JP2007123902A - Method of manufacturing rigid flexible printed circuit board - Google Patents

Method of manufacturing rigid flexible printed circuit board Download PDF

Info

Publication number
JP2007123902A
JP2007123902A JP2006292679A JP2006292679A JP2007123902A JP 2007123902 A JP2007123902 A JP 2007123902A JP 2006292679 A JP2006292679 A JP 2006292679A JP 2006292679 A JP2006292679 A JP 2006292679A JP 2007123902 A JP2007123902 A JP 2007123902A
Authority
JP
Japan
Prior art keywords
flexible
region
rigid
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006292679A
Other languages
Japanese (ja)
Inventor
Dong Gi An
Jonfun Jan
Myonhi Jon
Chul Min Lee
Yang Je Lee
Young Duck Park
Young Po Park
Dek Gin Yang
Kyu Hyok Yim
ドンギ アン
チョルミン イ
ヤンゼ イ
ギュヒョク イム
ジョンフン ジャン
ミョンヒ ジョン
ヨンドク パク
ヨンポ パク
ドクジン ヤン
Original Assignee
Samsung Electro Mech Co Ltd
三星電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to KR1020050102464A priority Critical patent/KR100722621B1/en
Application filed by Samsung Electro Mech Co Ltd, 三星電機株式会社 filed Critical Samsung Electro Mech Co Ltd
Publication of JP2007123902A publication Critical patent/JP2007123902A/en
Pending legal-status Critical Current

