JP2011023657A - Multi-piece wiring board housing kit, method of regenerating the same, and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multi-piece wiring board housing kit allowing piece wiring boards in a good-product condition to be easily and accurately formed into a kit, and also to provide a method of regenerating the same, and a method of manufacturing the same. <P>SOLUTION: This multi-piece wiring board housing kit 1 is equipped with: piece wiring boards 10 formed as wiring boards of individual units; and a frame 30 with the plurality of piece wiring boards 10 housed therein. The piece wiring board 10 is equipped with bridging parts 19 each formed protrusively from an outer peripheral end and jointed to the frame 30. The frame 30 is equipped with: piece housing holes 41 each formed similarly to the outer peripheral end of the piece wiring board 10 and having the piece wiring board 10 housed therein; and bridging recessed parts 42 each formed continuously to the piece housing hole 41 in the thickness direction of the frame 30 and having the bridging part 19 arranged therein. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a multi-piece wiring board accommodation kit including a frame containing a plurality of piece wiring boards formed as individual unit wiring boards, a method for regenerating such a multi-piece wiring board accommodation kit, and such a multi-piece wiring board. The present invention relates to a method for manufacturing a storage kit.

  When performing component mounting and other processing on the wiring board mounted on the mounting board of an electronic device, in consideration of work efficiency, a plurality of the same wiring board is used instead of a single wiring board. There has been proposed a technique to be performed on what is accommodated in an accommodation kit (usually referred to as a kit, a multi-piece wiring board, or an aggregate board) (for example, see Patent Document 1 to Patent Document 5).

  The reason why the wiring board accommodation kit is applied is that when mounting electronic components on the wiring board, rather than mounting each wiring board on a single board basis, the wiring board housing kit that handles multiple wiring boards is used. However, this is because it is easy to provide a guide and a grip for handling the mounting machine, and the mounting speed and efficiency are improved.

  However, if one or several of the several wiring boards housed in the wiring board housing kit are defective, the defective product will be included in the non-defective product. It will be in trouble. In other words, if mounting is performed while ignoring the inclusion of defective products, the work is not troublesome, but parts and mounting time are wasted.

  It may be possible to recognize the position of the defective board and change the mounting machine program so that mounting is not performed on the recognized defective board because of the presence of defective products. Is inefficient.

  Under such circumstances, it is general that the side who orders the wiring board from the wiring board manufacturer requests the wiring board manufacturer to deliver all the wiring board accommodation kits composed of non-defective substrates.

  On the other hand, a wiring board manufacturer that manufactures a wiring board accommodation kit cannot ship unless all the wiring boards arranged in the wiring board accommodation kit are non-defective products. For example, consider a case where 100 kits, that is, 600 wiring boards, in which six wiring boards are connected to one kit (wiring board housing kit) are manufactured.

  When 6 out of 600 circuit boards are defective, the defect rate counted on a single circuit board basis is 6 ÷ 600 = 1 (%), whereas one defect per kit. When it comes out, 6 kits become defective, and the actual defect rate becomes 6/100 = 6 (%), which causes a problem in terms of manufacturing efficiency. In addition, each kit must be discarded, which is a serious problem in the effective use of resources.

  In actual production lines, defects often occur due to defects in manufacturing tools, due to dust, processing equipment, etc. In that case, the same defects tend to occur continuously in the same part of the kit. The rate is likely to rise, which is a big problem.

  As a solution to these problems, you can remove defective products in a kit, fit good products extracted from other kits into all good products, or combine multiple good substrates with thermoplastic resin. There are proposals to make it possible.

  In addition, the wiring boards constituting the wiring board accommodation kit may not always be efficient in terms of production or effective use of resources when viewed from the side of the wiring board manufacturer. For example, the external size of the wiring board accommodation kit is determined by the convenience of the mounting machine, reflow, or solder DIP device. Therefore, the external size of the wiring board accommodation kit is the single size of the wiring board to be accommodated, or the size that matches the work size suitable for processing (for example, the single effective size is just an integral multiple of the kit size) )), Instead of scraps.

  Moreover, the arrangement position and pitch of the wiring board within one kit are determined by the circumstances of the wiring board user side to be mounted. Therefore, since it is not necessarily close-packed, an extra gap is generated between the wiring boards, and there is a problem that it is not the best in terms of effective use of resources such as the production efficiency and the number of wiring boards (number) that can be manufactured from the unit area. .

  Further, the conventional method for replacing only defective products in a kit with non-defective products has the following problems.

  That is, in the conventional method, as called a so-called hard board, a defective board is punched on the premise that the wiring board has a certain thickness (for example, about 1 mm or more) and the entire wiring board has a certain rigidity. After that, a method of fitting a non-defective substrate is taken. That is, the interface between the frame portion to be fitted and the non-defective wiring board to be fitted comes into contact with each other at the end faces, thereby positioning and fixing.

  However, when the wiring board is required to be thin and flexible as in recent years, for example, the total thickness of an 8-layer wiring board (multilayer wiring board) may be less than 0.5 mm. In such a case, even if a non-defective wiring board is fitted into the frame, the wiring board can easily fall off the frame with friction between the wall surfaces or a small amount of adhesive applied to the end face, effectively functioning as a kit. There is a problem that it cannot be demonstrated.

  At the same time as the wiring board becomes thin, it becomes rigid and easily bends. Moreover, the flexibility further increases in the flexible wiring board in which flexibility is positively imparted to the wiring board. Therefore, the problems associated with the thinning of the wiring board are becoming a more important issue.

  In other words, the conventional method of simply removing defective products and replacing them with non-defective products is mainly used in thin and thin devices such as thin wiring boards, flexible wiring boards, or rigid flexible wiring boards with hard and flexible parts. This technique cannot be applied to a wiring board.

  In the conventional method, when a good wiring board is inserted into a portion from which a defective product has been removed, the positioning method is based on the end face of the wiring board. If the wiring board becomes thinner, the fitting operation itself becomes difficult. Furthermore, there arises a problem that the positional relationship between various guides for mounting and subsequent processing arranged around the kit and the wiring board fitted later cannot maintain sufficient accuracy. In recent years, electronic components have been miniaturized and the density of wiring itself has become extremely high. Therefore, misalignment caused by insufficient position accuracy is an obstacle to component mounting.

  In addition, in the method of combining good products proposed by the conventional method into one piece by molding or the like, it is necessary to configure parts such as runners and frames, and it is unavoidable to use thermoplastic resin for the part that fixes the wiring board. . However, in recent years, due to environmental issues, lead-based low-melting-point solder has become unusable, and in reality the use of solder with a higher melting point has inevitably caused problems due to the softening point and heat resistance of the resin. Is getting harder.

  In addition, the method of exchanging defective products in the kit with another good product is not an improvement in product layout, etc., so the number of production on the wiring board manufacturer who manufactures the wiring board with the kit size determined by the wiring board user is produced. The efficiency issue has not improved at all.

  Generally, a plurality of wiring boards are mounted on one electronic device. If multiple wiring boards are made to correspond to one electronic device or are stored in one kit in units of one module, etc., handling and management are easy for wiring board users. Thus, productivity can be improved. However, from the standpoint of a wiring board manufacturer, there are the following problems.

  For example, when three types of wiring boards, wiring board A, wiring board B, and wiring board C, having different specifications and design standards are included in one kit, the wiring board A, the wiring board B, and the wiring board C are manufactured separately. Normally, the tendency and rate of defects occurring in the process are different. Then, the yield as a kit is determined by the worst one of them, and even if it is not, the production efficiency in the form of a kit that falls below the single item production is further deteriorated.

  In addition, wiring board A, wiring board B, and wiring board C with different specifications are housed in one kit and manufactured under the same processing conditions, but the specifications and design rules are different. The application state of heat and pressure is slightly different, the thickness of the insulating layer is different between the wiring board A and the wiring board B, or the side etch amount at the time of pattern formation is different due to the difference in wiring density, etc. A situation in which the finished line width differs between A and the wiring board C easily occurs.

  When the finished line width is different, for example, there is a possibility that the characteristic impedance differs between the wiring boards A, B, B, and C to be used as a set in one unit, and the unit does not work well. As a circuit board user, this is a situation to avoid. Therefore, more complicated and strict control of the manufacturing process is required, resulting in a further difficulty in manufacturing.

  Also, for the convenience of the wiring board user, etc., a part of the combined wiring boards (for example, when the wiring board A, the wiring board B, the wiring board C, and three types of boards are included in one kit, the wiring board When only A) is required, it can be produced only in units of kits, so that there is a problem in that the production efficiency and material efficiency are greatly reduced.

  In addition, as a wiring board user, when a kit is composed of wiring board A, wiring board B, and wiring board C for one module, for example, wiring board A is a single-sided board, wiring board B is a four-layer board, and wiring board C. It is basically impossible for a wiring board manufacturer to place wiring boards with fundamental specifications different from those of a 6-layer board in one kit. For example, if the wiring board A, which may be a single-sided board, is made with a material structure of a six-layer board, there is a problem that the cost is very high.

Japanese Patent Laid-Open No. 10-12993 JP 2004-87786 A JP 2002-289985 A JP 2002-43702 A JP 2003-69190 A

  The present invention has been made in view of such a situation, and includes a piece wiring board having a bridging portion, a piece accommodation hole in which the piece wiring board is accommodated, and a bridging recess in which the bridging portion is arranged. A multi-piece wiring board accommodation kit comprising a plurality of pre-formed individual piece wiring boards in a frame so that a non-defective piece wiring board can be easily and accurately made into a kit An object of the present invention is to provide a multi-piece wiring board accommodation kit.

  The present invention also relates to a method for recycling a multi-piece wiring board accommodation kit that reuses a frame of a multi-piece wiring board accommodation kit including a frame in which a plurality of piece wiring boards are arranged and accommodated. It is possible to provide a recycling method for a multi-piece wiring board accommodation kit that suppresses the manufacturing cost of the frame by repeatedly using the frame by joining a separately prepared new piece wiring board to the frame after removing Objective.

