CN202506978U - Processing equipment for laser wet cutting and detecting of surface mounting technology (SMT) template - Google Patents
Processing equipment for laser wet cutting and detecting of surface mounting technology (SMT) template Download PDFInfo
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- CN202506978U CN202506978U CN 201220023310 CN201220023310U CN202506978U CN 202506978 U CN202506978 U CN 202506978U CN 201220023310 CN201220023310 CN 201220023310 CN 201220023310 U CN201220023310 U CN 201220023310U CN 202506978 U CN202506978 U CN 202506978U
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Abstract
The utility model relates to processing equipment for the laser wet cutting and detecting of a surface mounting technology (SMT) template, which is mainly used for solving the problems of bad processing quality and low processing dimensional accuracy of the SMT template due to a laser dry cutting technology in the prior art. The adopted processing equipment for the laser wet cutting of the SMT template adopts a movable double-drive gantry structure, wherein a Y axis moves back and forth to drive an X axis to move back and forth, a Z axis is fixed on an X-axis movable plate, and moves left and right along with the X-axis movable plate, and a cutting head and nozzles are arranged on a Z-axis movable plate; and through the technical scheme that the nozzles synchronously spray cooling water to a cutting area below the cutting head, the problems are better solved, and the processing equipment can be used in the SMT template laser wet cutting and detecting industrial production.
Description
Technical field
The process equipment that the utility model relates to the wet cutting of a kind of SMT template laser and detects.
Background technology
SMT template laser cutting technique is extensively adopted at present, and after the completion template cutting of using the high-speed cutting of moving beam formula, there is the defective in porous or few hole in template toward contact.What generally adopt now all is manual detection, many for hole number, and omitting often appears in the template that density is big, and human factor becomes the key factor that influences reliability.After cutting is accomplished, re-using the linear CCD checkout equipment template is scanned, carry out image processing and identification contrast then, is a kind of reliable and stable method.If the generation small opening need return cutting equipment again and carry out contraposition, and then perforations adding.If porous then directly scrap again and to produce.This work has also increased manual work and cost greatly for production line when increasing product quality reliability.The file that cutting is simultaneously used will call between cutting equipment and checkout equipment back and forth, and the placement of template positive and negative in the process that detects, direction and contraposition all around all will rely on manually-operated to handle, and be not high on efficient and accuracy.
The utility model proposes the process equipment of the wet cutting of a kind of SMT template laser, and this process equipment can be adapted to the processing of SMT web plate new material fully through verification experimental verification, for widening the field of materials that is applied to the SMT web plate processing basis is provided.
Summary of the invention
The utility model technical problem to be solved is that the SMT template that exists in the prior art causes the problem that crudy is bad and accurate to dimension is not high because of the dried cutting process of laser; The utility model provides a kind of new wet cutting of SMT template laser and the process equipment that detects; This equipment is in SMT template laser cutting process; Simultaneously to an amount of cooling water of cut point area spray; In time cutting zone is carried out cooling processing because of the heat affected area of laser and the instantaneous generation of material, avoid causing the cut point zone to produce thermal deformation because of localized hyperthermia because of cooling in time.
For solving the problems of the technologies described above; The technical scheme that the utility model adopts is following: wet cutting of a kind of SMT template laser and the process equipment that detects, comprise cutting head, nozzle, X to moving beam, Y to moving beam, steel disc stretch tight net mechanism, waste material dust suction parts, CCD linear scan assembly and main control computer; Said process equipment adopts and moves two gantry structures that drive, and the Y axle seesaws and drives the X axle and seesaw, and the Z axle is fixed on the moving plate of X axle, and carries out side-to-side movement with the moving plate of X axle, and cutting head and nozzle are installed in the Z axle and move on the plate; Spray cooling water through this nozzle synchronously to the cut point zone of cutting head below; Waste material dust suction parts be positioned at steel disc stretch tight the net mechanism below; CCD linear scan assembly is positioned at below the waste material dust exhaust apparatus; X is provided with lamp box to moving beam top, and CCD linear scan assembly has glass, the moving of main control computer control cutting head, nozzle, CCD linear scan assembly.
