CN107128532B - A fully automatic equipment for gold finger placement, wrapping, high temperature glue and labeling - Google Patents

Abstract

The invention discloses a fully automatic equipment for gold finger mounting, wrapping, high-temperature glue and labeling, including an equipment mounting frame, a belt conveying line installed on the equipment mounting frame, a high-temperature glue mounting mechanism, and a high-temperature glue wrapping mechanism , a rotary and lateral movement mechanism and a labeling mechanism, the belt conveying lines have three, the high-temperature glue mounting mechanism performs high-temperature glue pasting on the PCB board, and the high-temperature glue wrapping mechanism performs high-temperature glue wrapping on the PCB board, The labeling mechanism labels the PCB board. This kind of automatic equipment for gold finger mounting, wrapping high-temperature glue and labeling has the advantages of high automation, high work efficiency, good quality of processed products, stable and reliable performance, high product qualification rate, and reduced labor costs. The advantages.

Description

A fully automatic equipment for gold finger placement, wrapping, high temperature glue and labeling

technical field

The invention relates to an automatic equipment in the field of SMT production, in particular to an automatic equipment for gold finger mounting, wrapping high-temperature glue and labeling.

Background technique

At present, the protection of gold fingers in SMT production process is generally covered by high-temperature glue wrapping, so that it will not be stained with dirt, welding beads and other things. At present, the wrapping process of this gold finger is mostly manual work, the workload is very heavy, and the quality has wrinkles, exposed gold, missing stickers and other defects, which affect and reduce the processing quality of the product. In addition, the current automatic labeling machines on the market generally have defects such as large space occupation, complex structure, and troublesome operation. All these defects seriously limit the further development and popularization and application of this field.

In view of this, the purpose of the present invention is to provide a new technical solution to solve the existing technical defects.

Contents of the invention

In order to overcome the deficiencies of the prior art, the present invention provides a fully automatic equipment for gold finger mounting and wrapping high-temperature glue and labeling, which solves the problems of low work efficiency and high temperature of mounting and wrapping existing in the existing manual mounting and wrapping high-temperature glue. Technical defects such as poor glue quality, uneven processing quality, and low product pass rate.

The technical solution adopted by the present invention to solve its technical problems is:

A fully automatic equipment for gold finger mounting and wrapping high-temperature glue and labeling, including an equipment mounting frame and a belt conveyor line installed on the equipment mounting frame, a high-temperature glue mounting mechanism, a high-temperature glue wrapping mechanism, and a rotary and lateral movement Mechanism and labeling mechanism, the belt conveying line has three, after the equipment starts to work, the processed PCB board is first placed on the first belt conveying line and reaches the high temperature glue placement station, the high temperature glue placement mechanism Carry out high-temperature glue sticking work on the PCB board, and the PCB board after the high-temperature glue is mounted is transported to the high-temperature glue wrapping station in the second belt conveyor line, and the high-temperature glue wrapping mechanism performs high-temperature glue wrapping work on the PCB board, and the wrapping The PCB board finished with high-temperature glue is rotated 90 degrees by the rotary traverse mechanism and placed on the third belt conveyor line. The third belt conveyor line sends the PCB board to the labeling station, and the labeling mechanism carries out the process on the PCB board. Labeling.

As an improvement of the above-mentioned technical solution, the high-temperature glue placement mechanism includes a glue sticking lifting device and a glue sticking device. The mobile assembly and the adhesive mounting plate and high-temperature adhesive feeding device installed on the adhesive two-axis mobile assembly. The adhesive mounting plate is equipped with an adhesive driving cylinder, an adhesive head, an adhesive pressing drive cylinder, a pressing Glue head and high-temperature glue cutting assembly, the glue-applying drive cylinder can drive the glue-applying head against the gold finger and apply high-temperature glue, and the glue-pressing driving cylinder can drive the glue-pressing head to press the high-temperature glue on the gold finger The high-temperature glue shearing assembly can cut off the high-temperature glue that has been mounted.

