TWM449429U - Material receiving device of flexible printed circuit board substrate - Google Patents

Description

Soft printed circuit board substrate receiving device

The present invention relates to a material receiving device for a flexible printed circuit board substrate, and more particularly to a materializing device for applying the flat end of a two-roll flexible printed circuit board substrate.

In order to enable a plurality of roll-shaped flexible printed circuit board substrates of the same width to be successively processed, it is necessary to dock one end of the substrate with the head end of the other substrate, so that the plurality of rolled substrates can be continuously performed. Follow-up process steps. In the docking operation of the substrate, the tape is mainly adhered to the upper and lower surfaces of the mating portion of the two substrates by manual manual means.

However, due to the manual manual method of adhering the tape to the butt joint portion of the two substrates, the operator is slightly careless, and is liable to cause adverse effects such as substrate crushing, folding, substrate docking offset, tape wrinkles or substrate wrinkles. In particular, in the case of a substrate having a large width (for example, 500 mm, etc.), the substrate has a higher frequency of docking failure, and the poor bonding of the substrate is more disadvantageous for the subsequent processing steps of the substrate.

The main purpose of this creation is to provide a flexible printed circuit board substrate receiving device, and to create a solution to the existing manual butt-feeding method, which is easy to cause product crush, breakage, butt offset, tape wrinkles, and panel wrinkles. Waiting for bad things.

In order to achieve the pre-existing purpose, the flexible printing circuit board substrate feeding device proposed by the present invention comprises: a receiving platform comprising a platform body and a cutting carrier plate, wherein the upper surface of the platform body is a horizontal receiving working surface for providing a substrate to be docked thereon, and the platform body is working on the receiving body The surface defines a receiving direction and a cutting direction perpendicular to the receiving direction. The platform body has a mounting groove in the middle, and the cutting carrier is detachably assembled in the mounting groove, and the cutting carrier is cut. a cutting groove extending in a straight line along the cutting direction; the two substrate holders are mounted on the platform body and disposed on both sides of the mounting groove along the receiving direction, and the substrate holders each include a pressing rod and a lifting and lowering driving group for driving the pressing rod, the pressing rod is located on the receiving working surface for pressing against the substrate to be fixed on the platform body; a glueing station comprising a frame portion and a shape formed thereon a long groove extending through the frame portion for arranging a tape passing through the bottom surface of the long groove, the splicing station being detachably mounted on the receiving platform so that the tape corresponds to the cutting carrier plate; The lower rubber table can be driven to lift and set on the receiving level. Directly below the cutting carrier, the top of the lowering table has a flat bearing surface for providing a tape passing through the bearing surface; a flattening tool is inserted into the long groove of the loading station for Smoothing the tape on the substrate; and a lifting drive assembly, disposed below the receiving platform, comprising a carrier and at least one lifting drive, the mounting slot of the carrier relative to the receiving platform, and the lifting drive The lifting and lowering end is connected to the bearing seat, and the carrying seat provides a detachable assembly of the lower rubbering station, and the lifting and lowering drive can drive the bearing seat and the lower rubberizing table thereon to be displaced up and down.

By applying the creation of the front pick-up device, it is applied to the same width and width. The docking operation of the flexible printed circuit board substrate can achieve the following effects:

1. The original feeding device can make the butt joints of the substrate be flush and flush, and the upper and lower tapes can be flatly attached to the mating parts of the substrate, the tape will not be wrinkled, or the skew will be uneven, or the substrate will be crushed or broken. The situation.

2. The creative feeding device uses the upper and lower rubber tables to flatten the tape on the substrate, and flattens the tape with the leveling tool to adhere to the substrate, so that the non-contact adhesive tape can be used to avoid the operation. The situation in which personnel contaminate the substrate during the work.

3. The creative material pick-up device can be used for the docking operation of the flexible printed circuit board substrate in a standardized process, which not only facilitates the docking between the rolled substrates, but also avoids the unskilled operation of the substrate and the poor quality of the substrate. The situation.