  Further, the present invention is a multi-piece wiring board accommodation kit comprising a piece wiring board having a bridging portion, a piece housing hole in which the piece wiring board is housed, and a frame having a bridging recess in which the bridging portion is arranged. A manufacturing method comprising: a frame positioning step for positioning a frame; a piece positioning step for positioning a piece wiring board; and a holding jig plate that opposes the frame and the piece wiring board to the reference jig plate and the reference jig plate. Another object is to provide a manufacturing method of a multi-piece wiring board accommodation kit capable of easily and accurately making a piece wiring board in a non-defective state by providing a jig plate pressurizing step for sandwiching To do.

  A multi-piece wiring board accommodation kit according to the present invention is a multi-piece wiring board accommodation kit comprising a piece wiring board formed as an individual unit wiring board and a frame containing a plurality of the piece wiring boards, The piece wiring board includes a bridging portion that protrudes from the outer peripheral end and is joined to the frame, and the frame is formed to resemble the outer peripheral end of the piece wiring board and accommodates the piece wiring board It is characterized by comprising an accommodation hole and a bridging recess formed in the thickness direction of the frame continuously to the piece accommodation hole and in which the bridging portion is arranged.

  Therefore, the multi-piece wiring board accommodation kit according to the present invention can accommodate a plurality of individually formed piece wiring boards in a frame easily and with high accuracy. The board can be easily and accurately made into a kit, and the productivity in the processing step for the piece wiring board can be improved.

  Further, in the multi-piece wiring board accommodation kit according to the present invention, the thickness of the piece wiring board and the thickness of the frame are equivalent, and the surface of the piece wiring board and the surface of the frame are flush with each other. Features.

  Therefore, when performing the process with respect to a piece wiring board using the multi-piece wiring board accommodation kit which concerns on this invention, the productivity in the processing process with respect to a piece wiring board can be improved.

  Further, in the multi-piece wiring board accommodation kit according to the present invention, the bridging portion is formed by extending a layer selected from a plurality of piece laminated material layers forming the piece wiring board. To do.

  Therefore, the multi-piece wiring board accommodation kit according to the present invention can easily and accurately form a bridge portion having a thickness smaller than that of the piece wiring board.

  Further, in the multi-piece wiring board accommodation kit according to the present invention, the bridging portion is formed by extending an inner layer core portion arranged on the inner side among the plurality of piece laminated material layers. To do.

  Therefore, the multi-piece wiring board accommodation kit according to the present invention can easily and accurately form a bridging portion having the same strength and thickness as the inner layer core portion.

  In the multi-piece wiring board accommodation kit according to the present invention, the plurality of piece wiring boards are of different types.

  Therefore, since the multi-piece wiring board accommodation kit according to the present invention is a so-called assembled board in which different types of piece wiring boards are accommodated in one kit, the kit content suitable for the mounting board of the mounting destination can be obtained. Thus, mounting on the mounting board can be efficiently performed with good productivity.

  Further, in the multi-piece wiring board accommodation kit according to the present invention, the frame is formed of a frame laminated material layer having the same number of layers as the piece wiring board, and the bridging recess is selected from the frame laminated material layer. A region corresponding to the bridging recess of the layer is formed by removing the region.

  Therefore, the multi-piece wiring board accommodation kit according to the present invention can easily and accurately form the frame and the bridging recess by the same process as the piece wiring board.

  Further, in the multi-piece wiring board accommodation kit according to the present invention, the frame is formed by a single frame member, and the bridging recess is formed by removing an area corresponding to the bridging portion from the frame member. It is characterized by being.

  Therefore, the multi-piece wiring board accommodation kit according to the present invention can easily form a frame.

  In the multi-piece wiring board accommodation kit according to the present invention, at least one of the plurality of piece wiring boards is a dummy wiring board.

  Therefore, the multi-piece wiring board accommodation kit according to the present invention mounts a necessary number of piece wiring boards in a state in which the handling ease and identity are ensured, so that it is possible to prevent the use of unnecessary piece wiring boards. Is possible and inexpensive.

  In the multi-piece wiring board accommodation kit according to the present invention, the bridging portion is joined to the bridging recess by a joining member disposed in the bridging recess.

  Therefore, the multi-piece wiring board accommodation kit according to the present invention can accommodate the pre-selected piece wiring board in the piece accommodation hole and securely fix the piece wiring board corresponding to the same rank. It can accommodate and can improve the productivity in the processing process with respect to a piece wiring board.

  In the multi-piece wiring board accommodation kit according to the present invention, the joining member is disposed between a bottom surface of the bridging recess and the bridging portion.

  Therefore, the multi-piece wiring board accommodation kit according to the present invention can easily and highly accurately arrange the joining member in the bridging recess, and can improve productivity.

  In the multi-piece wiring board accommodation kit according to the present invention, the outer surface of the bridging portion is arranged flush with or on the inner side of the surface of the frame.

  Therefore, the multi-piece wiring board accommodation kit according to the present invention can prevent the occurrence of protrusions on the surface of the frame and improve the ease of handling.

  Further, in the multi-piece wiring board accommodation kit according to the present invention, the joining member is disposed on the outer surface of the bridging portion, and between the bridging recess and the bridging portion on the inner side with respect to the surface of the frame. It is characterized by being filled in between.

  Therefore, the multi-piece wiring board accommodation kit according to the present invention can easily and highly accurately arrange the joining member on the bridging portion, so that productivity can be improved.

  In the multi-piece wiring board accommodation kit according to the present invention, the bridging portion and the bridging recess have a constriction in plan view.

  Therefore, since the multi-piece wiring board accommodation kit according to the present invention can suppress the flow of the joining member, the process is simplified by applying an adhesive when joining the bridge portion and the bridge recess portion. be able to.

  In the multi-piece wiring board accommodation kit according to the present invention, the piece wiring board satisfies a preset specification rank standard.

  Therefore, since the multi-piece wiring board accommodation kit according to the present invention can arrange the piece wiring boards satisfying the equivalent specifications, it is possible to improve the productivity in the processing step for the piece wiring boards.

  In the multi-piece wiring board accommodation kit according to the present invention, the frame includes a mark indicating processing information for a subsequent processing step.

  Therefore, the multi-piece wiring board accommodation kit according to the present invention can improve the productivity in the processing step for the piece wiring board.

  Moreover, in the multi-piece wiring board accommodation kit according to the present invention, the outer peripheral facing interval in which the outer peripheral end of the piece wiring board and the wall surface of the piece containing hole face each other is between several tenths of mm to several mm. It is characterized by that.

  Therefore, the multi-piece wiring board accommodation kit according to the present invention can securely and firmly position the piece wiring board to the piece accommodation hole within a preset range (outer periphery facing interval), and has improved workability and reliability. Can be improved.

  Moreover, in the multi-piece wiring board accommodation kit according to the present invention, a joining length at which the bridging part and the bridging concave part are joined is between several tenths of mm to several mm. .

  Therefore, the multi-piece wiring board accommodation kit according to the present invention can reliably join the piece wiring board (bridge portion) and the frame (bridge concave portion) in a preset range (joining length), Workability and reliability can be improved.

  Further, in the multi-piece wiring board accommodation kit according to the present invention, the bridge facing interval in which the side surface in the width direction of the bridge portion faces the wall surface of the bridge recess is between several tens of μm to several hundred μm. It is characterized by that.

  Therefore, the multi-piece wiring board accommodation kit according to the present invention can position and join the bridging portion to the bridging concave portion within a preset range (interval between bridges), thereby improving workability and reliability. Can be improved.

  A multi-piece wiring board accommodation kit recycling method according to the present invention comprises a piece wiring board formed as an individual unit wiring board, and a frame in which a plurality of the piece wiring boards are arranged and accommodated. A recycling method for a multi-piece wiring board housing kit that reuses the frame of the housing kit, wherein the multi-piece wiring board housing kit is a multi-piece wiring board housing kit according to the present invention, wherein the piece wiring board is After the frame is removed and the frame is washed, a new piece wiring board prepared separately is joined to the frame.

  Therefore, since the method for regenerating a multi-piece wiring board accommodation kit according to the present invention repeatedly uses the frame, the manufacturing cost of the frame can be suppressed.

  The method for manufacturing a multi-piece wiring board accommodation kit according to the present invention includes a piece wiring board formed as an individual unit wiring board, and a frame in which a plurality of the piece wiring boards are arranged and accommodated. The board includes a bridging portion that protrudes from the outer peripheral end and is joined to the frame, and the frame is formed to resemble the outer peripheral end of the piece wiring board and accommodates the piece wiring board And a manufacturing method of a multi-piece wiring board accommodation kit provided with a bridging recess formed continuously in the thickness direction of the frame so as to arrange the bridging portion, A frame positioning step for positioning and positioning the frame on the reference jig plate, and a piece position for receiving the piece wiring board in the piece receiving hole and positioning the bridging portion in the bridging recess. A jig plate that sandwiches the frame and the piece wiring board between the reference jig plate and the holding jig plate facing the reference jig plate after the piece wiring board is received in the piece receiving hole. And a pressurizing step.

  Therefore, the manufacturing method of the multi-piece wiring board accommodation kit according to the present invention makes it possible to easily and accurately accommodate a plurality of individually formed piece wiring boards in the frame. This piece wiring board can be easily and highly accurately made into a kit. In addition, the surface of the multi-piece wiring board accommodation kit can be easily flushed.

  Moreover, in the manufacturing method of the multi-piece wiring board accommodation kit which concerns on this invention, it is equipped with the joining member arrangement | positioning process which arrange | positions a joining member to the said bridge | bridging recessed part between the said frame positioning process and the said piece positioning process. And

  Therefore, the manufacturing method of the multi-piece wiring board accommodation kit according to the present invention makes it possible to easily and accurately join the bridging portion to the bridging recess, so that the piece wiring board is made into a kit with high productivity. be able to.

  Moreover, in the manufacturing method of the multi-piece wiring board accommodation kit which concerns on this invention, the joining member filling process which supplies a joining member to the outer surface of the said bridge | bridging part between the said frame positioning process and the said piece positioning process is carried out. It is characterized by providing.

  Therefore, the manufacturing method of the multi-piece wiring board accommodation kit according to the present invention enables the bridging part to be easily and accurately joined to the bridging concave part. can do.

