CN105407653A - Manufacturing method of circuit board - Google Patents
Manufacturing method of circuit board Download PDFInfo
- Publication number
- CN105407653A CN105407653A CN201510870899.7A CN201510870899A CN105407653A CN 105407653 A CN105407653 A CN 105407653A CN 201510870899 A CN201510870899 A CN 201510870899A CN 105407653 A CN105407653 A CN 105407653A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- circuit
- layer
- manufacture method
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1383—Temporary protective insulating layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/304—Protecting a component during manufacturing
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention belongs to the field of printed circuit board equipment, and particularly relates to a manufacturing method of a circuit board. The method comprises the following steps: carrying out cutting and board baking; fabricating an inner-layer line; carrying out lamination; drilling an outer layer; carrying out outer copper deposition; carrying out full-plate electroplating; fabricating an outer-layer line; carrying out pattern plating; carrying out appearance etching; carrying out resistance welding; carrying out a test; carrying out molding and milling; and the like, and also comprises a step of attaching a protecting adhesive film to the surface of the circuit board and windowing before the molding and milling step, wherein the windowing position of the protective adhesive film is a milling path through which an end-mill passes in the milling process. The protecting adhesive film is attached to the surface of the circuit board and is windowed, so that the target that the golden finger surface of the circuit board is not oxidized or scratched is achieved.
Description
Technical field
The invention belongs to printed circuit board apparatus field, particularly relate to a kind of manufacture method of circuit board.
Background technology
Printed circuit board is one of vitals of electronics industry, is the carrier of the supporter of electronic devices and components, electrical connection.Along with future developments such as electric terminal multifunction, high-precision densification and diversification, quality of circuit board is had higher requirement, therefore in making circuit boards, strict management and control is needed to quality.
Battery circuit board contact golden finger position is gold-plated general in 30 microinch, its price is more expensive, and the requirement of client to golden finger portion faces outward appearance is very strict, therefore it is careful to need in surface treatment+contact golden finger position gold-plated aftershaping process operations, and existing most of company plate face when the process of milling gong is all that bare board milling gong does not add up-protective layer, plate face and the oxidation of contact golden finger position is easily caused to spend with wiping; In addition, battery circuit board finished product shipment size is little, be difficult to wash trigger clean surface after shaping dirty, and clean major part company is all manual cleaning, and this kind of cleaning method is very easy to cause plate face golden finger position to wipe flower except not washing clean clearly.
Summary of the invention
In view of this, the invention provides a kind of manufacture method of circuit board, to solve the oxidizable problem with wiping flower of available circuit edge connector face.
The present invention is achieved in that a kind of manufacture method of circuit board, comprises the steps: sawing sheet baking sheet; Internal layer circuit makes; Pressing; Outer boring; Outer heavy copper; Electric plating of whole board; Outer-layer circuit makes; Graphic plating; Profile etch; Welding resistance; Test; Shaping milling gong; Also step is provided with: stick protection glued membrane at circuit board surface and window before described shaping milling gong step; Described protection glued membrane position of windowing is the milling gong path of the gong cutter process when milling gong.
Further, arrange fixed head respectively in the outside of described protection glued membrane, fixed by the semi-finished product circuit board posting protection glued membrane, then on fixed head, desired location carries out milling gong; The width that described protection glued membrane is windowed must 2mil larger than the width in gong cutter milling gong path.
Further, in the step of described sawing sheet baking sheet, comprise and select TG150 wiring board to carry out sawing sheet, setting baking sheet parameter 150 DEG C × 4H carries out baking sheet.
Further, in described pressing step; Be included on the circuit board after baking sheet and press one deck dry film, utilize UV light to expose by film aligning and circuit on the film is transferred on plate face by visualization way, and first etch with negative film flow process and move back film mode again and make circuit; Then by the pressing formula set, the core material and prepreg of making line pattern are added that outer copper foil is heated to press together.