As shown in FIG. 1 , the picking device for revealing the flexible printed circuit board substrate comprises a receiving platform 1, two substrate holders 2, a glue station 3, a plastic table 4, and a leveling tool. 5 and a lifting drive assembly 6, wherein:

The receiving platform 1 includes a platform body 10 and a cutting carrier 11 . The upper surface of the platform body 10 is a horizontal receiving working surface. The platform body 10 defines a receiving direction 1A and a in the receiving working surface. The cutting direction 1B, the cutting direction is perpendicular to the receiving direction, the platform body 10 has a mounting groove 12 in the middle, and the cutting carrier 11 is detachably assembled in the mounting groove 12, and the carrier plate 11 is cut. There is a cutting groove 111 extending linearly in the cutting direction, and the cutting groove 111 provides a cutter into which a linear movement is performed in the cutting direction.

In the preferred embodiment, a rectangular mounting groove 12 extending in the cutting direction is formed in the middle of the platform body 10, so that the platform body 10 is divided into two blocks, and the mounting groove 12 is located between the two plates. A sliding groove 13 is formed on each side of the 10th plate facing the mounting groove 12. The cutting carrier 11 corresponds to the mounting groove 12, and a sliding convex portion 112 is formed on each side of the cutting carrier 11 for cutting. The carrier 11 is assembled in the mounting groove 12 of the platform body 10 in a laterally sliding manner by means of the sliding projection 112 linearly moving along the sliding slot 13 and from the mounting groove 12 of the platform body 10. In the same way, the sliding convex portion and the sliding groove can also be interchanged with each other, and the same sliding and disassembling function can be achieved.

The two substrate holders 2 are mounted on the platform body 10 and disposed on both sides of the mounting groove 12 along the receiving direction 1A. The substrate holders 2 each include a pressing rod 20 and a lifting drive group. 21, the pressing rod 20 is movably disposed on the upper surface of the platform body 10, and the lifting driving group 21 can be a pneumatic cylinder or other driving mechanism capable of driving the vertical movement. In the preferred embodiment, the lifting and lowering is disclosed. The driving group 21 includes two pneumatic cylinders, and the two pneumatic cylinders are disposed at intervals of a cylinder block of the platform body 10 away from one side bottom surface of the mounting groove 12. The cylinder core of the pneumatic cylinder passes through the plate and is respectively connected to the pressing rod 20 The distance between the cylinders of the two pneumatic cylinders is sufficient to provide a soft printed circuit board substrate to be docked, so that the two pneumatic cylinders can be controlled to simultaneously move the pressure rod 20 to lower the soft printed circuit board substrate. The press-fitting is fixed to the platform body 10.

As shown in FIG. 1 and FIG. 2, the rubberizing station 3 includes a frame portion 30 and a rectangular long groove 31 formed in the frame portion 30 so as to penetrate vertically. The width of the long groove 31 is larger than the tape for receiving. Width, long slot 31 length In the preferred embodiment, the frame portion 30 is provided with an upper tape fixing guide post 32 at both ends of the frame portion 30 in the cutting direction, and the glue station is provided. The 3 series detachable group is mounted on the receiving platform 1 in alignment.

In the preferred embodiment, as shown in FIG. 1 and FIG. 2, the rubberizing table 3 is provided with a plurality of alignment convex portions 33 on the bottom surfaces of the two ends of the frame portion 30, and the second plate 10 of the receiving platform 1 The upper surface is adjacent to the cutting carrier 11 and is provided with an alignment recess 14 corresponding to the alignment convex portion 33. By the corresponding matching of the alignment convex portion 33 and the alignment concave portion 14, the glue table 3 can be aligned with the positioning group. It is on the receiving platform 1 and can be removed from the receiving platform 1.

As shown in FIG. 1 and FIG. 3, the rubberizing table 4 can be driven to be vertically disposed below the cutting carrier 11 of the receiving platform 1, and the width of the lowering station 4 is smaller than the mounting groove of the receiving platform 1. Width, the top of the rubberizing table 4 has a flat bearing surface, and the lower rubber table 4 is provided with a tape fixing guide column 40 at both ends of the cutting direction.

