CN105208801A - Fitting method for cover film of rigid and flexible combined board - Google Patents
Fitting method for cover film of rigid and flexible combined board Download PDFInfo
- Publication number
- CN105208801A CN105208801A CN201510489172.4A CN201510489172A CN105208801A CN 105208801 A CN105208801 A CN 105208801A CN 201510489172 A CN201510489172 A CN 201510489172A CN 105208801 A CN105208801 A CN 105208801A
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- China
- Prior art keywords
- coverlay
- light barrier
- rigid
- copper plate
- flexibility coat
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/061—Lamination of previously made multilayered subassemblies
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention relates to a fitting method for a cover film of a rigid and flexible combined board. The method comprises the following steps that a) a flexible copper clad plate, the cover film and a light barrier are cut; b) pattern transfer and browning are carried out on the flexible copper clad plate; c) positioning holes are drilled in a backing plate, the flexible copper clad plate, the light barrier and the cover film respectively; d) groove milling is carried out on the light barrier in the step 3); e) after a rivet is fixed to the first positioning hole of the backing plate, the flexible copper clad plate, the light barrier and the cover film sleeve the rivet successively for alignment and fixation; f) the cover film is pre-melted on the flexible copper clad plate in the groove milling area of the light barrier; g) laser cutting is carried out on the cover film which is pre-melted on the flexible copper clad plate in the step f); h) the cover film beyond the groove milling area is removed; and i) the flexile copper clad plate and the cover film are pressed rapidly.
Description
Technical field
The present invention relates to circuit board manufacturing area, particularly relate to a kind of rigid-flex combined board coverlay applying method.
Background technology
Along with the development of electronic science and technology, electronic product is increasing changes development toward " light, thin, portable ", in special equipment, namely rigid wiring board, flexible circuit board cannot meet electronic product simultaneously will have certain mechanical strength to have the requirement of certain flexibility again to wiring board.Flexible and hard combined circuit board, also referred to as rigid-flexible combined circuit board, rigid-flex combined board is made up of one or more rigid region and flexure region, and flexible region line pattern is commonly used Thermocurable polyimide (Polyimide, PI) coverlay to protect.The chemical stability good due to PI self and surface smoothing, direct whole plate pressing coverlay easily causes inter-layer bonding force to decline, and affects product reliability, and the method that industry adopts local to window usually for this reason carries out processing process.
For simple graph, still fit by location hole full wafer after windowing in coverlay local; For many layouts structure of complexity, the contraposition of coverlay 1 small pieces, after windowing in local, coverlay becomes independently small pieces, and One's name is legion, as adopted manual alignment to fit, then inefficiency, after groove milling, coverlay has 48 small pieces, the average 40-60 minute consuming time of pad pasting 1PNL, time and effort consuming, and accuracy error is large, cannot meet batch production requirements.
Summary of the invention
Object of the present invention is exactly to solve in prior art, for rigid and flexibility board coverlay laminating inefficiency, the technical problem of low precision, the present invention is mainly for the rigid-flex combined board of many jigsaw structure of complexity, adopt first to the superimposed laser cutting again of whole plate contraposition, remove unwanted coverlay afterwards, the invention provides a kind of rigid-flex combined board coverlay applying method.Concrete technical scheme of the present invention is as follows:
A kind of rigid-flex combined board coverlay applying method, described method comprises the steps:
Step a, sawing sheet: flexibility coat copper plate, coverlay, light barrier are cut by required specification;
Step b, carries out Graphic transitions to the flexibility coat copper plate in step a;
Step c, carries out brown process to the flexibility coat copper plate in step b;
Steps d, bores location hole: make backing plate 30 with epoxy resin board, on the flexibility coat copper plate 20 in described backing plate 30, step c, the light barrier 10 in step a, the coverlay 50 in step a bores respectively corresponding location hole.
Step e, carries out groove milling process by the light barrier in steps d;
Step f, contraposition: after the location hole fixing rivet 40 of described backing plate 30, is placed on the coverlay 50 in the described flexibility coat copper plate 20 in step c, the light barrier 10 in step e, steps d by respective location hole successively and described rivet 40 carries out contraposition fixes;
Step g, pre-hot melt, in the groove milling region of described light barrier, by the coverlay fritting of described groove milling overlying regions on described flexibility coat copper plate;
Step h, carries out laser cutting to the coverlay of fritting on described flexibility coat copper plate, and the coverlay size of described laser cutting is greater than the size in described groove milling region;
Step I: remove the coverlay outside described groove milling region, take off light barrier;
Step j: take off described flexibility coat copper plate, puts into fast press by described flexibility coat copper plate, carries out coverlay pressing.
