CN105828532B - A method for splitting circuit boards - Google Patents
A method for splitting circuit boards Download PDFInfo
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- CN105828532B CN105828532B CN201610380392.8A CN201610380392A CN105828532B CN 105828532 B CN105828532 B CN 105828532B CN 201610380392 A CN201610380392 A CN 201610380392A CN 105828532 B CN105828532 B CN 105828532B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
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- Structure Of Printed Boards (AREA)
Abstract
Description
技术领域technical field
本发明涉及电路板领域，尤其涉及一种电路板拼板的分板方法。The invention relates to the field of circuit boards, in particular to a method for splitting circuit boards.
背景技术Background technique
随着电子产品的快速发展，产品的机身越来越趋向于薄、轻巧化，产品内部的空间布局也会越来越紧凑，使得越来越多的电路板采用电路板拼板工艺进行加工制造，便于加工制作，而电路板拼板工艺中针对2毫米及以2毫米以上的板厚的PCB的成形加工难度比较大，板厚越大成型加工时对刀具的损伤也越大，同时板厚越大，加工成型速度越低，这样会影响电路板的分板速度和效率。With the rapid development of electronic products, the body of the product tends to be thinner and lighter, and the internal space layout of the product will become more and more compact, so that more and more circuit boards are processed by the circuit board jigsaw process Manufacturing, easy to process and manufacture, and the forming process of PCBs with a thickness of 2 mm and above in the circuit board assembly process is relatively difficult, the greater the thickness of the board, the greater the damage to the tool during forming processing, and the board The greater the thickness, the lower the processing and forming speed, which will affect the speed and efficiency of circuit board splitting.
发明内容Contents of the invention
本发明的目的在于提供一种电路板拼板的分板方法，能够提高电路板拼板的分板效率。The purpose of the present invention is to provide a method for dividing boards of circuit boards, which can improve the efficiency of dividing boards of circuit boards.
为了解决上述技术问题，本发明实施例提供了一种电路板拼板的分板方法，包括：In order to solve the above-mentioned technical problems, an embodiment of the present invention provides a circuit board splitting method, including:
提供基板；Provide the substrate;
将所述基板进行切割加工，以获得电路板拼板，所述电路板拼板包括多个电路板，且相邻的两个所述电路板通过连接筋拼接；Cutting the substrate to obtain a circuit board assembly, the circuit board assembly includes a plurality of circuit boards, and two adjacent circuit boards are spliced by connecting ribs;
根据所述基板的厚度对每一个所述连接筋切割掉预设厚度；cutting off a preset thickness for each of the connecting ribs according to the thickness of the substrate;
对各个所述电路板进行表面贴装工艺；Carrying out a surface mount process to each of the circuit boards;
对切割掉预设厚度的每一个所述连接筋完全切除，以对各个已经进行表面贴装工艺的所述电路板进行分板。Each of the connecting ribs with a preset thickness is completely cut off, so as to separate the circuit boards that have been subjected to surface mount technology.
其中，在所述根据所述基板的厚度对每一个所述连接筋切割掉预设厚度的步骤之后，包括：Wherein, after the step of cutting off a preset thickness for each of the connecting ribs according to the thickness of the substrate, it includes:
清洗各个所述电路板的表面。Clean the surface of each of the circuit boards.
其中，所述基板的板厚大于或等于2mm。Wherein, the thickness of the substrate is greater than or equal to 2mm.
其中，去除掉所述预设厚度的所述连接筋的厚度为1～1.2mm。Wherein, the thickness of the connecting rib excluding the preset thickness is 1-1.2 mm.
其中，所述将所述基板进行切割加工的步骤中，包括：Wherein, the step of cutting the substrate includes:
提供全自动切割设备；Provide fully automatic cutting equipment;
在全自动切割设备中输入切割程序；Input the cutting program in the automatic cutting equipment;
根据所述切割程序对所述基板进行全自动切割加工。Carry out automatic cutting processing on the substrate according to the cutting program.
其中，切割所述连接筋的刀具为锣刀。Wherein, the cutter for cutting the connecting rib is a gong cutter.
其中，各个所述电路板的结构相同。Wherein, the structure of each of the circuit boards is the same.
其中，各个所述电路板为刚性电路板。Wherein, each of the circuit boards is a rigid circuit board.