In the technique scheme, described laser cutting machine adopts the coaxial-type nozzle.The coaxial-type nozzle is hollow cylindrical, and there is photoelectric sensor mount pad 3 upper end, photoelectric sensor 1 and photoelectric sensor focusing knob 2 be located at photoelectric sensor mount pad 3 above, below the photoelectric sensor mount pad 3, coaxial water jet device inside is provided with 45
0Speculum 4 is with 45
0On the corresponding cylindrical sidewall of speculum 4, be provided with lighting source 5, be provided with laser generator 6,45 below the lighting source 5
0Be provided with focus lamp 7 below the speculum 4; Focus lamp 7 corresponding cylindrical sidewall are provided with focus lamp focusing differential head 8; Be provided with protective glass 9 below the focus lamp 7; Protective glass 9 following, water jet 12 passed through between nozzle 11 double-deckers in order to have double-deck nozzle 11, and nozzle 11 is connected with high service unit 10 through the water inlet 13 on the sidewall.
The SMT template laser cutting process method that wets comprises following several steps:
A) be fixed on the SMT template on the work stage of laser cutting machine;
B) cutting head of adjustment laser cutting machine is aimed at the cut point zone, and the nozzle through the cutting head next door is to cut point area spray cooling water;
C) the SMT template is carried out cut;
The utility model also can comprise a kind of full-automatic SMT template cutting and detect the cutting and the detection method of integral system, comprises following several steps:
A) CCD linear scan assembly moves to cutting zone in X, Y direction, and to scanning position, the top crossbeam moves to non-cutting area simultaneously;
B) lamp box above crossbeam presses down, and with the upper glass face of following CCD linear scan assembly the steel disc that is cut is clamped, and get into scanning mode and scan detection this moment;
File, position, direction, the positive and negative judgment task of c) cutting, scanning are accomplished by main control computer automatically;
D) move on the lamp box behind the end of scan, the CCD scan components moves down, and the waste material dust exhaust apparatus withdrawed from board cleaning waste residue automatically after cutting was accomplished;
E) the waste material dust exhaust apparatus has been cleared up waste residue and is got back to and return to cut state in the equipment body;
F), the cutting that covers of few sky, main control computer is arranged if detect if detect qualified steel disc.
In the technique scheme; Cutting accomplish back Z sidelong the cutting head that moves on it of sill bolt move to left; Through the handle on the waste material dust suction parts waste material dust suction parts are drawn back, the CCD linear scan assembly that is installed in waste material dust suction parts bottom just can detect the steel disc scanning that cutting is accomplished.On the lamp box cover plate, having per 3 is one group LED lamp band; The size of LED lamp is merely 3X3; Back lighting, steel disc is provided when being scanned; Evenly reduce the noise that exists on the image of scanning acquisition for the spot light one by one that makes LED provide becomes, on optical flat, adhere to one deck boss's film as thin as a wafer.Can obtain so clear, noise few the scanning picture.Steel disc cutting accomplish back X sidelong the moving cutting head on it of sill bolt move to non-cut state position by the position of cut state, pull off waste material dust suction parts, CCD linear scan parts are up to and the applying of steel disc lower surface, lamp box is descending up to compressing steel disc to be scanned.
The utility model discloses the wet cutting process method of a kind of SMT template laser, and this mode adopts laser to wet and cuts processing technology, in SMT web plate laser cutting process; Spray cooling water to cutting zone synchronously; In time cutting zone is carried out cooling processing, reduce the heat effect time in the process, dwindle the processing heat affected area; And then obviously reduce the existence of otch oxidized residual thing; Reduce the back side and hang slag, significantly improve otch crudy and machining accuracy, for the SMT web plate of producing more high-quality requirement provides possibility.In addition, this processing technology can be adapted to the processing of SMT web plate new material fully through verification experimental verification, for widening the field of materials that is applied to the SMT web plate processing basis is provided.
