CN117295260B - Multilayer soft and hard combined printed circuit board and manufacturing method thereof - Google Patents
Multilayer soft and hard combined printed circuit board and manufacturing method thereof Download PDFInfo
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- CN117295260B CN117295260B CN202311571364.0A CN202311571364A CN117295260B CN 117295260 B CN117295260 B CN 117295260B CN 202311571364 A CN202311571364 A CN 202311571364A CN 117295260 B CN117295260 B CN 117295260B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910052802 copper Inorganic materials 0.000 claims abstract description 27
- 239000010949 copper Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 16
- 238000010030 laminating Methods 0.000 claims abstract description 15
- 238000003825 pressing Methods 0.000 claims abstract description 10
- 239000004642 Polyimide Substances 0.000 claims abstract description 8
- 238000000151 deposition Methods 0.000 claims abstract description 8
- 238000005530 etching Methods 0.000 claims abstract description 8
- 229920001721 polyimide Polymers 0.000 claims abstract description 8
- 230000008569 process Effects 0.000 claims abstract description 8
- 238000005553 drilling Methods 0.000 claims abstract description 7
- 230000008021 deposition Effects 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims abstract description 5
- 238000000465 moulding Methods 0.000 claims abstract description 5
- 230000005611 electricity Effects 0.000 claims abstract description 4
- 238000012545 processing Methods 0.000 claims abstract description 4
- 238000012546 transfer Methods 0.000 claims abstract description 4
- 238000003466 welding Methods 0.000 claims abstract description 4
- 230000007246 mechanism Effects 0.000 claims description 72
- 239000010410 layer Substances 0.000 claims description 48
- 230000009471 action Effects 0.000 claims description 13
- 239000012790 adhesive layer Substances 0.000 claims description 13
- 230000000712 assembly Effects 0.000 claims description 6
- 238000000429 assembly Methods 0.000 claims description 6
- 230000007306 turnover Effects 0.000 claims description 5
- 238000003801 milling Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 230000008719 thickening Effects 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 6
- 239000000428 dust Substances 0.000 abstract description 6
- 239000010408 film Substances 0.000 description 58
- 238000005452 bending Methods 0.000 description 19
- 239000004593 Epoxy Substances 0.000 description 4
- 239000013039 cover film Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000011101 paper laminate Substances 0.000 description 4
- 230000009194 climbing Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 210000002489 tectorial membrane Anatomy 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Abstract
The invention discloses a multilayer soft and hard combined printed circuit board and a manufacturing method thereof, relating to the technical field of printed circuit boards, wherein the method comprises the following steps: processing a plate: the polyimide base material and the rigid plate are coated with copper on both sides, and then circuits are manufactured to obtain a soft board and a hard board respectively; sticking film: a layer of covering film is stuck on the top surface and the bottom surface of the soft board in a regional way; pressing: pressing the soft board and then baking the board; and (3) forming: each soft board is formed separately; pressing: a plurality of hard plates are symmetrically stacked at two ends of the soft plate, one end of the soft plate is sequentially stacked in a mode of a plurality of hard plates, a plurality of soft plates and a plurality of hard plates from bottom to top, two adjacent plates are separated by a plurality of prepregs, and a preset gap is further formed between the two adjacent soft plates; laminating and pressing; drilling holes; copper deposition/plate electricity deposition; pattern transfer: pasting a dry film on the surface of the whole plate, exposing and developing; etching: etching to obtain a circuit; welding resistance; and (5) molding. The problem that dust and carbon powder are diffused to gaps of the soft board in the forming process can be solved.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a multilayer soft and hard combined printed circuit board and a manufacturing method thereof.
Background
Along with the development of the printed circuit board to the directions of light, thin, short and small, the requirements on the circuit design and manufacturing method of electronic products are higher and higher, and the traditional fine circuit printed circuit board with equal thickness is difficult to fully meet the requirements of the electronic industry. In order to adapt to the development trend of diversification and modularization of electronic products, a multilayer soft and hard combination printed circuit board is provided, and the soft and hard combination is characterized in that the formed printed circuit board has the rigidity of a hard board and the softness of a soft board, and can be bent at multiple angles.