As a further improvement of the above technical solution, the magnetic base support assembly includes a magnetic base and a tooth-shaped support base arranged on the magnetic base, and a golden finger support plate matched with the tooth-shaped support base is arranged on the tooth-shaped support base.

As a further improvement of the above technical solution, the high-temperature rubber shearing assembly includes a shearing drive cylinder and a shearing blade arranged at the output end of the shearing drive cylinder, and the shearing drive cylinder can drive the shearing blade to shear the high-temperature rubber Cut off; the glue application head is hinged on the glue application mounting plate, one end of the glue application drive cylinder is hinged on the glue application installation plate, the output end of the glue application drive cylinder is hinged on the free end of the glue application head and The applicator head can be driven to rotate around its hinge point.

As a further improvement of the above technical solution, the adhesive jacking device includes an adhesive jacking cylinder and an adhesive jacking plate installed at the output end of the adhesive jacking cylinder, and the four sides of the adhesive jacking plate are The corner is connected with a glue-applied jacking guide column; the glue-applied two-axis moving assembly includes a glue-applied X-axis drive assembly and a glue-applied Y-axis assembly, and the X-axis drive assembly and the glue-applied Y-axis assembly can respectively drive the glue-applied The mounting plate moves in the X-axis direction and the Y-axis direction.

As a further improvement of the above technical solution, the high-temperature glue wrapping mechanism includes a wrapping jacking assembly and a high-temperature glue wrapping assembly, the wrapping jacking assembly is provided with a wrapping magnetic support assembly, and the high-temperature glue wrapping assembly includes a left mounting frame and a The right mounting frame, the left mounting frame is provided with a left oblique guide plate, a left package cylinder and a left package support cylinder, the left package support plate is arranged on the left oblique guide plate, the left package cylinder and the left package The supporting cylinder can respectively push the left oblique guide plate and the left package support plate to slide, and the right installation frame is provided with a right oblique guide plate, a right package cylinder and a right package support cylinder, and the right oblique guide plate is provided with The right package support plate, the right package cylinder and the right package support cylinder can respectively push the right oblique angle guide plate and the right package support plate to slide, and the left oblique angle guide plate and the right oblique angle guide plate are provided with package rubber .

As a further improvement of the above technical solution, the left mounting frame is provided with a first left guide rail, the left bevel guide plate is arranged on the first left guide rail, and the output end of the left wrapping cylinder is connected to the left bevel The guide plate can also push the left bevel guide plate to slide on the first left guide rail, the second left guide rail is arranged on the left bevel guide plate, and the left package support plate is arranged on the second left guide rail, The output end of the left package support cylinder is connected to the left package support plate and can push the left package support plate to slide on the second left guide rail; the right mounting frame is provided with a first right guide rail, and the right bevel guide plate Set on the first right guide rail, the output end of the right wrapped cylinder is connected to the right bevel guide plate and can push the right bevel guide plate to slide on the first right guide rail, and the right bevel guide plate A second right guide rail is provided, and the right package support plate is arranged on the second right guide rail, and the output end of the right package support cylinder is connected to the right package support plate and can push the right package support plate on the second right Slide on the rail.

As a further improvement of the above technical solution, the wrapped rubber block is a D-shaped rubber block; the bottom of the left mounting frame is provided with a left mounting frame support plate, and the left mounting frame support plate is installed on the fixed installation of the equipment through the left support guide rail. on file.

As a further improvement of the above technical solution, the package magnetic support assembly includes a package magnetic support base and a package suction cup arranged on the package magnetic support base; the package jacking assembly includes a package jacking drive linear motor and a parcel jacking The package magnetic support assembly is arranged on the package lifting plate.

As a further improvement of the above technical solution, the rotary and traverse mechanism includes a rotating device, and the labeling mechanism includes an automatic label feeding device, a label absorbing device, a visual alignment device, a labeling device and a code scanning device.

