CN108391376A - A kind of high-accuracy or very small region cover film applying method - Google Patents
A kind of high-accuracy or very small region cover film applying method Download PDFInfo
- Publication number
- CN108391376A CN108391376A CN201810182678.4A CN201810182678A CN108391376A CN 108391376 A CN108391376 A CN 108391376A CN 201810182678 A CN201810182678 A CN 201810182678A CN 108391376 A CN108391376 A CN 108391376A
- Authority
- CN
- China
- Prior art keywords
- cover film
- pcb board
- accuracy
- fitting
- small region
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a kind of high-accuracy or very small region cover film applying methods, including are preset with the pcb board of several contraposition luminous points（1）, cover film（4）, pre- heat plying-up machine and laser cutting machine, carry out acquisition, the cover film of circuitous pattern successively（4）Processing, contraposition, cut, remove waste material and pressing working procedure.The present invention obtains pcb board using laser scanning device（1）On circuit dash forward figure, using laser cutting machine to cover film（4）Fitting figure carry out monnolithic case processing, and aligned by aligning luminous point, improve aligning accuracy, meanwhile, whole big unit fitting, relatively traditional single PCS fittings are easily facilitated to cover film（4）It cleaned, promote fitting efficiency and man efficiency, to cover film（4）Gas laser cutting machine is used when being cut, the laser is only to cover film（4）Cutting substantially increases product quality and yields without hindering copper face.
Description
Technical field
The present invention relates to pcb board processing technique field, specially a kind of high-accuracy or very small region cover film applying method.
Background technology
Pcb board is divided into rigid circuit board and flexible PCB, Rigid Flex, and Rigid Flex soft board level is mostly at present
It is bonded using whole fitting and list PCS, the high-level raising hardboard level plated hole reliability that is made as all selects list PCS patches substantially
Close, to improve product reliability, but made by space limitation and register guide target spot influenced many small PCS product it is single right
Position Aligning degree is poor, cannot be satisfied making demand, meanwhile, single PCS fittings design soft zone complex figure, what wicket made
Plate, single PCS fitting, which needs to waste a large amount of manpowers, goes to make, and producing efficiency is low, and aligning accuracy is influenced to align by personnel's operation
It is bad, in addition, list PCS makes, since the smaller cleaning of unit is inconvenient when being cleaned after covering film production, it is not thorough to be easy to cause cleaning
Quality risk is brought at bottom in turn, therefore we make this improvement, proposes a kind of high-accuracy or very small region cover film fitting side
Method.
Invention content
To solve the defect that producing efficiency of the existing technology is low, alignment precision is poor and making is poor quality, the present invention
A kind of high-accuracy or very small region cover film applying method is provided.
In order to solve the above technical problem, the present invention provides the following technical solutions：
The high-accuracy or very small region cover film applying method of one kind of the invention, including it is preset with the pcb board of several contraposition luminous points
And cover film, following steps are carried out successively：
Step 1：The circuitous pattern on pcb board surface is obtained by laser scanning device, and determines positioning spot and patch on pcb board
Close region；
Step 2：Several registration holes to match with contraposition luminous point are processed on cover film by laser machining, and are being covered
Several are carved on epiphragma and is bonded figure with what fit area on pcb board matched, and cover film is divided by the fitting figure
The both ends of actual cell and scrap area, the actual cell are connect by connection strap with scrap area；
Step 3：Cover film is aligned by the contraposition luminous point in registration holes and pcb board by covering film surface with pcb board, and is led to
Pre- heat plying-up machine is crossed to be fitted in cover film on pcb board in advance；
Step 4：The connection strap that actual cell both ends are cut off by laser cutting machine, makes scrap area be detached with actual cell；
Step 5：It is taken or dust collection equipment removes waste material from the surface of pcb board by manually tearing；
Step 6：Actual cell is fitted in the fit area surface of pcb board by pressure transmission machine.
Further, the cover film in step 2 is after laser processing, by cleaning roller to cover film and PCB
The one side of plate fitting carries out cleaning treatment.