  A multi-piece wiring board accommodation kit according to the present invention is a multi-piece wiring board accommodation kit comprising a piece wiring board formed as an individual unit wiring board, and a frame containing a plurality of piece wiring boards. The board includes a bridging portion that protrudes from the outer peripheral end and is joined to the frame, the frame is formed to resemble the outer peripheral end of the piece wiring board, and the piece receiving hole that accommodates the piece wiring board, and the piece accommodating And a bridging recess formed continuously in the thickness direction of the frame and having a bridging portion disposed therein.

  Therefore, since the multi-piece wiring board accommodation kit according to the present invention can accommodate a plurality of individually formed piece wiring boards in a frame, it is easy and highly accurate to obtain a non-defective piece wiring board. It is possible to make a kit, and the productivity in the processing step for the piece wiring board can be improved.

  A method for regenerating a multi-piece wiring board accommodation kit according to the present invention is a multi-piece wiring board accommodation kit comprising a piece wiring board formed as an individual unit wiring board and a frame in which a plurality of piece wiring boards are arranged and accommodated. A method for recycling a multi-piece wiring board housing kit that reuses a frame, wherein the multi-piece wiring board housing kit is the multi-piece wiring board housing kit according to any one of claims 1 to 18. After the piece wiring board is removed from the frame and the frame is subjected to a cleaning process, a separately prepared new piece wiring board is joined to the frame.

  Therefore, the method for regenerating a multi-piece wiring board accommodation kit according to the present invention repeatedly uses the frame, and thus has an effect of reducing the manufacturing cost of the frame.

  A manufacturing method of a multi-piece wiring board accommodation kit according to the present invention includes a piece wiring board formed as an individual unit wiring board and a frame in which a plurality of piece wiring boards are arranged and accommodated. The bridge includes a bridging portion that protrudes from the end and is joined to the frame. The frame includes a piece receiving hole that is formed to be similar to the outer peripheral end of the piece wiring board and accommodates the piece wiring board, and a bridging portion. Is a manufacturing method of a multi-piece wiring board accommodation kit provided with a bridging recess formed continuously in the thickness direction of the frame continuously with the piece accommodation hole, and positioning and arranging the frame on the reference jig plate The frame positioning step, the piece positioning step for receiving the piece wiring board in the piece receiving hole and positioning the bridge portion in the bridge recess, and positioning the piece wiring board in the piece receiving hole, And characterized in that it comprises a jig plate pressing step sandwiching by a pressing jig plate opposite the piece wiring board reference jig plate and reference jig plate.

  Therefore, the manufacturing method of the multi-piece wiring board accommodation kit according to the present invention makes it possible to easily and accurately accommodate a plurality of individually formed piece wiring boards in the frame. The piece wiring board can be easily and highly accurately kitted. Moreover, there exists an effect that the surface of a multi-piece wiring board accommodation kit can be easily made into the same state.

It is sectional drawing which shows schematic structure of the inner layer part of the piece wiring board accommodated in the multi-piece wiring board accommodation kit which concerns on Embodiment 1 of this invention. It is a disassembled sectional view which decomposes | disassembles and shows schematic structure of the outer layer part laminated | stacked on the inner layer part of the piece wiring board accommodated in the multi-piece wiring board accommodation kit which concerns on Embodiment 1 of this invention, and an inner layer part. It is a disassembled perspective view which decomposes | disassembles and shows the outline of the lamination | stacking state (Example 1) when forming the piece wiring board accommodated in the multi-piece wiring board accommodation kit which concerns on Embodiment 1 of this invention. It is a disassembled perspective view which decomposes | disassembles and shows the outline of the lamination | stacking state (Example 2) when forming the piece wiring board accommodated in the multi-piece wiring board accommodation kit which concerns on Embodiment 1 of this invention. It is a disassembled perspective view which decomposes | disassembles and shows the outline of the lamination | stacking state (Example 3) when forming the piece wiring board accommodated in the multi-piece wiring board accommodation kit which concerns on Embodiment 1 of this invention. It is a perspective view which shows schematic structure of the piece wiring board accommodated in the multi-piece wiring board accommodation kit which concerns on Embodiment 1 of this invention. It is sectional drawing which shows the schematic structure of the bridge part of the piece wiring board accommodated in the multi-piece wiring board accommodation kit which concerns on Embodiment 1 of this invention in a cross section. It is a perspective view which shows schematic structure of the flame | frame of the multi-piece wiring board accommodation kit which concerns on Embodiment 1 of this invention. It is a disassembled perspective view which decomposes | disassembles and shows the schematic structure of the flame | frame of the multi-piece wiring board accommodation kit which concerns on Embodiment 1 of this invention. It is a perspective view which shows schematic structure of the multi-piece wiring board accommodation kit which concerns on Embodiment 1 of this invention. It is sectional drawing which shows the relationship (Example 4) of the bridge part and bridge | bridging recessed part of the multi-piece wiring board accommodation kit which concerns on Embodiment 1 of this invention. It is sectional drawing which shows the relationship (Example 5) of the bridge part and bridge | bridging recessed part of the multi-piece wiring board accommodation kit which concerns on Embodiment 1 of this invention. It is a perspective view which shows schematic structure of the multi-piece wiring board accommodation kit which concerns on Embodiment 2 of this invention. It is process drawing explaining the manufacturing method of the multi-piece wiring board accommodation kit (Example 6) which concerns on Embodiment 3 of this invention. It is process drawing which shows the state of the multi-piece wiring board accommodation kit (Example 6) in the process after the process shown to FIG. 10A. It is process drawing explaining the manufacturing method of the multi-piece wiring board accommodation kit (Example 7) which concerns on Embodiment 3 of this invention. It is process drawing which shows the state of the multi-piece wiring board accommodation kit (Example 7) in the process after the process shown to FIG. 11A. It is process drawing explaining the manufacturing method of the multi-piece wiring board accommodation kit which concerns on Embodiment 4 of this invention. It is a top view which shows the comparative example with respect to the planar shape of the bridge part and bridge | bridging recessed part of the multi-piece wiring board accommodation kit which concerns on Embodiment 4 of this invention. It is a top view which shows the planar shape of the bridge part and bridge | bridging recessed part of the multi-piece wiring board accommodation kit which concerns on Embodiment 4 of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<Embodiment 1>
Based on FIG. 1 thru | or FIG. 5, the piece wiring board accommodated in the flame | frame of the multi-piece wiring board accommodation kit which concerns on this Embodiment is demonstrated. Based on FIG. 6A and FIG. 6B, the frame of the multi-piece wiring board accommodation kit which accommodates a piece wiring board according to this embodiment will be described. Based on FIG. 7 thru | or FIG. 8B, the multi-piece wiring board accommodation kit which concerns on this Embodiment is demonstrated.

  1 is a cross-sectional view showing a schematic configuration of an inner layer portion of a piece wiring board accommodated in a multi-piece wiring board accommodation kit according to Embodiment 1 of the present invention.

  2 is an exploded cross-sectional view showing an exploded schematic configuration of an inner layer portion of the piece wiring board accommodated in the multi-piece wiring board accommodation kit according to Embodiment 1 of the present invention and an outer layer portion laminated on the inner layer portion. It is.

  Piece wiring board 10 (FIG. 2) according to the present embodiment includes inner layer portion 13 (FIG. 1) and outer layer portion 17 (FIG. 2). The inner layer portion 13 includes an inner layer core portion 11 and inner layer conductor portions 12 formed on both surfaces of the inner layer core portion 11. The inner layer core portion 11 is, for example, a flexible insulating substrate, and the inner layer conductor portion 12 laminated on the inner layer core portion 11 is patterned to form an inner layer conductor pattern.

  Outer layer portions 17 are formed on both surfaces of the inner layer portion 13, respectively. The outer layer portion 17 includes an outer layer insulating portion 15 and an outer layer conductor portion 16. The outer layer insulating portion 15 is laminated by applying, for example, a prepreg. The prepreg is an adhesive sheet in which a glass cloth is impregnated with a thermosetting resin to be in a semi-cured state, and becomes a copper-clad laminate by heating and pressing together with the copper foil (outer layer conductor portion 16). Further, it is also used as an adhesive sheet between the inner layer core material and the copper foil in the multilayering process when forming the wiring board.

  Therefore, the inner layer portion 13 and the outer layer portion 17 each constitute a multilayer wiring board. That is, the piece wiring board 10 constitutes a multilayer wiring board. When the outer layer portion 17 is laminated on the inner layer portion 13, the bridge portion 19 can be easily formed by sandwiching the release film 14f at a position corresponding to the bridge portion 19 (see FIG. 4). For example, a polyimide film can be applied to the release film 14f.

  The piece wiring board 10 is formed by a conventional multilayer wiring board manufacturing technique such as application of a prepreg. The piece wiring board 10 is provided with a bridging portion 19 so as to be, for example, a flying tail type (a shape in which a flex portion partially protrudes from a rigid portion into a tail shape). Note that the piece wiring board 10 can be formed by applying an adhesive and a single-sided wiring material regardless of the example of the present embodiment, and may be formed by any other method.

  FIG. 3A is an exploded perspective view showing an exploded view of an outline of a laminated state (Example 1) when forming a piece wiring board accommodated in the multi-piece wiring board accommodation kit according to Embodiment 1 of the present invention. .

  The inner layer portion 13 is formed in a state including the piece outer shape position 10t when the piece wiring board 10 is completed. A release film 14f is disposed on the surface of the inner layer portion 13 outside the piece outer shape position 10t so as to correspond to the bridging portion 19 (Example 1). In the state where the release film 14f is arranged, the outer layer insulating portion 15 (for example, prepreg) and the outer layer conductor portion 16 are laminated on the inner layer portion 13 to form the outer layer portion 17. In a state where the inner layer portion 13 and the outer layer portion 17 are formed, a wiring board having a multilayer laminated structure before being separated into individual units as the piece wiring board 10 is formed.

  Although the outer layer insulating portion 15 and the outer layer conductor portion 16 are illustrated as being stacked on one surface (upper surface) side of the inner layer portion 13, the outer layer insulating portion 15 and the outer layer are also illustrated on the other surface (lower surface) side (not shown). The conductor portion 16 is laminated, and the outer layer portion 17 is laminated on both surfaces of the inner layer portion 13.

  The piece wiring board 10 (see FIG. 4) is formed by applying techniques similar to the conventional techniques such as through-hole processing, via-hole processing, pattern formation for the outer layer conductor portion 16, surface treatment, and cutting.