Further, described light barrier is copper-clad plate, epoxy resin board or aluminium flake.
Further, described light barrier thickness is less than or equal to 0.2mm.
Further, described laser cutting adopts CO
2laser cutting.
Further, the diameter of described laser cutting is 25 μm; Speed is 160mm/s; Power is 7W; Frequency is 80KHZ.
Further, the temperature of described pre-hot melt 350 DEG C, warm-up time is 3-5 second.
Compared to prior art, the main beneficial effect that the invention provides a kind of rigid-flex combined board coverlay applying method is: by fitting on flexibility coat copper plate by whole for coverlay plate, groove milling process is carried out to described light barrier, coverlay above light barrier and the flexibility coat copper plate below light barrier are fitted in advance, carry out laser cutting afterwards, remove the coverlay outside described groove milling region again, take off light barrier and the flexibility coat copper plate being covered with coverlay, press soon afterwards, to make described coverlay and described flexibility coat copper plate pressing.Invention achieves raising aligning accuracy, greatly improve the Advantageous Effects of production efficiency.
Accompanying drawing explanation
Fig. 1 is a kind of rigid-flex combined board coverlay of embodiment of the present invention applying method key step schematic diagram.
Fig. 2 is a kind of rigid-flex combined board coverlay of embodiment of the present invention applying method flow chart of steps.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not used for limiting the present invention.
Embodiment
Refer to shown in Fig. 1 and Fig. 2.
The invention provides a kind of rigid-flex combined board coverlay applying method, described method comprises the steps:
Step a, sawing sheet: flexibility coat copper plate 20 sawing sheet, coverlay 50 sawing sheet, light barrier 10 sawing sheet, cuts described flexibility coat copper plate 20, coverlay 50 and light barrier 10 by required specification; Required specification is 250 ㎜ × length 100 ㎜.
Step b, carries out Graphic transitions by the flexibility coat copper plate 20 in step a.
Step c, flexibility coat copper plate 20 in step b is carried out brown process, described brown process is in the mode of chemical reaction, make its Surface Creation one deck brown oxide make copper face form suitable surface roughness, thus adhesion brown process when strengthening pressing make the roughness of copper face be 1.3 ~ 1.8um.
The concrete grammar of described brown process comprises the steps: that (1) enters plate; (2) binding dust; (3) pickling (microetch), the oxide of removal substrate surface and greasy dirt etc.; (4) × 3 are washed; (5) alkali cleaning, except degreasing, the residual film of dry film, ensures plate face cleanliness without any pollution; (6) DI washing × 3; (7) activate (preimpregnation), remove the buck in plate face, make plate face cleaner, avoid brown cylinder to be polluted; (8) brown; (9) DI washing × 3; (10) dry plate combination; (11) ejecting plate.
The design parameter of described brown process is as shown in the table:
Table 1
Steps d, bores location hole: make backing plate 30 with epoxy resin board, the coverlay 50 in the flexibility coat copper plate 20 in described backing plate 30, step c, the light barrier 10 in step a and step a bores respectively corresponding location hole.
Step e, carries out groove milling 60 by the light barrier 10 in steps d and processes.
Step f, contraposition: after the location hole fixing rivet 40 of described backing plate 30, successively the coverlay 50 in the described flexibility coat copper plate 20 in step c, the light barrier 10 in step e, steps d is placed on by respective location hole and rivet 40 carries out contraposition fixes, adopt the method for this whole plate contraposition, reach the Advantageous Effects that aligning accuracy is high.
Step g, pre-hot melt, in groove milling 60 region of described light barrier 10, with electric iron by coverlay 50 fritting of described groove milling 60 overlying regions on described flexibility coat copper plate 20, prevent coverlay 50 to be shifted.The temperature of described pre-hot melt 350 DEG C, warm-up time is 3-5 second.
Step h, carries out laser 70 to the coverlay 50 of fritting in step g on described flexibility coat copper plate 20 and cuts, and the cutting of described laser 70 adopts CO
2laser 70, in order to prevent, energy is excessive burns coverlay 50, and described laser 70 energy is finely tuned and needed accurately to control, wherein, Precision of Laser Cutting: ± 20 μm; The peak power output of laser: 10 watts; Output frequency: 60-120KHZ; Vibration mirror scanning scope: 50 ㎜ × 50 ㎜; Laser cutting diameter: 25 μm; Speed: 160mm/s; Power: 7W; Frequency: 80KHZ.