Further, in the step of described electric plating of whole board; Electric plating of whole board plates the layers of copper of 5-8um on plate face.
Further, in the step that described outer-layer circuit makes, press one deck dry film on circuit boards, utilize the exposure of UV light and visualization way to be transferred on plate face by circuit on the film by film aligning.
Further, in the step of described graphic plating, to window place's copper facing zinc-plated at circuit, hole copper Min20 micron, the thick 3-5 micron of tin.
Further, in the step of described profile etch: remove photopolymer layer, and etch away the copper below photopolymer layer, then remove tin coating, make the outer-layer circuit of battery circuit board completely out exposed.
Further, in described welding resistance step; Adopt white reticulated printing at plate coated on both sides green oil, and surface-treated copper will be needed out exposed by film aligning exposure imaging mode, and adopt wire mark to be coated on plate face by white marking ink.
Further, after described welding resistance step, also comprise immersion Ni/Au and the gold-plated step of contact golden finger; By clean for process in copper face and hole, and heavy upper nickel-gold layer in its surface, be set up plate one deck layer gold at contact golden finger position, heavy nickel-gold layer surface thick 120-150 microinch, wherein golden thick Min1 microinch, contact golden finger position is set up Gold plated Layer Min30 microinch.
In the manufacture method of circuit board provided by the invention, stick protection glued membrane windowing owing to adopting at circuit board surface; Reach and solve the not oxidized object with wiping flower in circuit board golden finger face.
Accompanying drawing explanation
fig. 1it is the signal of the manufacture method of circuit board provided by the invention
figure.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with
accompanying drawingand execution mode, the present invention is further elaborated.Should be appreciated that embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
The invention provides a kind of manufacture method of circuit board, comprise the steps: sawing sheet baking sheet; Internal layer circuit makes; Pressing; Outer boring; Outer heavy copper; Electric plating of whole board; Outer-layer circuit makes; Graphic plating; Profile etch; Welding resistance; Test; Shaping milling gong; Also step is provided with: stick protection glued membrane at circuit board surface and window before described shaping milling gong step; Described protection glued membrane position of windowing is the milling gong path of the gong cutter process when milling gong.
Protection glued membrane windowing is sticked at circuit board surface owing to adopting; Reach and solve the not oxidized object with wiping flower in circuit board golden finger face.
Below in conjunction with embodiment, realization of the present invention is described in detail.
as Fig. 1shown in, be the manufacture method signal of circuit board provided by the invention
figure, the manufacture method of this circuit board comprises the steps: sawing sheet baking sheet; Internal layer circuit makes; Pressing; Outer boring; Outer heavy copper; Electric plating of whole board; Outer-layer circuit makes; Graphic plating; Profile etch; Welding resistance; Test; Shaping milling gong; Also step is provided with: stick protection glued membrane at circuit board surface and window before described shaping milling gong step; Described protection glued membrane position of windowing is the milling gong path of the gong cutter process when milling gong.
Further, arrange fixed head respectively in the outside of described protection glued membrane, fixed by the semi-finished product circuit board posting protection glued membrane, then on fixed head, desired location carries out milling gong; The width that described protection glued membrane is windowed must 2mil larger than the width in gong cutter milling gong path.
Further, in the step of described sawing sheet baking sheet, comprise and select TG150 wiring board to carry out sawing sheet, setting baking sheet parameter 150 DEG C × 4H carries out baking sheet.
Further, in described pressing step; Be included on the circuit board after baking sheet and press one deck dry film, utilize UV light to expose by film aligning and circuit on the film is transferred on plate face by visualization way, and first etch with negative film flow process and move back film mode again and make circuit; Then by the pressing formula set, the core material and prepreg of making line pattern are added that outer copper foil is heated to press together.
Further, in the step of described electric plating of whole board; Electric plating of whole board plates the layers of copper of 5-8um on plate face.
