CN108391376B - A kind of high-accuracy or very small region cover film applying method - Google Patents
A kind of high-accuracy or very small region cover film applying method Download PDFInfo
- Publication number
- CN108391376B CN108391376B CN201810182678.4A CN201810182678A CN108391376B CN 108391376 B CN108391376 B CN 108391376B CN 201810182678 A CN201810182678 A CN 201810182678A CN 108391376 B CN108391376 B CN 108391376B
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- China
- Prior art keywords
- cover film
- pcb board
- machine
- accuracy
- laser
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
Abstract
The invention discloses a kind of high-accuracy or very small region cover film applying methods, pcb board (1), cover film (4), pre- heat plying-up machine and laser cutting machine including being preset with several positioning spots successively carry out the acquisition of circuitous pattern, the processing of cover film (4), contraposition, cut, remove waste material and pressing working procedure.The present invention obtains the prominent figure of the circuit on pcb board (1) using laser scanning device, monnolithic case processing is carried out using fitting figure of the laser cutting machine to cover film (4), and it is aligned by positioning spot, improve aligning accuracy, simultaneously, whole big unit fitting, relatively traditional single PCS fitting, which easily facilitates, cleans cover film (4), promote fitting efficiency and man efficiency, gas laser cutting machine is used when cutting to cover film (4), the laser only cuts without hurting copper face cover film (4), substantially increase product quality and yields.
Description
Technical field
The present invention relates to pcb board processing technique field, specially a kind of high-accuracy or very small region cover film applying method.
Background technique
Pcb board is divided into rigid circuit board and flexible circuit board, Rigid Flex, and Rigid Flex soft board level is mostly at present
It is bonded using whole fitting and list PCS, the high-level raising hardboard level plated hole reliability that is made as all selects list PCS patch substantially
It closes, to improve product reliability, but the product for being influenced many small PCS by space limitation and the production of register guide target spot is single right
Position Aligning degree is poor, is unable to satisfy production demand, meanwhile, single PCS fitting designs soft zone complex figure, wicket production
Plate, single PCS fitting need to waste a large amount of manpowers and go to make, and producing efficiency is low, and aligning accuracy is influenced to align by personnel's operation
It is bad, in addition, list PCS makes, since the smaller cleaning of unit is inconvenient when cleaning after covering film production, it be easy to cause cleaning not thorough
Quality risk is brought at bottom in turn, therefore we make improvement to this, proposes a kind of high-accuracy or very small region cover film fitting side
Method.
Summary of the invention
To solve the defect that producing efficiency of the existing technology is low, alignment precision is poor and production is poor quality, the present invention
A kind of high-accuracy or very small region cover film applying method is provided.
In order to solve the above-mentioned technical problems, the present invention provides the following technical solutions:
The high-accuracy or very small region cover film applying method of one kind of the invention, including being preset with several positioning spots
Pcb board and cover film successively carry out following steps:
Step 1: the circuitous pattern on pcb board surface is obtained by laser scanning device, and determines the positioning spot on pcb board
The fit area and；
Step 2: processing several registration holes to match with positioning spot by laser processing on cover film, and
Several are carved on cover film and is bonded figure with what fit area on pcb board matched, and the fitting figure divides cover film
It is segmented into actual cell and scrap area, the both ends of the actual cell are connect by connection strap with scrap area；
Step 3: cover film is aligned by the positioning spot in registration holes and pcb board by covering film surface with pcb board,
And cover film is fitted on pcb board in advance by pre- heat plying-up machine；
Step 4: the connection strap at the disconnected actual cell both ends of machine-cut is cut by laser, makes scrap area and actual cell point
From；
Step 5: it is taken or dust collection equipment removes waste material from the surface of pcb board by manually tearing；
Step 6: actual cell is fitted in the fit area surface of pcb board by pressure transmission machine.
Further, the cover film in step 2 is after laser processing, by cleaning roller to cover film and PCB
The one side of plate fitting carries out cleaning treatment.
Further, the pre- heat plying-up machine in step 3 uses YG-06T type hot melt adhesive film heat plying-up machine, step 4
In the laser cutting machine use CO2- M30 type gas laser cutting machine, the pressure transmission machine in step 6 are fast using YT-001 type
Press.