Coverlay 50 size that described laser 70 cuts is greater than the size in described groove milling 60 region, the length of side on each limit of described coverlay 50 all to be grown up 0.5-1.0mm than the corresponding sides of described groove milling 60, avoid laser 70 to puncture coverlay 50 with the energy making described light barrier 10 can keep out described laser 70 and damage described flexibility coat copper plate 20, institute's light barrier 10 can keep out the thin plate of the micro-energy processing of laser 70, the thickness of described light barrier 10 is preferably less than or equal to 0.2mm, light barrier 10 material can select copper-clad plate, epoxy resin board or aluminium flake, in actual applications, epoxy resin board is thicker, aluminium flake sharp processing requires higher, and copper-clad plate is easily processed and completely not Stimulated Light 70 affect, and can reuse, save Financial cost, therefore, in actual production, preferred copper-clad plate is as described light barrier 10.
The concrete steps of described step h comprise: (1) starts shooting; (2) data reads; (3) Selecting parameter; (4) upper plate; (5) CCD location; (6) laser cutting; (7) lower plate; (8) table top cleans; (9) shut down.
Step I: remove the coverlay 50 outside described groove milling 60 region, the coverlay namely in removal step g outside pre-fit area, takes off light barrier 10.
Step j: take off described flexibility coat copper plate 20, puts into fast press by described flexibility coat copper plate 20, carries out coverlay 50 pressing.
A kind of rigid-flex combined board coverlay 50 applying method that the embodiment of the present invention provides, after described method adopts whole plate to paste in advance, then carry out laser 70 and cut, the average 5-6 minute consuming time of pad pasting 1PNL, 40-60 minute more consuming time than manual alignment pad pasting in prior art, improved efficiency 8-10 are doubly.
The embodiment of the present invention reaches raising aligning accuracy, greatly improves the Advantageous Effects of production efficiency.
It should be noted that, above embodiment is only in order to illustrate technical scheme of the present invention and unrestricted, although with reference to preferred embodiment to invention has been detailed description, those of ordinary skill in the art is to be understood that, can modify to technical scheme of the present invention or equivalent replacement, and not departing from the spirit and scope of technical solution of the present invention, it all should be encompassed in the middle of right of the present invention.
Claims (6)
1. a rigid-flex combined board coverlay applying method, is characterized in that, described method comprises the steps:
Step a, sawing sheet: flexibility coat copper plate, coverlay, light barrier are cut by required specification;
Step b, carries out Graphic transitions to the flexibility coat copper plate in step a;
Step c, carries out brown process to the flexibility coat copper plate in step b;
Steps d, bores location hole: make backing plate with epoxy resin board, on the flexibility coat copper plate in described backing plate, step c, the light barrier in step a, the coverlay in step a bores respectively corresponding location hole.
Step e, carries out groove milling process by the light barrier in steps d;
Step f, contraposition: after the location hole fixing rivet of described backing plate, is placed on the described flexibility coat copper plate in step c, the light barrier in step e, coverlay in steps d by respective location hole successively and described rivet carries out contraposition fixes;
Step g, pre-hot melt, in the groove milling region of described light barrier, by the coverlay fritting of described groove milling overlying regions on described flexibility coat copper plate;
Step h, carries out laser cutting to the coverlay of fritting on described flexibility coat copper plate, and the coverlay size of described laser cutting is greater than the size in described groove milling region;
Step I, removes the coverlay outside described groove milling region, takes off light barrier;
Step j, takes off described flexibility coat copper plate, and described flexibility coat copper plate is put into fast press, carries out coverlay pressing.
2. rigid-flex combined board coverlay applying method according to claim 1, is characterized in that, described light barrier is copper-clad plate, epoxy resin board or aluminium flake.
3. rigid-flex combined board coverlay applying method according to claim 1 and 2, is characterized in that, described light barrier thickness is less than or equal to 0.2mm.
4. rigid-flex combined board coverlay applying method according to claim 3, is characterized in that, described laser cutting adopts CO
2laser cutting.
5. rigid-flex combined board coverlay applying method according to claim 4, is characterized in that, the diameter of described laser cutting is 25 μm; Speed is 160mm/s; Power is 7W; Frequency is 80KHZ.