Further, in the step that described outer-layer circuit makes, press one deck dry film on circuit boards, utilize the exposure of UV light and visualization way to be transferred on plate face by circuit on the film by film aligning.
Further, in the step of described graphic plating, to window place's copper facing zinc-plated at circuit, hole copper Min20 micron, the thick 3-5 micron of tin.
Further, in the step of described profile etch: remove photopolymer layer, and etch away the copper below photopolymer layer, then remove tin coating, make the outer-layer circuit of battery circuit board completely out exposed.
Further, in described welding resistance step; Adopt white reticulated printing at plate coated on both sides green oil, and surface-treated copper will be needed out exposed by film aligning exposure imaging mode, and adopt wire mark to be coated on plate face by white marking ink.
Further, after described welding resistance step, also comprise immersion Ni/Au and the gold-plated step of contact golden finger; By clean for process in copper face and hole, and heavy upper nickel-gold layer in its surface, be set up plate one deck layer gold at contact golden finger position, heavy nickel-gold layer surface thick 120-150 microinch, wherein golden thick Min1 microinch, contact golden finger position is set up Gold plated Layer Min30 microinch.
Here is detailed step:
Sawing sheet baking sheet: select the wiring board of TG150 model to carry out sawing sheet, and setting baking sheet parameter 150 DEG C × 4H carries out baking sheet, wherein the wiring board of TG150 model is 4 laminates, its core material 0.4mmH/H.
Internal layer circuit makes: the circuit board after baking sheet presses one deck dry film, utilizes UV light to expose and circuit on the film is transferred on plate face by visualization way by film aligning, and first etches with negative film flow process and move back film mode again and make circuit.
Pressing: by the pressing formula set, the core material and prepreg of making line pattern are added that outer copper foil is heated and press together, outer copper foil need use H/H.
Outer boring: utilize drilling data to process, after completing, measured hole partially and pore size.
Outer heavy copper: nonmetal hole metallization, after heavy copper, backlight need more than 9.5 grades, and hole copper thickness is Min20um.
Electric plating of whole board: the copper plating 5-8um on plate face, it is too thin to its object is to heavy copper metapore copper, directly should not do line pattern.
Outer-layer circuit: press one deck dry film on circuit boards, utilizes UV light to expose by film aligning and circuit on the film is transferred on plate face by visualization way.
Graphic plating: to window place's copper facing zinc-plated at circuit, hole copper Min20 micron, the thick 3-5 micron of tin;
Profile etch: remove photopolymer layer, and etch away the copper below photopolymer layer, then remove tin coating, make the outer-layer circuit of battery circuit board completely out exposed.
Welding resistance/character: adopt white reticulated printing at plate coated on both sides green oil, and surface-treated copper will be needed out exposed by film aligning exposure imaging mode, and adopt wire mark to be coated on plate face by white marking ink.
Immersion Ni/Au+contact golden finger is gold-plated: by clean for process in copper face and hole, and nickel-gold layer on sinking in its surface, be set up at contact golden finger position and plate one deck layer gold, the thick 120-150 microinch in heavy nickel-gold layer surface, wherein golden thick Min1 microinch, contact golden finger position is set up Gold plated Layer Min30 microinch.
Electrical testing: the electric property detecting battery circuit board, wherein detects underproof dirty oil neutral stroke fork mark, separates scrap process after milling gong with on-gauge plate.
Shaping milling gong: sticks protection glued membrane on battery circuit board surface before shaping milling gong and windows, described protection glued membrane position of windowing is the milling gong path of the gong cutter process when milling gong.
Wherein the present invention is before shaping milling gong, needs to stick protection glued membrane on battery circuit board surface, and windows, and described protection glued membrane position of windowing is the milling gong path of the gong cutter process when milling gong; And the width that described glued membrane is windowed must be larger than the width in gong cutter milling gong path, reality is 2mil, its object is to the protection glued membrane that can not burn edge, milling gong path when can prevent gong cutter milling gong, not only ensure that milling gong complete after protection glued membrane can easily tear off, and can also prevent battery circuit edge connector face can not oxidized with wiping flower; In order to avoid the most handy laser open window of method that glued membrane is windowed appears deviation, in glued membrane width of windowing.