The beneficial effects of the present invention are: the present invention provides a fully automatic equipment for gold finger mounting and wrapping high temperature glue and labeling, this kind of fully automatic equipment for gold finger mounting and wrapping high temperature glue and labeling Mounting mechanism, high temperature glue wrapping mechanism and labeling mechanism, through the high temperature glue placement mechanism, high temperature glue wrapping mechanism and labeling mechanism, it can realize automatic placement of high temperature glue, automatic wrapping of high temperature glue and automatic labeling, effectively improving production efficiency, Improve the processing quality of products, improve the production qualification rate of products, and further improve the production efficiency of production enterprises.

In short, this kind of automatic equipment for gold finger mounting and wrapping high-temperature glue and labeling solves the problems of low work efficiency, poor quality of mounting and wrapping high-temperature glue, uneven processing quality, and Technical defects such as low product pass rate.

Description of drawings

The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

Fig. 1 is the assembly schematic diagram of the present invention;

Fig. 2 is the assembly schematic diagram of another angle of the present invention;

Fig. 3 is the assembly diagram of the third angle of the present invention;

Fig. 4 is the assembly diagram of the fourth angle of the present invention;

Fig. 5 is a schematic diagram of the assembly of the high-temperature glue mounting mechanism in the present invention;

Fig. 6 is an assembly schematic diagram of another angle of the high-temperature glue mounting mechanism in the present invention;

Fig. 7 is a schematic structural view of the magnetic base support assembly in the present invention;

Fig. 8 is a schematic diagram of the assembly of the high-temperature glue wrapping mechanism in the present invention;

Fig. 9 is an assembly schematic diagram of another angle of the high-temperature glue wrapping mechanism in the present invention.

Detailed ways

The idea, specific structure and technical effects of the present invention will be clearly and completely described below in conjunction with the embodiments and accompanying drawings, so as to fully understand the purpose, features and effects of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, rather than all of them. Based on the embodiments of the present invention, other embodiments obtained by those skilled in the art without creative efforts belong to The protection scope of the present invention. In addition, all the connection/connection relationships involved in the patent do not simply refer to the direct connection of components, but mean that a better connection structure can be formed by adding or reducing connection accessories according to specific implementation conditions. Each technical feature in the present invention can be combined interactively on the premise of not contradicting each other, refer to Fig. 1-9.

A fully automatic equipment for gold finger placement, wrapping, high-temperature glue and labeling, including an equipment mounting frame 1, a belt conveyor line 2 installed on the equipment mounting frame 1, a high-temperature glue mounting mechanism 3, and a high-temperature glue wrapping mechanism 4. The rotating and traversing mechanism 5 and the labeling mechanism 6. The belt conveying line 2 has three, which are respectively the belt conveying line A21, the belt conveying line B22 and the belt conveying line C23. After the equipment starts to work, the processed PCB board first Put it on the first belt conveying line 2 and reach the high-temperature glue placement station, the high-temperature glue placement mechanism 3 performs high-temperature glue sticking work on the PCB board, and the PCB board with the high-temperature glue mounted is on the second belt The conveying line 2 is transported to the high-temperature glue wrapping station, and the high-temperature glue wrapping mechanism 4 wraps the PCB board with high-temperature glue, and the PCB board wrapped with high-temperature glue is rotated by 90 degrees by the rotary traverse mechanism 5 and placed on the third On the belt conveyor line 2, the third belt conveyor line 2 sends the PCB board to the labeling station, and the labeling mechanism 6 labels the PCB board.

Preferably, the high-temperature adhesive mounting mechanism 3 includes a gluing jacking device 31 and a gluing device 32, the gluing lifting device 31 is provided with a magnetic base support assembly 33, and the gluing device 32 includes a gluing device 32. The two-axis moving assembly 321 and the gluing installation plate 322 and high-temperature glue feeding device 323 installed on the gluing two-axis moving assembly 321, the gluing drive cylinder 324, the gluing drive cylinder 324, and the gluing installation plate 322 are installed Head 325, glue-pressing drive cylinder 326, glue-pressing head 327 and high-temperature glue shearing assembly 328. The glue-applying drive cylinder 324 can drive the glue-applying head 325 to abut against the gold finger and apply high-temperature glue. The glue-pressing drive The cylinder 326 can drive the glue pressing head 327 to press the high-temperature glue on the gold finger to achieve secondary pressing, and the high-temperature glue cutting component 328 can cut off the high-temperature glue after placement.

