CN104648816A - Electronic component packaging body - Google Patents
Electronic component packaging body Download PDFInfo
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- CN104648816A CN104648816A CN201310576997.0A CN201310576997A CN104648816A CN 104648816 A CN104648816 A CN 104648816A CN 201310576997 A CN201310576997 A CN 201310576997A CN 104648816 A CN104648816 A CN 104648816A
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- electronic component
- component packing
- carrier band
- packing body
- housing recess
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Abstract
The invention provides an electronic component packaging body. The electronic component packaging body can reliably contain electronic components, and a cover band can be properly stripped. The electronic component packaging body (101) comprises a carrier band (10), a plurality of electronic components (40), the cover band (20) and a joint portion (30). The carrier band is provided with a main face (11) and a plurality of concave containing portions (12); the electronic components (40) are contained in the concave containing portions (12) respectively; and the cover band (20) is jointed with the main face (11) in a manner of covering the concave containing portions (12), and the joint portion (30) is arranged between the carrier band (10) and the cover band (20). The joint portion (30) comprises two linear portions (31) and a plurality of middle portions (32), wherein the linear portions (31) clamp the concave containing portions (12) to be arranged in a separating manner in the width direction of the carrier band (10) and each extend in the length direction, and the middle portions (32) are located between the adjacent concave containing portions (12). The stripping resistance ratio alpha of the maximum value to the minimum value of the stripping resistance in the process of continuously stripping the cover band (20) from the carrier band (10) in the length direction is more than 1.0 and below 2.0.
Description
Technical field
The present invention relates to electronic component packing body.
Background technology
As the mode of being transported from factory to user by more small-sized electronic unit, extensively adopt electronic component packing body.Figure 15 represents an example of electronic component packing body of the prior art.(such as with reference to patent documentation 1).Electronic component packing body 900 shown in this figure possesses carrier band 91, cover strip 92 and multiple electronic unit 94.Carrier band 91 is banded, has multiple housing recess 91a.Multiple housing recess 91a equally spaced configures along the length direction of carrier band 91.Multiple electronic unit 94, such as, be incorporated in multiple housing recess 91a respectively for chip resister, diode etc.Cover strip 92 engages with carrier band 91 in the mode covering multiple housing recess 91a.Carrier band 91 and cover strip 92 are such as engaged by thermo-compressed.The part be bonded with each other is junction surface 93.In electronic component packing body 900, junction surface 93 comprises and clips multiple housing recess 91a configured separate and 2 the wire portions extended on the length direction of each carrier band 91 on the direction, broadband of carrier band 91.
Junction surface 93 is not arranged on adjacent housing recess 91a each other.Therefore, according to the difference of the size of electronic unit 94 or the joint situation of cover strip 92, be accommodated in the resistance component 94 in certain housing recess 91a, may depart from from housing recess 91a and be sandwiched in the gap of carrier band 91 and cover strip 92, or adjacent housing recess 91a may be strayed into.Expect to have the countermeasure prevented this from occurring, but the peel resistance when cover strip 92 being peeled off from carrier band 91 is on the length direction of carrier band 91 terrifically in strong and weak different countermeasure, it is very difficult for cover strip 92 stably being peeled off.
Prior art document
Patent documentation 1: Japanese Unexamined Patent Publication 5-270565 publication
Summary of the invention
The technical matters solved is wanted in invention
The present invention considers that above-mentioned situation completes, its problem be to provide a kind of can reliably housing electronic parts and the electronic component packing body of cover strip can be peeled off validly.
For the technical scheme of technical solution problem
Electronic component packing body provided by the invention comprises: carrier band, and it has interarea and configuration spaced apart in the longitudinal direction and respectively since multiple housing recess that above-mentioned interarea caves in; Be accommodated in multiple electronic units of above-mentioned multiple housing recess respectively; With the cover strip engaged with above-mentioned interarea in the mode covering above-mentioned multiple housing recess, the junction surface of above-mentioned carrier band and above-mentioned cover strip, comprise: clip above-mentioned multiple housing recess configured separate on the Width of above-mentioned carrier band, and 2 wire portions that the above-mentioned length direction of each leisure extends; And the multiple pars intermedias between above-mentioned housing recess adjacent respectively, the peel resistance of the maxima and minima of peel resistance when above-mentioned cover strip being peeled off continuously from above-mentioned carrier band along above-mentioned length direction is more than 1.0 than α, and is less than 2.0.
In a preferred embodiment of the invention, above-mentioned peel resistance ratio is more than 1.4.
In a preferred embodiment of the invention, above-mentioned peel resistance ratio is less than 1.8.
In a preferred embodiment of the invention, above-mentioned each pars intermedia is round-shaped.
In a preferred embodiment of the invention, above-mentioned each pars intermedia is polygonal shape.
