KR101373330B1 - Manufacturing method for flexible printed circuits board using roll to roll exposure method and through slitting - Google Patents

Abstract

A method for manufacturing an FPCB using roll to roll exposure and slitting methods includes: a dry film bonding step (S10) of closely bonding a dry film (20) to a copper clad laminate (10); a circuit pattern forming step (S20) of forming a circuit pattern by exposing, developing, etching, and separating the copper clad laminate (10) with the dry film (20) with a first width (L20); and a slitting step (S30) of slitting the copper clad laminate (10) along a central line (LM20) of the first width (L20). Wherein, all the steps are performed with a roll to roll method. [Reference numerals] (AA) Start; (BB) End; (S10) Dry film bonding step; (S20) Circuit pattern forming step; (S30) Slitting step

Description

Manufacturing method for flexible printed circuits board using roll to roll exposure method and through slitting

The present invention relates to a method for manufacturing an FPCB using a roll to roll (RTR) exposure and a slitting method, and more particularly, to an FPCB using an RTR exposure and a slitting method capable of widening an exposure width for forming a circuit pattern. It relates to a manufacturing method.

Recently, with the development of the degree of integration of semiconductor integrated circuits, the development of surface-mount technology for directly mounting small chip components, and the miniaturization of electronic equipments, the necessity of a printed circuit board that can be easily embedded in a more complicated and narrow space has been developed. In response to this demand, flexible printed circuit boards have been developed. Such flexible printed circuit boards are rapidly increasing in demand due to the development of electronic devices such as portable terminals, LCDs, PDPs, cameras, printer heads, and the demands thereof are increasing.

As the type of the flexible printed circuit board as described above, it is roughly classified into single, double and multi-sided according to the position and the number of circuit patterns. Among them, the cross-sectional flexible printed circuit board has circuit patterns formed on only one surface, and the mounting density of the parts is low and the manufacturing method is simple. The double-sided flexible printed circuit board has circuit patterns formed on both upper and lower surfaces, and upper and lower circuits are connected through through holes. A multilayer flexible printed circuit board is a three-dimensional circuit board having an inner layer circuit and an outer layer circuit, and has advantages of high-density component mounting by a three-dimensional wiring and shortening of a wiring distance.

In order to manufacture the flexible printed circuit board as described above, after forming a through hole in a copper-clad laminate plate having a copper foil layer formed on one side or both sides of an insulating film such as polyimide (Polyimide) resin, and then copper plated the through hole, After laminating a dry film on the copper-clad laminate, circuit patterns are sequentially formed by exposure, development and etching, and then a coverlay film is welded to the outside of the copper-laminated laminate and hot pressed. The lamination process is performed using. Here, the coverlay film is to protect and insulate the exposed surface of the circuit, and after cutting to a certain size, the unnecessary part is removed by CNC machining or mold punching, and then welded and laminated on the outer side of the copper-clad laminate.

At this time, the manufacturing method of the FPCB using the conventional RTR exposure and slitting method had to limit the width of the copper-clad laminate to 200 to 300mm due to the technical limitations of the through-hole processing apparatus in the first through-hole forming step. Accordingly, the exposure width for forming the circuit pattern of the flexible printed circuit board was also limited to 240 to 260 mm.

In particular, the flexible printed circuit board has a very thin copper foil layer, which makes it impossible to cope with existing double-sided printed circuit board production facilities, and requires various expensive expensive facilities, and each process is performed by limiting the width of the copper laminate sheet. Difficulties include lower productivity, higher defect rates, and eventually higher manufacturing costs resulting in lower product competitiveness.

Therefore, it is necessary to develop a method of manufacturing FPCB using various RTR exposure and slitting methods to solve the above problems.

Korea Patent Publication 2010-0062239 (2010.06.10)

The present invention has been made to solve the above problems, and relates to a manufacturing method of the FPCB using the RTR exposure and slitting method that can widen the exposure width for forming the circuit pattern of the flexible printed circuit board.

In the manufacturing method of the FPCB using the RTR exposure and slitting method according to the present invention, all steps are made in a roll to roll (RTR) method, and the dry film adhesion step of closely contacting the dry film 20 to the copper clad laminate 10 ( S10); A circuit pattern forming step (S20) of forming a circuit pattern by exposing, developing, corroding, and peeling the copper foil laminated plate 10 in which the dry film 20 is in close contact with a first width L20; And a slitting step (S30) of slitting the copper foil laminate 10 along the center line LM20 of the first width L20.

In addition, the dry film adhesion step (S10) is characterized in that made by the pressing of the contact member 100.

In addition, the adhesion member 100 is in close contact with the dry film 20 at a pressure of 4 to 6kgf / cm ₂ to the copper-clad laminate 10 while the temperature of the adhesion member 100 is maintained at 80 to 120 degrees. Characterized in that.