However, the multilayer soft and hard combined printed circuit board is pressed and formed firstly during manufacturing, the flexible board bending area is lost due to the fact that the soft board bending area is pressed together, the requirement of bending cannot be met, in order to solve the problem, the soft board bending area is designed in a layered mode in the prior art, gaps are reserved between the soft boards, the defects can be overcome through the design, when the soft and hard combined board is manufactured, the soft board bending area is easy to deform during forming, dust and carbon powder generated during forming are diffused into the gaps between the soft boards and cannot be removed, board crushing damage of the soft board bending area is caused, and the defects of high voltage are seriously generated.
Disclosure of Invention
In order to solve the defects in the prior art, the invention provides a multilayer soft and hard combined printed circuit board and a manufacturing method thereof, which can solve the problem that dust and carbon powder are diffused into a soft board gap in the forming process.
In order to achieve the object of the invention, the following scheme is adopted:
a manufacturing method of a multilayer soft and hard combined printed circuit board comprises the following steps:
s1, processing a plate: the polyimide base material and the rigid plate are coated with copper on both sides, and then circuits are manufactured to obtain a soft board and a hard board respectively;
s2, film sticking: a layer of covering film is stuck on the top surface and the bottom surface of the soft board in a regional way;
s3, laminating: pressing the soft board and then baking the board;
s4, forming: each soft board is formed separately;
s5, laminating: a plurality of hard plates are symmetrically stacked at two ends of the soft plate, one end of the soft plate is sequentially stacked in a mode of a plurality of hard plates, a plurality of soft plates and a plurality of hard plates from bottom to top, two adjacent plates are separated by a plurality of prepregs, and a preset gap is further formed between the two adjacent soft plates; laminating and then pressing;
s6, drilling: drilling the pressed whole plate;
s7, copper deposition/plate electricity: depositing a copper layer on the hole wall and electroplating for thickening;
s8, pattern transfer: pasting a dry film on the surface of the whole plate, exposing and developing;
s9, etching: etching the whole plate to obtain a circuit;
s10, resistance welding;
s11, molding: milling the shape.
Further, step S2 utilizes the pad pasting device to paste one deck tectorial membrane at soft board surface regional nature, pad pasting device includes conveying mechanism, climbing mechanism, stop gear and pad pasting equipment, conveying mechanism is the annular, be equipped with logical groove in preset position department, conveying mechanism is used for carrying the soft board to logical groove department in proper order, climbing mechanism locates logical groove below, stop gear framework locates logical groove top, pad pasting equipment sets up in stop gear top, step S2 pad pasting' S method is:
s21, conveying a soft board to the through groove by the conveying mechanism;
s22, lifting the soft board at the through groove by the jacking mechanism until the soft board is positioned in the action range of the limiting mechanism;
s23, adjusting and positioning the flexible board by the limiting mechanism so that the area of the flexible board to be film-pasted is positioned in the action range of film pasting equipment;
s24, carrying out regional film pasting on the top surface of the soft board by film pasting equipment;
s25, loosening the soft board by the limiting mechanism, enabling the soft board to descend onto the conveying mechanism by the jacking mechanism, continuously conveying the soft board to the turnover position by the conveying mechanism, turning over the soft board by using manual or turnover equipment, and then starting execution from the step S21 until double-sided film pasting of the soft board is completed and then taking out the soft board.