Compared with prior art, the invention has the following beneficial effects: this kind of high-accuracy or very small region cover film fittings
Method obtains the circuitous pattern on pcb board using laser scanning device, is carried out using fitting figure of the laser cutting machine to cover film
Monnolithic case processing, and aligned by positioning spot, aligning accuracy is improved, meanwhile, whole big unit fitting is relatively traditional
Single PCS fitting easily facilitate cover film cleaned, promotes fitting efficiency and man efficiency, when being cut to cover film
Using gas laser cutting machine, which only cuts without hurting copper face cover film, substantially increases product quality and yields.
Detailed description of the invention
Attached drawing is used to provide further understanding of the present invention, and constitutes part of specification, with reality of the invention
It applies example to be used to explain the present invention together, not be construed as limiting the invention.In the accompanying drawings:
Fig. 1 is a kind of high-accuracy or very small region cover film applying method flow chart of the invention；
Fig. 2 is a kind of high-accuracy or very small region cover film applying method pcb board structural schematic diagram of the invention；
Fig. 3 is a kind of high-accuracy or very small region cover film applying method cover film schematic diagram of the invention；
Fig. 4 is a kind of high-accuracy or very small region cover film applying method fitting schematic diagram of the invention.
In figure: 1, pcb board；2, positioning spot；3, fit area；4, cover film；5, actual cell；6, scrap area；7,
Registration holes；8, connection strap.
Specific embodiment
To be easy to understand the technical means, the creative features, the aims and the efficiencies achieved by the present invention, below with reference to
Specific embodiment, the present invention is further explained.
As shown in Figs 1-4, a kind of high-accuracy or very small region cover film applying method, including it is preset with several positioning light
The pcb board 1 and cover film 4 of point, successively carry out following steps:
Step 1: the circuitous pattern on 1 surface of pcb board is obtained by laser scanning device, and determines the positioning light on pcb board 1
Point 2 and fit area 3；
Step 2: processing several registration holes 7 to match with positioning spot by laser processing on cover film 4,
And carve several on cover film 4 and be bonded figure with what fit area 3 on pcb board 1 matched, figure is bonded by cover film 4
It is divided into actual cell 5 and scrap area 6, the both ends of actual cell 5 are connect by connection strap 8 with scrap area 6；
Step 3: by the positioning spot in the registration holes 7 and pcb board 1 on 4 surface of cover film by cover film 4 and pcb board 1
Alignment, and cover film 4 is fitted in advance on pcb board 1 by pre- heat plying-up machine；
Step 4: the connection strap 8 at disconnected 5 both ends of actual cell of machine-cut is cut by laser, makes scrap area 6 and actual cell
5 separation；
Step 5: it is taken or dust collection equipment removes waste material from the surface of pcb board 1 by manually tearing；
Step 6: actual cell 5 is fitted in 3 surface of fit area of pcb board 1 by pressure transmission machine.
Wherein, the cover film 4 in step 2 pastes cover film 4 and pcb board 1 by cleaning roller after laser processing
The one side of conjunction carries out cleaning treatment.
Wherein, the pre- heat plying-up machine in step 3 uses YG-06T type hot melt adhesive film heat plying-up machine, the laser in step 4
Cutting machine uses CO2- M30 type gas laser cutting machine, the pressure transmission machine in step 6 use the fast press of YT-001 type.
It should be noted that the present invention is a kind of high-accuracy or very small region cover film applying method, when specific works, benefit
The prominent figure of the circuit on pcb board 1 is obtained with laser scanning device, is carried out using fitting figure of the laser cutting machine to cover film 4 whole
Body sharp processing, and aligned by positioning spot, aligning accuracy is improved, meanwhile, whole big unit fitting is relatively traditional
Single PCS fitting, which easily facilitates, to be cleaned cover film 4, promotes fitting efficiency and man efficiency, when cutting to cover film 4
Using gas laser cutting machine, which only cuts without hurting copper face cover film 4, substantially increases product quality and non-defective unit
Rate.
The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this
The principle of invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes
Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and its
Equivalent thereof.