  FIG. 3B is an exploded perspective view showing an exploded view of the stacked state (Example 2) when the piece wiring board accommodated in the multi-piece wiring board accommodation kit according to Embodiment 1 of the present invention is formed. .

  FIG. 3B is a modification of FIG. 3A (Example 1), and the outer layer portion 17 has an outer insulating layer 15 and an outer conductor layer 16 preliminarily laminated, but has no adhesiveness, for example, a single-sided copper-laminated laminate. It consists of a plate material. A laminated adhesive 14b (adhesive sheet 14b) in which a punch hole 14w is previously formed at a position corresponding to the bridging portion 19 is laminated and adhered to the inner layer portion 13, and the outer layer portion 17 is laminated and adhered to the laminated adhesive 14b. A multilayer laminated structure before being separated into individual units is formed as the wiring board 10.

  In the case of the present example, a punch hole 14w is formed at a position where the release film 14f (Example 1) is disposed, and the laminated adhesive 14b is not formed in the punch hole 14w. Therefore, the piece wiring board 10 is formed as in the first embodiment. Since other matters are the same as those in the first embodiment, description thereof will be omitted.

  FIG. 3C is an exploded perspective view showing an exploded view of the laminated state (Example 3) when forming a piece wiring board accommodated in the multi-piece wiring board accommodation kit according to Embodiment 1 of the present invention. .

  3C is a modified example of FIG. 3B (Example 2), and the outer layer portion 17 has an outer insulating layer 15 and an outer conductor layer 16 pre-laminated, but has no adhesiveness, for example, single-sided copper-laminated laminate It consists of a plate material. In the outer layer portion 17 and the laminated adhesive 14b (adhesive sheet 14b), a punch hole 14w and a punch hole 17w are formed in advance at positions corresponding to the bridging portion 19, respectively. The hole-processed adhesive sheet 14b and the outer layer portion 17 are laminated and bonded to the inner layer portion 13 to form a multilayer laminated structure before being separated into individual units as the piece wiring board 10.

  In addition, in this case, the point from which the punching hole 17w is formed in the outer-layer part 17 and the punching hole 14w is formed in the adhesive agent sheet 14b differs from Example 2. FIG. Therefore, in the piece wiring board 10 before being separated into individual units similar to those in the first and second embodiments, the outer layer material (outer layer portion 17) in the bridging portion 19 to be described later is removed in advance ( For example, the multilayer stacked structure shown in FIGS. 8A, 8B, and 10A) is formed. Since other matters are the same as those in the first embodiment, description thereof will be omitted.

  FIG. 4 is a perspective view showing a schematic configuration of a piece wiring board accommodated in the multi-piece wiring board accommodation kit according to Embodiment 1 of the present invention.

  As shown in FIGS. 3A to 3C, the outer layer portion 17 is laminated on the surface of the inner layer portion 13 to form a wiring board having a multilayer laminated structure. That is, a wiring board having a multilayer structure before being separated into individual units as the piece wiring board 10 is formed.

  Thereafter, the wiring board having the multilayer laminated structure is cut according to the piece outer shape position 10t. The piece wiring board 10 has an outer layer wiring pattern 16p (see FIG. 5) appropriately formed on the outer layer conductor portion 16 (the illustration of the outer layer wiring pattern 16p is omitted in FIG. 4).

  That is, the piece wiring board 10 is formed as an individual unit wiring board (multilayer wiring board). At this time, the bridging portion 19 is left in a state of protruding from the piece outer position 10t without being cut from the piece wiring board 10 (piece outer position 10t).

  The bridging portion 19 includes a release film 14f in FIG. 3A (Example 1), a punch hole 14w in FIG. 3B (Example 2), a punch hole 14w in FIG. 3C (Example 3), and a punch hole 17w. Each is formed in a corresponding region. That is, the bridging portion 19 corresponds to a region processed so that the outer layer portion 17 does not adhere to the inner layer portion 13 (non-adhesive region), and corresponds to a region that is the same as or slightly inside the non-adhesive region. Shaped.

  Accordingly, the piece wiring board 10 according to the present embodiment includes the bridging portion 19 that is formed to protrude from the outer peripheral end (piece outer shape position 10t) and is joined to the frame 30 (see FIG. 6A). The bridging portion 19 is, for example, about 1 mm to 2 mm in width and about 1 mm to several mm in length, and is joined to the frame 30.

  As described above, the piece wiring board 10 is manufactured on the side where the piece wiring board 10 is manufactured without being restricted by the size of the multi-piece wiring board accommodation kit 1 and the arrangement of the piece wiring boards 10 in the kit. Thus, it is possible to form a workpiece having a multilayer laminated structure in which the piece wiring board 10 is freely formed.

  In other words, it is possible to optimize the production efficiency and material efficiency that have been problems in the prior art, and the multi-piece wiring because one defective product exists among the plurality of piece wiring boards 10. It can prevent that the board accommodation kit 1 whole becomes defective, can improve productivity, and can reduce production cost.

  FIG. 5 is a cross-sectional view showing a schematic configuration of the bridging portion of the piece wiring board housed in the multi-piece wiring board housing kit according to Embodiment 1 of the present invention in cross section.

  The piece wiring board 10 includes an outer layer portion 17 (an outer layer insulating portion 15 and an outer layer wiring pattern 16p) laminated on the inner layer portion 13, and includes a bridging portion 19 protruding from the piece outer position 10t.

  In the region corresponding to the bridging portion 19, the outer layer portion 17 is not bonded to the inner layer portion 13 as described above. Therefore, the outer layer portion 17 in the region corresponding to the bridging portion 19 can be peeled off by applying an appropriate external force Fr.

  The piece wiring board 10 can also be formed by employing another processing procedure in the conventional method for manufacturing a flying tail type partially flexible wiring board. For example, in order to make it easy to peel the outer layer portion 17 in the region corresponding to the bridging portion 19, a method of forming slits and half cuts in advance in the actual outer position of the wiring board of the outer layer portion 17, It is also possible to adopt a method of forming the piece wiring board 10 by removing the outer layer portion 17 in the corresponding region and then cutting the wiring board having a multilayer laminated structure.

  In the case where the piece wiring board 10 has a partially flexible structure (a structure called a so-called flex rigid), the flexible region (flex part) constitutes the inner layer part 13 (inner layer core part 11). Since the flexible wiring board (flex board) that extends to the outside becomes an exposed region, the bridging portion 19 can be configured by simply extending the flexible wiring board ( (See Embodiment 2, FIG. 9).

  The piece wiring board 10 which is an individual unit wiring board is subjected to inspections such as electrical inspection and appearance inspection, and can select only non-defective products. Moreover, it is possible to classify into an appropriate specification rank according to the specification within the characteristic range of non-defective products.

  The standard of the specification rank includes, for example, electrical characteristics, shape specifications (dimension specifications), appearance specifications such as colors, and other qualities. The standard of the specification rank can be determined in advance between the orderer who ordered the multi-piece wiring board accommodation kit 1 and the manufacturer who manufactures the multi-piece wiring board accommodation kit 1.

  More specifically, the electrical characteristics include characteristic impedance and conduction resistance. In addition, as physical characteristics, the thickness and dimensions of the wiring board, the pattern based on the reference guide position, the deviation of the resist formation position from the design value, the deviation from the design value such as the pattern width (for example, side Etch amount), wiring pattern conductor thickness, through hole, terminal plating thickness, resist thickness, and the like.

  Further, as appearance characteristics, there are an overall or local hue (in particular, a hue of a resist or a transparent copper foil), brightness, and saturation. For example, glossiness of terminal conductors, plated parts, wiring boards as a whole, surface roughness of plated terminals, scratches on optical recognition marks such as futuristic marks, direction of polishing scratches, scratch depth, glossiness, color tone, etc. There is.

  As described above, the piece wiring board 10 can satisfy a preset specification rank standard. Therefore, since the multi-piece wiring board accommodation kit 1 can arrange the piece wiring boards 10 that satisfy the equivalent specifications, the productivity of the piece wiring board 10 in the processing step can be improved.

  FIG. 6A is a perspective view showing a schematic configuration of a frame of the multi-piece wiring board accommodation kit according to Embodiment 1 of the present invention.

  A frame 30 is prepared separately from the piece wiring board 10. The frame 30 according to the present embodiment is formed to be similar to the outer peripheral end (piece outer shape position 10t) of the piece wiring board 10 and is continuous to the piece receiving hole 41 for receiving the piece wiring board 10 and the piece receiving hole 41. And a bridging recess 42 formed in the thickness direction of the frame 30 in which the bridging portion 19 is disposed.

  Further, the frame 30 includes a guide hole 30g for positioning and accommodating the piece wiring board 10. That is, the piece wiring board 10 is accommodated in the piece accommodating hole 41, and the bridging portion 19 is joined to the bridging recess 42.

  The piece receiving hole 41 is formed to be slightly larger than the piece wiring board 10. Moreover, the bridging recessed part 42 is previously formed so that the bridging part 19 may be joined. The frame 30 may be formed of a single frame member, and the bridging recess 42 may be formed by removing an area corresponding to the bridging portion 19 from the frame 30 member. According to this configuration, the frame 30 can be easily formed.

  The frame 30 can be formed by shaping and grinding a metal plate. Further, it can be formed by molding a heat-resistant synthetic resin. Furthermore, as shown in FIG. 6B, a laminated structure similar to that of the piece wiring board 10 can be used.

  The material of the frame 30 withstands the processing temperature when the piece wiring board 10 is accommodated in the frame 30 and the processing temperature in the processing step for the piece wiring board 10 accommodated in the multi-piece wiring board accommodation kit 1 (frame 30). Anything is fine.

  The frame 30 is preferably provided with a mark 30m indicating processing information for a subsequent processing step. With this configuration, the multi-piece wiring board accommodation kit 1 can improve productivity in the processing step for the piece wiring board 10.

  The mark 30m indicating the processing information includes, for example, various displays such as a guide groove, a position display, a lot name display, a model name display, and a reflow direction display in addition to the guide hole 30g.

  FIG. 6B is an exploded perspective view showing an exploded schematic structure of the frame of the multi-piece wiring board accommodation kit according to Embodiment 1 of the present invention.