The disclosed SMT template of the utility model laser cutting process method that wets, this process is compared with the dried cutting technique of laser of traditional SMT template, has following advantage:
1) can significantly improve SMT template kerf quality, show as that wide littler, the surface of seam is cleaner, the residual characteristics such as littler of otch;
2) because the local deformation influence is ignored basically, adopt this method can adopt higher process velocity to cut, improve working (machining) efficiency;
Can not only be applicable to existing stainless SMT template processing, can also carry out Laser Processing, remedy the dried cutting process of transmission laser and be difficult to adapt to the deficiency that the SMT brand-new material is processed to being applied to SMT brand-new material (like nickel alloy, nickel sheet etc.).
The disclosed SMT template of the utility model laser cutting process method that wets; Solving in the past, the SMT template causes the problem that crudy is bad and accurate to dimension is not high because of the dried cutting process of laser; In addition, for being applied to the processing of SMT template new material more suitable laser processing technology is provided.Through processing checking, adopt the wet cutting process method of this laser can significantly improve SMT template kerf quality, show as seam wide littler, the surface is cleaner, the residual characteristics such as littler of otch, enhances productivity, saves production cost, has obtained better technical effect.
Description of drawings
Fig. 1 is the wet cutting process method sketch map of SMT template laser.
Fig. 2 is a coaxial-type nozzle arrangements sketch map.
Among Fig. 1, the SMT template; 2, water spout; 3, laser cutting head; 4, Z axle; 5, X axle; 6, Y axle; 7, work stage.
Among Fig. 2,1 is photoelectric sensor; 2 is the photoelectric sensor focusing knob, and 3 is that photoelectric sensor mount pad 3,4 is 45
0Speculum, 5 is lighting source, and 6 is laser generator, and 7 is focus lamp, and 8 are focus lamp focusing differential head, and 9 is protective glass, and 10 is the high service unit, and 11 is nozzle, and 12 is water jet, and 13 is water inlet, and 14 is SMT plate to be processed, 15 is workbench.
The illumination light and optical fiber laser 6 emitted laser of lighting source 5 emissions incide 45 simultaneously
0Speculum 4,45
04 pairs of laser of speculum are all-trans; And contrast Mingguang City 45 degree are anti-reflection; Light beam impinges perpendicularly on the focus lamp 7; Can adjust the Energy distribution of processing plane focal beam spot through the distance between control focus lamp 7 and the processing platform 15, see through the laser after focus lamp 7 focusing, through getting to SMT plate 14 surfaces on the processing platform 15 behind the protective glass 9.Introduce High-Pressure Waters from water under high pressure feed unit 10, in process workpiece is dipped in the water jet that high-pressure water jet 12 forms.
Through specific embodiment the utility model is done further to set forth below, but be not limited only to present embodiment.
Specific embodiment
[embodiment 1]
Wet cutting of a kind of SMT template laser and the process equipment that detects, as shown in Figure 1, comprise cutting head, nozzle, X to moving beam, Y to moving beam, steel disc stretch tight net mechanism, waste material dust suction parts, CCD linear scan assembly and main control computer; Said process equipment adopts and moves two gantry structures that drive, and the Y axle seesaws and drives the X axle and seesaw, and the Z axle is fixed on the moving plate of X axle, and carries out side-to-side movement with the moving plate of X axle, and cutting head and nozzle are installed in the Z axle and move on the plate; Spray cooling water through this nozzle synchronously to the cut point zone of cutting head below; Waste material dust suction parts be positioned at steel disc stretch tight the net mechanism below; CCD linear scan assembly is positioned at below the waste material dust exhaust apparatus; X is provided with lamp box to moving beam top, and CCD linear scan assembly has glass, the moving of main control computer control cutting head, nozzle, CCD linear scan assembly.