The leveling tool 5 is used to extend into the long groove 31 of the rubberizing table 3 to flatten the tape. In the preferred embodiment, the leveling tool 5 includes a handle 50 and a pivoting device. A rolling wheel 51 at the bottom of the handle 50.

The lifting and lowering drive unit 6 is disposed under the receiving platform 1 and is connected to the lower rubber table 4 for driving the lower rubber table 4 to be displaced up and down. The lifting and lowering drive assembly 6 includes a carrier 60 and one or more The lifting drive 61 can be a pneumatic cylinder or other mechanism sufficient to drive the lifting and lowering movement of the lower rubber table. In the preferred embodiment, the lifting and lowering drive assembly 6 includes a two-pneumatic cylinder type lifting drive 61 and a carrier 60, the two lifting actuators 61 are arranged at intervals along the cutting direction, the two air pressures The cylinder-type lifting drive 61 has a cylinder core facing up and is commonly connected to the bottom of the carrier 60. The top of the carrier 60 forms a plurality of recesses 601, and the assembly recess 601 provides a bottom portion of the lowering station 4 to be fixed therein.

When the feeding device of the flexible printed circuit board substrate is used, as shown in FIG. 4, the two flexible printed circuit board substrates 8 to be butted are respectively pressed by the receiving direction 1A of the receiving platform 1 respectively. The rod 20 is extended and placed flat, and the pressing rod 20 is lowered by the substrate holder 2 to fix the two substrates 8 to the receiving platform 1 respectively, wherein the substrate can be aligned by the infrared laser marker guiding means The edge of the 8 is ensured that the two sides of the substrate 8 are butt-aligned without deviation, and after the pressing rod 20 is pressed against the substrate 8, the cutting blade 9 is used to cut along the linear cutting groove 111 on the cutting carrier 11 of the receiving platform 1. The excess portion of the substrate 8 is abutted, ensuring that the butt edges of the substrate 8 are neat and smooth.

Next, as shown in FIG. 5, the aligning table 3 of the pre-assembled tape 7 is disposed on the receiving platform 1, wherein the adhesive tape 7 disposed on the sizing station 3 is facing downward, and the tape 7 is The end is adhered to the tape fixing guide post 32 on both ends of the gluing table 3, and after the gluing table 3 is assembled on the receiving platform 1, the tape 7 in the gluing table 3 is pressed on the rubber surface by the rubber surface. The upper surface of the butt edge of the substrate 8 is as shown in FIG. 6, and then the flattening tool 5 is extended into the long groove 31 of the topping table 3, and the adhesive tape 7 adhered to the upper surface of the substrate 8 is adhered to the upper surface of the substrate 8. The flattening tool 5 is smeared and pressed, and as shown in Fig. 7, the cutter 9 is used to cut off the excess portion of the tape 7 in the gumming station 3 which protrudes beyond the substrate 8.

Then, as shown in FIG. 8 and FIG. 9, the cutting carrier 11 is taken out from the receiving platform 1, and the lifting drive 61 is pushed to push the carrier 60 and the lowering table 4 thereon to rise, so that the lowering station 4 is Tape 7 is flattened with its rubber surface Attached to the lower surface of the mating edge of the two substrates 8, as shown in FIG. 10, the flattening tool 5 is extended into the long groove 31 of the topping table 3, and the glued table 3 is adhered to the lower surface of the substrate 8. The tape 7 is smoothed and pressed, and the leveling tool 5 is taken out, as shown in FIG. 11, and then the cutter 7 is used to cut off the excess portion of the tape 7 in the lower rubber table 4 from the outside of the substrate 8, as shown in the figure. As shown in FIG. 12, the lifting and lowering drive 61 pushes the carrier 60 and the lowering table 4 thereon to lower, the loading station 3 is taken out, and the pressing rods 20 on both sides of the receiving platform 1 are raised, so that the butted substrate 8 can be Smooth movement on the receiving platform 1.