In addition, the circuit pattern forming step (S20) is characterized in that the first width (L20) is 450 to 550mm.

In addition, the circuit pattern forming step (S20) is characterized in that the exposure is made by an exposure member 200 provided with a light source irradiator for irradiating a light source.

In addition, the circuit pattern forming step (S20) is characterized in that the development is made by a developing member 300 having a developing nozzle unit for injecting a developing chemical.

In addition, the circuit pattern forming step (S20) is characterized in that the corrosion is made by a corrosion member 400 having a corrosion nozzle portion for injecting the corrosion chemicals.

In addition, the circuit pattern forming step (S20) is characterized in that the peeling is made by a peeling member 500 is provided with a peeling nozzle for spraying a peeling chemical.

In addition, the slitting step (S30) is characterized in that the slitting is made by a dicing saw (600, Dicing Saw).

Accordingly, the manufacturing method of the FPCB using the R.T.R exposure and slitting method according to the present invention has the advantage that all the steps can be made in succession, since all steps are made in a roll-roll method,

In addition, the dry film contacting step according to the present invention has an advantage that the process time is relatively shorter than the temporary welding or laminating method by closely contacting the dry film on the copper-clad laminate.

In addition, the adhesive member according to the present invention is a copper foil at an optimum temperature and pressure not to damage the copper foil laminated plate by contacting the dry film at a pressure of 4 to 6kgf / cm ₂ to the copper foil laminated plate while the temperature is maintained at 80 to 120 degrees There is an advantage that the dry film can be in close contact with the laminate.

In addition, the circuit pattern forming step according to the present invention has a first width is 450 to 550mm, there is an advantage that can be widened the exposure width for forming the circuit pattern compared to the conventional method.

In addition, the slitting step according to the present invention has the advantage that the slitting of the copper-clad laminated plate on which the circuit pattern is formed by a dicing saw, the slitting precision is increased and the production precision of the flexible printed circuit board can be increased.

1 is a step diagram showing a manufacturing method of the FPCB using the RTR exposure and slitting method according to the present invention
Figure 2 is a schematic diagram showing the dry film adhesion step shown in FIG.
3 to 6 are schematic views showing the circuit pattern forming step shown in FIG.
7 is a schematic view showing the slitting step shown in FIG.
8 is a schematic view showing an embodiment of an exposure step according to the present invention;

Hereinafter, the technical idea of the present invention will be described more specifically with reference to the accompanying drawings.

The accompanying drawings are only examples to illustrate the technical idea of the present invention in more detail, and thus the technical idea of the present invention is not limited to the forms of the accompanying drawings.

1 is a step diagram showing a manufacturing method of the FPCB using the R.T.R exposure and slitting method according to the present invention.

Referring to Figure 1, the manufacturing method of the FPCB using the RTR exposure and slitting method according to the present invention all steps are made in a roll-to-roll (RTR: Roll To Roll) method, dry film adhesion step (S10), the circuit pattern It comprises a forming step (S20), a slitting step (S30).

On the other hand, the manufacturing method of the FPCB using the RTR exposure and slitting method according to the present invention before the dry film adhesion step (S10), the via hole forming step of forming a via hole in the copper-clad laminate, and the copper plating step of copper plating the via hole and In addition, a soft etching step of soft etching the copper-clad laminate in which the via holes are formed may be performed.

In the via hole forming step, a via hole is formed in the copper clad laminate using an ultraviolet laser drill.

In this case, the via hole is preferably processed to have a diameter of 30 μm or less, but the present invention is not limited thereto and may be applied in more various dimensions and shapes.

The copper plating step is performed by electroless plating copper foil laminated plates and via holes, followed by copper plating.

In the soft etching step, stains and stains generated on both sides of the copper clad laminate in the via hole forming step and the copper plating step are removed using a chemical agent.

2 is a schematic view showing the dry film adhesion step shown in FIG.

Referring to FIG. 2, the dry film adhesion step (S10) loads and unloads the copper foil laminate 10 and the dry film 20 in a roll-to-roll manner, and the dry film 20 on one or both sides of the copper laminate laminate 10. )).

2 shows an embodiment in which the dry film 20 is in close contact with both surfaces of the copper clad laminate 10, the present invention is not limited to the above embodiment.

Here, the copper-clad laminate 10 is composed of a pair of copper foils 12 respectively bonded to both sides of the insulating film 11, the insulating film 11 is generally made of a polyimide film, the insulating film 11 The thickness of is generally composed of 10 ~ 40㎛ and the thickness of the pair of copper foil 12 is generally composed of 18 ~ 70㎛.

Herein, polyimide has good insulation, low dimensional deformation even at high temperatures, excellent heat resistance and excellent flexibility.