The SMT template laser cutting process method that wets comprises following several steps: a) be fixed on the SMT template on the work stage of laser cutting machine; B) cutting head of adjustment laser cutting machine is aimed at the cut point zone, and the nozzle through the cutting head next door is to cut point area spray cooling water; C) the SMT template is carried out cut.
[embodiment 2]
A kind of SMT template laser cutting process method that wets comprises following several steps:
A) be fixed on the SMT template on the work stage of laser cutting machine;
B) cutting head of adjustment laser cutting machine is aimed at the cut point zone, and the nozzle through the cutting head next door is to cut point area spray cooling water;
C) the SMT template is carried out cut;
Used laser cutting machine adopts and moves two gantry structures that drive; The Y axle seesaws and drives the X axle and seesaw, and the Z axle is fixed on the moving plate of X axle, and carries out side-to-side movement with the moving plate of X axle; On the moving plate of Z axle cutting head is installed, and is fixed with nozzle on the cutting head next door; Spray cooling water through this nozzle synchronously to the cut point zone of cutting head below.
[embodiment 3]
The cutting and the detection method of a kind of full-automatic SMT template cutting and detection integral system comprise following several steps:
A) CCD linear scan assembly moves to cutting zone in X, Y direction, and to scanning position, the top crossbeam moves to non-cutting area simultaneously;
B) lamp box above crossbeam presses down, and with the upper glass face of following CCD linear scan assembly the steel disc that is cut is clamped, and get into scanning mode and scan detection this moment;
File, position, direction, the positive and negative judgment task of c) cutting, scanning are accomplished by main control computer automatically;
D) move on the lamp box behind the end of scan, the CCD scan components moves down, and the waste material dust exhaust apparatus withdrawed from board cleaning waste residue automatically after cutting was accomplished;
E) the waste material dust exhaust apparatus has been cleared up waste residue and is got back to and return to cut state in the equipment body;
F), the cutting that covers of few sky, main control computer is arranged if detect if detect qualified steel disc;
Used laser cutting device adopts to move and twoly drives gantry structure, comprise cutting head, nozzle, X to moving beam, Y to moving beam, steel disc stretch tight net mechanism, waste material dust suction parts, CCD linear scan assembly and main control computer; Said process equipment adopts and moves two gantry structures that drive, and the Y axle seesaws and drives the X axle and seesaw, and the Z axle is fixed on the moving plate of X axle, and carries out side-to-side movement with the moving plate of X axle, and cutting head and nozzle are installed in the Z axle and move on the plate; Spray cooling water through this nozzle synchronously to the cut point zone of cutting head below; Waste material dust suction parts be positioned at steel disc stretch tight the net mechanism below; CCD linear scan assembly is positioned at below the waste material dust exhaust apparatus; X is provided with lamp box to moving beam top, and CCD linear scan assembly has glass, the moving of main control computer control cutting head, nozzle, CCD linear scan assembly.
[embodiment 4]
The cutting and the detection method of a kind of full-automatic SMT template cutting and detection integral system; This device systems adopts moving beam formula structure; Is waste material dust suction parts at the steel disc net that stretches tight below the mechanism, accomplishes back waste material dust exhaust apparatus in cutting and withdraws from board automatically and clear up waste residue.CCD linear scan assembly below the waste material dust exhaust apparatus can move to cutting zone in X, Y direction simultaneously; And the scanning position of appearing on the stage; The top crossbeam moves to non-cutting area simultaneously; Lamp box above crossbeam presses down, and with the upper glass face of following CCD linear scan assembly the steel disc that is cut is clamped, and this thing gets into scanning mode and scans detection.Cutting and scanning are accomplished by a main control computer simultaneously, and work such as the file of cutting, scanning, position, direction, positive and negative judgement main control computer are thus accomplished automatically.Move on the lamp box behind the end of scan, scan components moves down, and the waste material dust exhaust apparatus has been cleared up waste residue and got back to and return to cut state in the equipment body.If detect qualified then this steel disc can unload, if detect the cutting that can cover immediately of few sky, main control computer is arranged, do not need contraposition again.