Links

Images

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing RFPCB, in which external terminal parts are protected, cost and time of a process are decreased, and reliability of a product is improved. <P>SOLUTION: A method of manufacturing a rigid flexible printed circuit board (RFPCB) having a flexible region and a rigid region includes a step S100 of protecting a part of a first circuit pattern corresponding to a flexible region of a first soft film on which the first circuit pattern is formed, and forming a base board by laminating insulating layers on a top of the first circuit pattern corresponding to the rigid region; a step S200 of laminating single-sided flexible copper clad laminate having a second soft film on both sides of the base board; a step S300 of removing a portion of a copper foil layer corresponding to the flexible region to expose the second soft film, and forming a second circuit pattern in which a portion of the copper foil layer corresponding to the rigid region is connected to the first circuit pattern; and a step S400 of removing a portion corresponding to the flexible region of the second soft film. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a rigid flexible printed circuit board, and more particularly, to a flexible region having a terminal portion for an external connection terminal and a method for manufacturing a rigid flexible printed circuit board including the rigid region.
  Recently, as the degree of integration of semiconductor elements increases, the number of connection terminals provided on the semiconductor elements for connecting the semiconductor elements and external circuits has increased, and the arrangement density has increased. It is in. In addition, in a semiconductor device such as a semiconductor package on which such a semiconductor element is mounted, there is a demand for downsizing and thinning in order to improve the mounting density, and in particular, a notebook PC (personal computer), PDA, It can be said that a major problem in dealing with portable information devices such as cellular phones is the miniaturization and thinning of semiconductor packages.
  In order to package a semiconductor element, it is necessary to mount the semiconductor element on a wiring board and connect the connection terminal of the semiconductor element and the connection terminal on the wiring board. However, when about 1000 connection terminals are arranged around a semiconductor element of about 10 mm square, the arrangement pitch is as very fine as about 40 μm. In order to connect the connection terminals arranged at such a fine pitch to the connection terminals arranged on the wiring board, a very high accuracy is required for alignment on the wiring formation or connection on the wiring board. Therefore, there is a problem that it is very difficult to cope with conventional wire bonding technology or TAB (Tape Automated Bonding) technology.
  As a means for solving such a problem, a rigid flexible printed circuit board having a structure in which a rigid board and a flexible board are structurally coupled and the rigid area and the flexible area are interconnected without using a separate connector ( The use of Rigid-Flexible Printed Circuit Board (RFPCB) is increasing, and in particular, the above-mentioned rigid flexible printed circuit board is a connector corresponding to the demand for higher integration of mounting parts and fine pitch accompanying the higher functionality of mobile devices. It is mainly used for small terminals such as mobile phones that require high integration by removing unnecessary space.
  1A to 1D are process diagrams showing a method for manufacturing a rigid flexible printed circuit board according to a conventional example.
  First, as shown in FIG. 1A, a portion of the first circuit pattern 12 formed on one surface of the polyimide film 11 corresponding to the flexible region (see region I in FIG. 1D) is protected by a coverlay 20.
  Thereafter, as shown in FIG. 1B, a resist cover 30 is applied to the remaining corresponding circuit pattern 12 region of the flexible region to form a base substrate. The region coated with the resist cover 30 in the first circuit pattern 12 is a terminal portion exposed for the external terminal and the mounting pad, and the resist cover 30 is used for protection from the external environment during the process. Protect.
  At this time, as the resist cover 30, heat resistant tape or peelable ink can be used.
  Next, as shown in FIG. 1C, the insulating layer 40 in which openings corresponding to the flexible regions are formed on both surfaces of the base substrate, and the single-sided flexible copper-clad laminates 45 and 50 in which the openings are formed are heated to a predetermined degree. And laminating under pressure.
  The single-sided flexible copper-clad laminates 45 and 50 are obtained by forming the copper foil layer 50 on one surface of the flexible film 45, and the flexible film 45 is preferably a polyimide film.
  Thereafter, as shown in FIG. 1D, the second circuit pattern 80 is formed on the copper foil layer 50, the resist cover 30 formed on the terminal portion is removed, and the flexible region I and the rigid region II including the terminal portion are included. Complete the rigid flexible printed circuit board.
  At this time, through holes 60 are formed in order to electrically connect the second circuit patterns 80 to each other and between the second circuit patterns 80 and the first circuit patterns 12, and conductivity is imparted to the inner walls of the through holes 60. A plating layer 70 is formed.
  Here, the end portion of the flexible film 45 that forms the opening portion hangs downward at a predetermined angle due to a predetermined pressure received during lamination.
  As described above, in the conventional method of manufacturing a rigid flexible printed circuit board, a resist cover is used to protect the terminal portion exposed for the external terminal and the mounting pad from the external environment during the manufacturing process. There is a problem that the process cost and the process time increase by further performing the cover coating process and the resist cover removing process.
  Further, if the resist cover is applied to the terminal portion and various processes are performed and then the resist cover is removed, there is a problem in that a defect such as contamination due to the residue of the resist cover occurs on the surface of the terminal portion.
  Therefore, the present invention has been made in view of such problems, and the object of the present invention is to change the order of the external terminals and the mounting pads without using a separate protection means. Accordingly, it is an object of the present invention to provide a method for manufacturing a rigid flexible printed circuit board, in which process cost and process time are reduced and product reliability is increased by protecting the exposed terminal portion.
  In order to solve the above problems, according to an aspect of the present invention, there is provided a method for manufacturing a rigid flexible printed board including a flexible region and a rigid region, wherein (A) a first circuit pattern is formed on at least one surface. Forming at least one portion of the first circuit pattern corresponding to the flexible region in the first flexible film with a protective film and laminating an insulating layer on the upper surface of the first circuit pattern corresponding to the rigid region; , (B) a step of laminating a single-sided flexible copper clad laminate having a copper foil layer formed on one surface of the second flexible film on both sides of the base substrate, and (C) a portion of the copper foil layer corresponding to the flexible region, The second circuit pattern is removed by exposing the second flexible film and the portion of the copper foil layer corresponding to the rigid region is connected to the first circuit pattern. Forming a provides (D), characterized in that it comprises a step of removing portions of the second flexible film corresponding to the flexible region, the manufacturing method of the rigid-flexible printed circuit board.