Further, the pre- heat plying-up machine in step 3 uses YG-06T type hot melt adhesive film heat plying-up machines, step 4
In the laser cutting machine use CO2-M30 type gas laser cutting machines, the pressure transmission machine in step 6 is fast using YT-001 types
Press.
Compared with prior art, the present invention has the advantages that：This kind of high-accuracy or very small region cover film fitting
Method obtains the circuit on pcb board using laser scanning device and dashes forward figure, using laser cutting machine to the fitting figure of cover film into
Row monnolithic case is processed, and is aligned by aligning luminous point, and aligning accuracy is improved, meanwhile, whole big unit fitting is opposite to pass
Single PCS fittings of system, which easily facilitate, to be cleaned cover film, promotes fitting efficiency and man efficiency, is cut to cover film
Shi Caiyong gas laser cutting machines, the laser only cut without hindering copper face cover film, substantially increase product quality and non-defective unit
Rate.
Description of the drawings
Attached drawing is used to provide further understanding of the present invention, and a part for constitution instruction, the reality with the present invention
It applies example to be used to explain the present invention together, not be construed as limiting the invention.In the accompanying drawings：
Fig. 1 is a kind of high-accuracy or very small region cover film applying method the flow chart of the present invention；
Fig. 2 is a kind of high-accuracy or very small region cover film applying method the pcb board structural schematic diagram of the present invention；
Fig. 3 is a kind of high-accuracy or very small region cover film applying method the cover film schematic diagram of the present invention；
Fig. 4 is a kind of high-accuracy or very small region cover film applying method the fitting schematic diagram of the present invention.
In figure：1, pcb board；2, positioning spot；3, fit area；4, cover film；5, actual cell；6, scrap area；7、
Registration holes；8, connection strap.
Specific implementation mode
To make the technical means, the creative features, the aims and the efficiencies achieved by the present invention be easy to understand, with reference to
Specific implementation mode, the present invention is further explained.
As shown in Figs 1-4, a kind of high-accuracy or very small region cover film applying method, including it is preset with several contraposition light
The pcb board 1 and cover film 4 of point, carry out following steps successively：
Step 1：The circuitous pattern on 1 surface of pcb board is obtained by laser scanning device, and determines 2 He of positioning spot on pcb board 1
Fit area 3；
Step 2：Several registration holes 7 to match with contraposition luminous point are processed on cover film 4 by laser machining, and
Several are carved on cover film 4 and is bonded figure with what fit area 3 on pcb board 1 matched, and fitting figure divides cover film 4
Both ends for actual cell 5 and scrap area 6, actual cell 5 are connect by connection strap 8 with scrap area 6；
Step 3：Cover film 4 is aligned with pcb board 1 by the contraposition luminous point in the registration holes 7 and pcb board 1 on 4 surface of cover film,
And cover film 4 is fitted in advance on pcb board 1 by pre- heat plying-up machine；
Step 4：The connection strap 8 that 5 both ends of actual cell are cut off by laser cutting machine, makes scrap area 6 divide with actual cell 5
From；
Step 5：It is taken or dust collection equipment removes waste material from the surface of pcb board 1 by manually tearing；
Step 6：Actual cell 5 is fitted in 3 surface of fit area of pcb board 1 by pressure transmission machine.
Wherein, the cover film 4 in step 2 pastes cover film 4 and pcb board 1 by cleaning roller after laser processing
The one side of conjunction carries out cleaning treatment.
Wherein, the pre- heat plying-up machine in step 3 uses YG-06T type hot melt adhesive film heat plying-up machines, the laser in step 4
Cutting machine uses CO2-M30 type gas laser cutting machines, and the pressure transmission machine in step 6 uses the fast press of YT-001 types.
It should be noted that the present invention is a kind of high-accuracy or very small region cover film applying method, when specific works, profit
The prominent figure of the circuit on pcb board 1 is obtained with laser scanning device, the fitting figure of cover film 4 is carried out using laser cutting machine whole
Body sharp processing, and aligned by aligning luminous point, aligning accuracy is improved, meanwhile, whole big unit fitting is relatively traditional
Single PCS fittings, which easily facilitate, to be cleaned cover film 4, promotes fitting efficiency and man efficiency, when being cut to cover film 4
Using gas laser cutting machine, which only cuts without hindering copper face cover film 4, substantially increases product quality and non-defective unit
Rate.