Highly dense phenolic board is fixed afterwards on the two sides of the battery circuit board posting protection glued membrane; and this highly dense phenolic board be provided with the window identical with protecting the corresponding size of the window's position on glued membrane and be drilled with the location hole corresponding with institute's bore position on battery circuit board, and the battery circuit board of glued membrane is protected to be fixed together with being pasted with close phenolic board by pin through described location hole.
Then by milling gong cutter on highly dense phenolic board in window along milling gong path corresponding on battery circuit board milling gong, gong goes out customer demand end product rule.
Can clean battery circuit board after milling gong completes; to remove the greasy dirt on its surface; described highly dense phenolic board is removed after cleaning; also can clean and directly remove highly dense phenolic board; then blowning installation is adopted to be blown away by type battery circuit board surface dust; then tear protection glued membrane, obtain resultant battery circuit board after tested.
Finally carry out FQC inspection: one-hundred-percent inspection plate face outward appearance, tight inspection contact golden finger position wipes flower problem;
FQA inspects by random samples: plate face outward appearance of making a random inspection, and tight inspection contact golden finger position wipes flower problem, and measured hole copper thickness, face copper thickness, thickness of dielectric layers, green oil thickness, just can shipment after the test passes such as solderability, thermal shock.
In sum, the present invention sticks protection glued membrane by circuit board surface before milling gong and at milling gong path uplifting window, protects glued membrane that battery circuit edge connector face can be made not oxidized colored with wiping; Remove after completing milling gong upper highly dense phenolic board blowning installation in type battery circuit board surface dust is walked to tear protection glued membrane just can; without the need to cleaning through washing trigger again; therefore while shortening production procedure; and decrease battery circuit board impaired risk in transport with the course of processing, reduce production cost.
The foregoing is only better embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. a manufacture method for circuit board, comprises the steps: sawing sheet baking sheet; Internal layer circuit makes; Pressing; Outer boring; Outer heavy copper; Electric plating of whole board; Outer-layer circuit makes; Graphic plating; Profile etch; Welding resistance; Test; Shaping milling gong; It is characterized in that, before described shaping milling gong step, be also provided with step: stick protection glued membrane at circuit board surface and window; Described protection glued membrane position of windowing is the milling gong path of the gong cutter process when milling gong.
2. the manufacture method of circuit board as claimed in claim 1, is characterized in that: arrange fixed head respectively in the outside of described protection glued membrane, and fixed by the semi-finished product circuit board posting protection glued membrane, then on fixed head, desired location carries out milling gong; The width 2mil larger than the width in gong cutter milling gong path that described protection glued membrane is windowed.
3. the manufacture method of circuit board as claimed in claim 2, is characterized in that: in the step of described sawing sheet baking sheet, comprises and selects TG150 wiring board to carry out sawing sheet, and setting baking sheet parameter 150 DEG C × 4H carries out baking sheet.
4. the manufacture method of circuit board as claimed in claim 3, is characterized in that: in described pressing step; Be included on the circuit board after baking sheet and press one deck dry film, utilize UV light to expose by film aligning and circuit on the film is transferred on plate face by visualization way, and first etch with negative film flow process and move back film mode again and make circuit; Then by the pressing formula set, the core material and prepreg of making line pattern are added that outer copper foil is heated to press together.
5. the manufacture method of circuit board as claimed in claim 4, is characterized in that: in the step of described electric plating of whole board; Electric plating of whole board plates the layers of copper of 5-8um on plate face.
6. the manufacture method of circuit board as claimed in claim 5, is characterized in that: in the step that described outer-layer circuit makes, press one deck dry film on circuit boards, utilizes the exposure of UV light and visualization way to be transferred on plate face by circuit on the film by film aligning.