Further, stop gear includes two spacing subassemblies about conveying mechanism symmetry, spacing subassembly includes the bottom plate and locates T template on the bottom plate, two slide, two connecting rods, telescopic link and locating plate, the support frame is located to the bottom plate, the bottom plate is equipped with the spout that runs through itself, the T template is connected to the telescopic link expansion end, the T template is indulged the section towards conveying mechanism outside, this indulge section bottom and is equipped with first splint, first splint pass the spout downwards, the bottom plate top is equipped with two guide rails of symmetry in T template both sides, slide sliding fit is in the guide rail that corresponds, the connecting rod both ends rotate respectively and connect in T template changeover portion one end and slide, the slide bottom is equipped with the second splint, the locating plate is located the bottom plate inboard, and through screwed connection in T template, on the flexible sheet conveying direction, locating plate length is greater than flexible sheet length, step S23 is:
when the soft board is lifted, the telescopic rods of the two limiting assemblies are simultaneously extended to reduce the distance between the two T-shaped boards, so that the distance between the two positioning boards is reduced, the two first clamping boards are gathered on the soft board, the sliding board is driven in the moving process of the T-shaped boards under the action of the connecting rod, and the four second clamping boards are further caused to gather on the soft board; after the flexible board is fixed, the area of the flexible board exposed between the two positioning boards is the area of the flexible board to be pasted with the film.
Further, climbing mechanism includes base and roof, is equipped with the lifter in the base, and the roof is connected to the expansion end at its top, and step S22 is: the lifting rod lifts the top plate, and the top plate continuously moves upwards after contacting the soft plate until the soft plate is positioned in the action range of the limiting mechanism.
The multilayer soft and hard combined printed circuit board is obtained by a manufacturing method of the multilayer soft and hard combined printed circuit board and comprises a first unit and two second units which are symmetrical to two ends of the first unit;
the first unit comprises a plurality of soft boards, the soft boards comprise polyimide base materials and double-sided first copper layers, the top surface and the bottom surface of each soft board are outwards provided with an adhesive layer and a covering film layer in sequence, the lengths of the adhesive layer and the covering film layer are the same, and the length of the covering film layer is smaller than that of the soft board;
the second unit comprises a plurality of hard plates and a plurality of prepregs, the hard plates comprise a rigid plate and a double-sided second copper layer, from bottom to top, a plurality of hard plates, a plurality of soft plates and a plurality of hard plates are sequentially stacked, two adjacent plates are separated by the plurality of prepregs, a preset gap is reserved between the two adjacent soft plates, and after stacking, the top surface and the bottom surface of the whole plate are outwards provided with the plurality of prepregs, a third copper layer, an electroplated layer and a solder mask layer in sequence.
Further, two adjacent soft boards are separated by three prepregs, wherein the thickness of the two prepregs is the same as the sum of the thickness of the adhesive layer and the thickness of the two layers of the covering film layer, the rest of one prepreg is positioned between the two prepregs with the same thickness, and the rest of one prepreg extends into the preset gap.
Further, the hard board and the soft board are separated by three prepregs, wherein the lengths of the two prepregs are the same as the length of the hard board, the rest one prepreg is clung to the first copper layer of the soft board, and the thickness of the rest one prepreg is the same as the sum of the thicknesses of the adhesive layer and the covering film layer.
The invention has the beneficial effects that: the multilayer soft and hard combined printed circuit board is designed in a layered manner, so that the problem that the bending area of the soft board loses flexibility due to the fact that the soft board is pressed together can be solved, and the requirement of bending can be met; after the soft board is separated to form a circuit, the circuit and the cover film are pressed together to form a soft board bending area, so that dust and carbon powder are easily cleaned, and the cover film can also protect the soft board bending area in the process; and a layer of covering film is stuck on the surface of the soft board by using a film sticking device, so that the covering film is ensured to be accurately stuck on the bending area of the soft board.
Drawings
FIG. 1 is a flow chart of a method of fabricating an embodiment;
FIG. 2 is a block diagram of a film laminating apparatus according to an embodiment;
FIG. 3 is a top view of a film laminating apparatus according to an embodiment;
FIG. 4 is a bottom view of a spacing assembly of an embodiment;
FIG. 5 is a schematic diagram of a multi-layer rigid-flex printed circuit board according to an embodiment;
reference numerals: the device comprises a conveying mechanism-5, a through groove-51, a bottom plate-31, a sliding groove-311, a guide rail-312, a vertical plate-313, a T-shaped plate-32, a first clamping plate-321, a guide rod-322, a sliding plate-33, a second clamping plate-331, a connecting rod-34, a telescopic rod-35, a positioning plate-36, a jacking mechanism-4, a base-41, a top plate-42, a polyimide substrate-11, a first copper layer-12, an adhesive layer-13, a covering film layer-14, a prepreg-21, a rigid plate-22, a second copper layer-23, a third copper layer-24, an electroplated layer-25 and a solder mask layer-26.
