CN101879962A - Tape package of chip components and preparation method and device thereof - Google Patents
Tape package of chip components and preparation method and device thereof Download PDFInfo
- Publication number
- CN101879962A CN101879962A CN 201010209543 CN201010209543A CN101879962A CN 101879962 A CN101879962 A CN 101879962A CN 201010209543 CN201010209543 CN 201010209543 CN 201010209543 A CN201010209543 A CN 201010209543A CN 101879962 A CN101879962 A CN 101879962A
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- adhesive tape
- tape
- chip components
- carrier band
- parts
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Abstract
The invention discloses a tape package of chip components and a preparation method and device thereof. The invention is characterized by additionally arranging two easily torn lines parallel to the binding site at the inner side of an adhesive tape on the binding site of a carrier tape and the adhesive tape in the tape package by remaking heating blocks of a taping machine or splitting cutters of an adhesive tape splitter. No adhesive force exists between the torn part of the adhesive tape and the carrier tape, thus avoiding that the adhesive tape sticks the paper scraps or can not be torn, and the taping process can adapt to wider heating temperature range and stripping force range, and the taped products can adapt to wider temperature and humidity storage environment, thus not affecting normal use of the tapes.
Description
Technical field
The invention belongs to the tape package in chip components and parts field, particularly a kind of chip components and parts, and the preparation method of this tape package and device.
Background technology
The tape package of existing chip components and parts, be on carrier band 1, to form circular pilot hole 11 and square hole 12 (see figure 1)s respectively, then below carrier band 1 with tail band 3 seal square hole 12 (carrier band 1 form simultaneously with square hole 12, tail band 3 or integrated formation except), with braider chip components and parts 4 are put into square hole 12 (see figure 2)s on request, then on carrier band 1 with adhesive tape 2 seal square hole 12 above (see figure 3).Adhesive tape 2 and tail band 3 all scribble hot melt adhesive, and by the heat block on the braider, in addition suitable temperature and pressure makes adhesive tape 2, tail band 3 and carrier band 1 fusion.In the design of heat block, adhesive tape heat block 7 ' generally is designed to the fluted body (see figure 5), and the heating back forms two parallel heat fusion vestiges, the i.e. binding site 5 of carrier band 1 and adhesive tape 2 (seeing Fig. 3,4) in the adhesive tape both sides.
When the client uses, utilize chip mounter, under the situation of pilot hole location, tear adhesive tape step by step, one by one element is sucked out on the assigned address that is attached to wiring board with suction nozzle.
Advantage: easy to use, suction is accurate, the efficient height.
Shortcoming: when tearing adhesive tape, if the carrier band poor quality of paper material, or make moist or heating-up temperature when too high when paper tape, easily under the binding force of adhesive tape and paper tape, the paper scrap on paper tape surface is adhered on the adhesive tape, the paper scrap that causes chip mounter card machine phenomenon easily or tear out drops on the wiring board, pollutes wiring board; Perhaps adhesive tape and carrier band binding force are too high and chip mounter can't normally be torn adhesive tape, cause normally paster of chip mounter.
Summary of the invention
For addressing the above problem, the tape package that the purpose of this invention is to provide a kind of chip components and parts, its electronic devices and components adhesive tape when the chip mounter paster that has solved tape package tear that the back paper scrap adheres on the adhesive tape and the too high and problem that can't normally tear adhesive tape of adhesive tape and carrier band binding force.
Another object of the present invention provides the preparation method and the preparation facilities of above-mentioned tape package.
The object of the present invention is achieved like this: a kind of tape package of chip components and parts, comprise carrier band and adhesive tape, and it is characterized in that: the inboard of the binding site of described carrier band and adhesive tape is provided with two easy-torn lines parallel with binding site.
Described easy-torn line is a thin groove of being located at tape surface, or the dotted line of being made up of pore or grooving.
The spacing of described two easy-torn lines is greater than the width of carrier band square hole.
The preparation method of the tape package of above-mentioned chip components and parts is characterized in that may further comprise the steps: at first, chip components and parts are put into the square hole of the carrier band of back cover; Seal the carrier band upper surface with adhesive tape then, and two easy-torn lines parallel with binding site are set in the inboard of both binding sites.
Described easy-torn line forms by scraping quarter, punching or laser technology.
The preparation facilities of the tape package of above-mentioned chip components and parts, it is characterized in that: described device is a braider, comprise being used for heat block that carrier band and adhesive tape are combined, the scraper that can form thin groove in tape surface of two projectioies is set in the inboard of the heated contact surface of this heat block.