1‧‧‧ receiving platform

10‧‧‧ Platform Ontology

11‧‧‧ Cutting carrier board

111‧‧‧Cut trench

112‧‧‧Sliding convex

12‧‧‧Assemble

13‧‧‧Chute

14‧‧‧ alignment recess

1A‧‧‧ Receiving direction

1B‧‧‧ cutting direction

2‧‧‧Substrate holder

20‧‧‧Press

21‧‧‧ Lifting drive group

3‧‧‧Glue table

30‧‧‧ Frame Department

31‧‧‧Long slot

32‧‧‧Upper tape fixing guide post

33‧‧‧ alignment convex

4‧‧‧Under the rubber table

40‧‧‧Under the tape fixing guide post

5‧‧‧ leveling tools

50‧‧‧ handle

51‧‧‧Rolling wheel

6‧‧‧ Lifting drive assembly

60‧‧‧ bearing seat

601‧‧‧Group recess

61‧‧‧ Lifting drive

7‧‧‧ Tape

8‧‧‧Substrate

9‧‧‧Cutter

1 is a perspective exploded view of a preferred embodiment of the present invention.

2 is a perspective view showing the preferred embodiment of the receiving device shown in FIG. 1 in which the bottom surface of the top plate is adhesively taped upward.

Figure 3 is a perspective view of the adhesive tape of the lower stage of the preferred embodiment of the receiving device of Figure 1.

Fig. 4 is a reference diagram of the implementation state in which the two substrates are placed on the receiving platform, and the cutter is cut and the pressure bar is fixed.

FIG. 5 is a reference diagram of an implementation state in which a glue station having a tape is mounted on a receiving platform to adhere a tape on a bottom surface of the glue table to a joint edge of the two substrates.

Fig. 6 is a reference diagram of an implementation state in which a flattening tool is used to extend the flattening tape in the gumming station.

Fig. 7 is a reference view showing an implementation state in which the ends of the tape in the gumming table are extended by the cutter to extend the excess portion outside the substrate.

Figure 8 is a reference diagram of the implementation state of extracting the cutting carrier from the receiving platform .

Figure 9 is a side plan view of the cutting carrier in which the cutting carrier has been withdrawn.

Fig. 10 is a view showing an implementation state in which a flattening tool is inserted into a gluing table to smooth the adhesive tape adhered to the lower surface of the substrate in the gluing table.

Fig. 11 is a view showing an implementation state in which an excess portion of the tape in the lower stage is extended beyond the substrate by using a cutter.

Figure 12 is the implementation of the lifting drive pushing the carrier and the lower rubberizing platform, removing the rubberizing station, and raising the pressing rods on both sides of the receiving platform, so that the docked substrate can be smoothly moved on the receiving platform. Status reference map.

1‧‧‧ receiving platform

10‧‧‧ Platform Ontology

11‧‧‧ Cutting carrier board

111‧‧‧Cut trench

112‧‧‧Sliding convex

12‧‧‧Assemble

13‧‧‧Chute

14‧‧‧ alignment recess

1A‧‧‧ Receiving direction

1B‧‧‧ cutting direction

2‧‧‧Substrate holder

20‧‧‧Press

21‧‧‧ Lifting drive group

3‧‧‧Glue table

30‧‧‧ Frame Department

31‧‧‧Long slot

32‧‧‧Upper tape fixing guide post

33‧‧‧ alignment convex

4‧‧‧Under the rubber table

40‧‧‧Under the tape fixing guide post

5‧‧‧ leveling tools

50‧‧‧ handle

51‧‧‧Rolling wheel

6‧‧‧ Lifting drive assembly

60‧‧‧ bearing seat

601‧‧‧Group recess

61‧‧‧ Lifting drive

7‧‧‧ Tape

Claims (8)