  In the method for manufacturing a rigid flexible printed circuit board according to the present invention, the region not protected by the protective film in the first circuit pattern corresponding to the flexible region is a terminal portion for external connection terminals.
  In the method for manufacturing a rigid flexible printed circuit board according to the present invention, in step (D), in step (D-1), from the second flexible film, a region corresponding to the end of the flexible region that does not contact the rigid region is formed by laser processing. A step of cutting, and (D-2) a second flexible film corresponding to the flexible region by cutting the region corresponding to the end of the flexible region in contact with the rigid region from the cut second flexible film by a physical method And a step of removing.
  In the method of manufacturing a rigid flexible printed circuit board according to the present invention, the first circuit pattern includes a boundary pattern formed in a region corresponding to an end portion of the flexible region that is not in contact with the rigid region. One flexible film is protected, wherein the boundary pattern is not electrically connected to other patterns in the first circuit pattern.
  In the method for manufacturing a rigid flexible printed circuit board according to the present invention, the step (D) is characterized by removing a portion of the second flexible film corresponding to the flexible region by laser processing.
  Moreover, in the manufacturing method of the rigid flexible printed circuit board which concerns on this invention, (D) step machined the area | region corresponding to the edge part of the flexible area | region III which does not contact a rigid area | region from (D-1) 2nd flexible film. And (D-2) cutting the second flexible film corresponding to the flexible region by cutting the region corresponding to the end of the flexible region in contact with the rigid region from the cut second flexible film by a physical method. Removing the flexible film.
  In the method for manufacturing a rigid flexible printed circuit board according to the present invention, the step (D) is characterized in that a portion of the second flexible film corresponding to the flexible region is removed by machining.
  In the method for manufacturing a rigid flexible printed circuit board according to the present invention, the machining is a process using any one of punching, a knife, and a router bit.
  In the method for manufacturing a rigid flexible printed board according to the present invention, the first flexible film and the second flexible film are polyimide films.
  In the method for manufacturing a rigid flexible printed board according to the present invention, the insulating layer is a semi-cured prepreg.
  In the method for manufacturing a rigid flexible printed board according to the present invention, the insulating layer is a bonding sheet.
  In the method of manufacturing a rigid flexible printed circuit board according to the present invention, after the step (A), (E) a step of alternately forming a desired number of additional circuit layers and additional insulating layers on the upper surface of the insulating layer. It is further characterized by including.
  According to the method of manufacturing the rigid flexible printed circuit board of the present invention, the external terminal and the terminal portion exposed for the mounting pad can be protected by changing the order of the processes without using a separate protective substance. As a result, the process cost and the process time can be reduced and the reliability of the product can be increased.
  Exemplary embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
  2 and 3 are views showing a method for manufacturing a rigid flexible printed circuit board according to the present invention, FIG. 2 is a flow chart showing the method for manufacturing a rigid flexible printed circuit board according to the present invention, and FIGS. It is process sectional drawing which shows the manufacturing method of the rigid flexible printed circuit board concerning this in detail.
  A method for manufacturing a rigid flexible printed circuit board according to the present invention will be described with reference to FIG.
  First, in the first flexible film having the first circuit pattern formed on at least one surface, a part of the first circuit pattern corresponding to the flexible region III is protected by a protective film, and the upper surface of the first circuit pattern corresponding to the rigid region IV In step S100, an insulating layer is stacked to form a base substrate.
  At this time, in the first circuit pattern corresponding to the flexible region III, the first circuit pattern excluding the terminal portion for external connection terminal is protected with a protective film to protect it from the external environment, and the terminal portion is exposed as it is. As the protective film, it is preferable to use a flexible film such as a polyimide film.
  In the method of manufacturing the rigid flexible printed circuit board according to the embodiment of the present invention, a desired number of additional circuit layers and insulating layers are alternately formed on the insulating layer formed on the upper surface of the first circuit pattern corresponding to the rigid region IV. Thus, it is possible to form a base substrate having a multilayer structure.
  Thereafter, a single-sided flexible copper-clad laminate is sequentially laminated on both sides of the base substrate (S200).
  At this time, the single-sided flexible copper-clad laminate has a shape in which a copper foil layer is formed on one surface of the second flexible film. In some embodiments, the second flexible film and the copper foil layer are separated and laminated. Also good.
  Next, the portion of the copper foil layer corresponding to the flexible region III is removed to expose the second flexible film, and the portion corresponding to the rigid region IV forms a second circuit pattern connected to the first circuit pattern (S300). ).
  In other words, a through hole is formed in the copper foil layer corresponding to the rigid region IV, electroless copper plating and electrolytic copper plating are applied to provide conductivity in the through hole, and then an etching process is performed to cope with the flexible region III. The copper foil layer to be removed is removed, and a second circuit pattern is formed on the copper foil layer corresponding to the rigid region IV. At this time, the second circuit pattern can be electrically connected to the first circuit pattern through a through hole.
  Finally, the portion of the second flexible film corresponding to the flexible region III is removed (S400).
  The second flexible film can be laser-processed or machined to remove portions corresponding to the flexible region III all at once. At this time, the depth can be adjusted so that only the second flexible film can be removed without damaging the first flexible film during laser processing.
  Alternatively, according to another embodiment of the present invention, the region of the second flexible film corresponding to the end of the flexible region III that is not in contact with the rigid region IV is cut by laser processing or machining, and the flexible contact with the remaining rigid region IV is performed. The area | region of the 2nd flexible film corresponding to the edge part of the area | region III can be removed by a physical method, and the 2nd flexible film corresponding to the flexible area | region III can be removed.