Detailed Description
Example 1
As shown in fig. 5, the embodiment provides a multi-layer soft and hard combined printed circuit board, which is H-shaped and comprises a first unit and two second units symmetrical to two ends of the first unit.
Specifically, the first unit includes two flexible boards, the flexible boards have bending property, the flexible boards include a polyimide substrate 11 and a double-sided first copper layer 12, the top surface and the bottom surface of the flexible boards are provided with an adhesive layer 13 and a covering film layer 14 in turn, the adhesive layer 13 and the covering film layer 14 have the same length, and the length of the covering film layer 14 is smaller than that of the flexible boards, that is, the surface of the flexible boards is not all film-adhered, but is regional film-adhered.
Specifically, the second unit includes four hard plates and thirteen prepregs 21, the hard plates include a rigid plate 22 and a double-sided second copper layer 23, the rigid plate 22 may be one material selected from a phenolic paper laminate, an epoxy paper laminate, a polyester glass felt laminate and an epoxy glass cloth laminate, from bottom to top, two hard plates, two soft plates and two hard plates are stacked in sequence, the two hard plates are separated by two prepregs 21, the hard plates are separated from the soft plates by three prepregs 21, the two soft plates are separated from each other by three prepregs 21 and are separated by a preset gap, and after stacking, the top surface and the bottom surface of the integral plate are provided with two prepregs 21, a third copper layer 24, an electroplated layer 25 and a solder resist layer 26 in sequence.
More specifically, the hard board and the soft board are separated by three prepregs 21, wherein two prepregs 21 have the same length, the length of the prepreg 21 is the same as that of the hard board, the length of the remaining one prepreg 21 is smaller than that of the hard board, the remaining one prepreg 21 is tightly attached to the first copper layer 12 of the soft board, the end parts of the remaining one prepreg 21 correspond to the adhesive layer 13 and the covering film layer 14, and the thickness of the remaining one prepreg is the same as the sum of the thicknesses of the adhesive layer 13 and the covering film layer 14.
More specifically, the two flexible boards are separated by three prepregs 21, wherein the thicknesses of the two prepregs 21 are the same, the thickness of the prepregs 21 is the same as the sum of the thicknesses of the two layers of the adhesive layer 13 and the covering film layer 14, the length of the prepregs 21 is smaller than that of the rest one prepreg 21, the rest one prepreg 21 is positioned between the two prepregs 21 with the same thickness, and the rest one prepreg 21 is used for separating the two flexible boards by a preset gap.
The multilayer soft and hard combined printed circuit board layered design in the embodiment can solve the problem that the bending area of the soft board loses flexibility due to being pressed together, thereby meeting the requirement of bending.
Example 2
As shown in fig. 2, the present embodiment provides a film laminating device for performing regional film lamination on a surface of a plate, where the laminated film is a cover film, and the film laminating device includes a conveying mechanism 5, a jacking mechanism 4, a limiting mechanism and film laminating equipment.
Specifically, the conveying mechanism 5 is annular, because the space size is limited, only part of the conveying mechanism 5 is shown in the drawing, the conveying mechanism 5 is provided with a through groove 51 at a preset position, the conveying mechanism 5 is used for conveying boards to the through groove 51 in sequence, the board size is larger than the through groove 51, so that the boards can be covered on the through groove 51, the jacking mechanism 4 is arranged below the through groove 51, the limiting mechanism is arranged above the through groove 51, the jacking mechanism 4 is used for lifting the boards at the through groove 51 to the limiting mechanism, the limiting mechanism is used for adjusting and positioning the lifted boards, the boards are prevented from being displaced, the film pasting equipment is arranged above the limiting mechanism and used for pasting films on the boards, and the film pasting equipment is conventional equipment, and the structure of the film pasting equipment is not specifically shown in the drawing.