Preferably, the magnetic base support assembly 33 includes a magnetic base 331 and a tooth-shaped support base 332 disposed on the magnetic base 331 , and a golden finger support plate 333 matched thereon is provided on the tooth-shaped support base 332 .

Preferably, the high-temperature glue shearing assembly 328 includes a shearing drive cylinder and a shearing blade arranged at the output end of the shearing drive cylinder, and the shearing drive cylinder can drive the shearing blade to cut off the high-temperature glue; The gluing head 325 is hinged on the gluing mounting plate 322, one end of the gluing driving cylinder 324 is hinged on the gluing mounting plate 322, and the output end of the gluing driving cylinder 324 is hinged on the free side of the gluing head 325. end and can drive the gluing head 325 to rotate around its hinge point.

Preferably, the gluing jacking device 31 includes a gluing jacking cylinder 311 and a gluing jacking plate 312 installed at the output end of the gluing jacking cylinder 311, the four sides of the gluing jacking plate 312 The corner is connected with a glued jacking guide column 313; the glued two-axis moving assembly 321 includes a glued X-axis drive assembly and a glued Y-axis assembly, and the X-axis drive assembly and the glued Y-axis assembly can be driven separately The adhesive mounting plate 322 moves in the X-axis direction and the Y-axis direction.

When implementing the present invention, the adhesive jacking plate 312 is lifted up by the adhesive jacking cylinder 311, and the magnetic base support assembly 33 installed on the adhesive jacking plate 312 rises and leans against the PCB board Below the gold finger on the top; further, the two-axis moving assembly 321 cooperates to move the position of the glue application head 325 to the top of the place where the gold finger starts to stick, and the glue application head 325 is driven by the glue application driving cylinder 324 to Move down and paste the high-temperature glue on the upper surface of the front end of the gold finger; the Y-axis assembly of the two-axis moving assembly 321 drives the glue-applying head 325 to move at a constant speed, and the glue-applying head 325 rolls along the upper surface of the gold finger under the action of friction, At the same time, the high-temperature glue is continuously pasted on the gold finger; in this process, the glue-pressing drive cylinder 326 drives the glue-pressing head 327 to press the high-temperature glue on the upper surface of the gold finger for secondary compression, so that the high-temperature glue is pasted well. It is more stable and flat, and the quality of the glue is better. When the high-temperature glue is applied to the end point, the glue-applying drive cylinder 324 drives the glue-applying head 325 to release the golden finger, and at the same time, the Y-axis assembly retreats a small distance backward, and then the shearing drive cylinder of the high-temperature glue shearing assembly 328 Drive the shearing blade to cut off the high-temperature glue; after the high-temperature glue is cut off, the Y-axis assembly continues to move until the cut high-temperature glue is completely pressed on the gold finger by the glue head 327. At this point, a gluing process is completed, and the mechanism is reset. Continuously repeating the above process, automatic glue application can be realized, with high work efficiency and good glue quality.

In the above-mentioned gluing process, the starting point and end point of gluing can be operated through the preset values of the staff, and then different starting points and ending points can be set according to different types of golden fingers, which has strong versatility.

Preferably, the high-temperature glue wrapping mechanism 4 includes a wrapping lifting component 41 and a high-temperature glue wrapping component 42, the wrapping lifting component 41 is provided with a wrapping magnetic support component 44, and the high-temperature glue wrapping component 42 includes a left mounting frame 421 and the right mounting frame 422, the left mounting frame 421 is provided with a left oblique guide plate 423, the left parcel cylinder 424 and the left parcel support cylinder 425, and the left oblique guide plate 423 is provided with a left parcel support plate 426 , the left package cylinder 424 and the left package support cylinder 425 can respectively push the left oblique guide plate 423 and the left package support plate 426 to slide, and the right installation frame 422 is provided with a right oblique guide plate 427 and a right package cylinder 428 And right package support cylinder 429, described right oblique angle guide plate 427 is provided with right package support plate 430, described right package cylinder 428 and right package support cylinder 429 can push right oblique angle guide plate 427 and right package support plate respectively 430 slides, and the left bevel guide plate 423 and the right bevel guide plate 427 are all provided with wrapped rubber blocks 431 .