7. the manufacture method of circuit board as claimed in claim 6, is characterized in that: in the step of described graphic plating, to window place's copper facing zinc-plated at circuit, hole copper Min20 micron, the thick 3-5 micron of tin.
8. the manufacture method of circuit board as claimed in claim 7, is characterized in that: in the step of described profile etch: remove photopolymer layer, and etch away the copper below photopolymer layer, then remove tin coating, make the outer-layer circuit of battery circuit board completely out exposed.
9. the manufacture method of circuit board as claimed in claim 8, is characterized in that: in described welding resistance step; Adopt white reticulated printing at plate coated on both sides green oil, and surface-treated copper will be needed out exposed by film aligning exposure imaging mode, and adopt wire mark to be coated on plate face by white marking ink.
10. the manufacture method of circuit board as claimed in claim 9, is characterized in that: after described welding resistance step, also comprise immersion Ni/Au and the gold-plated step of contact golden finger; By clean for process in copper face and hole, and heavy upper nickel-gold layer in its surface, be set up plate one deck layer gold at contact golden finger position, heavy nickel-gold layer surface thick 120-150 microinch, wherein golden thick Min1 microinch, contact golden finger position is set up Gold plated Layer Min30 microinch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510870899.7A CN105407653A (en) | 2015-12-02 | 2015-12-02 | Manufacturing method of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510870899.7A CN105407653A (en) | 2015-12-02 | 2015-12-02 | Manufacturing method of circuit board |
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| CN105407653A true CN105407653A (en) | 2016-03-16 |
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|---|---|---|---|
| CN201510870899.7A Pending CN105407653A (en) | 2015-12-02 | 2015-12-02 | Manufacturing method of circuit board |
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Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105764271A (en) * | 2016-04-28 | 2016-07-13 | 江苏博敏电子有限公司 | Manufacturing process for memory bank module circuit board |
| CN105792530A (en) * | 2016-04-25 | 2016-07-20 | 苏州市王氏电路板有限公司 | PCB processing technology |
| CN105873366A (en) * | 2016-04-28 | 2016-08-17 | 江苏博敏电子有限公司 | Process for manufacturing touch screen circuit board |
| CN106535508A (en) * | 2016-11-14 | 2017-03-22 | 福建世卓电子科技有限公司 | Multi-layer board flexible circuit board built-in golden finger exposure process |
| CN106961795A (en) * | 2017-03-24 | 2017-07-18 | 江门崇达电路技术有限公司 | A kind of PCB forming methods |
| CN108882565A (en) * | 2018-08-20 | 2018-11-23 | 珠海海迅软性多层板有限公司 | Plug finger dual camera mould group class flexible and hard combined circuit preparation method |
| CN109526147A (en) * | 2018-12-11 | 2019-03-26 | 江门崇达电路技术有限公司 | A kind of method of taping of PCB production board |
| CN110190389A (en) * | 2019-06-03 | 2019-08-30 | 深圳市景旺电子股份有限公司 | A kind of antenna plate and preparation method thereof |
| CN111629523A (en) * | 2020-07-01 | 2020-09-04 | 深圳市和美精艺科技有限公司 | Preparation method of multilayer electric hole process packaging substrate and substrate |
| CN112105153A (en) * | 2020-08-14 | 2020-12-18 | 新余市木林森线路板有限公司 | Self-defined manufacturing method of LED circuit board |
| CN112118678A (en) * | 2020-08-31 | 2020-12-22 | 珠海智锐科技有限公司 | Manufacturing method of packaging substrate |