A receiving device for a flexible printed circuit board substrate comprises: a receiving platform comprising a platform body and a cutting carrier plate, wherein the upper surface of the platform body is a horizontal receiving working surface for providing The docking substrate is placed flat thereon, and the platform body defines a receiving direction and a cutting direction perpendicular to the receiving direction in the receiving working surface, the platform body has a mounting groove in the middle, and the cutting carrier plate is detachable The set is mounted in the mounting groove, and the cutting carrier plate has a cutting groove extending linearly along the cutting direction; the two substrate holders are mounted on the platform body and arranged along the receiving direction The substrate holders respectively comprise a pressing rod and a lifting and lowering driving group for driving the lifting rod, and the pressing rod is located on the receiving working surface for pressing against the substrate to be fixed on the platform body; a rubberizing station comprising a frame portion and a long groove formed in the frame portion and extending through the frame portion for arranging a tape passing through the bottom surface of the long groove, the glue plate is detachably assembled and aligned On the material platform, the tape is corresponding to the cutting carrier The lower rubber table can be driven to be lifted and disposed directly under the cutting carrier plate of the receiving platform, and the top of the rubberizing table has a flat bearing surface for setting a tape passing through the bearing surface; a flattening tool a first slot extending into the long stage of the glue station for smearing the tape on the substrate; and a lifting drive assembly disposed below the receiving platform, comprising a carrier and at least one lifting drive The lifting seat is connected to the mounting groove of the receiving platform, and the lifting drive is connected to the carrying seat by the lifting and lowering driving end. The carrying seat provides a detachable assembly of the lower rubber table, and the lifting drive can drive the bearing seat And the lowering table on the upper and lower displacements. The receiving device of the flexible printed circuit board substrate of claim 1, wherein the platform body forms a rectangular mounting groove extending in the cutting direction, the platform body is divided into two plates, and the two plates are oriented toward the mounting groove. Forming a sliding slot on each side of the cutting plate, the cutting carrier plate corresponding to the mounting groove, and forming a sliding convex portion on each side of the cutting carrier plate, so that the cutting carrier plate slides along the convex portion along the sliding groove Linear motion can be disassembled from the platform body. The material receiving device of the flexible printed circuit board substrate of claim 2, wherein the rubberizing station is provided with a plurality of alignment convex portions on the bottom surfaces of the two ends of the frame portion, and the upper surface of the two plates of the receiving platform An alignment concave portion corresponding to the alignment convex portion is disposed adjacent to the cutting carrier plate, and the alignment convex portion and the alignment concave portion are correspondingly matched, so that the detachable group of the rubberizing station is disposed on the receiving platform . The pick-up device for a flexible printed circuit board substrate according to claim 3, wherein the lift drive group of the substrate holder comprises a two-pneumatic cylinder, and the two pneumatic cylinders are disposed at a platform interval of the platform body. The plate is away from the side bottom surface of one of the fitting grooves, and the cylinder core of the pneumatic cylinder passes through the plate and is respectively connected to both ends of the pressure bar. The picking device for a flexible printed circuit board substrate according to any one of claims 1 to 4, wherein the glue applicator is provided with an upper tape fixing guide post at both ends of the cutting direction, and the lower rubber table is cut along The ends of the tangential direction are each provided with a tape to fix the guide post. The picking device for a flexible printed circuit board substrate according to any one of claims 1 to 4, wherein the leveling tool comprises a handle and a rolling wheel pivoted at a bottom of the handle, The rolling wheel can extend into the long groove of the glue station. The pick-up device for a flexible printed circuit board substrate according to any one of claims 1 to 4, wherein the lift drive assembly has a two-pneumatic cylinder type lift drive, the cylinder of the two pneumatic cylinders facing upwards The bottom of the carrier is connected in common, and the top of the carrier forms a set of recesses, and the bottom of the carrier provides the bottom of the lower stage to be fixed therein. The picking device for a flexible printed circuit board substrate according to any one of claims 1 to 4, wherein the glue applicator is provided with an upper tape fixing guide post at both ends of the cutting direction, and the lower rubber table is cut along Each of the two ends of the tangential direction is provided with a tape fixing guide post; the leveling tool comprises a handle and a rolling wheel pivoted on the bottom of the handle, the rolling wheel can extend into the long groove of the glue table The lifting drive assembly has a two-pneumatic cylinder type lifting drive, the cylinders of the two pneumatic cylinders face upward and are commonly connected to the bottom of the carrier, and the top of the carrier forms a set of recesses provided by the assembly recesses The bottom of the gumming station is fixed.