The preparation facilities of the tape package of above-mentioned chip components and parts, it is characterized in that: described device is a braider, comprise and be used for heat block that carrier band and adhesive tape are combined, at this heat block rear a pair of pinwheel is installed or dotted line cuts hobboing cutter, it is parallel with the heated contact surface inboard of heat block that this pinwheel or dotted line cut hobboing cutter.
The preparation method of the tape package of above-mentioned chip components and parts is characterized in that may further comprise the steps: at first, chip components and parts are put into the square hole of back cover carrier band; Seal the carrier band upper surface with the adhesive tape that is provided with two parallel easy-torn lines then, these two parallel easy-torn lines are positioned at the inner side of adhesive tape and carrier band binding site behind the involution.
The preparation facilities of the tape package of above-mentioned chip components and parts, it is characterized in that: described preparation facilities is the adhesive tape cutting machine, wherein has additional on the cutting tool of adhesive tape cutting machine to become the thin adhesive tape of multireel simultaneously or cut scraper, pinwheel or the dotted lines that the back forms the parallel easy-torn line of two row and cut hobboing cutter cutting whole volume adhesive tape.
The present invention compared with prior art, has following beneficial effect: owing to do not have binding power between part that adhesive tape is torn and the carrier band, so stopped the phenomenon that sticking paper scrap of adhesive tape or adhesive tape can not tear open, and the braid process can adapt to wideer heating-up temperature and peeling force scope, product after the braid can adapt to wideer temperature, humidity storage condition, can not influence the normal use of braid.
Description of drawings
Fig. 1 is the structural representation and the A section drawing of the carrier band of prior art;
Fig. 2 is with the carrier band back cover and the section drawing after putting into chip components and parts in the prior art;
Fig. 3 is the B section drawing of in the prior art carrier band being sealed up behind the surperficial adhesive tape.
Fig. 4 is structural representation and the C section drawing of among the present invention carrier band being sealed up behind the surperficial adhesive tape;
Fig. 5 is the lateral plan of braider heat block in the prior art;
Fig. 6 is the lateral plan of heat block in the embodiment of the invention 1;
Fig. 7 be in the embodiment of the invention 2 heat block and pinwheel scheme drawing is set;
Fig. 8 is the structural representation of the cutting tool of adhesive tape cutting machine in the embodiment of the invention 3;
Fig. 9 is the adhesive tape structure scheme drawing of the embodiment of the invention 3 after cutting tool is cut.
The specific embodiment
The present invention is a kind of tape package of chip components and parts, comprises carrier band 1 and adhesive tape 2, and the inboard of the binding site 5 of wherein said carrier band 1 and adhesive tape 2 is provided with two easy-torn lines 6 parallel with binding site 5.
This easy-torn line 6 is for being located at the thin groove on adhesive tape 2 surfaces, or the dotted line of being made up of pore or grooving.In order not hinder subsequently when chip mounter uses chip components and parts 4 sucking-offs, the spacing of two easy-torn lines 6 is greater than the width of carrier band 1 square hole 12.
The preparation method of the tape package of above-mentioned chip components and parts may further comprise the steps: at first, chip components and parts 4 are put into the square hole 12 of the carrier band 1 of back cover; Seal carrier band 1 upper surface with adhesive tape 2 then, and two easy-torn lines 6 parallel with binding site 5 are set in the inboard of both binding sites 5.Described easy-torn line 6 forms by scraping technologies such as quarter, punching or laser.
Perhaps, the preparation method of the tape package of above-mentioned chip components and parts may further comprise the steps: at first, chip components and parts 4 are put into the square hole 12 of the carrier band 1 of back cover; Seal carrier band 1 upper surface with the adhesive tape 2 that has been provided with two parallel easy-torn lines 6 then, these two parallel easy-torn lines 6 are positioned at the inner side of adhesive tape 2 and carrier band 1 binding site 5 behind the involution.
Below the present invention is further elaborated by specific embodiment, but the present invention is not limited to this specific examples.
As shown in Figure 5, the Cross section Design of the heat block 7 ' of braider originally is a matrix, and left and right both sides jut is a heated contact surface, is used to heat adhesive tape, makes 1 fusion of adhesive tape 2 and carrier band and forms two parallel heating vestiges, and promptly binding site 5.