Accordingly, the dry film adhesion step (S10) according to the present invention has an advantage that the process time is relatively shorter than the temporary welding or laminating method by closely contacting the dry film 20 to the copper-clad laminate 10.

Dry film adhesion step (S10) is in close contact with the dry film 20 to the copper-clad laminate 10 using the adhesion member 100.

The contact member 100 is formed in a roller structure and the dry film 20 may be in close contact with the copper foil laminated sheet 10 at a pressure of 4 to ₆ kgf / cm ₂ while the temperature is maintained at 80 to 120 degrees. 10) is the optimal temperature and optimal pressure to avoid damage.

A tape made of sponge material so that the dry film 20 does not escape from the copper-clad laminate 10 when the adhesive member 100 comes into close contact with the copper-clad laminate 10 at the edge of the adhesion member 100. (Not shown) may be attached.

Accordingly, the adhesion member 100 according to the present invention is in contact with the dry film 20 at a pressure of 4 to 6kgf / cm ₂ to the copper foil laminated plate 10 in a state where the temperature is maintained at 80 to 120 degrees, copper foil laminated plate ( 10) there is an advantage that the dry film 20 can be in close contact with the copper-clad laminate 10 at an optimum temperature and pressure that does not damage.

3 to 6 are schematic views showing the circuit pattern forming step shown in FIG.

 Referring to FIGS. 3 to 6, the circuit pattern forming step (S20) loads and unloads the copper clad laminate 10 on which the dry film 20 is in close contact with the roll-to-roll method, and the copper foil on which the dry film 20 is in close contact. The laminate 10 is exposed, developed, corroded, and peeled off at a first width L20 to form a circuit pattern.

As described above, the circuit pattern forming step (S20) is carried out in the exposure, development, corrosion, and peeling step, Figure 3 is an exposure step, Figure 4 is a developing step, Figure 5 is a corrosion step, Figure 6 is a peeling step As a schematic diagram shown, this circuit pattern forming step S20 will be described in more detail.

Referring to FIG. 3, in the exposing step, the dry film 20 is exposed to the first width L20 using the exposure member 200 provided with a light source irradiating unit for irradiating a light source (ultraviolet ray), and the dry film 20. Allow a predetermined portion of to cure.

Here, the first width (L20) is 450 to 550mm, which is about twice as much as the exposure width for forming a conventional circuit pattern, as described above, the FPCB of the RTR exposure and slitting method according to the present invention The manufacturing method has an advantage of widening an exposure width for forming a circuit pattern of a flexible printed circuit board.

At this time, the light source irradiating unit irradiates ultraviolet rays.

Referring to FIG. 4, in the developing step, an unnecessary portion of the dry film 20 is removed by using a developing member 300 having a developing nozzle unit for spraying a developing chemical. At this time, the dry film 20 is formed so that the circuit pattern can be seen visually.

Here, Na ₂ , CO ₃ may be used as the developer.

Referring to FIG. 5, the corrosion step corrodes a predetermined portion of the copper foil 12 of the copper foil laminated plate 10 by using a corrosion member 400 having a corrosion nozzle part for spraying a corrosion chemical.

Here, CuCl ₂ may be used as the corrosion agent.

Referring to FIG. 6, in the peeling step, the dry film 20 remaining on the copper-clad laminate 10 is removed using a peeling member 500 provided with a peeling nozzle unit for ejecting a peeling chemical.

Here, NaOH may be used as the peeling agent.

FIG. 7 is a schematic diagram illustrating the slitting step shown in FIG. 1.

Referring to FIG. 7, in the slitting step S30, the copper-clad laminate 10 on which the circuit pattern forming step 20 is formed is slit along the center line LM20 of the first width.

In this case, the slitting step S30 may slit the copper-clad laminate 10 on which the circuit pattern forming step S20 is performed by using a dicing saw 600 along the center line LM20 of the first width. Can be.

 The dicing saw 600 is generally rotated at 10,000 to 50,000 rpm to cut along the copper-clad laminate 10 in which the circuit pattern forming step S20 is formed. Here, the cutting of the copper-clad laminate 10 is performed by the rotational force of the dicing saw and the impact force between the copper-clad laminate 10, and the size of the diamond grains constituting the dicing saw 600 and directly in contact with the copper-clad laminate 10 The surface area of the dicing saw 600 determines the efficiency of the cutting.

Accordingly, when the area between the dicing saw 600 and the copper-clad laminate 10 is large, the chipping is increased while the machinability is improved, and when the area between the dicing blade 205 and the wafer 101 is small, the chipping is performed. This decreases while the machinability is lowered.

In this way, when the cutting is considered in consideration of the area where the dicing saw 600 and the copper foil laminated sheet 10 abut, the slitting precision of the copper laminated sheet 10 can be improved.