  The frame 30 includes a frame inner layer portion 34 corresponding to the inner layer portion 13 of the piece wiring board 10, a frame outer layer portion 37 and a frame outer layer portion 40 corresponding to the outer layer portions 17, 17 of the piece wiring board 10.

  Further, in order to adjust the shape in the thickness direction of the bridging recess 42 (position in the thickness direction with respect to the bridging portion 19), the frame inner layer portion 34 is a frame inner layer punch hole in a region corresponding to the bridging portion 19. 34w, and the frame outer layer portion 40 has a frame outer layer punch hole 40w.

  The frame outer layer portion 37, the frame inner layer portion 34 in which the frame inner layer punch hole 34w is formed, and the frame outer layer portion 40 in which the frame outer layer punch hole 40w is formed are stacked, and then a piece receiving hole corresponding to the piece wiring board 10 41 is formed by punching, for example, and the frame 30 shown in FIG. 6A is obtained.

  Further, after the laminating process, the piece receiving hole 41 and the guide hole 30g are formed by drilling, die processing, or the like. Further, the mark 30m is formed by printing or the like.

  FIG. 7 is a perspective view showing a schematic configuration of the multi-piece wiring board accommodation kit according to Embodiment 1 of the present invention.

  The piece wiring board 10 is set on the frame 30 shown in FIG. 6A to form the multi-piece wiring board accommodation kit 1. The piece wiring board 10 has already been inspected in advance and is classified into specification ranks as necessary, so that a multi-piece wiring board accommodation kit 1 containing the piece wiring boards 10 with uniform attributes is formed. can do.

  As described above, the multi-piece wiring board accommodation kit 1 according to the present embodiment includes a piece wiring board 10 formed as an individual unit wiring board (multilayer wiring board), and a frame 30 containing a plurality of piece wiring boards 10. Is a multi-piece wiring board accommodation kit 1.

  In addition, the piece wiring board 10 includes a bridging portion 19 that protrudes from the outer peripheral end and is joined to the frame 30, and the frame 30 is formed to be similar to the outer peripheral end of the piece wiring board 10. A piece receiving hole 41 accommodated and a bridging recess 42 formed continuously in the thickness direction of the frame 30 and arranged with the bridging portion 19 are provided.

  Therefore, the multi-piece wiring board accommodation kit 1 according to the present invention can accommodate a plurality of pieces of the individual unit wiring boards 10 formed in advance in the frame 30 easily and with high accuracy. The piece wiring board 10 can be easily and highly accurately kitted, and the productivity of the piece wiring board 10 in the processing step can be improved.

  Note that the thickness of the piece wiring board 10 and the thickness of the frame 30 are equal, and the surface of the piece wiring board 10 and the surface of the frame 30 are preferably flush with each other. Therefore, the productivity in the processing step for the piece wiring board 10 can be improved using the multi-piece wiring board accommodation kit 1.

  The accuracy of “level” in the present embodiment may be a value that is sufficiently small with respect to the thickness of the piece wiring board 10 (for example, 1/10 to 1/20 or less). It is a range including about 1 mm.

  At least one of the plurality of piece wiring boards 10 can be a dummy wiring board. According to this configuration, the multi-piece wiring board accommodation kit 1 mounts the necessary number of piece wiring boards 10 in a state in which the handling ease and identity are ensured. It becomes possible to prevent, and it becomes cheap.

  FIG. 8A is a cross-sectional view showing a relationship (Example 4) between the bridging portion and the bridging recess of the multi-piece wiring board accommodation kit according to Embodiment 1 of the present invention.

  The piece wiring board 10 includes an inner layer portion 13 and outer layer portions 17 and 17 stacked on both surfaces of the inner layer portion 13. The inner layer portion 13 includes an inner layer core portion 11 and an inner layer conductor portion 12. The outer layer portion 17 includes an outer layer insulating portion 15 and an outer layer conductor portion 16. The outer layer insulating portion 15 is formed by laminating a plurality of (for example, four) prepregs. The bridging portion 19 is formed by extending the inner layer core portion 11 from which the inner layer conductor portion 12 is removed.

  That is, the bridging portion 19 extends a layer selected from a plurality of piece laminated material layers (the inner layer core portion 11, the inner layer conductor portion 12, the outer layer insulating portion 15, and the outer layer conductor portion 16) that form the piece wiring board 10. Is formed. According to this configuration, the multi-piece wiring board accommodation kit 1 can easily and accurately form the bridging portion 19 having a thickness smaller than the thickness of the piece wiring board 10.

  Moreover, as for the bridging part 19, it is desirable to extend and form the inner layer core part 11 arrange | positioned inside among several piece laminated material layers. According to this configuration, the multi-piece wiring board accommodation kit 1 can easily and highly accurately form the bridging portion 19 having the same strength and thickness as the inner layer core portion 11.

  On the other hand, the frame 30 includes a frame inner layer portion 34, a frame outer layer portion 37, and a frame outer layer portion 40. The frame inner layer portion 34 includes a frame inner layer core portion 31, a frame inner layer conductor portion 32 and a frame inner layer conductor portion 33 which are respectively laminated on both surfaces of the frame inner layer core portion 31. A frame outer layer portion 37 is laminated on the frame inner layer conductor portion 32, and a frame outer layer portion 40 is laminated on the frame inner layer conductor portion 33.

  The frame outer layer portion 37 includes a frame outer layer insulating portion 35 and a frame outer layer conductor portion 36, and the frame outer layer portion 40 includes a frame outer layer insulating portion 38 and a frame outer layer conductor portion 39. The frame outer layer insulating portion 35 and the frame outer layer insulating portion 38 are formed by stacking a plurality of prepregs (four corresponding to the outer layer insulating portion 15), for example.

  As described above, in the laminated structure of multi-piece wiring board accommodation kit 1 according to the present embodiment, frame inner layer portion 34 corresponds to inner layer portion 13. That is, the frame inner layer core portion 31 corresponds to the inner layer core portion 11, the frame inner layer conductor portion 32 corresponds to the inner layer conductor portion 12, and the frame inner layer conductor portion 33 corresponds to the inner layer conductor portion 12. The frame outer layer portion 37 corresponds to the outer layer portion 17 (upper side in the drawing). That is, the frame outer layer insulating portion 35 corresponds to the outer layer insulating portion 15, and the frame outer layer conductor portion 36 corresponds to the outer layer conductor portion 16. The frame outer layer portion 40 corresponds to the outer layer portion 17 (the lower side in the drawing). That is, the frame outer layer insulating portion 38 corresponds to the outer layer insulating portion 15, and the frame outer layer conductor portion 39 corresponds to the outer layer conductor portion 16.

  The frame inner layer conductor portion 33, the frame outer layer insulating portion 38, and the frame outer layer conductor portion 39 are left in the region of the bridging recess 42, and the frame inner layer conductor portion 33 (the frame outer layer insulating portion 38 and the frame outer layer conductor portion 39). A bottom surface of the bridging recess 42 is formed. Further, with respect to the region of the bridging recess 42, the frame inner layer core portion 31, the frame inner layer conductor portion 32, and the frame outer layer portion 37 (the frame outer layer insulating portion 35 and the frame outer layer conductor portion 36) are removed. Side surfaces are formed.

  That is, the outer frame layer portion 37, the inner frame layer conductor portion 32, and the inner frame layer core portion 31 are removed to form the bridging recess 42. In addition, in the remaining frame inner layer conductor portion 33 and frame outer layer portion 40 constituting the bottom surface of the bridging recess 42, a piece receiving hole 41 is formed continuously to the bridging recess 42. Therefore, the piece wiring board 10 is housed in the piece housing hole 41.

  As described above, in the present embodiment, the frame 30 is composed of the same number of frame laminated material layers as the piece wiring board 10 (frame inner layer core portion 31, frame inner layer conductor portion 32, frame inner layer conductor portion 33, frame outer layer insulation). Part 35, frame outer layer conductor part 36, frame outer layer insulating part 38, frame outer layer conductor part 39), and the bridging recess 42 has a region corresponding to the bridging recess 42 of the layer selected from the frame laminated material layer. It is formed by removing.

  Therefore, the multi-piece wiring board accommodation kit 1 can easily and highly accurately form the frame 30 and the bridging recess 42 by the same process as the piece wiring board 10.

  In addition, as for the outer periphery opposing space | interval Spf where the outer periphery end of the piece wiring board 10 and the wall surface of the piece accommodation hole 41 oppose, it is desirable to be between several tenths mm to several mm. With this configuration, the multi-piece wiring board accommodation kit 1 can reliably and firmly position the piece wiring board 10 in the piece accommodation hole 41 within a preset range (outer periphery facing interval Spf), and is easy to operate and reliable. Can be improved. That is, the piece receiving hole 41 is formed to be larger than the outer peripheral end of the piece wiring board 10 so as to correspond to a preset range (outer peripheral facing interval Spf).

  By setting the outer peripheral facing interval Spf from several tenths of mm to several mm within this range, the piece wiring board 10 can be easily and accurately inserted into the piece receiving hole 41. This is because the housing operation can be performed with good workability. That is, what makes the bridging recess 42 larger than the bridging portion 19 is a clearance for positioning when the piece wiring board 10 is accommodated in the frame 30.

  Moreover, it is desirable that the joining length Lbb at which the bridging portion 19 and the bridging recess 42 are joined is between several tenths of mm to several mm. With this configuration, the multi-piece wiring board accommodation kit 1 reliably joins the piece wiring board 10 (the bridging portion 19) and the frame 30 (the bridging recess 42) within a preset range (joining length Lbb). It is possible to improve workability and reliability.

The joining length Lbb is set to a few tenths to a few millimeters in this range, so that the piece wiring board 10 can be easily and accurately accommodated in the piece accommodation hole 41 in the bridge. This is because the portion 19 can be reliably joined to the bridging recess 42 and workability and reliability can be improved. FIG. 8B is a diagram of the multi-piece wiring board accommodation kit according to Embodiment 1 of the present invention. It is sectional drawing which shows the relationship (Example 5) of a bridge part and a bridge recessed part.

  FIG. 8A is a modified example (Example 5), and the basic configuration is the same as that of FIG. 8A, and therefore, different items will be mainly described.