| CN112235960A (en) * | 2020-10-28 | 2021-01-15 | 惠州市特创电子科技有限公司 | Gold immersion circuit board and preparation method thereof |
| CN113811074A (en) * | 2021-08-12 | 2021-12-17 | 宏华胜精密电子(烟台)有限公司 | Printed circuit board manufacturing method, golden finger protection method and protection structure |
| CN114367497A (en) * | 2020-10-14 | 2022-04-19 | 大族激光科技产业集团股份有限公司 | Method for removing residual epoxy resin glue on golden finger of display device |
| CN114501858A (en) * | 2022-01-04 | 2022-05-13 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of semi-flexible circuit board |
| CN114630512A (en) * | 2022-04-01 | 2022-06-14 | 江苏迪飞达电子有限公司 | Manufacturing method of multilayer depth control gong product |
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Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105792530A (en) * | 2016-04-25 | 2016-07-20 | 苏州市王氏电路板有限公司 | PCB processing technology |
| CN105792530B (en) * | 2016-04-25 | 2019-01-29 | 苏州市王氏电路板有限公司 | A kind of processing technology of pcb board |
| CN105764271A (en) * | 2016-04-28 | 2016-07-13 | 江苏博敏电子有限公司 | Manufacturing process for memory bank module circuit board |
| CN105873366A (en) * | 2016-04-28 | 2016-08-17 | 江苏博敏电子有限公司 | Process for manufacturing touch screen circuit board |
| CN106535508A (en) * | 2016-11-14 | 2017-03-22 | 福建世卓电子科技有限公司 | Multi-layer board flexible circuit board built-in golden finger exposure process |
| CN106535508B (en) * | 2016-11-14 | 2018-10-19 | 福建世卓电子科技有限公司 | The exposed technique of golden finger built in multi-layer board flexible circuit board |
| CN106961795A (en) * | 2017-03-24 | 2017-07-18 | 江门崇达电路技术有限公司 | A kind of PCB forming methods |
| CN106961795B (en) * | 2017-03-24 | 2019-02-12 | 江门崇达电路技术有限公司 | A kind of PCB forming method |
| CN108882565A (en) * | 2018-08-20 | 2018-11-23 | 珠海海迅软性多层板有限公司 | Plug finger dual camera mould group class flexible and hard combined circuit preparation method |
| CN109526147A (en) * | 2018-12-11 | 2019-03-26 | 江门崇达电路技术有限公司 | A kind of method of taping of PCB production board |
| CN110190389A (en) * | 2019-06-03 | 2019-08-30 | 深圳市景旺电子股份有限公司 | A kind of antenna plate and preparation method thereof |
| CN111629523A (en) * | 2020-07-01 | 2020-09-04 | 深圳市和美精艺科技有限公司 | Preparation method of multilayer electric hole process packaging substrate and substrate |
| CN112105153A (en) * | 2020-08-14 | 2020-12-18 | 新余市木林森线路板有限公司 | Self-defined manufacturing method of LED circuit board |
| CN112118678A (en) * | 2020-08-31 | 2020-12-22 | 珠海智锐科技有限公司 | Manufacturing method of packaging substrate |
| CN114367497A (en) * | 2020-10-14 | 2022-04-19 | 大族激光科技产业集团股份有限公司 | Method for removing residual epoxy resin glue on golden finger of display device |
| CN114367497B (en) * | 2020-10-14 | 2024-02-06 | 大族激光科技产业集团股份有限公司 | Method for removing residual epoxy resin glue of golden finger of display device |
| CN112235960A (en) * | 2020-10-28 | 2021-01-15 | 惠州市特创电子科技有限公司 | Gold immersion circuit board and preparation method thereof |
| CN113811074A (en) * | 2021-08-12 | 2021-12-17 | 宏华胜精密电子(烟台)有限公司 | Printed circuit board manufacturing method, golden finger protection method and protection structure |
| CN114501858A (en) * | 2022-01-04 | 2022-05-13 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of semi-flexible circuit board |
| CN114630512A (en) * | 2022-04-01 | 2022-06-14 | 江苏迪飞达电子有限公司 | Manufacturing method of multilayer depth control gong product |
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Application publication date: 20160316 |