Used laser cutting machine adopts and moves two gantry structures that drive, and the Y axle seesaws and drives the X axle and seesaw, and the Z axle is fixed on the moving plate of X axle, and carries out side-to-side movement with the moving plate of X axle, on the moving plate of Z axle cutting head and nozzle is installed; Spray cooling water through this nozzle synchronously to the cut point zone of cutting head below.
The coaxial-type nozzle, as shown in Figure 2, the coaxial-type nozzle is hollow cylindrical; There is photoelectric sensor mount pad 3 upper end; Photoelectric sensor 1 and photoelectric sensor focusing knob 2 be located at photoelectric sensor mount pad 3 above, below the photoelectric sensor mount pad 3, coaxial water jet device inside is provided with 45
0Speculum 4 is with 45
0On the corresponding cylindrical sidewall of speculum 4, be provided with lighting source 5, be provided with laser generator 6,45 below the lighting source 5
0Be provided with focus lamp 7 below the speculum 4; Focus lamp 7 corresponding cylindrical sidewall are provided with focus lamp focusing differential head 8; Be provided with protective glass 9 below the focus lamp 7; Protective glass 9 following, water jet 12 passed through between nozzle 11 double-deckers in order to have double-deck nozzle 11, and nozzle 11 is connected with high service unit 10 through the water inlet 13 on the sidewall.
Claims (6)
1. wet cutting of a SMT template laser and the process equipment that detects, comprise cutting head, nozzle, X to moving beam, Y to moving beam, steel disc stretch tight net mechanism, waste material dust suction parts, CCD linear scan assembly and main control computer; Said process equipment adopts and moves two gantry structures that drive, and the Y axle seesaws and drives the X axle and seesaw, and the Z axle is fixed on the moving plate of X axle, and carries out side-to-side movement with the moving plate of X axle, and cutting head and nozzle are installed in the Z axle and move on the plate; Spray cooling water through this nozzle synchronously to the cut point zone of cutting head below; Waste material dust suction parts be positioned at steel disc stretch tight the net mechanism below; CCD linear scan assembly is positioned at below the waste material dust exhaust apparatus; X is provided with lamp box to moving beam top, and CCD linear scan assembly has glass, the moving of main control computer control cutting head, nozzle, CCD linear scan assembly.
2. wet cutting of SMT template laser according to claim 1 and the process equipment that detects is characterized in that described laser cutting machine adopts the coaxial-type nozzle.
3. wet cutting of SMT template laser according to claim 2 and the process equipment that detects; It is characterized in that the coaxial-type nozzle is hollow cylindrical; There is photoelectric sensor mount pad (3) upper end; Photoelectric sensor (1) and photoelectric sensor focusing knob (2) be located at photoelectric sensor mount pad (3) above, below the photoelectric sensor mount pad (3), coaxial water jet device inside is provided with 45
0Speculum (4) is with 45
0On the corresponding cylindrical sidewall of speculum (4), be provided with lighting source (5), be provided with laser generator (6), 45 below the lighting source (5)
0Be provided with focus lamp (7) below the speculum (4); The cylindrical sidewall that focus lamp (7) is corresponding is provided with focus lamp focusing differential head (8); Be provided with protective glass (9) below the focus lamp (7); Protective glass (9) following, water jet (12) passed through between nozzle (11) double-decker in order to have double-deck nozzle (11), and nozzle (11) is connected with high service unit (10) through the water inlet (13) on the sidewall.
4. wet cutting of SMT template laser according to claim 3 and the process equipment that detects; It is characterized in that coaxial water jet device also comprises workbench (15); Place SMT template to be processed (14) above, SMT template to be processed (14) is positioned at nozzle (11) below.
5. wet cutting of SMT template laser according to claim 3 and the process equipment that detects is characterized in that laser generator (6) is the optical-fiber laser generator; Nozzle (11) is annular, and water jet (12) is column; Focus lamp focusing differential head (8) is used for level or vertical adjusting focus lamp (7).