The film pasting method comprises the following steps:
s21, conveying a plate to the through groove 51 by the conveying mechanism 5, wherein the position of the plate at the through groove 51 is not strictly limited, and the plate can be adjusted by the limiting mechanism in the later stage even if the position of the plate is deviated;
s22, lifting the plate at the through groove 51 by the jacking mechanism 4 until the plate is positioned in the action range of the limiting mechanism;
s23, adjusting and positioning the plate by the limiting mechanism so that the area of the plate to be subjected to film pasting is positioned in the action range of film pasting equipment;
s24, carrying out regional film pasting on the top surface of the plate by film pasting equipment;
s25, loosening the plate by the limiting mechanism, enabling the plate to descend onto the conveying mechanism 5 by the jacking mechanism 4, continuously conveying the plate to the turning position by the conveying mechanism 5, turning the plate by using manual or turning equipment, and then starting execution from the step S21 until double-sided film pasting of the plate is completed and then taking out the plate.
More specifically, as shown in fig. 2-4, the limiting mechanism comprises two limiting components symmetrical about the conveying mechanism 5, the limiting components comprise a bottom plate 31, a T-shaped plate 32 arranged on the bottom plate 31, two sliding plates 33, two connecting rods 34, a telescopic rod 35 and a positioning plate 36, the bottom plate 31 is arranged on a supporting frame, the bottom plate 31 is provided with a sliding groove 311 penetrating through the bottom plate 31, a power source of the telescopic rod 35 can be driven by an air cylinder, an oil cylinder or hydraulic pressure, a movable end of the telescopic rod 35 is connected with the T-shaped plate 32, a longitudinal section of the T-shaped plate 32 faces to the outer side of the conveying mechanism 5, a first clamping plate 321 is arranged at the bottom of the longitudinal section of the T-shaped plate 32, the first clamping plate 321 passes through the sliding groove 311 downwards, two guide rails 312 symmetrical to two sides of the T-shaped plate 32 are arranged at the top of the bottom plate 31, the ends of the guide rails 312 point to the longitudinal section of the T-shaped plate 32, the sliding plates 33 are in sliding fit with the corresponding guide rails 312, two ends of the connecting rods 34 are respectively connected to one end of the transverse section of the T-shaped plate 32 and the sliding plates 33, the bottoms of the sliding plates 33 are provided with second clamping plates 331, the positioning plates 36 are positioned on the inner side of the bottom plate 31, the positioning plate 36 is connected to the T-shaped plate 32 by screws so as to be replaced, in the direction, and the plate 36 is in the conveying direction, in the conveying direction, and the length of the plate is greater than the length than the plate 36 is the plate in the length of the film.
The limiting mechanism specifically works as follows:
when the plate is lifted, the telescopic rods 35 of the two limiting assemblies are simultaneously extended to reduce the distance between the two T-shaped plates 32, so that the distance between the two positioning plates 36 is reduced, the two first clamping plates 321 are gathered on the plate, under the action of the connecting rod 34, the sliding plate 33 is driven to move towards the longitudinal section direction of the T-shaped plates 32 in the moving process of the T-shaped plates 32, the four second clamping plates 331 are further caused to gather on the plate, and the plate is adjusted and positioned through the two first clamping plates 321 and the four second clamping plates 331; after the plate is fixed, the area of the plate exposed between the two positioning plates 36 is the area of the plate to be coated.
More specifically, as shown in fig. 2, the jacking mechanism 4 includes a base 41 and a top plate 42, a lifting rod is disposed in the base 41, a power source of the lifting rod can be driven by an air cylinder, an oil cylinder or a hydraulic pressure, and a movable end of the top of the lifting rod is connected with the top plate 42.