In a preferred embodiment of the invention, above-mentioned each pars intermedia comprises multiple widget.
In a preferred embodiment of the invention, above-mentioned each wire portion is continuous print shape on above-mentioned length direction.
In a preferred embodiment of the invention, above-mentioned each wire portion is included in multiple short-term parts of configuration spaced apart on above-mentioned length direction.
In a preferred embodiment of the invention, above-mentioned each pars intermedia and above-mentioned two linear parts from.
In a preferred embodiment of the invention, above-mentioned each pars intermedia is with only separated from one another with any one mode be connected in above-mentioned two wire portions.
In a preferred embodiment of the invention, above-mentioned each pars intermedia is separated from one another in the mode be connected with above-mentioned two wire portion both sides.
In a preferred embodiment of the invention, above-mentioned cover strip has substrate layer and the knitting layer of mutual lamination.
In a preferred embodiment of the invention, above-mentioned knitting layer forms above-mentioned junction surface by thermo-compressed.
In a preferred embodiment of the invention, above-mentioned substrate layer comprises transparent resin.
In a preferred embodiment of the invention, above-mentioned carrier band comprises the resin sheet being implemented the embossing (emboss) for the formation of above-mentioned multiple housing recess and having processed.
In a preferred embodiment of the invention, above-mentioned housing recess is rectangular shape when overlooking.
Other feature and advantage of the present invention, the detailed description of carrying out below by referring to accompanying drawing, can be definitely.
Accompanying drawing explanation
Fig. 1 is the main portion block diagram of the electronic component packing body representing the first embodiment of the present invention.
Fig. 2 is the main portion birds-eye view of the electronic component packing body representing Fig. 1.
Fig. 3 is the main portion sectional view of the III-III line along Fig. 2.
Fig. 4 is the main portion amplification sectional view of the IV-IV line along Fig. 3.
Fig. 5 is the table of the peel resistance representing electronic component packing body.
Fig. 6 is the main portion sectional view representing the operation peeling off cover strip.
Fig. 7 is the main portion birds-eye view of the electronic component packing body representing the second embodiment of the present invention.
Fig. 8 is the main portion birds-eye view of the electronic component packing body representing the 3rd embodiment of the present invention.
Fig. 9 is the main portion birds-eye view of the electronic component packing body representing the 4th embodiment of the present invention.
Figure 10 is the main portion birds-eye view of the electronic component packing body representing the 5th embodiment of the present invention.
Figure 11 is the main portion birds-eye view of the electronic component packing body representing the 6th embodiment of the present invention.
Figure 12 is the main portion birds-eye view of the electronic component packing body representing the 7th embodiment of the present invention.
Figure 13 is the main portion birds-eye view of the electronic component packing body representing the 8th embodiment of the present invention.
Figure 14 is the main portion birds-eye view of the electronic component packing body representing the 9th embodiment of the present invention.
Figure 15 is the main portion birds-eye view of the example representing electronic component packing body of the prior art.
Description of reference numerals
101 ~ 109 electronic component packing bodies
10 carrier bands
11 interareas
12 housing recess
20 cover strips
21 substrate layers
22 knitting layers
30 junction surfaces
31 wire portions
31a short-term parts
32 pars intermedias
32a widget
40 electronic units
80 stripper roll
Detailed description of the invention
Below, with reference to accompanying drawing, the preferred embodiment of the present invention is specifically described.
Fig. 1 ~ Fig. 4 represents the electronic component packing body of the first embodiment of the present invention.The electronic component packing body 101 of present embodiment possesses carrier band 10, cover strip 20, junction surface 30 and multiple electronic unit 40.Fig. 1 represents the operation using stripper roll 80 to peel off cover strip 20 from carrier band 10.Fig. 2 is the main portion birds-eye view of the electronic component packing body 101 of the state of unstripped cover strip 20, and Fig. 3 is the main portion sectional view of the III-III line along Fig. 2.Fig. 4 is the main portion amplification sectional view of the IV-IV line along Fig. 3, has showed the lit-par-lit structure of cover strip 20.
Electronic component packing body 101, generally under the state being wound in not shown spool, transports from the fabrication shop of electronic unit 40 to the factory of user, carries out keeping as required.When user uses electronic unit 40, electronic component packing body 101 is sent successively from said reel.In the position of pickup electronic unit 40, peel off cover strip 20 from carrier band 10, become the state that electronic unit 40 exposes.The electronic unit 40 picking up this by such as utilizing the fitting machine of absorption (mounter) (not shown) and expose.Then, electronic unit 40 is installed in circuit substrate of regulation etc.The pickup of such electronic unit 40, generally continuous and carry out at high speed.