其中，所述连接筋为矩形、圆形或半椭圆形。Wherein, the connecting rib is rectangular, circular or semi-elliptical.
本发明实施例提供的电路板拼板的分板方法通过将厚度较厚的连接筋先切割掉一部分以减少连接筋的厚度，使得在电路板拼板进行后续分板时，余下的连接筋厚度较小，利于刀具进行切割加工，提高了电路板拼板的分板效率。The circuit board splitting method provided by the embodiment of the present invention reduces the thickness of the connecting ribs by first cutting off a part of the thicker connecting ribs, so that when the circuit board is assembled for subsequent board splitting, the thickness of the remaining connecting ribs Smaller, it is beneficial for the cutter to cut and process, and improves the efficiency of board splitting for circuit board assembly.
附图说明Description of drawings
为了更清楚地说明本发明实施例的技术方案，下面将对实施方式中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本发明一些实施方式，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings that need to be used in the implementation. Obviously, the drawings in the following description are some implementations of the present invention, which are common to those skilled in the art. As far as the skilled person is concerned, other drawings can also be obtained based on these drawings on the premise of not paying creative work.
图1是本发明实施例提供的一种电路板拼板的分板方法的流程示意图；Fig. 1 is a schematic flow chart of a circuit board splitting method provided by an embodiment of the present invention;
图2是本发明实施例提供的另一种电路板拼板的分板方法的流程示意图。Fig. 2 is a schematic flow chart of another circuit board splitting method provided by an embodiment of the present invention.
具体实施方式Detailed ways
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有付出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
下面将结合附图1-附图2，对本发明实施例提供的电路板拼板的分板方法进行详细介绍。In the following, with reference to accompanying drawings 1 to 2, the circuit board splitting method provided by the embodiment of the present invention will be described in detail.
请参见图1，是本发明实施例提供的一种电路板拼板的分板方法的流程示意图。如图1所示，本发明实施例的方法可以包括以下步骤S101-步骤S109。Please refer to FIG. 1 , which is a schematic flow chart of a circuit board splitting method provided by an embodiment of the present invention. As shown in FIG. 1 , the method in this embodiment of the present invention may include the following steps S101-S109.
S101：提供基板；S101: providing a substrate;
具体的，基板是制造PCB的基本材料，一般情况下，基板就是覆铜箔层压板，电路板就是在基板上有选择地进行孔加工、化学镀铜、电镀铜、蚀刻等加工，得到所需电路图形。可以理解的，电路板的性能、质量、制造中的加工性、制造成本、制造水平等，在很大程度上取决于基板材料。该基板为尺寸较大的基板，能够形成多块电路板，如2×2、3×3等规格的电路板拼板。Specifically, the substrate is the basic material for manufacturing PCBs. In general, the substrate is a copper-clad laminate, and the circuit board is selectively processed on the substrate such as hole processing, electroless copper plating, electroplating copper, and etching to obtain the required circuit graphics. It can be understood that the performance, quality, processability in manufacturing, manufacturing cost, manufacturing level, etc. of the circuit board depend to a large extent on the substrate material. The substrate is a substrate with a large size, and can form a plurality of circuit boards, such as circuit boards of 2×2, 3×3 and other specifications.
可以理解的，基板的厚度大于或等于2mm。It can be understood that the thickness of the substrate is greater than or equal to 2 mm.
S103：将所述基板进行切割加工，以获得电路板拼板，所述电路板拼板包括多个电路板，且相邻的两个所述电路板通过连接筋拼接；S103: Cutting the substrate to obtain a circuit board assembly, the circuit board assembly includes a plurality of circuit boards, and two adjacent circuit boards are spliced by connecting ribs;
具体的，为了提高切割效率，通过全自动切割设备对基板进行切割加工，其中，具体步骤为：提供全自动切割设备；在全自动切割设备中输入切割程序；根据所述切割程序对所述基板进行全自动切割加工。通过全自动切割设备切割出所需规格的电路板的，并且在电路板上设置线路图形单元，以电连接后续的电子元件。Specifically, in order to improve the cutting efficiency, the substrate is cut and processed by a fully automatic cutting device, wherein the specific steps are: providing a fully automatic cutting device; inputting a cutting program in the fully automatic cutting device; cutting the substrate according to the cutting program Fully automatic cutting process. The circuit board of the required specification is cut out by fully automatic cutting equipment, and the circuit pattern unit is set on the circuit board to electrically connect the subsequent electronic components.