  At this time, the first circuit pattern corresponds to the end of the flexible region III that does not contact the rigid region IV so that only the second flexible film can be cut without damaging the first flexible film during laser processing. The boundary pattern may be formed so as not to be electrically connected to other patterns in the first circuit pattern.
  As described above, in the method for manufacturing a rigid flexible printed circuit board according to the present invention, the second flexible layer laminated to form the outer layer without protecting the terminal portion in the flexible region III using a separate protection means. By changing the timing of the film and copper foil layer opening forming step after the second circuit pattern formation to protect the terminal portion, the reliability of the product can be improved without increasing the number of steps and the process cost. .
  3A to 3I are process diagrams illustrating an example of a method for manufacturing a rigid flexible printed circuit board according to an embodiment of the present invention.
  First, as shown in FIG. 3A, a flexible copper clad laminate (Flexible PCB) 100 in which copper foil layers 120 are formed on both surfaces of a first flexible film 110 is provided.
  As the 1st flexible film 110, a polyester or a polyimide film can be used, for example.
  Thereafter, as shown in FIG. 3B, first circuit patterns 150 that are electrically connected to each other are formed on both surfaces of the first flexible film 100.
  That is, an internal via hole 130 penetrating through the flexible copper clad laminate 100 is formed, electroless plating and electrolytic plating are performed to form a plated layer 140, and then, for example, photolithography is applied to the copper foil layer 120 on which the plated layer 140 is formed. The first circuit pattern 150 can be formed by applying a construction method. At this time, the first circuit patterns 150 formed on both surfaces can be electrically connected to each other along the internal via hole 130 provided with conductivity by the plating layer 140.
  Here, the first circuit pattern 150 includes an external connection terminal terminal portion 150a in the flexible region (see region III in FIG. 3E), and in the flexible region, only on one surface (upper surface in the drawing) of the first flexible film 110. The first circuit pattern 150 is formed, and the first circuit pattern is not disposed on the other surface (the lower surface in the drawing).
  Next, as shown in FIG. 3C, a protective film 160 is applied to the upper surface of the first circuit pattern 150 corresponding to the flexible region excluding the terminal portion 150a.
  In order to protect the first circuit pattern 150 corresponding to the flexible region excluding the terminal portion 150a from the external environment, a flexible film such as a polyimide film is used as a protective film on the upper surface of the first circuit pattern 150. The first circuit pattern 150 is protected by close application.
  Thereafter, as shown in FIG. 3D, an insulating layer 170 in which an opening 180 corresponding to the flexible region is formed is provided.
  The insulating layer 170 employs a prepreg or bonding sheet in which a glass fiber is infiltrated with a thermosetting resin so as to be in a semi-cured state, to increase the interlayer adhesion during lamination, and to increase the physical strength of the rigid region after lamination. it can.
  The opening 180 can be formed by punching or router processing using a wooden mold, a mold, or the like.
  Next, as shown in FIG. 3E, the insulating layers 170 each having an opening 180 are laminated on both surfaces of the first flexible film 110 in which a part of the first circuit pattern 150 is protected by the protective film 160. Then, the base substrate 190 including the flexible region III and the preliminary rigid region IV is formed.
  In the method of manufacturing a rigid flexible printed circuit board according to another embodiment of the present invention, a desired number of additional circuit layers (not shown) and insulating layers are alternately stacked on the upper surface of the insulating layer 170 to form a multilayer. The formed base substrate can be formed.
  Here, a region of the first circuit pattern 150 and the first flexible film 110 that is exposed to the opening 180 of the insulating layer 170 forms a flexible region III, and a region in which the insulating layer 170 is laminated to increase the mechanical strength. Forms a preliminary rigid region IV.
  Thereafter, as shown in FIG. 3F, single-sided flexible copper-clad laminates (200, 210) (200 ', 210') are laminated on both sides of the base substrate 190.
  Here, the single-sided flexible copper-clad laminate (200, 210) (200 ', 210') is obtained by forming copper foil layers 210, 210 'on one surface of the second flexible films 200, 200'.
  On one surface of the base substrate 190, the terminal portion 150a exposed by the insulating layer 170 in which the opening portion 180 is formed is used until the rigid flexible printed circuit board is completed by the single-sided flexible copper-clad laminates 200 and 210 having no opening portion. Help protect against the external environment. That is, the portion of the first circuit pattern 150 existing in the flexible region III and the terminal portion 150a are covered with the single-sided flexible copper-clad laminate (200, 210) provided so as to close the upper surface of the opening 180.
  At this time, on the other surface of the base substrate 190, another insulating layer 170 having an opening 180 is laminated on the upper surface of the first flexible film 110 (the surface facing downward in FIG. 3F). A single-sided flexible copper-clad laminate (200 ′, 210 ′) is laminated on 170. The single-sided flexible copper-clad laminate (200 ′, 210 ′) has an opening 220 formed so as to penetrate the opening 180 corresponding to the opening 180. Accordingly, the lower surface of the first flexible film 110 where the first circuit pattern 150 is located, which is located in the flexible region III, is exposed by the openings 180 and 220 overlapping each other. Yes. Similarly to the first flexible film 110, the second flexible films 200 and 200 'can be formed of, for example, a polyester or polyimide film.
  Next, as shown in FIG. 3G, in a part of the preliminary rigid region IV, a through hole 230 is formed that penetrates the base substrate 190 and the copper foil layers 210 and 210 ′ laminated on both surfaces thereof. In addition, plating layers 240 and 240 ′ are formed on the upper surfaces of the copper foil layers 210 and 210 ′. Note that the plating layer 240 ′ is also formed on a portion exposed from the opening 220.
  The through hole 230 formed to electrically connect the second circuit pattern (see 250 in FIG. 3H) formed in the copper foil layer 210 to the first circuit pattern 150 includes the first flexible film 110 and the insulating film. Since the insulating material such as the layer 170 and the second flexible films 200 and 200 ′ is included, the electroless plating and the electroplating are performed to form the plating layers 240 and 240 ′. Can be given.
  At this time, the through hole 230 is formed based on a preset position using a mechanical drill such as a CNC drill (Computer Numerical Control Drill).
  In the embodiment, the through hole 230 in which the plating layers 240 and 240 ′ are formed on the inner wall can be filled with an embedding ink (not shown).
  Thereafter, as shown in FIG. 3H, a portion corresponding to the flexible region III is removed from the copper foil layer 210 on which the plating layer 240 is formed, and plating layers 240 and 240 ′ corresponding to the preliminary rigid region IV are formed. The second circuit patterns 250 and 250 ′ are formed on the copper foil layers 210 and 210 ′, thereby completing the rigid region V.