Carrier band 10 such as comprises opaque polyethylene terephthalate (PET) resin or polystyrene (PS) resin, is the band shape extended in the longitudinal direction.The carrier band 10 of present embodiment, such as, comprised and processed by embossing and be formed with the resin sheet of multiple housing recess 12.The example enumerating the size of carrier band 10 is, thickness about 0.1 ~ 1.1mm, width about 4 ~ 12mm.In addition, as the material of carrier band 10, also can replace resin and such as adopt paper.As an example of the carrier band 10 formed by paper, can enumerate and be processed as thinner by the thickness of the part by ground paper thicker for Thickness Ratio and form the structure of multiple housing recess 12.Multiple housing recess 12 equally spaced configures along the length direction of carrier band 10, is set to for receiving multiple electronic unit 40 respectively.In the present embodiment, multiple housing recess 12 is configured in the Width central authorities of carrier band 10.Each housing recess 12 caves in from the interarea 11 of carrier band 10, in the present embodiment, is rectangular shape when overlooking.The example enumerating the size of housing recess 12 is that the length direction of carrier band 10 is of a size of about 0.16 ~ 7.5mm, and Width is of a size of about 0.16 ~ 4.55, and the degree of depth is about 0.05 ~ 3.0mm.In addition, the example enumerating adjacent housing recess 12 interval is each other, such as about 0.5 ~ 7.8mm.In addition, the plan view shape of housing recess 12, except rectangular shape, can also adopt polygonal shape, round-shaped, elliptical shape etc., be applicable to the various shapes of the electronic unit 40 received.
Cover strip 20 is the band shape with the width of carrier band 10 same degree.As shown in Figure 4, the cover strip 20 of present embodiment is substrate layer 21 structure stacked with knitting layer 22.Substrate layer 21 such as comprises transparent or semitransparent polyethylene terephthalate (PET) resin, and its thickness is such as about 40 ~ 100 μm.Knitting layer 22 realizes the layer of engagement function by applying heat and pressure, such as, comprise polyethylene (PE) resinoid.Cover strip 20 engages with the interarea 11 of carrier band 10, covers multiple housing recess 12 thus.Thus, electronic unit 40 is incorporated in housing recess 12 in the mode be closed in all directions.In addition, multiple electronic unit 40 is taken out, so cover strip 20 can be peeled off from carrier band 10 to allow.When carrier band 10 is formed by paper, cover strip 20 is configured to can suitably engage relative to paper and peel off.
Junction surface 30 is the part that carrier band 10 and cover strip 20 directly engage, and is the position formed by the engagement function of the knitting layer 22 of thermo-compressed performance cover strip 20 in the present embodiment.That is, a part for knitting layer 22 is the position of being touched with carrier band 10 by heat and pressure.Junction surface 30 comprises 2 wire portions 31 and multiple pars intermedia 32.2 wire portions 31 clip multiple housing recess 12 configured separate on the Width of carrier band 10, and the length direction separately along carrier band 10 extends continuously.Multiple pars intermedia 32 is positioned at housing recess 12 adjacent respectively each other, in the present embodiment, is configured at adjacent housing recess 12 midway location each other.In the present embodiment, each pars intermedia 32 is round-shaped when overlooking.One example of the size at junction surface 30 is, the width in wire portion 31 is about 0.2 ~ 0.6mm, and 2 wire portion 31 distances are each other about 1.0 ~ 5.0mm, and the diameter of pars intermedia 32 is about 0.1 ~ 2mm.
As the method forming such junction surface 30, such as, can list the method using and be built-in with the metal moulded section instrument of temperature booster.This moulded section instrument, being formed as corresponding with 2 wire portions 31 and pars intermedia 32 is such as projection.Under the state that the temperature of these projections is higher, overlapped carrier band 10 and cover strip 20 are pressed, form junction surface 30 thus.Above-mentioned moulded section instrument also can by repeated presses action on the length direction of carrier band 1010 and cover strip 20, formed comparatively live forever in the longitudinal direction junction surface 30.Or, can be also following mode as above-mentioned moulded section instrument: by adopting the structure being similar to roller, rotating and carrier band 10 and cover strip 20 are pressed, form junction surface 30 thus.
Multiple electronic unit 40 is the such more small-sized electronic units of such as chip resister or cond.Multiple electronic unit 40 is accommodated in multiple housing recess 12 respectively.In the present embodiment, as electronic unit 40, LSI packaged unit, chip resister, diode etc. can be set as, its size one such as under: the length direction of carrier band 10 is of a size of about 0.15 ~ 7.3mm, Width is of a size of about 0.15 ~ 4.35mm, is highly about 0.05 ~ 1.0mm.
In addition, electronic component packing body 101 also can for having the structure of configuration multiple knock holees in the longitudinal direction at the Width adjacent one end avoiding multiple housing recess 12.These knock holees are used for electronic component packing body 101 to send specified length with specified speed.Sending like this, such as, electronic component packing body 101 part under the state being wound in not shown spool being extracted out, carry out in the operation of cover strip 20 being peeled off.