  The piece wiring board 10 includes an inner layer portion 13 and outer layer portions 17 and 17 stacked on both surfaces of the inner layer portion 13. The inner layer part 13, the outer layer part 17, and the bridging part 19 are the same as in Example 4 (FIG. 8A). On the other hand, the frame 30 includes a frame inner layer portion 34, a frame outer layer portion 37, and a frame outer layer portion 40. The frame inner layer portion 34, the frame outer layer portion 37, and the frame outer layer portion 40 are the same as those in the fourth embodiment (FIG. 8A).

  For a region of the bridging recess 42, a part of the layer outer layer insulating portion 38 (for example, the remaining three layers excluding one of the four prepregs on the inner frame inner layer conductor portion 33 side), the frame The outer conductor portion 39 is left, and the bottom surface of the bridging recess 42 is formed. In addition, with respect to the region of the bridging recess 42, some layers of the frame inner layer portion 34, the frame outer layer portion 37, the frame inner layer conductor portion 33, and the frame outer layer insulating portion 38 (for example, inner frame inner layer conductors of four prepregs). The side surface of the bridging recess 42 is formed by removing one layer on the part 33 side.

  That is, a part of the outer layer layer portion 37, the inner frame layer portion 34, and the outer frame layer insulating portion 38 is removed to form the bridging recess 42. Further, the joining member 25 is connected to the bridging portion 19 and the bridge so as to correspond to the difference in the thickness direction with respect to the fourth embodiment (the thickness of the frame inner layer conductor portion 33, the thickness of one prepreg constituting the frame outer layer insulating portion 38). It arrange | positions between the bottom faces of the tangle recess 42.

  As shown in FIG. 8A and FIG. 8B, the depth position of the bridging recess 42 can be appropriately adjusted in accordance with the position of the bridging part 19. That is, it is possible to adjust the position with respect to the bridging portion 19 by changing the stacking state symmetrically or asymmetrically on both sides with the frame inner layer portion 34 as the center. In addition, the thickness of the joining member 25 can be taken into consideration to make it asymmetric.

  The thickness when the outer frame insulating portion 38 is removed in correspondence with the bridging recess 42 is adjusted in consideration of the thickness and position of the bridging portion 19. That is, in the state after the piece wiring board 10 is fitted and accommodated in the piece accommodation hole 41 and the bridging portion 19 is joined to the bridging recess 42, both surfaces of the piece wiring board 10 are both of the frame 30. Adjustment is made so that the surface is substantially flush with the surface.

  As shown in FIGS. 8A and 8B, when the piece wiring board 10 and the frame 30 have the same laminated structure, that is, the piece laminated material layer (the inner layer core portion 11, the inner layer conductor portion 12, the outer layer insulating portion 15, Outer layer conductor portion 16), frame laminated material layer (frame inner layer core portion 31, frame inner layer conductor portion 32, frame inner layer conductor portion 33, frame outer layer insulating portion 35, frame outer layer conductor portion 36, frame outer layer insulating portion 38, frame outer layer When the conductor portion 39) has the same laminated structure, the thicknesses can be matched to each other depending on the situation of the bridging portion 19.

  When the joining member 25 (joining member 25f) has a thickness, the surface of the multi-piece wiring board accommodation kit 1 can be made flush by adjusting, for example, the number of prepregs constituting the frame outer layer insulating portion 38. it can. Since the frame outer layer insulating portion 35 and the frame outer layer insulating portion 38 generally have a prepreg laminated structure in many cases, the thickness can be easily adjusted by adjusting the number of prepregs.

  The thickness and position of the bridging portion 19 are also adjusted by adjusting the lamination state of the outer insulating layer 15 constituting the outer layer portion 17 (for example, adjusting the number of prepregs when a plurality of prepregs are laminated). It is possible to change.

  In the present embodiment, the bridging portion 19 is joined to the bridging recess 42 by a joining member 25 (25f) disposed in the bridging recess 42. Therefore, the multi-piece wiring board accommodation kit 1 can accommodate the piece wiring board 10 selected in advance in the piece accommodation hole 41 and securely fix the piece wiring board 10 corresponding to the same specification rank. The productivity in the processing step for the piece wiring board 10 can be improved.

  Further, it is desirable that the joining member 25f be disposed between the bottom surface of the bridging recess 42 and the bridging portion 19. With this configuration, the multi-piece wiring board accommodation kit 1 can easily and highly accurately arrange the joining member 25f in the bridging recess 42, so that productivity can be improved.

<Embodiment 2>
Based on FIG. 9, the multi-piece wiring board accommodation kit which concerns on this Embodiment is demonstrated.
Since the basic configuration of the multi-piece wiring board accommodation kit according to the present embodiment is the same as that of the multi-piece wiring board accommodation kit 1 according to the first embodiment, the differences are mainly described with reference to the reference numerals.

  FIG. 9 is a perspective view showing a schematic configuration of a multi-piece wiring board accommodation kit according to Embodiment 2 of the present invention.

  In the multi-piece wiring board accommodation kit 1 according to the present embodiment, a plurality of types of piece wiring boards 10 are arranged. For example, a first type piece wiring board 10 (piece wiring board 10 m) and a second type piece wiring board 10 (piece wiring board 10 n) are accommodated in one frame 30.

  That is, in the multi-piece wiring board accommodation kit 1 according to the present embodiment, the plurality of piece wiring boards 10 are of different types. Therefore, since the multi-piece wiring board accommodation kit 1 according to the present invention is a so-called assembled board in which different types of piece wiring boards 10 (piece wiring boards 10m, piece wiring boards 10n) are accommodated in one kit. Productivity in the processing step for the plate 10 can be improved.

  The piece wiring board 10n has, for example, a partially flexible structure (a structure called a so-called flex rigid). That is, a hard wiring board 10nh (rigid board) as a main body part and a flexible wiring board 10nf (flex board) as an extended part extended from the hard wiring board 10nh are provided.

  The flexible wiring board 10nf is a region where the flexible board (flex board) constituting the inner layer portion 13 (inner layer core portion 11) is exposed to the outside, and thus is exposed to the flexible wiring substrate 10nf. The corresponding bridging portion 19 can be configured by simply extending the flexible wiring board 10nf.

  The multi-piece wiring board accommodation kit 1 according to the first to fifth embodiments can be a so-called assembled board in which different kinds of wiring boards 10 are accommodated. In the case of an assembled board, the effectiveness when only some of the piece wiring boards 10 are required will be described.

  In the case of an assembled board, it is usually desirable from the viewpoint of productivity to accommodate a unit corresponding to one unit of a mounting board as a mounting destination in the multi-piece wiring board accommodation kit 1. Therefore, in the assembled board, the necessary number and the necessary types of piece wiring boards 10 are accommodated in the multi-piece wiring board accommodation kit 1, so that there is no excess or deficiency in a normal production state.

  However, for example, when the piece wiring board 10 is mounted on the mounting board of the mounting destination using the assembled board, when a defect occurs in the specific piece wiring board 10, the piece wiring board 10 is required for repair. For example, only a specific one of the piece wiring boards 10 accommodated in the assembled substrate is required.

  In the conventional technology, since the multi-piece wiring board accommodation kit is formed in units of kits, the piece wiring board included in the multi-piece wiring board accommodation kit will produce unnecessary ones, and wasteful production Will do. However, separately manufacturing only the necessary piece wiring board requires a new manufacturing preparation from the beginning, which requires a lot of costs, labor, and time.

  Even in the above-described situation, according to the multi-piece wiring board accommodation kit 1 according to the present embodiment, the piece wiring boards 10 originally manufactured under optimum conditions are accommodated in the frame 30 even if they are assembled boards. Because it is only doing, correspondence is easy. That is, it is possible to respond quickly and inexpensively by various means as shown in the following (1) to (3).

  For example, (1) only the necessary piece wiring board 10 is accommodated in the frame 30 to obtain the multi-piece wiring board accommodation kit 1. (2) The dummy wiring board is accommodated in the portion corresponding to the unnecessary piece wiring board 10 instead of the regular piece wiring board 10. (3) A frame 30 on which only the necessary piece wiring board 10 is arranged is newly prepared and the piece wiring board 10 is accommodated.

<Embodiment 3>
Based on FIG. 10A thru | or FIG. 11B, the manufacturing method of the multi-piece wiring board accommodation kit which concerns on this Embodiment, and a multi-piece wiring board accommodation kit is demonstrated. Since the basic configuration of the multi-piece wiring board accommodation kit is the same as that of the first embodiment and the second embodiment, mainly different items will be described with reference to symbols.

  FIG. 10A is a process diagram illustrating a method for manufacturing the multi-piece wiring board accommodation kit (Example 6) according to Embodiment 3 of the present invention.

  FIG. 10B is a process diagram illustrating a state of the multi-piece wiring board accommodation kit (Example 6) in a process subsequent to the process illustrated in FIG. 10A.

  First, a reference jig plate 50 provided with positioning pins 50p is prepared. Next, the guide hole 30g of the frame 30 is positioned on the positioning pin 50p and placed on the reference jig plate 50.

  Thereafter, the joining member 25 is disposed on the bottom surface of the bridging recess 42. As the bonding member 25, for example, a thin epoxy prepreg or an epoxy-based material is considered in consideration of consistency such as adhesion, heat resistance, and thermal expansion coefficient of the inner layer portion 13 of the piece wiring board 10 with the inner layer core portion 11. Apply adhesive sheet. An appropriate amount of an epoxy adhesive may be dropped on the bottom surface of the bridging recess 42 instead of the film-like joining member 25.

  When the joining member 25 is thermosetting, curing can be promoted by heating the reference jig plate 50 and the holding jig plate 51. When it is necessary to suppress the surface treatment of the piece wiring board 10, the oxidation of the outer layer conductor portion 16 (copper foil), and the like, and naturally it is desired to avoid heating, a normal temperature curing adhesive can be applied.

  After the joining member 25 is applied to the bridging recess 42, the guide hole 10g of the piece wiring board 10 is positioned on the positioning pin 50p, and the piece wiring board 10 is accommodated in the frame 30 (piece receiving hole 41, bridging recess 42). . In addition, the bridge part 19 (bridge part 19f) of a present Example is made symmetrical in the lamination direction. That is, the outer layer portion 17 is removed symmetrically on both sides with respect to the inner layer portion 13.