6. wet cutting of SMT template laser according to claim 1 and the process equipment that detects is characterized in that, on the lamp box cover plate, adhering to per 3 is one group LED lamp band, adheres to the thin boss's film of one deck on the optical flat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220023310 CN202506978U (en) | 2012-01-19 | 2012-01-19 | Processing equipment for laser wet cutting and detecting of surface mounting technology (SMT) template |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220023310 CN202506978U (en) | 2012-01-19 | 2012-01-19 | Processing equipment for laser wet cutting and detecting of surface mounting technology (SMT) template |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202506978U true CN202506978U (en) | 2012-10-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220023310 Withdrawn - After Issue CN202506978U (en) | 2012-01-19 | 2012-01-19 | Processing equipment for laser wet cutting and detecting of surface mounting technology (SMT) template |
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|---|---|
| CN (1) | CN202506978U (en) |
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| CN103212841A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | Processing equipment for laser wet cutting and detecting of SMT (Surface Mounting Technology) template |
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| CN113714659A (en) * | 2021-08-31 | 2021-11-30 | 东莞光韵达光电科技有限公司 | Femtosecond laser cutting device for SMT template |
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- 2012-01-19 CN CN 201220023310 patent/CN202506978U/en not_active Withdrawn - After Issue
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| CN104048625A (en) * | 2013-03-12 | 2014-09-17 | 昆山允可精密工业技术有限公司 | Automatic contact instrument used for measuring thin sheet material dimensions |
| CN104096976A (en) * | 2013-04-10 | 2014-10-15 | 昆山思拓机器有限公司 | Laser cutting device for manufacturing step template |
| CN104096966A (en) * | 2013-04-10 | 2014-10-15 | 昆山思拓机器有限公司 | Method for manufacturing step template |
| CN103231619A (en) * | 2013-04-19 | 2013-08-07 | 王敬达 | Preparation equipment for large-size fine embossed metal plate |
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| CN106695130B (en) * | 2015-07-21 | 2019-11-01 | 上海咔咻智能科技有限公司 | High-rate laser galvanometer cutting machine and high-rate laser galvanometer cutting method |
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| CN108637490A (en) * | 2018-04-10 | 2018-10-12 | 上海柏楚电子科技股份有限公司 | A kind of double methods for driving laser cutting machine load inertia and moment of friction of automatic measurement |
| CN108772909A (en) * | 2018-05-22 | 2018-11-09 | 徐州工程学院 | A kind of dedicated treatment facility for mine water bed mud |
| CN109202300A (en) * | 2018-09-26 | 2019-01-15 | 北京允升吉电子有限公司 | A kind of SMT template construct method |
| CN110961797A (en) * | 2019-11-20 | 2020-04-07 | 无锡市赛尔特焊割设备有限公司 | Robot cutting control system based on automation |
| CN110961797B (en) * | 2019-11-20 | 2021-07-30 | 无锡市赛尔特焊割设备有限公司 | Robot cutting control system based on automation |
| CN110682013A (en) * | 2019-11-22 | 2020-01-14 | 宁波瑞利时数控科技有限公司 | Anti-collision safety device of cutting machine |
| CN110682013B (en) * | 2019-11-22 | 2021-07-02 | 宁波瑞利时数控科技有限公司 | Anti-collision safety device of cutting machine |
| CN112092096A (en) * | 2020-09-07 | 2020-12-18 | 台州星星光电科技有限公司 | Cutting method for covering protective film on surface of glass panel |
| CN112092096B (en) * | 2020-09-07 | 2022-04-12 | 台州星星光电科技有限公司 | Cutting method for covering protective film on surface of glass panel |
| CN113714659A (en) * | 2021-08-31 | 2021-11-30 | 东莞光韵达光电科技有限公司 | Femtosecond laser cutting device for SMT template |
| CN113714659B (en) * | 2021-08-31 | 2023-10-24 | 东莞光韵达光电科技有限公司 | Femtosecond laser cutting device for SMT template |
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