6. rigid-flex combined board coverlay applying method according to claim 5, is characterized in that, the temperature of described pre-hot melt 350 DEG C, and warm-up time is 3-5 second.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510489172.4A CN105208801B (en) | 2015-08-11 | 2015-08-11 | A kind of rigid-flex combined board cover film applying method |
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|---|---|---|---|
| CN201510489172.4A CN105208801B (en) | 2015-08-11 | 2015-08-11 | A kind of rigid-flex combined board cover film applying method |
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| CN105208801A true CN105208801A (en) | 2015-12-30 |
| CN105208801B CN105208801B (en) | 2018-07-31 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108391376A (en) * | 2018-03-06 | 2018-08-10 | 东莞森玛仕格里菲电路有限公司 | A kind of high-accuracy or very small region cover film applying method |
| CN109041447A (en) * | 2018-08-31 | 2018-12-18 | 广州兴森快捷电路科技有限公司 | Film covering method and rigid-flex combined board |
| CN109466155A (en) * | 2018-10-31 | 2019-03-15 | 珠海杰赛科技有限公司 | A method of it improving rigid-flex combined board cover film and is bonded efficiency |
| CN109526147A (en) * | 2018-12-11 | 2019-03-26 | 江门崇达电路技术有限公司 | A kind of method of taping of PCB production board |
| CN111010823A (en) * | 2019-12-25 | 2020-04-14 | 江苏弘信华印电路科技有限公司 | Processing method for improving flatness of rigid-flexible board |
| WO2022036756A1 (en) * | 2020-08-20 | 2022-02-24 | 瑞声声学科技(深圳)有限公司 | Sheet-type fpc and manufacturing method therefor |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100808674B1 (en) * | 2007-04-20 | 2008-02-29 | (주)인터플렉스 | Method of attaching coverlay on flexible section of rigid-flexible printed circuit board |
| WO2011088489A1 (en) * | 2010-01-20 | 2011-07-28 | At & S Austria Technologie & Systemtechnik Aktiengesellschaft | Method for producing a rigid-flexible circuit board |
| CN102595806A (en) * | 2012-02-20 | 2012-07-18 | 深圳崇达多层线路板有限公司 | Method for manufacturing rigid-flexible combined circuit board capable of protecting inner-layer soft board |
| CN203912323U (en) * | 2014-06-11 | 2014-10-29 | 深圳华麟电路技术有限公司 | Location hole structure of flexible/hard multilayer circuit board |
| CN104640375A (en) * | 2015-01-28 | 2015-05-20 | 深圳崇达多层线路板有限公司 | Method for manufacturing soft-hard combination board |
-
2015
- 2015-08-11 CN CN201510489172.4A patent/CN105208801B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100808674B1 (en) * | 2007-04-20 | 2008-02-29 | (주)인터플렉스 | Method of attaching coverlay on flexible section of rigid-flexible printed circuit board |
| WO2011088489A1 (en) * | 2010-01-20 | 2011-07-28 | At & S Austria Technologie & Systemtechnik Aktiengesellschaft | Method for producing a rigid-flexible circuit board |
| CN102595806A (en) * | 2012-02-20 | 2012-07-18 | 深圳崇达多层线路板有限公司 | Method for manufacturing rigid-flexible combined circuit board capable of protecting inner-layer soft board |
| CN203912323U (en) * | 2014-06-11 | 2014-10-29 | 深圳华麟电路技术有限公司 | Location hole structure of flexible/hard multilayer circuit board |
| CN104640375A (en) * | 2015-01-28 | 2015-05-20 | 深圳崇达多层线路板有限公司 | Method for manufacturing soft-hard combination board |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108391376A (en) * | 2018-03-06 | 2018-08-10 | 东莞森玛仕格里菲电路有限公司 | A kind of high-accuracy or very small region cover film applying method |
| CN109041447A (en) * | 2018-08-31 | 2018-12-18 | 广州兴森快捷电路科技有限公司 | Film covering method and rigid-flex combined board |
| CN109041447B (en) * | 2018-08-31 | 2024-04-09 | 广州兴森快捷电路科技有限公司 | Film coating method and rigid-flex printed circuit board |
| CN109466155A (en) * | 2018-10-31 | 2019-03-15 | 珠海杰赛科技有限公司 | A method of it improving rigid-flex combined board cover film and is bonded efficiency |
| CN109526147A (en) * | 2018-12-11 | 2019-03-26 | 江门崇达电路技术有限公司 | A kind of method of taping of PCB production board |
| CN111010823A (en) * | 2019-12-25 | 2020-04-14 | 江苏弘信华印电路科技有限公司 | Processing method for improving flatness of rigid-flexible board |
| WO2022036756A1 (en) * | 2020-08-20 | 2022-02-24 | 瑞声声学科技(深圳)有限公司 | Sheet-type fpc and manufacturing method therefor |
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| Publication number | Publication date |
|---|---|
| CN105208801B (en) | 2018-07-31 |
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