Preferably, the left mounting frame 421 is provided with a first left guide rail, the left oblique guide plate 423 is arranged on the first left guide rail, and the output end of the left wrapped cylinder 424 is connected to the left oblique guide plate 423 and can push the left bevel guide plate 423 to slide on the first left guide rail, the left bevel guide plate 423 is provided with the second left guide rail, and the left package support plate 426 is arranged on the second left guide rail Above, the output end of the left package support cylinder 425 is connected to the left package support plate 426 and can push the left package support plate 426 to slide on the second left guide rail; the right mounting frame 422 is provided with the first right guide rail, so The right bevel guide plate 427 is arranged on the first right guide rail, the output end of the right package cylinder 428 is connected to the right bevel guide plate 427 and can push the right bevel guide plate 427 on the first right guide rail sliding, the right oblique guide plate 427 is provided with a second right guide rail, the right package support plate 430 is arranged on the second right guide rail, and the output end of the right package support cylinder 429 is connected to the right package support plate 430 and can push the right package support plate 430 to slide on the second right guide rail.

Preferably, the wrapped rubber block 431 is a D-shaped rubber block; the bottom of the left mounting frame 421 is provided with a left mounting frame support plate 420, and the left mounting frame support plate 420 is installed on the fixed installation of the equipment through the left support guide rail 432. on file.

The package magnetic support assembly 44 includes a package magnetic support base 441 and a package suction cup 442 arranged on the package magnetic support base 441; the package jacking assembly 41 includes a package jacking drive linear motor and a package jacking plate. The package magnetic support assembly 44 is arranged on the package lifting plate.

When implementing the present invention, at first, the package lifting assembly 41 pushes the package lifting plate to rise under the driving action of its package lifting drive linear motor, and the package magnetic force support seat assembly 44 arranged on the package lifting plate rises; when the package magnetic force When the package suction cup 442 on the support seat assembly 44 reaches the height of the back of the PCB board, the package jacking assembly 41 stops working, and the vacuum source of the package suction cup 442 starts to work and sucks the PCB board; further, the package jacking assembly 41 continues Work and lift the PCB board, when the PCB board passes through the left bevel guide plate 423 and the right bevel guide plate 427, the high temperature glue protruding from the edge of the PCB board will be guided by the left bevel guide plate 423 and the right bevel guide plate The board 427 is bent downward by 90 degrees; further, the package jacking assembly 41 continues to work, and the PCB board continues to rise until the upper surface of the PCB board abuts against the lower surfaces of the left package support plate 426 and the right package support plate 430 Finally, the package jacking assembly 41 stops working. At this time, the left package cylinder 424 and the right package cylinder 428 respectively drive the left bevel guide plate 423 and the right bevel guide plate 427 to move towards each other, driving the left bevel guide plate 423 and the right bevel guide plate 427 to move towards each other. The wrapping rubber block 431 on the right bevel guide plate 427 moves toward each other, and the wrapping rubber block 431 wraps the high-temperature glue that has been bent by 490 degrees to the lower surface of the PCB. After the high-temperature glue is wrapped, the left wrapping cylinder 424 and the right wrapping cylinder 428 respectively drive the left bevel guide plate 423 and the right bevel guide plate 427 to move backward, and the left wrap support cylinder 425 and the right wrap support cylinder 429 respectively Drive the left package support plate 426 and the right package support plate 430 to move backward, the package jacking assembly 41 continues to work and lifts the PCB board that has completed the high temperature glue package work to the preset position (waiting for the rotation and traverse mechanism 5 to lift the PCB board removed).