  For example, the second circuit patterns 250 and 250 ′ are exposed and developed after a photosensitive material (not shown) is applied to the upper surfaces of the plating layers 240 and 240 ′ and the artwork film on which the pattern is formed is adhered. An etching resist pattern can be formed by performing a process, and a photolithography method that performs the etching process can be used.
  Here, the second circuit pattern 250 may be electrically connected to the first circuit pattern 150 and the second circuit pattern 250 ′ on the other surface through the through hole 230.
  Finally, as shown in FIG. 3I, a portion of the second flexible film 200 corresponding to the flexible region III is removed, thereby forming a rigid flexible printed board including the flexible region III and the rigid region V.
  Here, as a method of partially removing the second flexible film 200, as shown in FIG. 4 which is a plan view of FIG. 3H, the end of the flexible region III that does not contact the rigid region V in the second flexible film 200 is shown. The region A corresponding to the portion is cut by laser processing or machining, and the region B corresponding to the end of the flexible region III in contact with the rigid region V is removed by a physical method to correspond to the flexible region III. The second flexible film 200 can be removed. As this physical removal method, for example, at the edge of the copper foil layer along the region B at the base of the second flexible film 200 that is formed into a tongue-like shape by the cutting, the tongue piece is cut off while being pulled up obliquely upward. In this way, a simple method of removing can be adopted.
  As described above, when the region B corresponding to the end of the flexible region III in contact with the rigid region V is removed by the physical method in the second flexible film 200, the end of the second flexible film 200 is physically As shown in FIG. 1D, after the conventional opening is formed, it has a shape opposite to the end portion of the flexible film 45 because it is directed upward by a predetermined pressure generated when the method is used. .
  In addition, at the time of laser processing, the first circuit pattern 150 has an end of the flexible region III that does not contact the rigid region V so that only the second flexible film 200 can be cut without damaging the first flexible film 110. A boundary pattern (not shown) can be further formed in the region A corresponding to the portion. Here, the boundary pattern must be formed so as not to be electrically connected to other patterns in the first circuit pattern 150. The boundary pattern may be electrically connected to the first circuit pattern 150 by, for example, patterning a copper foil layer so as to avoid undesired electrical shorts in the first circuit pattern 150 and damage to the first flexible film upon cutting. Can be formed as a dummy pattern.
  Alternatively, the second flexible film 200 corresponding to the flexible region III can be removed at once by performing laser processing or machining by a method for manufacturing a rigid flexible printed circuit board according to another embodiment of the present invention. At this time, the depth can be adjusted so that only the second flexible film 200 can be removed without damaging the first flexible film 110 during laser processing.
  Here, the machining is preferably a process using punching, a knife, a router bit, or the like.
  In a conventional rigid flexible printed circuit board manufacturing method, a terminal using heat-resistant tape or peelable ink is used to protect the external terminal in the flexible region or the terminal portion for the mounting pad from the external environment during the manufacturing process. Forming a resist cover on the part and removing the resist cover after the manufacturing process brings about product defects due to contamination by residues, etc., and increases in cost and time due to the addition of the process by forming and removing the resist cover There was a point.
  However, as described above, in the method of manufacturing the rigid flexible printed circuit board according to the present invention, the external terminals and the mounting pads are exposed only by changing the order of the processes without using a separate protection means. By protecting the terminal portion, the process cost and the process time can be reduced and the reliability of the product can be increased.
  That is, when laminating the single-sided flexible copper-clad laminate for forming the second circuit pattern in the rigid region, the opening corresponding to the flexible region is not formed before the lamination, but is formed after the second circuit pattern is formed. By doing so, it is possible to protect the terminal portion exposed to the outside without a separate protection means during the manufacturing process, and thus it is possible to bring about an effect of improving the reliability of the product while realizing simplification of the process. .
  As mentioned above, although this invention was demonstrated in detail by the specific Example, these Examples do not limit the scope of the present invention, Various modifications can be added within the scope of the present invention. The scope of the invention is limited only by the interpretation of the claims.
It is sectional drawing according to process for demonstrating the manufacturing method of the conventional rigid flexible printed circuit board. It is sectional drawing according to process for demonstrating the manufacturing method of the conventional rigid flexible printed circuit board. It is sectional drawing according to process for demonstrating the manufacturing method of the conventional rigid flexible printed circuit board. It is sectional drawing according to process for demonstrating the manufacturing method of the conventional rigid flexible printed circuit board. It is a flow chart showing a manufacturing method of a rigid flexible printed circuit board concerning the present invention. It is sectional drawing according to process for demonstrating the manufacturing method of the rigid flexible printed circuit board which concerns on one Example of this invention. It is sectional drawing according to process for demonstrating the manufacturing method of the rigid flexible printed circuit board which concerns on one Example of this invention. It is sectional drawing according to process for demonstrating the manufacturing method of the rigid flexible printed circuit board which concerns on one Example of this invention. It is sectional drawing according to process for demonstrating the manufacturing method of the rigid flexible printed circuit board which concerns on one Example of this invention. It is sectional drawing according to process for demonstrating the manufacturing method of the rigid flexible printed circuit board which concerns on one Example of this invention. It is sectional drawing according to process for demonstrating the manufacturing method of the rigid flexible printed circuit board which concerns on one Example of this invention. It is sectional drawing according to process for demonstrating the manufacturing method of the rigid flexible printed circuit board which concerns on one Example of this invention. It is sectional drawing according to process for demonstrating the manufacturing method of the rigid flexible printed circuit board which concerns on one Example of this invention. It is sectional drawing according to process for demonstrating the manufacturing method of the rigid flexible printed circuit board which concerns on one Example of this invention. It is a top view of FIG. 3H.
Explanation of symbols
DESCRIPTION OF SYMBOLS 100 Flexible copper clad laminated board 110 1st flexible film 120,210,210 'Copper foil layer 130 Internal via hole 140,240,240' Plating layer 150 Internal circuit pattern 150a Terminal part 160 Protective film 170 Insulating layer 180,220 Opening 190 Base substrate 200, 200 ′ second flexible film 230 through hole 250, 250 ′ second circuit pattern