Accordingly, in the slitting step S30 according to the present invention, since the slitting of the copper-clad laminate 10 in which the circuit pattern forming step S20 is performed is performed by the dicing saw 600, the slitting precision is increased, thereby making flexible printing. There is an advantage that the production precision of the circuit board can be increased.

After all the above-described steps, the cover lay temporary step, hot press step, printing step, surface treatment step, BBT inspection can be further performed.

The cover ray temporary step attaches a cover layer for protecting the circuit formed on the copper clad laminate.

At this time, polyimide etc. are used as a coverlay.

In the hot press step, the cover layer is pressed by high temperature and high pressure with a copper clad laminate.

At this time, the temperature conditions of the hot press are 100 ° C to 200 ° C, and pressurization conditions are 30 kgf / cm 2 to 100 kgf / cm 2.

The printing step displays the model name, version, layout of the parts, and the like, on the cover layer.

The surface treatment step removes oil, foreign substances, etc. from the cover layer.

The BBT test checks whether the circuit formed on the copper clad laminate is open or shorted.

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An embodiment of the exposure step according to the present invention can further widen the exposure width for forming a circuit pattern on the copper-clad laminate 10 in which the dry film 20 is in close contact, which will be described below.

In the exposure step, the exposure width may be further widened by exposing the copper-clad laminate 10 in which the dry film 20 is in close contact with each other in a roll-to-roll manner capable of forward rotation and reverse rotation.

In more detail, in the embodiment of the exposure step, first, the copper foil laminated plate 10 in which the dry film 20 is in close contact with the dry roll 20 is moved to one side, and a predetermined portion of the dry film 20 L20).

Next, the copper foil laminated board 10 in which the dry film 20 is in close contact with the reverse roll-to-roll method is transferred to the other side to expose the remaining portions of the dry film 20 to the first width L20.

Accordingly, the embodiment of the exposure step according to the present invention by exposing the copper-clad laminate 10 in which the dry film 20 is in close contact with the roll-to-roll method capable of forward rotation and reverse rotation, the exposure width can be further widened There is this.

In addition, the development, corrosion, and peeling step according to the present invention may also use a roll-to-roll method capable of forward and reverse rotation.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

10: copper clad laminate
11: insulation film 12: copper foil
20: dry film
100: contact member 200: exposure member
300: developing member 400: corrosion member
500: peeling member 600: dicing saw

Claims (9)

Every step is done by Roll To Roll (RTR) method,
A dry film adhesion step (S10) of closely contacting the dry film 20 to the copper-clad laminate 10;
A circuit pattern forming step (S20) of forming a circuit pattern by exposing, developing, corroding, and peeling the copper foil laminated plate 10 in which the dry film 20 is in close contact with a first width L20; And
Slitting step (S30) for slitting the copper foil laminated plate 10 along the center line (LM20) of the first width (L20); and FPCB using an RTR exposure and slitting method Method of preparation.
The method of claim 1, wherein the dry film adhesion step (S10)
Method for producing FPCB using the RTR exposure and slitting method, characterized in that by pressing the contact member 100.
The method of claim 2, wherein the contact member 100 is
RTR exposure and slitter, characterized in that the dry film 20 in close contact with the copper foil laminated plate 10 at a pressure of 4 to 6kgf / cm ₂ in a state where the temperature of the contact member 100 is maintained at 80 to 120 degrees Method for producing FPCB using the casting method.
The method of claim 1, wherein the circuit pattern forming step (S20)
The first width (L20) is 450 to 550mm characterized in that the FPCB manufacturing method using the RTR exposure and slitting method.
The method of claim 4, wherein the circuit pattern forming step (S20)
And the exposure is performed by an exposure member (200) equipped with a light source irradiating unit for irradiating a light source.
The method of claim 4, wherein the circuit pattern forming step (S20)
The developing method is a FPCB manufacturing method using the RTR exposure and slitting method, characterized in that the development is made by a developing member 300 having a developing nozzle for injecting the developer.
The method of claim 4, wherein the circuit pattern forming step (S20)
The corrosion method is a manufacturing method of the FPCB using the RTR exposure and slitting method characterized in that the corrosion member 400 is provided with a corrosion nozzle portion for spraying the corrosion chemicals.
The method of claim 4, wherein the circuit pattern forming step (S20)
The method of manufacturing an FPCB using the RTR exposure and slitting method, characterized in that the peeling is made by a peeling member 500 having a peeling nozzle for ejecting a peeling chemical.
The method of claim 1, wherein the slitting step (S30)
The slitting is performed by a dicing saw (600, Dicing Saw), characterized in that the manufacturing method of FPCB using the RTR exposure and slitting method.

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