Present embodiment improves the braider heat block on original basis, as shown in Figure 6, sets up two scrapers 71 of projection slightly in the inboard of heat block 7 heated contact surfaces, requires the scraper can not be too high in order to avoid adhesive tape is cut off fully.Like this, heat block 7 in use, adhesive tape 2 and carrier band 1 move heat block 7 times, heat block 7 forms two strias in that binding site 5 is inboard when forming two heating vestiges and making adhesive tape and carrier band bonding, promptly easy-torn line 6.
As shown in Figure 5, the Cross section Design of the heat block 7 ' of braider originally is a matrix, and left and right both sides jut is a heated contact surface, is used to heat adhesive tape, makes 1 fusion of adhesive tape 2 and carrier band and forms two parallel heating vestiges, and promptly binding site 5.
As shown in Figure 7, present embodiment in the back of former heat block 7 ', is installed a pair of pinwheel 8 or dotted line and is cut hobboing cutter on the basis of original equipment, and it is parallel with the heated contact surface inboard of heat block that this pinwheel 8 or dotted line cut hobboing cutter.Like this, when adhesive tape 2 is mobile below heat block 7 ' and pinwheel 8, will spurs pinwheel 8 and rotate.Pinwheel 8 will be pricked out a large amount of fine needle holes on adhesive tape in rotating process, these fine needle holes are linked to be the parallel dotted line of two row.
Present embodiment is at adhesive tape 2 two parallel easy-torn lines 6 to be set in advance, and then enters braider and carry out braid.Therefore, the setting of easy-torn line 6 is chosen in and cuts whole volume adhesive tape with the adhesive tape cutting machine and become in the step of the thin adhesive tape of multireel to carry out.
Making the branch cutting process of adhesive tape, on cutting tool 9, increasing the little scraper 91 that forms stria, making it form the parallel stria (easy-torn line 6) of two row when whole volume face glue becomes the multireel adhesive tape cutting, shown in Fig. 8,9.When braid is used, just needn't do special processing, directly use just by original mode.
Also can not change the structure of former cutting tool, but behind cutting tool, set up a pair of pinwheel or dotted line cuts hobboing cutter, can realize making the purpose of the parallel easy-torn line of two row equally.
The chip components and parts that use the inventive method tape package are when the chip mounter paster, the adhesive tape of easy-torn line 6 midways location is torn along easy-torn line 6, the adhesive tape of 6 liang of side positions of easy-torn line then still is bonded on the carrier band 1, because adhesive tape and 1 of the carrier band torn do not have binding power, so can not produce and glued the phenomenon that paper scrap or adhesive tape can not tear open.
Claims (10)
1. the tape package of chip components and parts comprises carrier band and adhesive tape, it is characterized in that: the inboard of the binding site of described carrier band and adhesive tape is provided with two easy-torn lines parallel with binding site.
2. the tape package of chip components and parts according to claim 1, it is characterized in that: described easy-torn line is a thin groove of being located at tape surface, or the dotted line of being made up of pore or grooving.
3. the tape package of chip components and parts according to claim 1, it is characterized in that: the spacing of described two easy-torn lines is greater than the width of carrier band square hole.
4. the preparation method of the tape package of chip components and parts is characterized in that may further comprise the steps: at first, chip components and parts are put into the square hole of the carrier band of back cover; Seal the carrier band upper surface with adhesive tape then, and two easy-torn lines parallel with binding site are set in the inboard of both binding sites.
5. the preparation method of the tape package of chip components and parts according to claim 4 is characterized in that: described easy-torn line forms by scraping quarter, punching or laser technology.
6. realize the tape package preparation method's of the described chip components and parts of claim 4 preparation facilities, it is characterized in that: described device is a braider, comprise being used for heat block that carrier band and adhesive tape are combined, the scraper that can form thin groove in tape surface of two projectioies is set in the inboard of the heated contact surface of this heat block.
7. realize the tape package preparation method's of the described chip components and parts of claim 4 preparation facilities, it is characterized in that: described device is a braider, comprise and be used for heat block that carrier band and adhesive tape are combined, at this heat block rear a pair of pinwheel is installed or dotted line cuts hobboing cutter, it is parallel with the heated contact surface inboard of heat block that this pinwheel or dotted line cut hobboing cutter.
8. the preparation method of the tape package of chip components and parts is characterized in that may further comprise the steps: at first, chip components and parts are put into the square hole of back cover carrier band; Seal the carrier band upper surface with the adhesive tape that is provided with two parallel easy-torn lines then, these two parallel easy-torn lines are positioned at the inner side of adhesive tape and carrier band binding site behind the involution.