Claims (3)
1. a kind of high-accuracy or very small region cover film applying method, including be preset with several positioning spots pcb board (1) and
Cover film (4), which is characterized in that successively carry out following steps:
Step 1: the circuitous pattern on pcb board (1) surface is obtained by laser scanning device, and determines the positioning light on pcb board (1)
Point (2) and fit area (3)；
Step 2: processing several registration holes (7) to match with positioning spot by laser processing on cover film (4),
And several are carved on cover film (4) and is bonded figure, the fitting figure with what fit area (3) on pcb board (1) matched
Cover film (4) is divided into actual cell (5) and scrap area (6), the both ends of the actual cell (5) pass through connection strap (8)
It is connect with scrap area (6)；
Step 3: by the positioning spot in the registration holes (7) and pcb board (1) on cover film (4) surface by cover film (4) and PCB
Plate (1) alignment, and cover film (4) is fitted in advance on pcb board (1) by pre- heat plying-up machine；
Step 4: being cut by laser the connection strap (8) at disconnected actual cell (5) both ends of machine-cut, makes scrap area (6) and practical single
First (5) separation；
Step 5: it is taken or dust collection equipment removes waste material from the surface of pcb board (1) by manually tearing；
Step 6: actual cell (5) is fitted in fit area (3) surface of pcb board (1) by pressure transmission machine.
2. one kind according to claim 1 is high-accuracy or very small region cover film applying method, which is characterized in that step 2
In the cover film (4) after laser processing, cover film (4) is bonded with pcb board (1) by cleaning roller one side into
Row cleaning treatment.
3. one kind according to claim 1 is high-accuracy or very small region cover film applying method, which is characterized in that step 3
In the pre- heat plying-up machine use YG-06T type hot melt adhesive film heat plying-up machine, the laser cutting machine in step 4 uses
CO2- M30 type gas laser cutting machine, the pressure transmission machine in step 6 use the fast press of YT-001 type.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810182678.4A CN108391376B (en) | 2018-03-06 | 2018-03-06 | A kind of high-accuracy or very small region cover film applying method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810182678.4A CN108391376B (en) | 2018-03-06 | 2018-03-06 | A kind of high-accuracy or very small region cover film applying method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108391376A CN108391376A (en) | 2018-08-10 |
| CN108391376B true CN108391376B (en) | 2019-11-29 |
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| CN201810182678.4A Active CN108391376B (en) | 2018-03-06 | 2018-03-06 | A kind of high-accuracy or very small region cover film applying method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112105155B (en) * | 2020-08-20 | 2022-01-11 | 瑞声新能源发展(常州)有限公司科教城分公司 | Chip FPC and manufacturing method thereof |
| CN113473715B (en) * | 2021-06-28 | 2022-06-07 | 江苏先河激光技术有限公司 | Laser cutting and laminating method and device for FPC (flexible printed circuit) board |
| CN114228020B (en) * | 2021-12-14 | 2023-03-03 | 中国科学院大连化学物理研究所 | Automatic ptfe film laminating method and device for batch preparation of water electrolysis composite films |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103384444B (en) * | 2013-07-30 | 2016-04-20 | 博敏电子股份有限公司 | A kind ofly protect rigid-flex combined board of internal layer windowed regions and preparation method thereof |
| CN103997859B (en) * | 2014-06-03 | 2017-02-15 | 深圳市华大电路科技有限公司 | Flexible circuit board capable of being continuously discharged one by one, and preparation method thereof |
| CN204090314U (en) * | 2014-09-30 | 2015-01-07 | 苏州安洁科技股份有限公司 | A kind of electricity collection sheet semi-finished product |
| CN105208801B (en) * | 2015-08-11 | 2018-07-31 | 深圳崇达多层线路板有限公司 | A kind of rigid-flex combined board cover film applying method |
| CN105799289B (en) * | 2016-03-11 | 2018-04-24 | 广州美维电子有限公司 | A kind of method for being posted film and preparation method thereof and film progress pad pasting is posted using this |
| CN205987548U (en) * | 2016-08-29 | 2017-02-22 | 广州兴森快捷电路科技有限公司 | Flexible circuit board unit fixed knot constructs |
| CN106507614B (en) * | 2016-11-18 | 2019-03-19 | 东莞市五株电子科技有限公司 | A kind of production method of Rigid Flex |
| CN106851995A (en) * | 2017-04-10 | 2017-06-13 | 昆山苏杭电路板有限公司 | The high-accuracy multi-joint removable processing method for filling unit printed board |
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| CN108391376A (en) | 2018-08-10 |
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