The jacking mechanism 4 works as follows: when the plate is conveyed to the through groove 51, the lifting rod lifts the top plate 42, and the top plate 42 continues to move upwards after contacting the plate until the plate is located in the action range of the limiting mechanism.
More specifically, as shown in fig. 3, in order to increase stability of the T-shaped plate 32 during movement, a guide bar 322 is disposed at a longitudinal section of the T-shaped plate 32 and extends outward, the guide bar 322 slidably penetrates through a vertical plate 313 on the bottom plate 31, a spring is disposed at an outer periphery of the guide bar 322, and two ends of the spring are respectively connected with the longitudinal section of the T-shaped plate 32 and the vertical plate 313.
Example 3
As shown in fig. 1, the present embodiment provides a method for manufacturing a multilayer soft and hard combined printed circuit board, which can manufacture the multilayer soft and hard combined printed circuit board in embodiment 1, and includes the following steps:
s1, processing a plate: copper is coated on the two sides of the polyimide substrate 11, and then a circuit is manufactured to obtain a soft board; the rigid board 22 is coated with copper on both sides, and then a circuit is fabricated to obtain a rigid board, wherein the rigid board 22 is selected from one of a phenolic paper laminate, an epoxy paper laminate, a polyester glass felt laminate and an epoxy glass cloth laminate.
S2, film sticking: a covering film is stuck on the top surface and the bottom surface of the soft board in a regional way, the covering film is an insulating protection film, and the main function of the covering film is to cover and protect electronic elements and wires on the soft board and prevent the electronic elements and wires from being interfered and damaged by external environment, and the soft board can be protected in the process of forming the soft board.
S3, laminating: and (5) pressing the soft board and then baking the board.
S4, forming: each flexible board is formed separately, and note that this step is to form the bending area of the flexible board, and not all areas of the flexible board.
S5, laminating: the two ends of the soft board are symmetrically stacked with a plurality of hard boards, one end of the soft board is sequentially stacked in a mode of a plurality of hard boards, a plurality of soft boards and a plurality of hard boards from bottom to top, two adjacent boards are separated by a plurality of prepregs 21, and a preset gap is also formed between the two adjacent soft boards; laminating and then pressing;
s6, drilling: drilling the pressed whole plate;
s7, copper deposition/plate electricity: depositing a copper layer on the hole wall and electroplating for thickening;
s8, pattern transfer: pasting a dry film on the surface of the whole plate, exposing and developing;
s9, etching: etching the whole plate to obtain a circuit;
s10, resistance welding;
s11, molding: milling the shape.
More specifically, step S2 is to apply a film on the surface of the flexible board by using the film applying apparatus in embodiment 2, and the method is:
s21, conveying a soft board to the through groove 51 by the conveying mechanism 5;
s22, lifting the top plate 42 by the lifting rod, and continuing to move upwards after the top plate 42 contacts the plate until the soft plate is positioned in the action range of the limiting mechanism;
s23, after the soft board is lifted, the telescopic rods 35 of the two limiting assemblies are simultaneously extended to enable the space between the two positioning plates 36 to be reduced, and the two first clamping plates 321 and the four second clamping plates 331 are gathered on the soft board, so that the posture adjustment and the positioning of the soft board are realized; after the flexible board is fixed, the area of the flexible board exposed between the two positioning boards 36 is the area of the flexible board to be pasted with the film;
s24, carrying out regional film pasting on the top surface of the soft board by film pasting equipment;
s25, after film pasting on the top surface of the flexible board is completed, the telescopic rods 35 of the two limiting assemblies are shortened simultaneously, after the flexible board loses the limitation of the limiting assemblies, the lifting mechanism 4 enables the flexible board to descend onto the conveying mechanism 5 again, the conveying mechanism 5 continuously conveys the flexible board to the turnover position, the flexible board is turned over by using manual or turning equipment, and the process starts from the step S21 until the double-sided film pasting of the flexible board is completed, and then the flexible board is taken out.
In this embodiment, the circuit is formed separately on the flexible board, and the flexible board bending area is formed after the circuit is pressed with the cover film, so that even if dust and carbon powder are present, the circuit can be cleaned easily. If the multi-layer board is pressed and laminated and then the soft board bending area is formed according to the conventional method, because the two soft boards are laminated, a gap is reserved between the soft boards in the soft board bending area, and then dust and carbon powder generated by a milling cutter or laser easily enter the gap during forming, so that the clearance cannot be cleaned. The film pasting device is further utilized to carry out regional film pasting on the soft board, so that the covering film is ensured to be accurately pasted on a bending area of the soft board, and the covering film can also play a role in protecting the soft board during soft board molding.
The above embodiments are merely for illustrating the technical ideas and features of the present invention, and are not meant to be exclusive or limiting. It will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention.
Claims (6)
1. The manufacturing method of the multilayer soft and hard combined printed circuit board is characterized by comprising the following steps of:
s1, processing a plate: copper is coated on both sides of the polyimide substrate (11) and the rigid plate (22), and then circuits are manufactured to obtain a soft plate and a hard plate respectively;
s2, film sticking: a layer of covering film is stuck on the top surface and the bottom surface of the soft board in a regional way;
s3, laminating: pressing the soft board and then baking the board;
s4, forming: each soft board is formed separately;
s5, laminating: a plurality of hard plates are symmetrically stacked at two ends of the soft plate, one end of the soft plate is sequentially stacked in a mode of a plurality of hard plates, a plurality of soft plates and a plurality of hard plates from bottom to top, two adjacent plates are separated by a plurality of prepregs (21), and a preset gap is further formed between the two adjacent soft plates; laminating and then pressing;
s6, drilling: drilling the pressed whole plate;
s7, copper deposition/plate electricity: depositing a copper layer on the hole wall and electroplating for thickening;
s8, pattern transfer: pasting a dry film on the surface of the whole plate, exposing and developing;
s9, etching: etching the whole plate to obtain a circuit;
s10, resistance welding;
s11, molding: milling the shape;
step S2 is to use a film pasting device to locally paste a layer of covering film on the surface of a soft board, the film pasting device comprises a conveying mechanism (5), a jacking mechanism (4), a limiting mechanism and film pasting equipment, the conveying mechanism (5) is annular, through grooves (51) are formed in preset positions, the conveying mechanism (5) is used for sequentially conveying the soft board to the through grooves (51), the jacking mechanism (4) is arranged below the through grooves (51), the limiting mechanism is arranged above the through grooves (51), the film pasting equipment is arranged above the limiting mechanism in a supporting mode, and the film pasting method in step S2 is as follows:
s21, conveying a soft board to the through groove (51) by the conveying mechanism (5);
s22, lifting the soft board at the through groove (51) by the jacking mechanism (4) until the soft board is positioned in the action range of the limiting mechanism;
s23, adjusting and positioning the flexible board by the limiting mechanism so that the area of the flexible board to be film-pasted is positioned in the action range of film pasting equipment;
s24, carrying out regional film pasting on the top surface of the soft board by film pasting equipment;
s25, releasing the soft board by the limiting mechanism, enabling the soft board to descend onto the conveying mechanism (5) by the jacking mechanism (4), continuously conveying the soft board to a turnover position by the conveying mechanism (5), turning over the soft board by using manual or turnover equipment, and then starting execution from the step S21 until double-sided film pasting of the soft board is completed, and then taking out the soft board.