  Thereafter, the holding jig plate 51 is disposed so as to overlap the reference jig plate 50, the piece wiring board 10, and the frame 30, and the piece wiring board 10 is accommodated in the frame 30 by appropriate pressure and heating. In addition, when there exists a possibility that the bridging part 19f may float in the middle of the bridging recessed part 42, you may make it press the bridging part 19f by forming a projection part in the holding jig board 51. FIG. By providing the protrusion that presses the bridging portion 19f, the bonding by the joining member 25 can be more reliably performed. Further, heating and pressurization can be performed only on the region of the bridging portion 19f and the joining member 25.

  That is, in the present embodiment, the bridging portion 19f is joined to the bridging recess 42 by the joining member 25 (joining member 25f) disposed in the bridging recess 42. Therefore, the multi-piece wiring board accommodation kit 1 can accommodate the piece wiring board 10 selected in advance in the piece accommodation hole 41 and securely fix the piece wiring board 10 corresponding to the same rank. It can accommodate and can improve the productivity in the processing process with respect to the piece wiring board 10. FIG.

  In more detail, the joining member 25f is preferably disposed between the bottom surface of the bridging recess 42 and the bridging portion 19f. With this configuration, the multi-piece wiring board accommodation kit 1 can easily and highly accurately arrange the joining member 25f in the bridging recess 42, so that productivity can be improved.

  As described above, the manufacturing method of the multi-piece wiring board accommodation kit 1 according to the present embodiment includes a plurality of piece wiring boards 10 formed as individual unit wiring boards (multilayer wiring boards) and a plurality of piece wiring boards 10. The piece wiring board 10 includes a bridging portion 19f that protrudes from the outer peripheral end and is joined to the frame 30. The frame 30 is similar to the outer peripheral end of the piece wiring board 10. A piece receiving hole 41 formed and containing the piece wiring board 10 and a bridging recess 42 formed continuously in the thickness direction of the frame 30 so as to dispose the bridging portion 19f. This is a manufacturing method of the multi-piece wiring board accommodation kit 1.

  In the manufacturing method of the multi-piece wiring board accommodation kit 1 according to the present embodiment, the piece wiring board 10 is accommodated in the piece positioning hole 41 and the frame positioning step of positioning and arranging the frame 30 on the reference jig board 50. After the piece positioning step of fitting the bridging portion 19f into the bridging recess 42 and positioning the piece wiring board 10 in the piece receiving hole 41, the frame 30 and the piece wiring board 10 are connected to the reference jig plate 50 and the reference jig. A jig plate pressing step sandwiched between the holding jig plate 51 facing the tool plate 50.

  Therefore, the manufacturing method of the multi-piece wiring board accommodation kit 1 can accommodate a plurality of pieces of piece wiring boards 10 formed in advance in the frame 30 easily and with high accuracy. The piece wiring board 10 can be easily and highly accurately kitted. Moreover, the multi-piece wiring board accommodation kit 1 can be easily made flush.

  Moreover, the joining member arrangement | positioning process of arrange | positioning the joining member 25f to the bridging recessed part 42 is provided between a frame positioning process and a piece positioning process. Therefore, since the manufacturing method of the multi-piece wiring board accommodation kit 1 enables the bridging portion 19f to be easily and accurately joined to the bridging recess 42, the piece wiring board 10 is made into a kit with high productivity. be able to. That is, it becomes possible to apply the joining member 25f formed into a sheet, and the productivity can be improved.

  FIG. 11A is a process diagram illustrating a method for manufacturing the multi-piece wiring board accommodation kit (Example 7) according to Embodiment 3 of the present invention.

  FIG. 11B is a process diagram illustrating a state of the multi-piece wiring board accommodation kit (Example 7) in a process subsequent to the process illustrated in FIG. 11A.

  The bridging portion 19 (bridging portion 19s) in the present embodiment is different from the bridging portion 19f in the sixth embodiment. That is, the bridging portion 19s in this embodiment is asymmetric in the stacking direction. That is, the outer layer portion 17 on the surface facing the piece receiving hole 41 is removed, but the outer layer portion 17 on the surface side is left. Therefore, the surface of the bridging portion 19 s is flush with the surface of the piece wiring board 10. The other items are the same as in the case of the sixth embodiment (FIGS. 10A and 10B), and thus the description thereof is omitted.

  As described above, in the present embodiment, the outer surface of the bridging portion 19s is disposed flush with or on the inner side of the surface of the frame 30. Therefore, the multi-piece wiring board accommodation kit 1 can prevent the occurrence of protrusions on the surface of the frame 30 and improve the ease of handling.

  The multi-piece wiring board accommodation kit 1 formed by the manufacturing method of the multi-piece wiring board accommodation kit 1 according to the present embodiment has the same characteristics as the piece wiring board 10 accommodated in the kit. Thus, it is possible to eliminate the influence of the variation of the piece wiring board 10 which is a problem. For example, since the influence of the variation of the piece wiring board 10 which becomes a problem when the piece wiring board 10 accommodated in the multi-piece wiring board accommodation kit 1 is replaced does not occur, high quality for the user who uses the piece wiring board 10 This is a multi-piece wiring board housing kit 1 and an efficient production method for a manufacturer supplying the piece wiring board 10.

<Embodiment 4>
Based on FIG. 12 thru | or FIG. 13B, the manufacturing method of the multi-piece wiring board accommodation kit which concerns on this Embodiment, and a multi-piece wiring board accommodation kit is demonstrated. Since the basic configuration of the multi-piece wiring board accommodation kit is the same as that of the first to third embodiments, the differences are mainly described with the use of reference numerals. Moreover, since the basic composition of the manufacturing method of a multi-piece wiring board accommodation kit is the same as that of Embodiment 3, it uses a code | symbol and mainly demonstrates a different matter.

  FIG. 12 is a process diagram illustrating a method for manufacturing a multi-piece wiring board accommodation kit according to Embodiment 4 of the present invention.

  In the multi-piece wiring board accommodation kit 1 according to the present embodiment, the bridging portion 19 and the bridging recess 42 are joined by the joining member 25 (joining member 25s) arranged on the surface side of the bridging portion 19. Yes. That is, as in the third embodiment, the bridging portion 19 is joined to the bridging recess 42 by the joining member 25 s disposed in the bridging recess 42.

  Therefore, the multi-piece wiring board accommodation kit 1 can accommodate the piece wiring board 10 selected in advance in the piece accommodation hole 41 and securely fix the piece wiring board 10 corresponding to the same rank. It can accommodate and can improve the productivity in the processing process with respect to the piece wiring board 10. FIG.

  The joining member 25 s is disposed on the outer surface of the bridging portion 19 and is filled between the bridging recess 42 and the bridging portion 19 on the inner side with respect to the surface of the frame 30. Therefore, the multi-piece wiring board accommodation kit 1 can easily and accurately arrange the joining member 25 s having fluidity to the bridging portion 19, thereby improving productivity.

  The joining member 25s can be, for example, a liquid adhesive (epoxy resin). Since it is liquid, it is possible to fill the gap between the bridge portion 19 and the bridge recess 42. That is, in the manufacturing method of the multi-piece wiring board accommodation kit 1 according to the present embodiment, the joining member filling step of supplying the joining member 25s to the outer surface of the bridge portion 19 between the frame positioning step and the piece positioning step. With.

  Therefore, since the manufacturing method of the multi-piece wiring board accommodation kit 1 enables the bridging portion 19 to be easily and accurately joined to the bridging recess 42, the multi-piece wiring board is made into a kit with high productivity. be able to.

  The reference jig plate 50 and the holding jig plate 51 according to the present embodiment include a covering member 52 on the surface facing the piece wiring board 10 and the frame 30. The covering member 52 is made of, for example, silicon rubber, and suppresses a step between the piece wiring board 10 and the frame 30 and prevents generation of scratches on the surface of the multi-piece wiring board accommodation kit 1. Further, the covering member 52 can prevent the filled joining member 25s from flowing out around the bridging recess 42 and contaminating the surface of the multi-piece wiring board accommodation kit 1.

  The covering member 52 can also be applied in the method of manufacturing the multi-piece wiring board accommodation kit 1 in the third embodiment.

  FIG. 13A is a plan view showing a comparative example with respect to the planar shape of the bridging portion and the bridging recess of the multi-piece wiring board accommodation kit according to Embodiment 4 of the present invention.

  The bridging portion 19 as a comparative example is joined to the bridging recess 42 at the bridging facing interval Sbf. The cross-sectional structure is as in the first to third embodiments. Accordingly, when the joining member 25s is supplied as a liquid adhesive (epoxy resin) to the surface side of the bridging portion 19, the outer side of the bridging recess 42 (the piece wiring board 10 and the frame 30) from the gap of the bridging facing interval Sbf. May flow out into the gap. When the joining member 25s flows out of the bridge recess 42, the joining member 25s may not be sufficiently supplied in the stacking direction in the bridge recess 42.

  FIG. 13B is a plan view showing a planar shape of the bridging portion and the bridging recess of the multi-piece wiring board accommodation kit according to Embodiment 4 of the present invention.

  As described with reference to FIG. 13A, when a liquid adhesive is used as the joining member 25s, it is necessary to prevent the adhesive from flowing out. In the multi-piece wiring board accommodation kit 1 according to the present embodiment, the bridging portion 19 and the bridging recess 42 are provided with a constriction (constriction 19c, constriction 42c). That is, since there is a constriction 19c and a constriction 42c facing each other in the outflow path, the outflow is suppressed and the joining member 25s is sufficiently supplied in the stacking direction of the bridging recesses 42.

  As described above, in the multi-piece wiring board accommodation kit 1 according to the present embodiment, it is desirable that the bridging portion 19 and the bridging recess 42 have a constriction (constriction 19c, constriction 42c) in plan view. Therefore, since the multi-piece wiring board accommodation kit 1 can suppress the flow of the joining member 25s, the joining member 25s (liquid adhesive) is applied when joining the bridging portion 19 and the bridging recess 42. Thus, the process can be simplified.

