CN109526147A - A kind of method of taping of PCB production board - Google Patents
A kind of method of taping of PCB production board Download PDFInfo
- Publication number
- CN109526147A CN109526147A CN201811510131.9A CN201811510131A CN109526147A CN 109526147 A CN109526147 A CN 109526147A CN 201811510131 A CN201811510131 A CN 201811510131A CN 109526147 A CN109526147 A CN 109526147A
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- CN
- China
- Prior art keywords
- adhesive tape
- pcb production
- production board
- taping
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a kind of methods of taping of PCB production board, tape in the whole face of PCB production board；It is cut by laser and separates the adhesive tape that need to retain with monolith adhesive tape；Unwanted adhesive tape is removed.The method of the present invention has the characteristics that high-efficient, precision is high, it is small and practical to be limited, and all kinds of PCB production boards with complex figure is suitble to tape.
Description
Technical field
The present invention relates to printed wiring board manufacture technology fields, and in particular to a kind of method of taping of PCB production board.
Background technique
Because of the requirement of client's patch technique, some PCB production boards need after electrical testing in the portions such as local pad and golden finger
The interim patch finished products of adhesive tapes in position is protected, and is prevented from aoxidizing or be made dirty；The general processing mode of patch finished products of adhesive tapes mainly has two at present
Kind: one is taped by pure craft in corresponding position；There are also one is use glue plastering machines and mold in corresponding position
It tapes.
Following disadvantage is individually present in the above two mode taped:
1, pure manual work, be according to taping requirement, hold by hand adhesive tape and pocket knife onboard one at one at patch, efficiency
It is extremely low, and be easy the adverse effects such as to leave fingerprint, sweat mark on PCB production board and scratch.
2, it is taped using glue plastering machine, needs die sinking (mold for opening rubberizing) in advance in 3-5 days in advance, and a mould can only fit
With a kind of product, be not suitable for using when be pilot production, when rubberizing, mold also will be aligned first, and efficiency, and skill are influenced
Art is immature, and precision of taping is low to cause fraction defective high, and product is limited big, irregular or PCB with complex figure at
Product plate, which cannot achieve, tapes.
Summary of the invention
It is an object of the invention to provide a kind of method of taping of PCB production board, be somebody's turn to do to overcome existing technological deficiency
Method has the characteristics that high-efficient, precision is high, it is small and practical to be limited, and is suitble to all kinds of PCB production boards with complex figure
It tapes.
In order to solve the above-mentioned technical problems, the present invention provides a kind of methods of taping of PCB production board, including following step
It is rapid:
S1, it tapes in the whole face of PCB production board；
S2, it is cut by laser and separates the adhesive tape that need to retain with monolith adhesive tape；
S3, unwanted adhesive tape is removed.
Preferably, further include step S0 before step S1: according to design requirement, cutting is first produced in laser cutting machine
Figure needs to open a window at the position taped in the cutting pattern on corresponding PCB production board.
Preferably, in step S2, the adhesive tape on PCB production board is cut by laser according to cutting pattern, passes through cutting
The design to open a window in figure separates the adhesive tape at corresponding windowing part with monolith adhesive tape.
Preferably, the parameter in step S2, when laser cutting are as follows: cutting speed 1-500mm/s, laser frequency 1-25kHz,
Laser output power 1-30W.
Compared with prior art, the invention has the following beneficial effects:
The method of the present invention by first taping in whole plate, the mode being then cut by laser by the adhesive tape that need to retain and
The separation of monolith adhesive tape, later period remove unwanted adhesive tape, and this method is with high-efficient, precision is high, it is small to be limited and practical
The characteristics of, it is suitble to all kinds of PCB production boards with complex figure to tape；And parameter when by strictly control laser cutting,
While cutting separation gel band, damage from laser can avoid to PCB production board, it is ensured that the quality of PCB.
Specific embodiment
In order to more fully understand technology contents of the invention, below in conjunction with specific embodiment to technical side of the invention
Case is described further and illustrates.
Embodiment
The present embodiment provides the production methods of PCB a kind of, including the method for taping of PCB production board, concrete technology
It is as follows:
(1), core plate, core thickness 0.075mm, outer copper foil thickness sawing sheet: are outputed by jigsaw size 520mm × 620mm
For 1OZ.