9. the preparation method of the tape package of chip components and parts according to claim 8 is characterized in that: described easy-torn line forms by scraping quarter, punching or laser technology.
10. realize the tape package preparation method's of the described chip components and parts of claim 8 preparation facilities, it is characterized in that: described preparation facilities is the adhesive tape cutting machine, wherein has additional on the cutting tool of adhesive tape cutting machine to become the thin adhesive tape of multireel simultaneously or cut scraper, pinwheel or the dotted lines that the back forms the parallel easy-torn line of two row and cut hobboing cutter cutting whole volume adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010209543 CN101879962A (en) | 2010-06-25 | 2010-06-25 | Tape package of chip components and preparation method and device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010209543 CN101879962A (en) | 2010-06-25 | 2010-06-25 | Tape package of chip components and preparation method and device thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101879962A true CN101879962A (en) | 2010-11-10 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010209543 Pending CN101879962A (en) | 2010-06-25 | 2010-06-25 | Tape package of chip components and preparation method and device thereof |
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| CN (1) | CN101879962A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103837768A (en) * | 2013-12-23 | 2014-06-04 | 广东风华高新科技股份有限公司 | Radial element testing equipment |
| CN104648816A (en) * | 2013-11-18 | 2015-05-27 | 罗姆股份有限公司 | Electronic component packaging body |
| CN106471524A (en) * | 2015-06-18 | 2017-03-01 | 株式会社村田制作所 | Carrier band and its manufacture method of manufacture method and RFID label tag |
| TWI602747B (en) * | 2016-04-11 | 2017-10-21 | All Ring Tech Co Ltd | Carrier tape cutting method and device |
| CN108690527A (en) * | 2018-07-06 | 2018-10-23 | 江西若邦科技股份有限公司 | A kind of novel easy-tear type heat-sealing cover band |
| CN108882666A (en) * | 2018-07-17 | 2018-11-23 | 珠海格力电器股份有限公司 | The fixed structure and its method of electromagnetic induction component |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4944979A (en) * | 1989-10-19 | 1990-07-31 | At&T Bell Laboratories | Tape conveyers for components |
| CN1605552A (en) * | 2000-10-11 | 2005-04-13 | 松下电器产业株式会社 | Connecting member for connecting carrier tapes and carrier tape connecting method using this connecting |
| CN2889947Y (en) * | 2005-12-07 | 2007-04-18 | 李智林 | Direct-reading type parts carrier belt |
| CN101273677A (en) * | 2005-09-16 | 2008-09-24 | 3M创新有限公司 | Cover tape and method for manufacture |
-
2010
- 2010-06-25 CN CN 201010209543 patent/CN101879962A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4944979A (en) * | 1989-10-19 | 1990-07-31 | At&T Bell Laboratories | Tape conveyers for components |
| CN1605552A (en) * | 2000-10-11 | 2005-04-13 | 松下电器产业株式会社 | Connecting member for connecting carrier tapes and carrier tape connecting method using this connecting |
| CN101273677A (en) * | 2005-09-16 | 2008-09-24 | 3M创新有限公司 | Cover tape and method for manufacture |
| CN2889947Y (en) * | 2005-12-07 | 2007-04-18 | 李智林 | Direct-reading type parts carrier belt |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104648816A (en) * | 2013-11-18 | 2015-05-27 | 罗姆股份有限公司 | Electronic component packaging body |
| CN103837768A (en) * | 2013-12-23 | 2014-06-04 | 广东风华高新科技股份有限公司 | Radial element testing equipment |
| CN103837768B (en) * | 2013-12-23 | 2016-08-24 | 广东风华高新科技股份有限公司 | Radial members test equipment |
| CN106471524A (en) * | 2015-06-18 | 2017-03-01 | 株式会社村田制作所 | Carrier band and its manufacture method of manufacture method and RFID label tag |
| CN106471524B (en) * | 2015-06-18 | 2019-07-30 | 株式会社村田制作所 | The manufacturing method of carrier band and its manufacturing method and RFID label tag |
| TWI602747B (en) * | 2016-04-11 | 2017-10-21 | All Ring Tech Co Ltd | Carrier tape cutting method and device |
| CN108690527A (en) * | 2018-07-06 | 2018-10-23 | 江西若邦科技股份有限公司 | A kind of novel easy-tear type heat-sealing cover band |
| CN108882666A (en) * | 2018-07-17 | 2018-11-23 | 珠海格力电器股份有限公司 | The fixed structure and its method of electromagnetic induction component |
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Application publication date: 20101110 |