  Moreover, it is desirable that the bridge facing distance Sbf where the side surface in the width direction of the bridge portion 19 and the wall surface of the bridge recess 42 face each other is between several tens of μm to several hundreds of μm. Accordingly, the multi-piece wiring board accommodation kit 1 can reliably position and join the bridging portion 19 to the bridging recess 42 within a preset range (the bridging facing interval Sbf), thereby improving workability and reliability. Can be improved. Moreover, since it limits to this range, the outflow of the joining member 25s can be suppressed, and on the other hand, the bridging portion 19 can be easily joined to the bridging recess 42.

  In addition, the position of the constriction 19c can be formed in the intermediate | middle of the root and the front-end | tip of the bridge part 19, for example. Moreover, the constriction 42c can be formed in the middle of the back of the bridging recessed part 42 and an open end corresponding to the constriction 19c.

<Embodiment 5>
The regeneration method of the multi-piece wiring board accommodation kit according to the present embodiment is based on the basic configuration of the multi-piece wiring board accommodation kit 1, the piece wiring board 10, and the frame 30 described in the first to fourth embodiments. Since the present invention can be applied as it is, different points are mainly described with reference to the reference numerals. In addition, since Embodiment 1 thru | or Embodiment 4 can be applied as it is, illustration as a reproduction | regenerating method of the multi-piece wiring board accommodation kit 1 which concerns on this Embodiment is not shown.

  The method for regenerating the multi-piece wiring board accommodation kit 1 according to the present embodiment includes a piece wiring board 10 formed as an individual unit wiring board and a frame 30 in which a plurality of piece wiring boards 10 are arranged and accommodated. This is a recycling method for the multi-piece wiring board housing kit 1 in which the frame 30 of the piece wiring board housing kit 1 is reused.

  Moreover, in the reproduction | regeneration method of the multi-piece wiring board accommodation kit 1, the multi-piece wiring board accommodation kit 1 is the multi-piece wiring board accommodation kit 1 described in any one of Embodiment 1 to Embodiment 4, After the wiring board 10 is removed from the frame 30 and the frame 30 is cleaned, a new piece wiring board 10 prepared separately is joined to the frame 30.

  Therefore, since the method for regenerating the multi-piece wiring board accommodation kit 1 uses the frame 30 repeatedly, the manufacturing cost of the frame 30 can be suppressed.

  Note that the piece wiring board 10 is removed from the frame 30 when it is removed by mounting it on the mounting board of the mounting destination by a normal mounting process, or when the defect of the piece wiring board 10 is found to be removed. included.

1 Multi-piece wiring board accommodation kit 10-piece wiring board 10g Guide hole 10t Piece outer position (outer edge)
10 nf flexible wiring board 10 nh rigid wiring board 10 n piece wiring board 10 m piece wiring board 11 inner layer core part (piece laminated material layer)
12 Inner layer conductor (Piece laminated material layer)
13 Inner layer part 14f Release film 14w Punching hole 14b Laminating adhesive 15 Outer layer insulating part (Piece laminated material layer)
16 Outer layer conductor (Piece laminated material layer)
16p outer layer wiring pattern 17 outer layer part 17w punch hole 19 bridge part 19c constriction 19f bridge part 19s bridge part 25, 25f, 25s joint member 30 frame 30g guide hole 30m mark 31 frame inner layer core part (frame laminated material layer)
32 Frame inner layer conductor (frame laminated material layer)
33 Frame inner layer conductor (frame laminated material layer)
34 Frame inner layer (frame laminate material layer)
34w Frame inner layer hole 35 Frame outer layer insulation (frame laminated material layer)
36 Frame outer layer conductor (frame laminated material layer)
37 Frame outer layer (frame laminate material layer)
38 Frame outer layer insulation (frame laminate material layer)
39 Outer frame conductor (frame laminated material layer)
40 Outer frame part of frame (frame laminated material layer)
40w Frame outer layer hole 41 Piece receiving hole 42 Bridge recess 42c Constriction 50 Reference jig plate 50p Positioning pin 51 Holding jig plate Lbb Bonding length Sbf Bridge facing distance Spf Outer periphery facing distance

Claims (22)

A multi-piece wiring board accommodation kit comprising a piece wiring board formed as an individual unit wiring board and a frame containing a plurality of the piece wiring boards,
The piece wiring board includes a bridging portion that is formed protruding from an outer peripheral end and joined to the frame,
The frame is formed to be similar to the outer peripheral edge of the piece wiring board and is formed in the thickness direction of the frame continuously with the piece receiving hole in which the piece wiring board is accommodated and the piece accommodating hole. A multi-piece wiring board accommodation kit, comprising: a bridging recess in which a portion is arranged. The multi-piece wiring board accommodation kit according to claim 1,
The multi-piece wiring board accommodation kit, wherein a thickness of the piece wiring board is equal to a thickness of the frame, and a surface of the piece wiring board is flush with a surface of the frame. The multi-piece wiring board accommodation kit according to claim 1 or 2,
The multi-piece wiring board accommodation kit, wherein the bridging portion is formed by extending a layer selected from a plurality of piece laminated material layers forming the piece wiring board. The multi-piece wiring board accommodation kit according to claim 3,
The multi-piece wiring board accommodation kit, wherein the bridging portion is formed by extending an inner layer core portion disposed inside the plurality of piece laminated material layers. The multi-piece wiring board accommodation kit according to any one of claims 1 to 4,
The multi-piece wiring board accommodation kit, wherein the plurality of piece wiring boards are of different types. The multi-piece wiring board accommodation kit according to any one of claims 1 to 5,
The frame is formed of a frame laminate material layer having the same number of layers as the piece wiring board, and the bridging recess removes a region corresponding to the bridging recess of a layer selected from the frame laminate material layer. A multi-piece wiring board accommodation kit, characterized by being formed. The multi-piece wiring board accommodation kit according to any one of claims 1 to 5,
The frame is formed of a single frame member, and the bridging recess is formed by removing a region corresponding to the bridging portion from the frame member. . The multi-piece wiring board accommodation kit according to any one of claims 1 to 7,
The multi-piece wiring board accommodation kit, wherein at least one of the plurality of piece wiring boards is a dummy wiring board. The multi-piece wiring board accommodation kit according to any one of claims 1 to 8,
The multi-piece wiring board accommodation kit, wherein the bridging part is joined to the bridging concave part by a joining member disposed in the bridging concave part. The multi-piece wiring board accommodation kit according to claim 9,
The multi-piece wiring board accommodation kit, wherein the joining member is disposed between a bottom surface of the bridging recess and the bridging part. The multi-piece wiring board accommodation kit according to claim 10,
The multi-piece wiring board accommodation kit, wherein an outer surface of the bridging portion is arranged flush with or inward of the surface of the frame. The multi-piece wiring board accommodation kit according to claim 9,
The multi-piece wiring, wherein the joining member is disposed on an outer surface of the bridging portion, and is filled between the bridging recess and the bridging portion on the inner side with respect to the surface of the frame. Board accommodation kit. The multi-piece wiring board accommodation kit according to any one of claims 9 to 12,
The multi-piece wiring board accommodation kit, wherein the bridging portion and the bridging recess have a constriction in plan view. The multi-piece wiring board accommodation kit according to any one of claims 1 to 13,
The multi-piece wiring board accommodation kit, wherein the piece wiring board satisfies a preset specification rank standard. The multi-piece wiring board accommodation kit according to any one of claims 1 to 14,
The multi-piece wiring board accommodation kit, wherein the frame includes a mark indicating processing information for a subsequent processing step. The multi-piece wiring board accommodation kit according to any one of claims 1 to 15,
The multi-piece wiring board accommodation kit, characterized in that an outer peripheral facing interval in which the outer peripheral edge of the piece wiring board and the wall surface of the piece accommodation hole face each other is between several tenths of mm to several mm. The multi-piece wiring board accommodation kit according to any one of claims 1 to 16,
The multi-piece wiring board accommodation kit, wherein a joining length at which the bridging part and the bridging concave part are joined is between several tenths of mm to several mm. The multi-piece wiring board accommodation kit according to any one of claims 1 to 17,
The multi-piece wiring board accommodation kit, wherein a bridge facing interval in which a side surface in the width direction of the bridge portion faces a wall surface of the bridge recess is between several tens of μm to several hundreds of μm. Regeneration of a multi-piece wiring board accommodation kit that reuses the frame of a multi-piece wiring board accommodation kit comprising a piece wiring board formed as an individual unit wiring board and a frame that houses a plurality of piece wiring boards arranged therein. A method,
The multi-piece wiring board accommodation kit is a multi-piece wiring board accommodation kit according to any one of claims 1 to 18,
A method for regenerating a multi-piece wiring board accommodation kit, comprising: removing the piece wiring board from the frame, performing a cleaning process on the frame, and joining a separately prepared new piece wiring board to the frame. A piece wiring board formed as an individual unit wiring board; and a frame in which a plurality of piece wiring boards are arranged and accommodated, and the piece wiring board is formed to protrude from an outer peripheral end and is joined to the frame. The frame includes a piece receiving hole that is formed to be similar to an outer peripheral end of the piece wiring board and that accommodates the piece wiring board, and is continuous with the piece receiving hole so as to dispose the bridging portion. And a manufacturing method of a multi-piece wiring board accommodation kit provided with a bridging recess formed in the thickness direction of the frame,
A frame positioning step of positioning and arranging the frame on a reference jig plate;
A piece positioning step of accommodating the piece wiring board in the piece receiving hole and positioning the bridging portion into the bridging recess; and
A jig plate pressurizing step of holding the piece wiring board in the piece receiving hole and then sandwiching the frame and the piece wiring board between the reference jig plate and a holding jig plate opposed to the reference jig plate; The manufacturing method of the multi-piece wiring board accommodation kit characterized by comprising. It is a manufacturing method of the multi-piece wiring board accommodation kit according to claim 20,
The manufacturing method of the multi-piece wiring board accommodation kit characterized by including the joining member arrangement | positioning process which arrange | positions a joining member to the said bridging recessed part between the said frame positioning process and the said piece positioning process. It is a manufacturing method of the multi-piece wiring board accommodation kit according to claim 20,
The manufacturing method of the multi-piece wiring board accommodation kit characterized by including the joining member filling process which supplies a joining member to the outer surface of the said bridge | bridging part between the said frame positioning process and the said piece positioning process.

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