可以理解的，为了提高加工效率，避免编造较多的切割程序，各个所述电路板的结构相同。It can be understood that, in order to improve the processing efficiency and avoid making up more cutting programs, each of the circuit boards has the same structure.
可以理解的，各个电路板为刚性电路板。It can be understood that each circuit board is a rigid circuit board.
可以理解的，连接筋为矩形、圆形或半椭圆形。It can be understood that the connecting rib is rectangular, circular or semi-elliptical.
S105：根据所述基板的厚度对每一个所述连接筋切割掉预设厚度；S105: Cut off a preset thickness for each of the connecting ribs according to the thickness of the substrate;
具体的，基板的厚度大于2mm。为了防止连接筋的厚度较厚，不利于后续的分板，将连接筋切除掉预设厚度。优选的，去除掉预设厚度的连接筋的厚度为1～1.2mm。使得连接筋在保证其本身的连接强度的同时，亦不对分板的效率造成影响。具体的，通过锣刀对连接筋的厚度进行切除。Specifically, the thickness of the substrate is greater than 2 mm. In order to prevent the thickness of the connecting rib from being too thick, which is not conducive to the subsequent board splitting, the connecting rib is cut off to a preset thickness. Preferably, the thickness of the connecting rib excluding the preset thickness is 1-1.2 mm. This ensures that the connection ribs do not affect the efficiency of the panel splitting while ensuring their own connection strength. Specifically, the thickness of the connecting rib is cut off with a gong knife.
S107：对各个所述电路板进行表面贴装工艺；S107: performing a surface mount process on each of the circuit boards;
具体的，对电路板进行SMT工艺，即在电路板上贴装上电子器件。Specifically, an SMT process is performed on the circuit board, that is, electronic devices are mounted on the circuit board.
S109：对切割掉预设厚度的每一个所述连接筋完全切除，以对各个已经进行表面贴装工艺的所述电路板进行分板；S109: Completely cut off each of the connecting ribs with a preset thickness, so as to separate the circuit boards that have undergone surface mount technology;
具体的，将连接筋进行完全切除，使得各个电路板不再连接在一起，即对各个电路板进行分板。其中，由于连接筋的厚度为1～1.2mm，可以使用普通的刀具进行切除，不会影响分板效率。Specifically, the connecting ribs are completely cut off so that the circuit boards are no longer connected together, that is, the circuit boards are divided into boards. Among them, since the thickness of the connecting rib is 1-1.2 mm, it can be cut with a common cutter without affecting the efficiency of the board separation.
本发明实施例提供的电路板拼板的分板方法通过将厚度较厚的连接筋先切割掉一部分以减少连接筋的厚度，使得在电路板拼板进行后续分板时，余下的连接筋厚度较小，利于刀具进行切割加工，提高了电路板拼板的分板效率。The circuit board splitting method provided by the embodiment of the present invention reduces the thickness of the connecting ribs by first cutting off a part of the thicker connecting ribs, so that when the circuit board is assembled for subsequent board splitting, the thickness of the remaining connecting ribs Smaller, it is beneficial for the cutter to cut and process, and improves the efficiency of board splitting for circuit board assembly.
请参见图2，是本发明实施例提供的另一种电路板拼板的分板方法的流程示意图。如图2所示，本发明实施例的方法可以包括以下步骤S201-步骤S211。Please refer to FIG. 2 , which is a schematic flow chart of another circuit board splitting method provided by an embodiment of the present invention. As shown in FIG. 2 , the method in this embodiment of the present invention may include the following steps S201 to S211.
S201：提供基板；S201: providing a substrate;
具体的，基板是制造PCB的基本材料，一般情况下，基板就是覆铜箔层压板，电路板就是在基板上有选择地进行孔加工、化学镀铜、电镀铜、蚀刻等加工，得到所需电路图形。可以理解的，电路板的性能、质量、制造中的加工性、制造成本、制造水平等，在很大程度上取决于基板材料。该基板为尺寸较大的基板，能够形成多块电路板，如2×2、3×3等规格的电路板拼板。Specifically, the substrate is the basic material for manufacturing PCBs. In general, the substrate is a copper-clad laminate, and the circuit board is selectively processed on the substrate such as hole processing, electroless copper plating, electroplating copper, and etching to obtain the required circuit graphics. It can be understood that the performance, quality, processability in manufacturing, manufacturing cost, manufacturing level, etc. of the circuit board depend to a large extent on the substrate material. The substrate is a substrate with a large size, and can form a plurality of circuit boards, such as circuit boards of 2×2, 3×3 and other specifications.
