | 2016-12-02 | 2017-07-14 | 广州贵宇光电材料科技有限公司 | A kind of high and pressure-resistant LED aluminum base plate of electrical strength |
| CN107787116A (en) * | 2017-11-16 | 2018-03-09 | 厦门利德宝电子科技股份有限公司 | A kind of aluminium base welded suitable for component piercing insert and preparation method thereof |
| CN210328128U (en) * | 2019-07-08 | 2020-04-14 | 深圳市诚之益电路有限公司 | High-voltage-resistant circuit board structure |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09266374A (en) * | 1996-03-28 | 1997-10-07 | Chichibu Onoda Cement Corp | Manufacture of heat-radiating board |
| CN103118486B (en) * | 2013-01-29 | 2016-01-27 | 惠州中京电子科技股份有限公司 | A kind of aluminum-based circuit board with element spliced eye and preparation method thereof |
| JP6457206B2 (en) * | 2014-06-19 | 2019-01-23 | 株式会社ジェイデバイス | Semiconductor package and manufacturing method thereof |
| ES2558164B1 (en) * | 2015-07-29 | 2016-11-02 | Amadeo F. ZAMORA GIL | CONNECTION SYSTEM FOR ELECTRICAL, SIGNAL AND / OR DATA FACILITIES. |
-
2021
- 2021-07-20 CN CN202110821018.8A patent/CN113473747B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206329932U (en) * | 2016-12-02 | 2017-07-14 | 广州贵宇光电材料科技有限公司 | A kind of high and pressure-resistant LED aluminum base plate of electrical strength |
| CN107787116A (en) * | 2017-11-16 | 2018-03-09 | 厦门利德宝电子科技股份有限公司 | A kind of aluminium base welded suitable for component piercing insert and preparation method thereof |
| CN210328128U (en) * | 2019-07-08 | 2020-04-14 | 深圳市诚之益电路有限公司 | High-voltage-resistant circuit board structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113473747A (en) | 2021-10-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI336608B (en) | Printed circuit board assembly and method of manufacturing the same | |
| TWI380757B (en) | Flexible printed circuit board and manufacturing method for the same | |
| CN104244616B (en) | A kind of preparation method of centreless thin base sheet | |
| JPS6390158A (en) | Method of forming multilayer structure with non-flat surface | |
| US9942976B2 (en) | Preparation method of a boss-type metal-based sandwich rigid-flex circuit board | |
| WO2003032695A1 (en) | Electrical circuit and method of formation | |
| CN103188882A (en) | Circuit board and manufacture method thereof | |
| TWI733829B (en) | Manufacturing method of multilayer circuit board | |
| WO2021052061A1 (en) | Manufacturing method for thermally-conductive pcb and pcb | |
| WO2014112108A1 (en) | Component-embedded substrate and method for manufacturing same | |
| CN110996520A (en) | Manufacturing method for double-sided circuit board embedded copper block | |
| CN103871996A (en) | Package structure and manufacturing method thereof | |
| TWI777958B (en) | Manufacturing method of multilayer circuit board | |
| CN113473747B (en) | Manufacturing method of high-voltage-resistant metal-based circuit board suitable for plug-in mode and circuit board | |
| JP2015050309A (en) | Method for manufacturing wiring board | |
| KR100791353B1 (en) | Method of Forming Permanent Protective Film and Printed Circuit Board thereof | |
| US20080283280A1 (en) | Method for Connecting Printed Circuit Boards | |
| KR101019423B1 (en) | Method for fabricating printed-circuit-board including buried pattern | |
| CN116156791A (en) | PCB structure with components embedded in core board layer and build-up layer and manufacturing method thereof | |
| CN112825616A (en) | 3D electromagnetic shield and preparation method thereof | |
| CN103687333B (en) | Manufacture method of substrate with built-in circuit component | |
| TW540261B (en) | Printed wiring board with high density inner layer structure | |
| CN102365006A (en) | Processing method of multi-layer circuit board | |
| JPH0897564A (en) | Multilayer wiring board and its manufacturing method | |
| CN202310269U (en) | Multi-layer circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |