CN113163626B - Manufacturing method of ultrathin printed circuit board - Google Patents
Manufacturing method of ultrathin printed circuit board Download PDFInfo
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- CN113163626B CN113163626B CN202010073679.2A CN202010073679A CN113163626B CN 113163626 B CN113163626 B CN 113163626B CN 202010073679 A CN202010073679 A CN 202010073679A CN 113163626 B CN113163626 B CN 113163626B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
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Abstract
A manufacturing method of an ultrathin printed circuit board comprises the following steps: selecting a transparent plate as a support plate; pressing the ultrathin core plate or the copper foil on the supporting plate by adopting a light-sensitive bonding sheet; supporting the ultrathin core plate through the supporting plate, and finishing the technological processes of film pasting, exposure, development, electroplating, lamination and the like on the ultrathin core plate; after the multilayer printed circuit board is formed, the support plate and the finished ultrathin printed circuit board are detached in a laser dissociation mode. The method can effectively avoid the problems of warping, clamping and the like of the ultrathin printed circuit board in the production process, and improve the scrapping caused by the deformation of the ultrathin core board, the clamping and the like; in addition, the supporting plate used by the invention does not need to be patterned, so that the steps of film pasting, exposure, development, etching and the like are omitted, the process manufacturing flow is simplified, the yield loss caused by the related process steps is avoided, and the manufacturing cost can be greatly saved.
Description
Technical Field
The present invention relates to a manufacturing technique of a printed circuit board or a semiconductor integrated circuit package substrate, and more particularly, to a method for manufacturing an ultra-thin printed circuit board.
Background
At present, electronic products are gradually miniaturized, and have high wiring density, small volume and light weight, and as an important carrier of electronic products, printed wiring boards and packaging substrates are also gradually developed towards high-precision circuits, dense small holes and ultrathin plates, and the total plate thickness of the printed wiring boards and the packaging substrates is usually below 0.2 mm.
Because the ultrathin substrate is very thin, the ultrathin substrate is easy to have large warpage, bending deformation and the like when being manufactured by a traditional method, and the ultrathin substrate is easy to generate poor quality in the processing process to cause scrapping. For example, in the case of electroless copper plating or electrolytic copper plating, the copper plating is greatly affected by swing, air pumping, vibration and water flow impact under the condition of no frame, and the problems of easy bending, plate stacking, poor copper plating, poor plating uniformity and the like are caused. In the process of manufacturing the graph, the problems of clamping plates, wrinkles, poor alignment precision and the like are easily caused due to the deformation and the warping of the plate, and the processing difficulty is very high.
In order to solve the above problems, currently, the conventional thin plate manufacturing mainly adopts a thin plate auxiliary frame or a coreless substrate.
The sheet metal auxiliary frame, which is a generally rectangular fixed frame consisting of four side frames, fixes the sheet metal on the frame and fixes it with a fixing member. The processing process belongs to the processing with a frame. Adopt sheet metal frame processing, need reform transform equipment, once throw into highly, and the size of fixed frame is generally equivalent with the sheet size. Different frames need to be equipped according to different thin plate sizes, so that the flexibility is not achieved, and the maintenance cost of the frames is high.
The ultra-thin substrate manufactured by adopting the coreless substrate process is a hot point of the research and development of the high-end substrate at present, and the manufacturing process comprises the following steps: (see FIG. 1)
1) A support plate 1 'is adopted, wherein the support plate 1' comprises an epoxy resin dielectric layer 2 'and a copper foil layer 3';
2) firstly, pasting a film, exposing, developing and etching on a copper foil layer 3 ' on a supporting plate 1 ' to manufacture an alignment target 4 ';
3) cutting the central area of the bonding sheet 5' and only leaving the marginal area;
4) the ultra-thin substrate 6 'comprises three parts, 7' is a first copper foil layer of the ultra-thin substrate; 8' is an ultrathin substrate epoxy resin bonding sheet; 9' is a second copper foil layer of the ultrathin substrate;
5) laminating the ultrathin substrate 6 ', the bonding sheet 5' and the support plate 1 ', manufacturing a copper circuit pattern on a second copper foil layer 9' of the ultrathin substrate, and manufacturing a laminated structure;
6) and cutting the ultrathin substrate 6 ' with the laminated structure along the inner side edge positions 10 ' and 11 ' of the bonding sheet 5 ', completely cutting off the bonding sheet 5 ', separating the ultrathin substrate 6 ' from the support plate 1 ', and finally realizing the manufacture of the ultrathin substrate.
The existing manufacturing process of the ultrathin substrate has the following defects:
1. the supporting plate needs to be patterned to obtain the alignment target 4', which additionally increases the processes of film pasting, exposure, development, etching, etc., and not only has a long process, but also increases the cost.
2. After the cutting is completed, since the size of the support plate 1' has become small, the support plate cannot be reused, a new support plate must be used, and thus the cost is significantly increased.
Disclosure of Invention
The invention aims to provide a manufacturing method of an ultrathin printed circuit board, which can effectively avoid the problems of warping, clamping and the like in the production process of the ultrathin printed circuit board and improve the scrapping caused by the deformation of an ultrathin core plate, the clamping and the like; in addition, the supporting plate used by the invention does not need to be patterned, so that the steps of film pasting, exposure, development, etching and the like are omitted, the process manufacturing flow is simplified, the yield loss caused by the related process steps is avoided, and the manufacturing cost can be greatly saved.
In order to achieve the purpose, the technical scheme of the invention is as follows:
a manufacturing method of an ultrathin printed circuit board comprises the following steps:
a) selecting a supporting plate, wherein the supporting plate is made of transparent or semitransparent materials;
b) placing a light sensation bonding sheet on the front surface of the supporting plate, wherein the area of the light sensation bonding sheet is smaller than or equal to that of the supporting plate;
c) placing the ultrathin core board on a light-sensitive adhesive sheet, and curing and bonding the ultrathin core board by adopting a hot-pressing or vacuum film pressing mode; the ultrathin core board comprises an insulating layer, a first copper foil and a second copper foil, wherein the thickness of the ultrathin core board is 10-50 mu m;
d) drilling the second copper foil, and chemically depositing copper or electroplating copper to realize interlayer conduction and interconnection between the second copper foil and the first copper foil; patterning the second copper foil to form a second conductive circuit layer;
e) placing a bonding sheet on the second layer of conductive circuit layer, placing a third copper foil above the bonding sheet, and pressing in a hot pressing mode;
f) drilling the third copper foil, and chemically depositing copper or electroplating copper to realize interlayer conduction and interconnection between the third copper foil and the second copper foil;
g) patterning the third copper foil to form a third conductive circuit layer;
h) repeating the steps e, f and g until the required number of laminated layers is completed to form the multilayer printed circuit board;
i) laser dissociation is carried out from the back side direction of the supporting plate, and the separation of the light sensitive bonding sheet and the first copper foil is realized;
j) and carrying out pattern manufacturing on the first copper foil to form a first conductive circuit layer, and finally obtaining the ultrathin printed circuit board.
Further, the invention also provides a manufacturing method of the ultrathin printed circuit board, which comprises the following steps:
a) selecting a supporting plate, wherein the supporting plate is made of transparent or semitransparent materials;
b) placing a light sensation bonding sheet on the front surface of the supporting plate, wherein the area of the light sensation bonding sheet is smaller than or equal to that of the supporting plate;
c) placing the first copper foil on a light-sensitive adhesive sheet, and curing and bonding the first copper foil by adopting a hot-pressing or vacuum film pressing mode;
d) patterning the first copper foil to form a first conductive circuit layer;
e) placing a bonding sheet on the first conductive circuit layer, placing a second copper foil above the bonding sheet, and pressing in a hot pressing mode, wherein the thickness of the bonding sheet is 10-50 micrometers;
f) drilling the second copper foil, and chemically depositing copper or electroplating copper to complete interlayer conduction and interconnection between the first copper foil and the second copper foil;
g) patterning the second copper foil to form a second conductive circuit layer;
h) repeating the steps e, f and g until the required number of laminated layers is completed to form the multilayer ultrathin printed circuit board;
i) and exposing from the back direction of the support plate to realize the separation of the light sensitive adhesive sheet and the first conductive circuit layer, and finally preparing the ultrathin printed circuit board with the single-sided buried-wire laminated structure.
The invention also provides a manufacturing method of the ultrathin printed circuit board, which comprises the following steps:
a) selecting a supporting plate, wherein the supporting plate is made of transparent or semitransparent materials;
b) placing a light sensation bonding sheet on the front surface of the supporting plate, wherein the area of the light sensation bonding sheet is smaller than or equal to that of the supporting plate;
c) placing the first copper foil on a light-sensitive adhesive sheet, and curing and bonding the first copper foil by adopting a hot-pressing or vacuum film pressing mode;
d) patterning the first copper foil to form a first conductive circuit layer;
e) placing a first bonding sheet on the first conductive circuit layer, placing a second copper foil above the first bonding sheet, and pressing in a hot pressing mode, wherein the thickness of the first bonding sheet is 10-50 micrometers;
f) drilling the second copper foil, and chemically depositing copper or electroplating copper to complete interlayer conduction and interconnection between the first copper foil and the second copper foil;
g) patterning the second copper foil to form a second layer of conductive circuit;
h) repeating the steps e, f and g until n-1 layers are completed, wherein n is the total number of layers of the printed circuit board;
i) placing a second bonding sheet on the (n-1) th graphic layer, placing an outer copper foil on the second bonding sheet, and pressing the second bonding sheet in a hot pressing mode, wherein the thickness of the second bonding sheet is 10-50 mu m;
j) forming a required circuit groove and a blind hole on the outer layer copper foil and the second bonding sheet by using laser;
k) filling the circuit groove and the blind hole in a chemical copper deposition and electroplating hole filling mode;
l) removing the copper layer on the surface of the second bonding sheet by an electrolytic polishing, mechanical polishing or copper thinning process;
m) exposing from the back direction of the supporting plate to realize the separation of the light sensitive adhesive sheet and the first conductive circuit layer, and finally obtaining the ultrathin printed circuit board containing the double-sided buried wire stack structure.
Furthermore, the invention also provides a manufacturing method of the ultrathin printed circuit board, which comprises the following steps:
a) selecting a supporting plate, wherein the supporting plate is made of transparent or semitransparent materials;
b) placing a light sensation bonding sheet on the front surface of the supporting plate, wherein the area of the light sensation bonding sheet is smaller than or equal to that of the supporting plate;
c) placing the ultrathin core plate containing the embedded material on a bonding sheet, and curing and bonding the ultrathin core plate containing the embedded material by adopting a vacuum pressing or hot pressing mode; the ultrathin core board comprises an insulating layer, a first copper foil and a second copper foil, wherein the thickness of the ultrathin core board is 10-50 mu m;
d) drilling the cured second copper foil, and chemically depositing copper or electroplating copper to realize interlayer conduction and interconnection between the second copper foil and the first copper foil; patterning the second copper foil to form a second conductive circuit layer;
e) placing a bonding sheet on the second layer of conductive circuit layer, placing a third copper foil above the bonding sheet, and pressing by adopting a hot pressing mode;
f) drilling the third copper foil, and chemically depositing copper or electroplating copper to realize interlayer conduction and interconnection between the third copper foil and the second copper foil;
g) patterning the third copper foil to form a third conductive circuit layer;
h) repeating the steps e, f and g until the required number of laminated layers is completed to form the multilayer printed circuit board;
i) laser dissociation is carried out from the back side direction of the supporting plate, and the separation of the light sensitive bonding sheet and the first copper foil is realized;
j) and carrying out pattern manufacturing on the first copper foil to form a first conductive circuit layer, and finally manufacturing the ultrathin printed circuit board containing the buried capacitor.
The invention also provides a manufacturing method of the ultrathin printed circuit board, which comprises the following steps:
a) selecting a supporting plate, wherein the supporting plate is made of transparent or semitransparent materials;
b) placing a light sensation bonding sheet on the front surface of the supporting plate, wherein the area of the light sensation bonding sheet is smaller than or equal to that of the supporting plate;
c) placing the first copper foil on a light-sensitive adhesive sheet, and curing and bonding the first copper foil by adopting a hot-pressing or vacuum film pressing mode;
d) patterning the first copper foil to form a first conductive circuit layer;
e) placing a first bonding sheet on the first conductive circuit layer, placing a second copper foil above the first bonding sheet, wherein the copper foil is a buried resistance copper foil, pressing the first bonding sheet and the second bonding sheet in a hot pressing mode, the lamination parameters of the first bonding sheet are the same as those of a common copper foil, and the thickness of the first bonding sheet is 10-50 mu m;
f) drilling the cured second copper foil, and chemically depositing copper or electroplating copper to realize interlayer conduction and interconnection between the second copper foil and the first copper foil; patterning the second copper foil to form a second conductive circuit layer;
g) placing a bonding sheet on the second layer of conductive circuit layer, placing a third copper foil containing a buried resistance material above the bonding sheet, and pressing in a hot pressing mode;
h) drilling the third copper foil, and chemically depositing copper or electroplating copper to realize interlayer conduction and interconnection between the third copper foil and the second copper foil;
i) patterning the third copper foil to form a third conductive circuit layer;
j) removing the exposed resistance material by adopting an etching liquid medicine soaking mode;
k) carrying out further pattern transfer on the third conductive circuit layer to obtain the required resistance;
l) repeating the steps e, f and g until the required number of laminated layers is finished to form a multilayer printed circuit board;
m) performing laser dissociation from the back direction of the support plate to realize the separation of the light sensitive adhesive sheet and the first copper foil;
n) carrying out pattern manufacturing on the first copper foil to form a first conductive circuit layer, and finally obtaining the ultrathin printed circuit board containing the buried resistor.
Preferably, the transparent or translucent material comprises an inorganic transparent material and an organic high molecular polymer.
Preferably, the inorganic transparent material includes glass, quartz and transparent ceramics.
Preferably, the organic high molecular polymer comprises PMMA-polymethyl methacrylate, PC-polycarbonate, PS-polystyrene or PE T-polyethylene terephthalate.
Preferably, the thickness of the supporting plate is 0.1-3 mm.
Preferably, the light-sensitive adhesive sheet is a light-sensitive adhesive sheet that can be decomposed by a laser light source having a wavelength of 0.01 to 1100 μm.
Preferably, the thickness of the ultrathin printed circuit board is 10-200 mu m.
Preferably, the material layers of the first and second bonding sheets comprise epoxy resin, polyimide, polymaleimide triazine resin, polyphenylene oxide or polytetrafluoroethylene, and FR-4 or FR-5.
Preferably, the embedded material comprises a material prepared by compounding ceramic and barium titanate with epoxy resin and polyimide respectively according to a certain proportion.
Preferably, the first copper foil, the second copper foil and the outer copper foil comprise rolled copper foils, electrolytic copper foils, reversed copper foils, carrier copper foils or buried copper foils, and the thickness of the copper foils is 1.5-64 mu m.
Preferably, the resistance value of the resistor is trimmed by laser ablation while testing the resistor, so as to control the resistance value within a desired range.
The invention has the advantages that:
1. shorter process flow and higher production efficiency
The traditional coreless substrate manufacturing process flow comprises the following steps: cutting, film pasting, exposure, development, etching, PP laser milling, typesetting, lamination, graphic making and cutting.
The manufacturing process flow of the invention is as follows: cutting, typesetting, laminating, pattern making and laser separation.
In the conventional coreless substrate process, firstly, the pattern fabrication is completed on the support plate to obtain the alignment target, and the process comprises the following steps: film pasting, exposure, development, etching and the like; moreover, the prepreg needs to be subjected to laser cutting before lamination, and the plate needs to be milled and disassembled in a mechanical mode after the prepreg is manufactured, so that the plate milling time is long and the equipment capacity is limited.
The method of the invention adopts the laser dissociation mode of the light sensitive bonding sheet, can realize separation only in a few seconds, does not need the steps of film pasting, exposure, development, etching and the like, greatly shortens the process flow and improves the production efficiency.
2. The cost is lower
The method shortens the process flow and reduces the production cost.
In addition, in the traditional manufacturing process, FR4 is used as a support plate, after cutting is completed, the size of the support plate is reduced, the single side is reduced by more than 0.2mm, the size of a PCB (printed circuit board) is kept unchanged, so that the support plate cannot be reused, a new support plate must be used, the price of the support plate is usually about the RMB of every size, and for a PCB factory with the capacity of hundreds of thousands of feet, the cost of the plate can be saved about hundreds of thousands of RMB every month. In addition, the prior art also needs to carry out the processes of film pasting, exposure, development, etching and the like.
After the supporting plate and the thin plate are separated, the supporting plate can be reused, the process is shorter, the material cost, the process cost, the labor cost and the like are integrated, and the production cost can be saved each year and is considerable.
3. The product yield is higher
The method of the invention adopts inorganic materials as the support plate, has smaller expansion and shrinkage, and the expansion and shrinkage coefficient is generally less than or equal to 3 ppm/DEG C. Whereas conventional fabrication processes use FR4 material, which typically has a shrinkage of greater than 30 ppm/c, the lamination temperature during subsequent lamination is typically greater than or equal to 190 c. For the inorganic substrate, the expansion and contraction of one lamination thereof is several hundred ppm. And the expansion and contraction of the conventional FR4 substrate in one lamination can reach thousands of ppm or even higher. The multilayer laminated structure needs to be laminated for many times, and the advantage of dimensional stability is more obvious by adopting the support plate of the invention.
In addition, the traditional method adopts a mechanical cutting mode to separate, and in the cutting process, mechanical stress and distortion exist, so that warping and deformation are easily caused.
The invention adopts the laser mode for separation, does not generate extra stress, and can greatly improve the size stability of the product.
In addition, the conventional substrate may be not well separated due to non-uniform glue flow, and the product may be scrapped due to poor separation caused by adhesion.
The invention adopts a laser dissociation mode, the bonding force of the light sensation bonding sheet and the substrate is better than that of the first copper foil needing to be detached in the laser dissociation process, no residue is left on the first copper foil, and the adhesion and the corresponding secondary pollution can not be caused.
4. Green environment protection
In the conventional coreless substrate manufacturing process, firstly, pattern manufacturing needs to be completed on a support plate to obtain an alignment target, and the process comprises the following steps: film pasting, exposure, development, etching and the like. Materials required in this process include dry or wet films, developing solutions, etchants, large amounts of cleaning water, and thus generate a large amount of wastewater.
The method of the invention does not need the process steps, thereby reducing the discharge of waste water; and, traditional FR4 backup pad is after accomplishing the cutting, and the backup pad size can reduce to some extent, and unilateral reduction more than 0.2mm, and the size of PCB board remains unchanged, therefore the backup pad can not reuse, must use new backup pad, the scrapping of a large amount of materials that causes. In the method, after the supporting plate is separated from the thin plate, the supporting plate can be reused, so that a large amount of material consumption is saved, and the method is green, environment-friendly and sustainable in development.
5. The printed circuit board has higher integration level and lower surface patch quantity
In the assembly of the printed circuit board, various passive elements such as capacitors, resistors, inductors and the like account for the majority, the ratio of the number of the passive elements to the number of the active elements is (15-20): 1, and the number of the passive elements is continuously and rapidly increased along with the improvement of the integration level of the IC and the increase of the I/O number of the IC. A large number of embedded passive elements are embedded into the printed circuit board, so that the mutual line length of the elements can be shortened, the electrical characteristics are improved, the effective packaging area of the printed circuit board is increased, a large number of welding points on the surface of the printed circuit board are reduced, the packaging reliability is improved, and the cost is reduced.
The printed circuit board containing the buried capacitor and the buried resistor is manufactured by the method, so that the manufacture of a more precise circuit can be realized.
The thickness of a buried capacitor material layer used in the process of manufacturing the buried capacitor is only 8-10 microns, and if the traditional process is adopted, the material is easy to crack due to direct single-sided or double-sided etching; in addition, due to the fact that the material is ultrathin and poor in rigidity, warping and deformation are prone to occur in the manufacturing process, poor alignment accuracy and copper leakage occur in the etching process, and scrapping is caused.
The method of the invention adopts inorganic materials such as glass and the like as the supporting plate, can solve the problem of insufficient rigidity in the process, has smaller deformation and warpage, higher alignment precision and less scrap, and greatly improves the product yield.
In addition, the traditional process method is adopted to manufacture the embedded resistor, the problems of warping, deformation and the like can occur in the manufacturing process due to insufficient rigidity of the material, and the finally manufactured resistance value is controlled within +/-20 percent.
In the method, inorganic materials such as glass and the like are used as the supporting plate, so that scrappage caused by warping deformation and the like can be reduced to a great extent; in addition, the resistance value of the resistor is corrected in a laser ablation mode while the resistor is tested, and the accuracy of the finally manufactured resistance value can be controlled within +/-2%.
Drawings
FIG. 1 is a cross-sectional view of a prior art product configuration;
FIGS. 2 to 8 are flowcharts of embodiment 1 of the present invention;
FIG. 2, FIGS. 9 to 14 are flow charts of embodiment 2 of the present invention;
FIG. 2, FIG. 9 to FIG. 12, FIG. 15 to FIG. 20 are flow charts of embodiment 3 of the present invention;
FIG. 2 and FIGS. 21 to 26 are flow charts of embodiment 4 of the present invention;
fig. 2 to 4 and fig. 27 to 35 are flowcharts of embodiment 5 of the present invention.
Detailed Description
The invention is described in detail below with reference to examples and figures:
example 1
The manufacturing method of the ultrathin printed circuit board comprises the following steps:
a) selecting a supporting plate 1, wherein the thickness of the supporting plate 1 is between 0.1mm and 3mm, as shown in figure 2;
b) selecting a light sensation bonding sheet 2 and an ultrathin core board (double-sided copper-clad) 3, wherein the size of the ultrathin core board 3 is the same as the size of the light sensation bonding sheet 2 or slightly smaller than the size of the light sensation bonding sheet 2, placing the light sensation bonding sheet 2 on a support plate 1, placing the ultrathin core board 3 on the light sensation bonding sheet 2, and performing lamination by adopting a vacuum lamination or hot pressing mode, as shown in fig. 3;
c) laser drilling, chemical plating and electroplating are carried out on the ultrathin core plate 3 to obtain a blind hole 5, so that the second copper foil 301 is electrically connected with the first copper foil 303; carrying out pattern transfer on the second copper foil to form a second conductive circuit layer 4; as shown in fig. 4; in the process, the prior art is adopted for laser drilling, chemical plating, electroplating and pattern transfer;
d) placing the bonding sheet 6 on the surface of the second conductive circuit layer 4, placing the copper foil 7 above the bonding sheet 6, and pressing in a hot pressing manner, as shown in fig. 5;
e) performing laser drilling, chemical plating and electroplating to obtain a blind hole 8, and performing pattern transfer on the copper foil 7 to form a third conductive circuit layer 9; repeating the steps d and e to obtain circuit boards with different layers; as shown in fig. 6;
f) performing exposure treatment from the back surface of the support plate 1 to separate the support plate 1 and the light-sensitive adhesive sheet 2 from the ultra-thin wiring board, as shown in fig. 7;
g) the first copper foil 303 is subjected to pattern transfer to form a first conductive circuit layer 10, so that the ultrathin printed wiring board is manufactured, as shown in fig. 8.
Example 2
The invention relates to a manufacturing method of an ultrathin printed circuit board, which comprises the following steps:
a) selecting a support plate 1, wherein the thickness of the support plate 1 is 0.1mm-3mm, as shown in figure 2;
b) placing the light sensation bonding sheet 2 on the support plate 1, placing the first copper foil 11 on the light sensation bonding sheet 2, and performing lamination by adopting a vacuum lamination or hot pressing mode, as shown in fig. 9; the sizes of the light sensation bonding sheet 2 and the first copper foil 11 are slightly smaller than that of the support plate 1, and the sizes of the light sensation bonding sheet 2 and the first copper foil 11 are equivalent;
c) carrying out pattern transfer on the first copper foil 11 to form a first conductive circuit layer 12, as shown in fig. 10, wherein the pattern transfer adopts the prior art in the process;
d) placing the bonding sheet 13 on the surface of the first conductive trace layer 12, placing the second copper foil 14 on the bonding sheet 13, and performing lamination by using a hot pressing manner, as shown in fig. 11;
e) performing laser drilling, chemical plating and electroplating on the second copper foil 14 to obtain a blind hole 15, so that the second copper foil 14 is electrically connected with the first copper foil 11;
f) carrying out pattern transfer on the second copper foil 14 to form a third conductive circuit layer 16; repeating the steps d and e in sequence to obtain circuit boards with different layers, as shown in fig. 12;
g) the support plate 1 and the photosensitive adhesive sheet 2 are separated from the ultrathin wiring board by performing exposure treatment from the back surface of the support plate 1, and the ultrathin printed wiring board with the single-sided buried wiring is obtained as shown in fig. 13 and 14.
Example 3
The invention discloses a manufacturing method of an ultrathin printed circuit board, wherein a conductive circuit comprises the following steps:
a) selecting a support plate 1, wherein the thickness of the support plate 1 is 0.1-3 mm, as shown in figure 2;
b) selecting a light sensation bonding sheet 2 and a first copper foil 11, wherein the size of the light sensation bonding sheet 2 and the size of the first copper foil 11 are slightly smaller than that of the support plate 1; the light-sensitive adhesive sheet 2 and the first copper foil 11 have the same size; placing the light sensation bonding sheet 2 on the support plate 1, placing the first copper foil 11 on the light sensation bonding sheet 2, and pressing in a vacuum pressing or hot pressing mode, as shown in fig. 9;
c) carrying out pattern transfer on the first copper foil 11 to form a first conductive circuit layer 12, wherein the pattern transfer adopts the prior art in the process, as shown in fig. 10;
d) placing the bonding sheet 13 on the surface of the first conductive circuit layer 12, placing the second copper foil 14 above the bonding sheet 13, and performing lamination by using a hot pressing manner, as shown in fig. 11;
e) laser drilling, chemical plating and electroplating are carried out on the second copper foil 14 to obtain a blind hole 15, so that the second copper foil 14 is electrically connected with the first copper foil 11; carrying out pattern transfer on the second copper foil 14 to form a third conductive circuit layer 16; repeating the steps d and e in sequence to obtain circuit boards with different layers until the secondary outer layer, as shown in fig. 12;
f) placing the second bonding sheet 17 on the surface of the second outer layer conductive circuit layer, placing the outer layer copper foil 18 on the second bonding sheet 17, and pressing in a hot pressing manner, as shown in fig. 15;
g) performing laser ablation on the outer copper foil 18 and the second bonding sheet 17 by using laser to obtain a required wire groove 19 and a required blind hole 20, as shown in fig. 16;
h) filling up the circuit grooves 19 and the blind holes 20 by chemical copper and electroplating, as shown in fig. 17;
i) removing the copper layer on the dielectric surface by electrolytic polishing, mechanical polishing or copper thinning process, as shown in fig. 18;
j) exposing from the back side direction of the supporting plate 1 to realize the separation of the supporting plate 1 and the first conducting circuit layer; finally, the ultrathin printed circuit board with the buried wires on the two sides is manufactured, as shown in fig. 19 and 20.
Example 4
The invention relates to a manufacturing method of an ultrathin printed circuit board, which comprises the following steps:
a) selecting a support plate 1, wherein the thickness of the support plate 1 is 0.1-3 mm, as shown in figure 2;
b) selecting a light sensation bonding sheet 2 and an ultrathin core plate 21 (with two sides coated with copper) made of a capacitor-embedded material, wherein the light sensation bonding sheet 2 and the ultrathin core plate 21 are slightly smaller than the support plate 1 in size; the light sensation bonding sheet 2 and the ultrathin core plate 21 have the same size; placing the light sensation bonding sheet 2 on the support plate 1, placing the ultrathin core plate 21 on the light sensation bonding sheet 2, and pressing in a vacuum pressing or hot pressing mode; as shown in fig. 21;
c) laser drilling, chemical plating and electroplating are carried out on the ultrathin core plate 21 to obtain a blind hole 22, so that the second copper foil 2101 is electrically connected with the first copper foil 2103; performing pattern transfer on the second copper foil 2101 to form a second conductive trace layer 23, as shown in fig. 22;
d) placing the bonding sheet on the surface of the second conductive circuit layer 23, placing the third copper foil 25 above the bonding sheet, and performing lamination by using a hot pressing manner, as shown in fig. 23;
e) laser drilling, chemical plating and electroplating are carried out on the third copper foil 25 to obtain a blind hole 26, so that the third copper foil is electrically connected with the second copper foil; carrying out pattern transfer on the third copper foil to form a third conductive circuit layer 27; repeating the steps d and e to obtain circuit boards with different layers, as shown in fig. 24;
f) performing exposure treatment from the back surface of the support plate 1 to separate the support plate 1 and the photosensitive adhesive sheet 2 from the ultra-thin wiring board, as shown in fig. 25;
g) the first copper foil 2103 is subjected to pattern transfer to form a first conductive circuit layer 28, so that an ultrathin printed wiring board with a buried capacitor is manufactured, as shown in fig. 26.
Example 5
The invention relates to a manufacturing method of an ultrathin printed circuit board, which comprises the following steps:
a) selecting a support plate 1, wherein the thickness of the support plate 1 is between 0.1mm and 3mm, as shown in figure 2;
b) selecting a light sensation bonding sheet 2 and an ultrathin core board (double-sided copper cladding) 3, wherein the size of the light sensation bonding sheet 2 and the size of the ultrathin core board 3 are slightly smaller than that of the support plate 1; the light sensation bonding sheet 2 and the ultrathin core plate 3 have the same size; placing the light sensation bonding sheet 2 on the support plate 1, placing the ultrathin core plate 3 on the light sensation bonding sheet 2, and pressing in a vacuum pressing or hot pressing mode, as shown in fig. 3;
c) laser drilling, chemical plating and electroplating are carried out on the ultrathin core board to obtain a blind hole 5, so that the second copper foil is electrically connected with the first copper foil; carrying out pattern transfer on the second copper foil to form a second conductive circuit layer 4; in the process, laser drilling, chemical plating, electroplating and pattern transfer all adopt the prior art, as shown in figure 4;
d) placing a bonding sheet 29 on the surface of the second conductive circuit layer 4, and placing a buried resistance copper foil 30 on the bonding sheet 29, wherein the buried resistance copper foil comprises a layer of resistance material 31 and a layer of third copper foil 32, and the layers are pressed in a hot pressing manner, as shown in fig. 27;
e) laser drilling, chemical plating and electroplating are carried out on the third copper foil 32 to obtain a blind hole 33, so that the third copper foil is electrically connected with the second copper foil; carrying out pattern transfer on the third copper foil to form a third conductive circuit layer 34, as shown in fig. 28;
f) removing the exposed resistor material by soaking with etching solution, as shown in fig. 29;
g) continuing to perform pattern transfer on the third conductive circuit layer 34 to obtain a resistor 35 as shown in the figure, and further processing the resistor in a laser processing manner to control the resistance value within a desired range, as shown in fig. 30;
h) repeating the steps d, e, f and g to obtain circuit boards with different layers, wherein the number of the buried layers is 1 to the required number, as shown in fig. 31 and 32;
i) performing exposure treatment from the back surface of the support plate 1 to separate the support plate 1 and the photosensitive adhesive sheet 2 from the ultra-thin wiring board, as shown in fig. 33 and 34;
j) the first copper foil 303 is subjected to pattern transfer to form a first conductive circuit layer 41, so that the ultrathin printed wiring board containing the buried resistor is manufactured, as shown in fig. 35.
Claims (16)
1. A manufacturing method of an ultrathin printed circuit board is characterized by comprising the following steps:
a) selecting a supporting plate, wherein the supporting plate is made of transparent or semitransparent materials;
b) placing a light sensation bonding sheet on the front surface of the supporting plate, wherein the area of the light sensation bonding sheet is smaller than or equal to that of the supporting plate;
c) placing the ultrathin core plate on a light sensation bonding sheet, and curing and bonding in a hot pressing or vacuum film pressing mode; the ultrathin core board comprises an insulating layer, a first copper foil and a second copper foil, wherein the thickness of the ultrathin core board is 10-50 mu m;
d) drilling the second copper foil, and chemically depositing copper or electroplating copper to realize interlayer conduction and interconnection between the second copper foil and the first copper foil; patterning the second copper foil to form a second conductive circuit layer;
e) placing a bonding sheet on the second conductive circuit layer, placing a third copper foil above the bonding sheet, and pressing in a hot pressing mode;
f) drilling the third copper foil, and chemically depositing copper or electroplating copper to realize interlayer conduction and interconnection between the third copper foil and the second copper foil;
g) patterning the third copper foil to form a third conductive circuit layer;
h) repeating the steps e, f and g until the required number of laminated layers is completed to form the multilayer printed circuit board;
i) laser dissociation is carried out from the back side direction of the supporting plate, and the separation of the light sensitive bonding sheet and the first copper foil is realized;
j) and carrying out pattern manufacturing on the first copper foil to form a first conductive circuit layer, and finally manufacturing the ultrathin printed circuit board.
2. A manufacturing method of an ultrathin printed circuit board is characterized by comprising the following steps:
a) selecting a supporting plate which is made of transparent or semitransparent materials;
b) placing a light sensation bonding sheet on the front surface of the supporting plate, wherein the area of the light sensation bonding sheet is smaller than or equal to that of the supporting plate;
c) placing the first copper foil on a light-sensitive adhesive sheet, and curing and bonding the first copper foil by adopting a hot-pressing or vacuum film pressing mode;
d) patterning the first copper foil to form a first conductive circuit layer;
e) placing a bonding sheet on the first conductive circuit layer, placing a second copper foil above the bonding sheet, and pressing in a hot pressing mode, wherein the thickness of the bonding sheet is 10-50 micrometers;
f) drilling the second copper foil, and chemically depositing copper or electroplating copper to complete interlayer conduction and interconnection between the first copper foil and the second copper foil;
g) patterning the second copper foil to form a second conductive circuit layer;
h) repeating the steps e, f and g until the required number of laminated layers is completed, and forming the multilayer ultrathin printed circuit board;
i) and exposing from the back direction of the supporting plate to realize the separation of the light sensitive adhesive sheet and the first conductive circuit layer, and finally preparing the ultrathin printed circuit board containing the single-sided buried wire.
3. A manufacturing method of an ultrathin printed circuit board is characterized by comprising the following steps:
a) selecting a supporting plate, wherein the supporting plate is made of transparent or semitransparent materials;
b) placing a light sensation bonding sheet on the front surface of the supporting plate, wherein the area of the light sensation bonding sheet is smaller than or equal to that of the supporting plate;
c) placing the first copper foil on a light-sensitive adhesive sheet, and curing and bonding the first copper foil by adopting a hot-pressing or vacuum film pressing mode;
d) patterning the first copper foil to form a first conductive circuit layer;
e) placing a first bonding sheet on the first conductive circuit layer, placing a second copper foil above the first bonding sheet, and pressing in a hot pressing mode, wherein the thickness of the first bonding sheet is 10-50 micrometers;
f) drilling the second copper foil, and chemically depositing copper or electroplating copper to complete interlayer conduction and interconnection between the first copper foil and the second copper foil;
g) patterning the second copper foil to form a second conductive circuit layer;
h) repeating the steps e, f and g until n-1 layers are completed, wherein n is the total number of layers of the printed circuit board;
i) placing a second bonding sheet on the n-1 th conductive circuit layer, placing an outer layer copper foil on the second bonding sheet, and pressing the second bonding sheet in a hot pressing mode, wherein the thickness of the second bonding sheet is 10-50 micrometers;
j) forming a required circuit groove and a blind hole on the outer layer copper foil and the second bonding sheet by using laser;
k) filling the circuit groove and the blind hole in a chemical copper deposition and electroplating hole filling mode;
l) removing the copper layer on the surface of the second bonding sheet by an electrolytic polishing, mechanical polishing or copper thinning process;
m) exposing from the back direction of the supporting plate to realize the separation of the light sensitive adhesive sheet and the first conductive circuit layer, and finally obtaining the ultrathin printed circuit board containing the double-sided buried wire stack structure.
4. The method of claim 3, wherein the first and second bonding sheets comprise epoxy resin, polyimide, polymaleimide triazine resin, polyphenylene oxide or polytetrafluoroethylene, and FR-4 or FR-5.
5. The method of claim 3, wherein the first, second and outer copper foils comprise rolled copper foil, electrolytic copper foil, reversed copper foil, carrier copper foil or buried copper foil, and the thickness of the copper foil is 1.5 to 64 μm.
6. A manufacturing method of an ultrathin printed circuit board is characterized by comprising the following steps:
a) selecting a supporting plate, wherein the supporting plate is made of transparent or semitransparent materials;
b) placing a light sensation bonding sheet on the front surface of the supporting plate, wherein the area of the light sensation bonding sheet is smaller than or equal to that of the supporting plate;
c) placing the ultrathin core plate containing the embedded material on a bonding sheet, and curing and bonding the ultrathin core plate containing the embedded material by adopting a vacuum pressing or hot pressing mode; the ultrathin core plate comprises an insulating layer, and a first copper foil and a second copper foil which are arranged on the upper portion and the lower portion of the insulating layer, and the thickness of the ultrathin core plate is 10-50 mu m;
d) after curing, drilling the second copper foil, and chemically depositing copper or electroplating copper to realize interlayer conduction and interconnection between the second copper foil and the first copper foil; patterning the second copper foil to form a second conductive circuit layer;
e) placing a bonding sheet on the second conductive circuit layer, placing a third copper foil above the bonding sheet, and pressing in a hot pressing mode;
f) drilling the third copper foil, and chemically depositing copper or electroplating copper to realize interlayer conduction and interconnection between the third copper foil and the second copper foil;
g) patterning the third copper foil to form a third conductive circuit layer;
h) repeating the steps e, f and g until the required number of laminated layers is completed to form the multilayer printed circuit board;
i) laser dissociation is carried out from the back side direction of the supporting plate, and the separation of the light sensitive bonding sheet and the first copper foil is realized;
j) and carrying out pattern manufacturing on the first copper foil to form a first conductive circuit layer, and finally manufacturing the ultrathin printed circuit board containing the buried capacitor.
7. The method of claim 6, wherein the capacitor-embedded material comprises a material of ceramics, barium titanate, epoxy resin and polyimide, respectively, in a certain ratio.
8. A manufacturing method of an ultrathin printed circuit board is characterized by comprising the following steps:
a) selecting a supporting plate, wherein the supporting plate is made of transparent or semitransparent materials;
b) placing a light sensation bonding sheet on the front surface of the supporting plate, wherein the area of the light sensation bonding sheet is smaller than or equal to that of the supporting plate;
c) placing the first copper foil on a light-sensitive adhesive sheet, and curing and bonding the first copper foil by adopting a hot-pressing or vacuum film pressing mode;
d) patterning the first copper foil to form a first conductive circuit layer;
e) placing a first bonding sheet on the first conductive circuit layer, placing a second copper foil above the first bonding sheet, wherein the copper foil is a buried resistance copper foil, pressing the first bonding sheet and the second bonding sheet in a hot pressing mode, the lamination parameters of the first bonding sheet are the same as those of a common copper foil, and the thickness of the first bonding sheet is 10-50 mu m;
f) after curing, drilling the second copper foil, and chemically depositing copper or electroplating copper to realize interlayer conduction and interconnection between the second copper foil and the first copper foil; patterning the second copper foil to form a second conductive circuit layer;
g) placing a bonding sheet on the second conductive circuit layer, placing a third copper foil containing a resistance embedding material above the bonding sheet, and pressing in a hot pressing mode;
h) drilling the third copper foil, and chemically depositing copper or electroplating copper to realize interlayer conduction and interconnection between the third copper foil and the second copper foil;
i) patterning the third copper foil to form a third conductive circuit layer;
j) removing the exposed resistance material by adopting an etching liquid medicine soaking mode;
k) carrying out further pattern transfer on the third conductive circuit layer to obtain the required resistance;
l) repeating the steps e, f and g until the required number of laminated layers is finished to form a multilayer printed circuit board;
m) performing laser dissociation from the back direction of the support plate to realize the separation of the light-sensitive bonding sheet and the first copper foil;
n) carrying out pattern manufacturing on the first copper foil to form a first conductive circuit layer, and finally manufacturing the ultrathin printed circuit board containing the buried resistor.
9. The method of manufacturing an ultra-thin printed circuit board as claimed in claim 8, wherein said step k corrects the resistance value of the resistor by laser ablation while testing the resistor, so as to control the resistance value within a desired range.
10. The method for manufacturing an ultra-thin printed circuit board as claimed in claim 1, 2, 3, 6 or 8, wherein the transparent or semi-transparent material comprises an inorganic transparent material and an organic high molecular polymer.
11. The method of claim 10, wherein the inorganic transparent material comprises glass, quartz, and transparent ceramic.
12. The method of claim 10, wherein the organic polymer comprises PMMA-polymethylmethacrylate, PC-polycarbonate, PS-polystyrene or PE T-polyethylene terephthalate.
13. The method for manufacturing an ultra-thin printed circuit board as claimed in claim 1, 2, 3, 6 or 8, wherein the thickness of the supporting plate is 0.1-3 mm.
14. The method for manufacturing an ultra-thin printed circuit board as claimed in claim 1, 2, 3, 6 or 8, wherein the photo-sensitive adhesive sheet is a photo-sensitive adhesive sheet that can be decomposed by a laser light source having a wavelength of 0.01 to 1100 μm.
15. The method for manufacturing an ultra-thin printed circuit board as claimed in claim 1, 2, 3, 6 or 8, wherein the thickness of the ultra-thin printed circuit board is 10 to 200 μm.
16. The method of manufacturing an ultra-thin printed circuit board as claimed in claim 1, 2, 6 or 8, wherein the first and second copper foils comprise rolled copper foil, electrolytic copper foil, reversed copper foil, carrier copper foil or buried copper foil, and the thickness of the copper foil is 1.5 to 64 μm.
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| CN114107855B (en) * | 2021-09-09 | 2022-08-19 | 九江德福科技股份有限公司 | Surface passivation treatment method of cathode roller for electrolytic copper foil |
| CN114302563A (en) * | 2021-12-28 | 2022-04-08 | 龙南骏亚柔性智能科技有限公司 | Production method applied to grinding of ultrathin circuit board |
| CN118488664A (en) * | 2024-06-18 | 2024-08-13 | 江苏博敏电子有限公司 | Technology for solving single-sided flatness of blind holes on outer layer of substrate based on coreless technology |
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