Claims (12)

  1. A method for manufacturing a rigid flexible printed circuit board including a flexible region and a rigid region,
    (A) In the first flexible film having a first circuit pattern formed on at least one surface, at least a part of the first circuit pattern corresponding to the flexible region is protected by a protective film, and the first circuit pattern corresponding to the rigid region Forming a base substrate by laminating an insulating layer on the upper surface of the substrate,
    (B) Laminating a single-sided flexible copper-clad laminate having a copper foil layer formed on one side of the second flexible film on both sides of the base substrate;
    (C) The portion of the copper foil layer corresponding to the flexible region is removed to expose the second flexible film, and the portion of the copper foil layer corresponding to the rigid region is connected to the first circuit pattern. Forming a second circuit pattern comprising:
    (D) removing the portion of the second flexible film corresponding to the flexible region, and a method for producing a rigid flexible printed circuit board.
  2.   2. The method of manufacturing a rigid flexible printed circuit board according to claim 1, wherein an area not protected by the protective film in the first circuit pattern corresponding to the flexible area is a terminal portion for an external connection terminal. 3. .
  3. In step (D),
    (D-1) cutting the region corresponding to the end of the flexible region not in contact with the rigid region by laser processing from the second flexible film;
    (D-2) From the cut second flexible film, a region corresponding to the end of the flexible region in contact with the rigid region is cut by a physical method, and a second flexible film corresponding to the flexible region is obtained. The manufacturing method of the rigid flexible printed circuit board of Claim 1 including the step of removing.
  4.   The first circuit pattern includes a boundary pattern formed in a region corresponding to an end of the flexible region that does not contact the rigid region, and protects the first flexible film during the laser processing, and the boundary pattern is The method of manufacturing a rigid flexible printed circuit board according to claim 3, wherein the rigid flexible printed circuit board is not electrically connected to other patterns in the first circuit pattern.
  5.   2. The method of manufacturing a rigid flexible printed circuit board according to claim 1, wherein the step (D) removes a portion of the second flexible film corresponding to the flexible region by laser processing. 3.
  6. In step (D),
    (D-1) cutting the region corresponding to the end of the flexible region III that does not contact the rigid region by machining from the second flexible film;
    (D-2) The second flexible film corresponding to the flexible region is removed from the cut second flexible film by cutting the region corresponding to the end of the flexible region in contact with the rigid region by a physical method. The manufacturing method of the rigid flexible printed circuit board of Claim 1 characterized by including the step to perform.
  7.   2. The method of manufacturing a rigid flexible printed circuit board according to claim 1, wherein in the step (D), a portion of the second flexible film corresponding to the flexible region is removed by machining.
  8.   The method for manufacturing a rigid flexible printed circuit board according to claim 6 or 7, wherein the machining is a process using any one of punching, a knife, and a router bit.
  9.   The method of manufacturing a rigid flexible printed circuit board according to claim 1, wherein the first flexible film and the second flexible film are polyimide films.
  10.   The method for manufacturing a rigid flexible printed circuit board according to claim 1, wherein the insulating layer is a semi-cured prepreg.
  11.   The method for manufacturing a rigid flexible printed circuit board according to claim 1, wherein the insulating layer is a bonding sheet.
  12. After the step (A),
    2. The method of manufacturing a rigid flexible printed circuit board according to claim 1, further comprising the step of alternately forming a desired number of additional circuit layers and additional insulating layers on the upper surface of the insulating layer. .
JP2006292679A 2005-10-28 2006-10-27 Method of manufacturing rigid flexible printed circuit board Pending JP2007123902A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020050102464A KR100722621B1 (en) 2005-10-28 2005-10-28 Method for manufacturing Rigid-flexible Printed Circuit Board