The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this
The principle of invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes
Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and its
Equivalent thereof.
Claims (3)
1. a kind of high-accuracy or very small region cover film applying method, including it is preset with the pcb board of several contraposition luminous points（1）With
Cover film（4）, which is characterized in that following steps are carried out successively：
Step 1：Pcb board is obtained by laser scanning device（1）The circuitous pattern on surface, and determine pcb board（1）On positioning light
Point（2）The fit area and（3）；
Step 2：By laser machining in cover film（4）On process several and the registration holes that match of contraposition luminous point（7）,
And in cover film（4）On carve several and pcb board（1）Upper fit area（3）The fitting figure to match, the fitting figure
By cover film（4）It is divided into actual cell（5）The scrap area and（6）, the actual cell（5）Both ends pass through connection strap（8）
With scrap area（6）Connection；
Step 3：Pass through cover film（4）The registration holes on surface（7）And pcb board（1）On contraposition luminous point by cover film（4）With PCB
Plate（1）Alignment, and by pre- heat plying-up machine by cover film（4）It is fitted in pcb board in advance（1）On；
Step 4：Actual cell is cut off by laser cutting machine（5）The connection strap at both ends（8）, make scrap area（6）With practical list
Member（5）Separation；
Step 5：By manually tear take or dust collection equipment by waste material from pcb board（1）Surface remove；
Step 6：By pressure transmission machine by actual cell（5）It is fitted in pcb board（1）Fit area（3）Surface.
2. one kind according to claim 1 is high-accuracy or very small region cover film applying method, which is characterized in that step 2
In the cover film（4）After laser processing, by cleaning roller to cover film（4）With pcb board（1）The one side of fitting into
Row cleaning treatment.
3. one kind according to claim 1 is high-accuracy or very small region cover film applying method, which is characterized in that step 3
In the pre- heat plying-up machine use YG-06T type hot melt adhesive film heat plying-up machines, the laser cutting machine in step 4 uses
CO2-M30 type gas laser cutting machines, the pressure transmission machine in step 6 use the fast press of YT-001 types.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810182678.4A CN108391376B (en) | 2018-03-06 | 2018-03-06 | A kind of high-accuracy or very small region cover film applying method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810182678.4A CN108391376B (en) | 2018-03-06 | 2018-03-06 | A kind of high-accuracy or very small region cover film applying method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108391376A true CN108391376A (en) | 2018-08-10 |
| CN108391376B CN108391376B (en) | 2019-11-29 |
Family
ID=63069961
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810182678.4A Active CN108391376B (en) | 2018-03-06 | 2018-03-06 | A kind of high-accuracy or very small region cover film applying method |
Country Status (1)
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| CN (1) | CN108391376B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112105155A (en) * | 2020-08-20 | 2020-12-18 | 瑞声新能源发展(常州)有限公司科教城分公司 | Chip FPC and manufacturing method thereof |
| CN113473715A (en) * | 2021-06-28 | 2021-10-01 | 武汉先河激光技术有限公司 | Laser cutting and laminating method and device for FPC flexible circuit board |
| CN114228020A (en) * | 2021-12-14 | 2022-03-25 | 中国科学院大连化学物理研究所 | Automatic ptfe film attaching mode and device for batch preparation of water electrolysis composite film |
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| CN112105155A (en) * | 2020-08-20 | 2020-12-18 | 瑞声新能源发展(常州)有限公司科教城分公司 | Chip FPC and manufacturing method thereof |
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| CN113473715A (en) * | 2021-06-28 | 2021-10-01 | 武汉先河激光技术有限公司 | Laser cutting and laminating method and device for FPC flexible circuit board |
| CN114228020A (en) * | 2021-12-14 | 2022-03-25 | 中国科学院大连化学物理研究所 | Automatic ptfe film attaching mode and device for batch preparation of water electrolysis composite film |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108391376B (en) | 2019-11-29 |
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