可以理解的，基板的厚度大于或等于2mm。It can be understood that the thickness of the substrate is greater than or equal to 2 mm.
S203：将所述基板进行切割加工，以获得电路板拼板，所述电路板拼板包括多个电路板，且相邻的两个所述电路板通过连接筋拼接；S203: Cutting the substrate to obtain a circuit board assembly, the circuit board assembly includes a plurality of circuit boards, and two adjacent circuit boards are spliced by connecting ribs;
具体的，为了提高切割效率，通过全自动切割设备对基板进行切割加工，其中，具体步骤为：提供全自动切割设备；在全自动切割设备中输入切割程序；根据所述切割程序对所述基板进行全自动切割加工。通过全自动切割设备切割出所需规格的电路板的，并且在电路板上设置线路图形单元，以电连接后续的电子元件。Specifically, in order to improve the cutting efficiency, the substrate is cut and processed by a fully automatic cutting device, wherein the specific steps are: providing a fully automatic cutting device; inputting a cutting program in the fully automatic cutting device; cutting the substrate according to the cutting program Fully automatic cutting process. The circuit board of the required specification is cut out by fully automatic cutting equipment, and the circuit pattern unit is set on the circuit board to electrically connect the subsequent electronic components.
可以理解的，为了提高加工效率，避免编造较多的切割程序，各个所述电路板的结构相同。It can be understood that, in order to improve the processing efficiency and avoid making up more cutting programs, each of the circuit boards has the same structure.
可以理解的，各个电路板为刚性电路板。It can be understood that each circuit board is a rigid circuit board.
可以理解的，连接筋为矩形、圆形或半椭圆形。It can be understood that the connecting rib is rectangular, circular or semi-elliptical.
S205：根据所述基板的厚度对每一个所述连接筋切割掉预设厚度；S205: Cut off a preset thickness for each of the connecting ribs according to the thickness of the substrate;
具体的，基板的厚度大于2mm。为了防止连接筋的厚度较厚，不利于后续的分板，将连接筋切除掉预设厚度。优选的，去除掉预设厚度的连接筋的厚度为1～1.2mm。使得连接筋在保证其本身的连接强度的同时，亦不对分板的效率造成影响。具体的，通过锣刀对连接筋的厚度进行切除。Specifically, the thickness of the substrate is greater than 2mm. In order to prevent the thickness of the connecting rib from being too thick, which is not conducive to the subsequent board splitting, the connecting rib is cut off to a preset thickness. Preferably, the thickness of the connecting rib excluding the preset thickness is 1-1.2 mm. This ensures that the connection ribs do not affect the efficiency of the panel splitting while ensuring their own connection strength. Specifically, the thickness of the connecting rib is cut off with a gong knife.
S207：清洗各个所述电路板的表面；S207: cleaning the surface of each circuit board;
具体的，为了防止对后续的表面贴装工艺的贴装精度造成影响，对各个电路板的表面进行清洗，以清除各个电路板上因切割造成的板屑。Specifically, in order to prevent the mounting accuracy of the subsequent surface mount process from being affected, the surface of each circuit board is cleaned to remove board scraps caused by cutting on each circuit board.
S209：对各个所述电路板进行表面贴装工艺；S209: performing a surface mount process on each of the circuit boards;
具体的，对电路板进行SMT工艺，即在电路板上贴装上电子器件。Specifically, an SMT process is performed on the circuit board, that is, electronic devices are mounted on the circuit board.