So far, the automatic wrapping of a PCB board with high-temperature glue is completed, realizing automatic work with high efficiency and stable and reliable quality.

Preferably, the rotating and traversing mechanism 5 includes a rotating device, and the labeling mechanism 6 includes an automatic label feeding device, a label absorbing device, a visual alignment device, a labeling device and a code scanning device.

The above is a specific description of the preferred implementation of the present invention, but the invention is not limited to the described embodiments, those skilled in the art can also make various equivalent deformations or replacements without violating the spirit of the present invention , these equivalent modifications or replacements are all within the scope defined by the claims of the present application.

Claims (6)

1. A full-automatic equipment that is used for golden finger to paste dress parcel high temperature to glue and paste label, its characterized in that: the device comprises an equipment mounting frame (1) and a belt conveying line (2), a high-temperature glue mounting mechanism (3), a high-temperature glue wrapping mechanism (4), a rotary traversing mechanism (5) and a labeling mechanism (6) which are arranged on the equipment mounting frame (1), wherein the belt conveying line (2) is provided with three, after equipment starts to work, a processed PCB (printed circuit board) is firstly arranged on a first belt conveying line (2) and reaches a high Wen Jiaotie mounting station, the high-temperature glue mounting mechanism (3) carries out high Wen Jiaotie glue work on the PCB, the high-temperature glue wrapped PCB is conveyed to a high-temperature glue wrapping station in a second belt conveying line (2), the high-temperature glue wrapping mechanism (4) carries out high-temperature glue wrapping work on the PCB, the PCB wrapped with the high-temperature glue is rotated by 90 degrees by the rotary traversing mechanism (5) and is placed on a third belt conveying line (2), the third belt conveying line (2) carries the PCB to a labeling station, and the labeling mechanism (6) carries out labeling on the PCB;

the high-temperature glue wrapping mechanism (4) comprises a wrapping jacking assembly (41) and a high-temperature glue wrapping assembly (42), a wrapping magnetic supporting assembly (44) is arranged on the wrapping jacking assembly (41), the high-temperature glue wrapping assembly (42) comprises a left mounting frame (421) and a right mounting frame (422), a left oblique angle guide plate (423), a left wrapping air cylinder (424) and a left wrapping supporting air cylinder (425) are arranged on the left mounting frame (421), a left wrapping supporting plate (426) is arranged on the left oblique angle guide plate (423), the left wrapping air cylinder (424) and the left wrapping supporting air cylinder (425) can respectively push the left oblique angle guide plate (423) and the left wrapping supporting plate (426) to slide, a right oblique angle guide plate (427), a right wrapping air cylinder (428) and a right wrapping supporting air cylinder (429) are arranged on the right mounting frame (422), a right wrapping supporting plate (430) is arranged on the right oblique angle guide plate (427), and the left wrapping supporting air cylinder (428) and the right wrapping supporting air cylinder (429) can respectively push the right oblique angle guide plate (427) and the right wrapping supporting plate (423) to slide, and the right wrapping guide plate (431) are respectively provided with a right wrapping guide block (427).

The rotary transverse moving mechanism (5) comprises a rotary device, and the labeling mechanism (6) comprises an automatic label feeding device, a label sucking device, a visual alignment device, a label mounting device and a code scanning device;

the high-temperature glue mounting mechanism (3) comprises a glue-sticking jacking device (31) and a glue-sticking device (32), wherein a magnetic seat supporting component (33) is arranged on the glue-sticking jacking device (31), the glue-sticking device (32) comprises a glue-sticking two-shaft moving component (321) and a glue-sticking mounting plate (322) and a high-temperature glue feeding device (323) which are arranged on the glue-sticking two-shaft moving component (321), a glue-sticking driving air cylinder (324), a glue-sticking head (325), a glue-pressing driving air cylinder (326), a glue-pressing head (327) and a high-temperature glue shearing component (328) are arranged on the glue-sticking mounting plate (322), the glue-sticking driving air cylinder (324) can drive the glue-sticking head (325) to abut against a golden finger and paste the high-temperature glue, the glue-pressing driving air cylinder (326) can drive the glue-pressing head (327) to press the golden finger to the high Wen Jiaoshang and realize secondary pressing, and the high-temperature glue shearing component (328) can cut off the glued high-temperature glue;