Publications (1)

Publication Number Publication Date
JP2007123902A true JP2007123902A (en) 2007-05-17

Family

ID=38063640

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006292679A Pending JP2007123902A (en) 2005-10-28 2006-10-27 Method of manufacturing rigid flexible printed circuit board

Country Status (4)

Country Link
JP (1) JP2007123902A (en)
KR (1) KR100722621B1 (en)
CN (1) CN100551206C (en)
TW (1) TWI300678B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010021297A (en) * 2008-07-10 2010-01-28 Compeq Manufacturing Co Ltd Rigid flex circuit board comprising peelable protective layer and manufacturing method thereof
CN103635007A (en) * 2012-08-24 2014-03-12 富葵精密组件(深圳)有限公司 Rigid-flexible circuit substrate, rigid-flexible circuit board and manufacturing method thereof
CN108012453A (en) * 2017-12-07 2018-05-08 江门黑氪光电科技有限公司 A kind of multilayer circuit board fabrication method for LED light strip

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100993318B1 (en) * 2008-09-04 2010-11-09 삼성전기주식회사 Method for manufacturi ng flying tail type rigid-flexible printed circuit board
TWI496518B (en) * 2009-10-02 2015-08-11 Innolux Corp Flexible printed circuit board and method for forming monitor
KR101055514B1 (en) * 2009-12-03 2011-08-08 삼성전기주식회사 Manufacturing method of rigid-flexible substrate
US8493747B2 (en) * 2010-02-05 2013-07-23 Ibiden Co., Ltd. Flex-rigid wiring board and method for manufacturing the same
KR101387313B1 (en) 2012-02-21 2014-04-18 삼성전기주식회사 Method of manufacturing flying tail type rigid-flexible printed circuit board and flying tail type rigid-flexible printed circuit board manufactured by the same
KR101814113B1 (en) * 2012-11-02 2018-01-02 삼성전기주식회사 Method for manufacturing of printed circuit board
CN103384444B (en) * 2013-07-30 2016-04-20 博敏电子股份有限公司 A kind ofly protect rigid-flex combined board of internal layer windowed regions and preparation method thereof
CN103763859A (en) * 2014-01-18 2014-04-30 上海美维电子有限公司 Machining method for printed circuit board
CN110139504B (en) * 2019-05-24 2020-07-10 深圳市景旺电子股份有限公司 Soft and hard combined circuit board and manufacturing method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05235556A (en) * 1992-02-26 1993-09-10 Fujitsu Ltd Pattern cut structure of thin film substrate
JPH05235552A (en) * 1992-02-26 1993-09-10 Sharp Corp Printed circuit board
JPH05259645A (en) * 1992-03-12 1993-10-08 Hitachi Chem Co Ltd Manufacture of flexible/rigid wiring board
JPH0974252A (en) * 1995-09-07 1997-03-18 Nippon Avionics Co Ltd Flexible rigid printed-wiring board and manufacture thereof
JPH10224037A (en) * 1997-02-04 1998-08-21 Sharp Corp Manufacture of composite multilayer printed wiring board
JP2005191600A (en) * 2005-03-24 2005-07-14 Nitto Denko Corp Manufacturing method for multilayer wiring circuit board