S211：对切割掉预设厚度的每一个所述连接筋完全切除，以对各个已经进行表面贴装工艺的所述电路板进行分板；S211: Completely cut off each of the connecting ribs with a preset thickness, so as to separate the circuit boards that have undergone surface mount technology;
具体的，将连接筋进行完全切除，使得各个电路板不再连接在一起，即对各个电路板进行分板。其中，由于连接筋的厚度为1～1.2mm，可以使用普通的刀具进行切除，不会影响分板效率。Specifically, the connecting ribs are completely cut off so that the circuit boards are no longer connected together, that is, the circuit boards are divided into boards. Among them, since the thickness of the connecting rib is 1-1.2 mm, it can be cut with a common cutter without affecting the efficiency of the board separation.
本发明实施例提供的电路板拼板的分板方法通过将厚度较厚的连接筋先切割掉一部分以减少连接筋的厚度，使得在电路板拼板进行后续分板时，余下的连接筋厚度较小，利于刀具进行切割加工，提高了电路板拼板的分板效率。The circuit board splitting method provided by the embodiment of the present invention reduces the thickness of the connecting ribs by first cutting off a part of the thicker connecting ribs, so that when the circuit board is assembled for subsequent board splitting, the thickness of the remaining connecting ribs Smaller, it is beneficial for the cutter to cut and process, and improves the efficiency of board splitting for circuit board assembly.
本发明实施例提供的电路板拼板的分板方法还通过对各个电路板进行清洗，以清除各个电路板上因切割造成的板屑，防止对后续的表面贴装工艺的贴装精度造成影响，进一步提高电路板的性能。The circuit board splitting method provided by the embodiment of the present invention also cleans each circuit board to remove the board scraps caused by cutting on each circuit board, so as to prevent the impact on the mounting accuracy of the subsequent surface mount process , to further improve the performance of the board.
本发明实施例的模块或单元可以根据实际需求组合或拆分。The modules or units of the embodiments of the present invention can be combined or split according to actual needs.
以上是本发明实施例的实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明实施例原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本发明的保护范围。The above is the implementation manner of the embodiment of the present invention. It should be pointed out that for those of ordinary skill in the art, without departing from the principle of the embodiment of the present invention, some improvements and modifications can also be made. These improvements and modifications are also It is regarded as the protection scope of the present invention.
Claims (6)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711336426.4A CN108012427A (en) | 2016-05-31 | 2016-05-31 | Board splitting method for jointed boards of circuit boards |
| CN201610380392.8A CN105828532B (en) | 2016-05-31 | 2016-05-31 | A method for splitting circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610380392.8A CN105828532B (en) | 2016-05-31 | 2016-05-31 | A method for splitting circuit boards |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711336426.4A Division CN108012427A (en) | 2016-05-31 | 2016-05-31 | Board splitting method for jointed boards of circuit boards |
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| CN201711336426.4A Pending CN108012427A (en) | 2016-05-31 | 2016-05-31 | Board splitting method for jointed boards of circuit boards |
| CN201610380392.8A Expired - Fee Related CN105828532B (en) | 2016-05-31 | 2016-05-31 | A method for splitting circuit boards |
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| CN201711336426.4A Pending CN108012427A (en) | 2016-05-31 | 2016-05-31 | Board splitting method for jointed boards of circuit boards |
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| CN107027242A (en) * | 2017-05-26 | 2017-08-08 | 中国电子科技集团公司第二十九研究所 | A kind of printed circuit board contour processing method |
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| JP2000225597A (en) * | 1999-02-08 | 2000-08-15 | Cmk Corp | Cutting tools for printed wiring boards |
| US8307547B1 (en) * | 2012-01-16 | 2012-11-13 | Indak Manufacturing Corp. | Method of manufacturing a circuit board with light emitting diodes |
| CN203523148U (en) * | 2013-10-18 | 2014-04-02 | 北大方正集团有限公司 | A printed circuit board jigsaw |
| CN104144564A (en) * | 2014-07-25 | 2014-11-12 | 江苏联康电子有限公司 | PCB jointed board |
| CN104394650B (en) * | 2014-08-13 | 2018-08-07 | 中国船舶重工集团公司第七0九研究所 | Complete the scoreboard method of the assembled circuit board of Surface Mount component |
| CN105101630A (en) * | 2015-06-26 | 2015-11-25 | 努比亚技术有限公司 | Printed circuit board panel and manufacturing method thereof |
| CN205160901U (en) * | 2015-11-16 | 2016-04-13 | 磊鑫达电子(深圳)有限公司 | PCB makeup V groove structure |
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| CN108012427A (en) | 2018-05-08 |
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