the left mounting frame (421) is provided with a first left guide rail, the left oblique angle guide plate (423) is arranged on the first left guide rail, the output end of the left wrapping cylinder (424) is connected to the left oblique angle guide plate (423) and can push the left oblique angle guide plate (423) to slide on the first left guide rail, the left oblique angle guide plate (423) is provided with a second left guide rail, the left wrapping support plate (426) is arranged on the second left guide rail, and the output end of the left wrapping support cylinder (425) is connected to the left wrapping support plate (426) and can push the left wrapping support plate (426) to slide on the second left guide rail; be provided with first right guide rail on right mounting bracket (422), right oblique angle deflector (427) set up on the first right guide rail, the output of right parcel cylinder (428) is connected to right oblique angle deflector (427) and can promote right oblique angle deflector (427) and slide on first right guide rail, be provided with the second right guide rail on right oblique angle deflector (427), right parcel backup pad (430) set up on the second right guide rail, the output of right parcel support cylinder (429) is connected to right parcel backup pad (430) and can promote right parcel backup pad (430) to slide on the second right guide rail.

2. The fully automatic equipment for hot glue and labeling of golden finger packaging according to claim 1, wherein the equipment is characterized in that: the magnetic seat supporting component (33) comprises a magnetic seat (331) and a tooth-shaped supporting seat (332) arranged on the magnetic seat (331), and a golden finger supporting plate (333) matched with the tooth-shaped supporting seat (332) is arranged on the tooth-shaped supporting seat in a matching mode.

3. The fully automatic equipment for hot glue and labeling of golden finger packaging according to claim 1, wherein the equipment is characterized in that: the high-temperature adhesive shearing assembly (328) comprises a shearing driving cylinder and a shearing blade arranged at the output end of the shearing driving cylinder, and the shearing driving cylinder can drive the shearing blade to cut off the high-temperature adhesive; the rubberizing head (325) is hinged on the rubberizing mounting plate (322), one end of the rubberizing driving air cylinder (324) is hinged on the rubberizing mounting plate (322), and the output end of the rubberizing driving air cylinder (324) is hinged at the free end of the rubberizing head (325) and can drive the rubberizing head (325) to rotate around the hinge point of the rubberizing head.

4. The fully automatic equipment for hot glue and labeling of golden finger packaging according to claim 1, wherein the equipment is characterized in that: the rubberizing jacking device (31) comprises a rubberizing jacking cylinder (311) and rubberizing jacking plates (312) arranged at the output ends of the rubberizing jacking cylinder (311), and rubberizing jacking guide posts (313) are connected at four corners of the rubberizing jacking plates (312); the rubberizing diaxon remove subassembly (321) includes rubberizing X axle drive assembly and rubberizing Y axle subassembly, X axle drive assembly and rubberizing Y axle subassembly can drive rubberizing mounting panel (322) respectively in X axle direction and Y axle direction removal.

5. The fully automatic equipment for hot glue and labeling of golden finger packaging according to claim 4, wherein the equipment comprises the following components: the wrapping rubber block (431) is a D-shaped rubber block; the bottom of the left mounting frame (421) is provided with a left mounting frame supporting plate (420), and the left mounting frame supporting plate (420) is mounted on a fixed mounting piece of equipment through a left supporting guide rail (432).

6. The fully automatic equipment for hot glue and labeling of golden finger packaging according to claim 4, wherein the equipment comprises the following components: the wrapping magnetic force supporting component (44) comprises a wrapping magnetic force supporting seat (441) and a wrapping sucker (442) arranged on the wrapping magnetic force supporting seat (441); the package jacking assembly (41) comprises a package jacking driving linear motor and a package jacking plate, and the package magnetic force supporting assembly (44) is arranged on the package jacking plate.

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