(2) internal layer circuit production (negative film technique): inner figure transfer is coated on core plate photosensitive with vertical application machine
Film, 8 μm of the film thickness monitoring of light-sensitive surface are completed on core plate using Full-automatic exposure machine with 5-6 lattice exposure guide rule (21 lattice exposure guide rule)
Internal layer circuit exposure；Core plate after exposure development is etched internal layer circuit by internal layer etching, and it is 3mil that internal layer line width, which measures,；It is interior
Then layer AOI checks the defects of opening short circuit, route notch, route pin hole of internal layer circuit, defective to scrap processing, zero defect
Product go out to downstream.
(3), press: core plate crosses vertical blackening process, and core plate and outer copper foil are then superimposed on one with prepreg in advance
(specific plate-laying sequence is copper foil, prepreg, core plate, prepreg, copper foil from top to bottom) is played, is then selected according to plate Tg
Lamination appropriate presses superimposed sheet, forms production plate.
(4), it drills: being drilled on production plate according to borehole data using the mode of machine drilling.
(5), heavy copper: one layer of thin copper is deposited by way of chemical reaction on hole wall, is provided for subsequent electric plating of whole board
Basis, backlight test 10 grades, and the heavy copper thickness in hole is 0.5 μm.
(6), according to the principle of electrochemical reaction, upper one layer of copper electric plating of whole board: is electroplated on the basis of heavy copper.
(7), outer-layer circuit (positive blade technolgy) is made: outer graphics transfer, it is luxuriant and rich with fragrance using Full-automatic exposure machine and positive route
Woods completes outer-layer circuit exposure with 5-7 lattice exposure guide rule (21 lattice exposure guide rule) on production plate, developed, is formed on production plate
Outer-layer circuit figure；Outer graphics plating, the then copper facing and tin plating respectively on production plate, copper facing is the electricity with 1.0-2.2ASD
Face copper thickness is plated to 1OZ, and hole wall copper thickness is thickeied to >=25mm by current density electric plating of whole board 150min, to obtain one
Hole wall copper plate that is smooth and uniform and having high reliability, and hole wall layers of copper and internal layer circuit layers of copper is made to form three-dimensional connection, it plates
Tin is that 10min, 3-5 μm of tin thickness is electroplated with the current density of 1.2ASD；Then film is successively moved back again, etches and move back tin, in production plate
On etch outer-layer circuit；Outer layer AOI detects outer layer line by the comparison with CAM data using automatic optical detecting system
Whether road has the defects of open circuit, notch, not clean, short-circuit etching.
(8), welding resistance, silk-screen character: using the white face wire mark brush TOP solder mask, and the face TOP character adds " UL label "；Tool
Body is, on the route and substrate for being not required to welding, one layer of coating prevents from generating bridge joint when welding between route, provides permanent electricity
The protective layer in compression ring border and resist chemical, while playing aesthetic appeal.
(9), surface treatment (heavy nickel gold): principle is learned in pad copper face Tonghua of welding resistance windowing position, and uniform deposition centainly requires
The nickel layer and layer gold of thickness, nickel layer thickness are as follows: 3-5 μm；Layer gold thickness are as follows: 0.05-0.1 μm.
(10), electrical testing: testing the electrically conducting performance of production board, this plate uses test method are as follows: flying probe.
(11), it tapes: specifically includes the following steps:
S0, according to design requirement, cutting pattern is first produced in laser cutting machine, in corresponding finished product in the cutting pattern
It opens a window at local pad and golden finger position on plate；
S1, it is taped in the whole face of production board using automatic film applicator；
S2, the adhesive tape on production board is cut by laser using laser cutting machine and according to cutting pattern, passes through cutting
The design to open a window in figure separates the adhesive tape at corresponding windowing part with monolith adhesive tape；When being wherein cut by laser
Parameter are as follows: cutting speed 1-500mm/s, laser frequency 1-25kHz, laser output power 1-30W.
S3, the tear tape since edges of boards remove unwanted adhesive tape, retain the part cut down, that is, correspond to finished product
The adhesive tape at local pad and golden finger position on plate.
(12), it forms: according to the prior art and pressing design requirement gong shape, PCB is made in the +/- 0.05mm of external form tolerance.
(13), FQC: according to customs inspection standard and our company test stone, checking PCB appearance, such as it is defective and
Shi Xiuli guarantees to provide excellent quality control for client.
(14), FQA: taking a sample test appearance, hole copper thickness, thickness of dielectric layers, green oil thickness, internal layer copper thickness of PCB etc. again is
The no requirement for meeting client.
(15), it packs: according to the manner of packing and packaging quantity of customer requirement, packaging being sealed to PCB, and be allowed to dry
Drying prescription and humidity card, then shipment.