2. The method for manufacturing the multilayer soft and hard combined printed circuit board according to claim 1, wherein the limiting mechanism comprises two limiting components symmetrical about the conveying mechanism (5), the limiting components comprise a bottom plate (31) and a T-shaped plate (32) arranged on the bottom plate (31), two sliding plates (33), two connecting rods (34), a telescopic rod (35) and a positioning plate (36), the bottom plate (31) is arranged on a supporting frame, the bottom plate (31) is provided with a sliding groove (311) penetrating the bottom plate (31), the movable end of the telescopic rod (35) is connected with the T-shaped plate (32), the longitudinal section of the T-shaped plate (32) faces the outer side of the conveying mechanism (5), the bottom of the longitudinal section is provided with a first clamping plate (321), the first clamping plate (321) downwards passes through the sliding groove (311), the top of the bottom plate (31) is provided with two guide rails (312) symmetrical to the two sides of the T-shaped plate (32), the sliding plates (33) are in sliding fit with corresponding guide rails (312), two ends of the connecting rods (34) are respectively connected with one end of the transverse section of the T-shaped plate (32) and the sliding plates (33), the bottom of the sliding plates (33) is provided with a second clamping plate (331), the inner side of the positioning plate (36) is positioned on the bottom of the bottom plate (31) and is connected with the soft plate (32) in the length of the soft plate (23) in the length direction.
When the flexible board is lifted, the telescopic rods (35) of the two limiting assemblies are simultaneously extended to enable the distance between the two T-shaped plates (32) to be reduced, so that the distance between the two positioning plates (36) is reduced, the two first clamping plates (321) are gathered on the flexible board, the T-shaped plates (32) can drive the sliding plate (33) in the moving process under the action of the connecting rod (34), and the four second clamping plates (331) are further caused to be gathered on the flexible board; after the flexible board is fixed, the area of the flexible board exposed between the two positioning boards (36) is the area of the flexible board to be pasted with the film.
3. The method for manufacturing a multilayer soft and hard combined printed circuit board according to claim 1, wherein the jacking mechanism (4) comprises a base (41) and a top plate (42), a lifting rod is arranged in the base (41), a movable end of the top of the lifting rod is connected with the top plate (42), and step S22 is as follows: the lifting rod lifts the top plate (42), and the top plate (42) continuously moves upwards after contacting the soft plate until the soft plate is positioned in the action range of the limiting mechanism.
4. The multilayer soft and hard combined printed circuit board is characterized by being obtained by the manufacturing method of the multilayer soft and hard combined printed circuit board according to any one of claims 1-3, and comprising a first unit and two second units which are symmetrical to two ends of the first unit;
the first unit comprises a plurality of soft boards, the soft boards comprise polyimide base materials (11) and double-sided first copper layers (12), the top surface and the bottom surface of each soft board are outwards provided with an adhesive layer (13) and a covering film layer (14) in sequence, the adhesive layer (13) and the covering film layer (14) are the same in length, and the length of the covering film layer (14) is smaller than that of the soft board;
the second unit includes a plurality of hardboards and a plurality of prepreg (21), and the hardboard includes rigid plate (22) and two-sided second copper layer (23), from the bottom up, a plurality of hardboards, a plurality of soft boards, a plurality of hardboards stack in proper order, all separate through a plurality of prepreg (21) between two adjacent planks, and separate between two adjacent soft boards and preset the clearance, stack the back, the top surface and the bottom surface of whole plank all outwards have a plurality of prepregs (21), third copper layer (24), electroplated layer (25), solder mask (26) in proper order.
5. The multi-layer soft and hard combined printed circuit board according to claim 4, wherein two adjacent soft boards are separated by three prepregs (21), wherein the thickness of two prepregs (21) is the same as the sum of the thicknesses of two layers of the adhesive layer (13) and the covering film layer (14), the remaining one prepreg (21) is located between the two prepregs (21) with the same thickness, and the remaining one prepreg (21) extends into the preset gap.
6. The multi-layer soft and hard combined printed circuit board according to claim 4, wherein the hard board and the soft board are separated by three prepregs (21), wherein two prepregs (21) have the same length as the hard board, the length is the same as the hard board, the remaining one prepreg (21) is closely attached to the first copper layer (12) of the soft board, and the thickness of the remaining one prepreg (21) is the same as the sum of the thicknesses of the adhesive layer (13) and the covering film layer (14).
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| CN117295260A (en) | 2023-12-26 |
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