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3155565B2 (en) * 1991-08-12 2001-04-09 シャープ株式会社 Manufacturing method of printed wiring board
JP4041048B2 (en) 2003-09-26 2008-01-30 エルナー株式会社 Flexible / rigid wiring board and method for manufacturing the same
KR100632557B1 (en) * 2004-04-20 2006-10-09 삼성전기주식회사 Manufacturing method of a printed circuit board having a coverlay molded by photosensitive polyimide

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05235556A (en) * 1992-02-26 1993-09-10 Fujitsu Ltd Pattern cut structure of thin film substrate
JPH05235552A (en) * 1992-02-26 1993-09-10 Sharp Corp Printed circuit board
JPH05259645A (en) * 1992-03-12 1993-10-08 Hitachi Chem Co Ltd Manufacture of flexible/rigid wiring board
JPH0974252A (en) * 1995-09-07 1997-03-18 Nippon Avionics Co Ltd Flexible rigid printed-wiring board and manufacture thereof
JPH10224037A (en) * 1997-02-04 1998-08-21 Sharp Corp Manufacture of composite multilayer printed wiring board
JP2005191600A (en) * 2005-03-24 2005-07-14 Nitto Denko Corp Manufacturing method for multilayer wiring circuit board

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010021297A (en) * 2008-07-10 2010-01-28 Compeq Manufacturing Co Ltd Rigid flex circuit board comprising peelable protective layer and manufacturing method thereof
CN103635007A (en) * 2012-08-24 2014-03-12 富葵精密组件(深圳)有限公司 Rigid-flexible circuit substrate, rigid-flexible circuit board and manufacturing method thereof
CN108012453A (en) * 2017-12-07 2018-05-08 江门黑氪光电科技有限公司 A kind of multilayer circuit board fabrication method for LED light strip
CN108012453B (en) * 2017-12-07 2020-09-29 江门黑氪光电科技有限公司 Manufacturing method of multilayer circuit board for LED lamp strip

Also Published As

Publication number Publication date
KR20070045787A (en) 2007-05-02
TW200718314A (en) 2007-05-01
TWI300678B (en) 2008-09-01
CN1956628A (en) 2007-05-02
KR100722621B1 (en) 2007-05-28
CN100551206C (en) 2009-10-14

Similar Documents

Publication Publication Date Title
US10674610B1 (en) Multilayer rigid flexible printed circuit board and method for manufacturing the same
US10091871B2 (en) Method of manufacturing rigid-flexible printed circuit board
KR101475109B1 (en) Multilayer Wiring Substrate and Method of Manufacturing the Same
US8482117B2 (en) Semiconductor device with electronic component incorporation substrate
JP5833236B2 (en) Method of manufacturing rigid flexible printed circuit board and rigid flexible printed circuit board
JP5101542B2 (en) Chip built-in printed circuit board and manufacturing method thereof
KR100584962B1 (en) Rigid-flexible PCB having a coverlay made from Liquid Crystal Polymer and manufacturing method thereof
CN101106861B (en) Method of manufacturing rigid-flexible printed circuit board
TWI475940B (en) Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate
US7293353B2 (en) Method of fabricating rigid flexible printed circuit board
CN101189717B (en) Printed wiring board with built-in semiconductor element and method for manufacturing same
JP4126052B2 (en) Printed circuit board manufacturing method and thin printed circuit board
US8850701B2 (en) Method for manufacturing multilayer printed circuit board having mounting cavity
US8256112B2 (en) Method of manufacturing high density printed circuit board
KR100619348B1 (en) Method for manufacturing package substrate using a electroless Ni plating
KR100619347B1 (en) Method for manufacturing Rigid-flexible Printed Circuit Board
US20060060960A1 (en) Printed circuit board having chip package mounted theron and method of fabricating same
US20080171172A1 (en) Component-embedded PCB and manufacturing method thereof
KR20090126537A (en) Printed circuit board with electronic components embedded therein and method for fabricating the same
US10034368B2 (en) Flying tail type rigid-flexible printed circuit board
JP2004235323A (en) Manufacturing method of wiring substrate
KR101015704B1 (en) Chip embedded printed circuit board and manufacturing method thereof
KR100499008B1 (en) Two-sided PCB without via hole and the manufacturing method thereof
TWI475938B (en) Multilayered wiring board and method of manufacturing the same
KR100661297B1 (en) Rigid-flexible printed circuit board for package on package, and manufacturing method

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090512

A521 Written amendment

Effective date: 20090810

Free format text: JAPANESE INTERMEDIATE CODE: A523

A131 Notification of reasons for refusal

Effective date: 20100126

Free format text: JAPANESE INTERMEDIATE CODE: A131

A521 Written amendment

Effective date: 20100426

Free format text: JAPANESE INTERMEDIATE CODE: A523

A02 Decision of refusal

Effective date: 20100615

Free format text: JAPANESE INTERMEDIATE CODE: A02