Through overtesting, the efficiency for method of taping in the present invention is that 30-50 times of manual rubberizing or glue plastering machine add mold
3-5 times.
It is provided for the embodiments of the invention technical solution above to be described in detail, specific case used herein
The principle and embodiment of the embodiment of the present invention are expounded, the explanation of above embodiments is only applicable to help to understand this
The principle of inventive embodiments；At the same time, for those skilled in the art, according to an embodiment of the present invention, in specific embodiment party
There will be changes in formula and application range, in conclusion the contents of this specification are not to be construed as limiting the invention.
Claims (4)
1. a kind of method of taping of PCB production board, which comprises the following steps:
S1, it tapes in the whole face of PCB production board；
S2, it is cut by laser and separates the adhesive tape that need to retain with monolith adhesive tape；
S3, unwanted adhesive tape is removed.
2. the method for taping of PCB production board according to claim 1, which is characterized in that further include step before step S1
Rapid S0: according to design requirement, first producing cutting pattern in laser cutting machine, in corresponding PCB production board in the cutting pattern
On open a window at the position that need to tape.
3. the method for taping of PCB production board according to claim 2, which is characterized in that in step S2, according to cutting drawing
Shape is cut by laser the adhesive tape on PCB production board, and by the design to open a window in cutting pattern, corresponding windowing portion is made after cutting
Respectively adhesive tape separated with monolith adhesive tape.
4. the method for taping of PCB production board according to claim 1, which is characterized in that in step S2, when laser cutting
Parameter are as follows: cutting speed 1-500mm/s, laser frequency 1-25kHz, laser output power 1-30W.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811510131.9A CN109526147A (en) | 2018-12-11 | 2018-12-11 | A kind of method of taping of PCB production board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811510131.9A CN109526147A (en) | 2018-12-11 | 2018-12-11 | A kind of method of taping of PCB production board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109526147A true CN109526147A (en) | 2019-03-26 |
Family
ID=65795951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811510131.9A Pending CN109526147A (en) | 2018-12-11 | 2018-12-11 | A kind of method of taping of PCB production board |
Country Status (1)
| Country | Link |
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| CN (1) | CN109526147A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113795087A (en) * | 2021-11-15 | 2021-12-14 | 深圳市大族数控科技股份有限公司 | Windowing method and windowing equipment |
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| CN108093570A (en) * | 2017-12-20 | 2018-05-29 | 深圳光韵达激光应用技术有限公司 | A kind of processing technology using laser-induced thermal etching removal circuit board local securing layer |
| CN108551729A (en) * | 2018-03-14 | 2018-09-18 | 江门崇达电路技术有限公司 | A kind of production method of more grafting Rigid Flexs |
| CN108770182A (en) * | 2018-04-17 | 2018-11-06 | 胜宏科技（惠州）股份有限公司 | A kind of double ladder portable antenna PCB and production method |
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2018
- 2018-12-11 CN CN201811510131.9A patent/CN109526147A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201585202U (en) * | 2009-11-27 | 2010-09-15 | 深圳市大族激光科技股份有限公司 | Automatic laser tapping machine |
| US20120134122A1 (en) * | 2010-11-25 | 2012-05-31 | Min-Cheol Kim | Display device and method of manufacturing the same |
| CN102711392A (en) * | 2012-06-25 | 2012-10-03 | 广州美维电子有限公司 | Manufacturing method of flexible-rigid circuit board |
| CN104507257A (en) * | 2014-12-11 | 2015-04-08 | 江门崇达电路技术有限公司 | Printed circuit board (PCB) molding method |
| CN105208801A (en) * | 2015-08-11 | 2015-12-30 | 深圳崇达多层线路板有限公司 | Fitting method for cover film of rigid and flexible combined board |
| CN105208789A (en) * | 2015-09-18 | 2015-12-30 | 深圳诚和电子实业有限公司 | Manufacturing method of battery circuit board |
| CN105392283A (en) * | 2015-10-16 | 2016-03-09 | 广州杰赛科技股份有限公司 | Process for realizing no carbon black on pattern in laser edge-milling |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113795087A (en) * | 2021-11-15 | 2021-12-14 | 深圳市大族数控科技股份有限公司 | Windowing method and windowing equipment |
| CN113795087B (en) * | 2021-11-15 | 2022-05-03 | 深圳市大族数控科技股份有限公司 | Windowing method and windowing equipment |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190326 |