When taking out multiple electronic unit 40 from electronic component packing body 101, as shown in Figure 1, such as, by using the method for stripper roll 80 cover strip 20 to be peeled off from carrier band 10 gradually along its length.Now, for peeling off the peel resistance of cover strip 20, increase and decrease according to the structure at junction surface 30.Such as, in the longitudinal direction, in the position that housing recess 12 exists, as junction surface 30, only there are 2 wire portions 31, therefore peel resistance is smaller.On the other hand, in the longitudinal direction, at the middle position of adjacent housing recess 12, except 2 wire portions 31, also there is pars intermedia 32, therefore peel resistance is larger.
Then, the effect of electronic component packaging body 101 is described.
Fig. 5 represents minimum peel resistance Fmin when on purpose carrying out various change to the engagement state at junction surface 30 and maximum peel resistance Fmax.Minimum peel resistance Fmin results from the position that only there are 2 wire portions 31 in the longitudinal direction, and maximum peel resistance Fmax results from the position that there is 2 wire portions 31 and pars intermedia 32 in the longitudinal direction.Ratio α is minimum peel resistance Fmin and the ratio of maximum peel resistance Fmax.When cover strip 20 being peeled off continuously along its length, peel resistance F is taken as maximum peel resistance Fmax and minimum peel resistance Fmin repeatedly.
First, when ratio α is the value more than 2.0, the taking-up of electronic unit 40 becomes unstable, be therefore evaluated as ×.Fig. 6 schematically shows the phenomenon occurred when ratio α is value more than 2.0.Ratio α is that the value more than 2.0 means that maximum peel resistance Fmax exceedes 2 times of minimum peel resistance Fmin.Therefore, after peeling off the part of the cover strip 20 covering certain housing recess 12, when peeling off the part of the cover strip 20 engaged by pars intermedia 32, in its end, the masterpiece more than 2 times is for carrier band 10.Therefore, when peeling off the part of the cover strip 20 engaged by pars intermedia 32, or after just peeling off, carrier band 10 becomes the situation that upspring in top in figure, and electronic unit 40 may fly out.According to the research of inventors, distinguished the situation in order to prevent such instability, preferred ratio α is less than 2.0.And then, when ratio α is less than 1.8, can more stably peel off cover strip 20.
Then, when ratio α is less than 1.4, may cause cannot suitably housing electronic parts 40, be therefore evaluated as ×.Ratio α is less than 1.4 and means that the engaging force of pars intermedia 32 is more weak.Therefore, the gap of non-expectation may be produced between carrier band 10 and cover strip 20.In such a state, electronic unit 40 may depart from from housing recess 12 by mistake and be sandwiched between carrier band 10 and cover strip 20, or may be strayed into adjacent housing recess 12.When ratio α is more than 1.4, the probability producing significant gap between carrier band 10 and cover strip 20 is very low, and this point is confirmed by the test of inventors.Thereby, it is possible to avoid the situation that electronic unit 40 departs from from the housing recess 12 that should receive.
By making pars intermedia 32 for round-shaped, the size of multiple pars intermedia 32 can be made to be formed deviation is less.Thereby, it is possible to the peel resistance making pars intermedia 32 play is more even.In addition, by suitably setting the diameter of pars intermedia 32, the size of peel resistance can be regulated with comparalive ease.These are applicable to ratio α to be set as desired value.
2 wire portions 31 are continuous print shape in the longitudinal direction, can make the peel resistance uniformization in the longitudinal direction that 2 wire portions 31 play thus.This is applicable to ratio α to be set as desired value.
Fig. 7 ~ Figure 14 represents other embodiment of the present invention.In addition, in these figures, to parts same or similar with above-mentioned embodiment, the symbol identical with above-mentioned embodiment is given.
Fig. 7 ~ Figure 10 represents the variation of pars intermedia 32.
Fig. 7 represents the electronic component packing body of the second embodiment of the present invention.In the electronic component packing body 102 of present embodiment, pars intermedia 32 is quadrangle form.Four edges of pars intermedia 32 either direction on the length direction of carrier band 10 and Width.According to such embodiment, also can reliably housing electronic parts 40 and cover strip 20 is suitably peeled off.In addition, when housing recess 12 is rectangular shape and adjacent housing recess 12 distance is each other shorter, the shape of the pars intermedia 32 of present embodiment, be applicable to pars intermedia 32 give raw desired by maximum peel resistance Fmax needed for sufficient area.
Fig. 8 represents the electronic component packing body of the 3rd embodiment of the present invention.In the electronic component packing body 103 of present embodiment, pars intermedia 32 is quadrangle form, the either direction of its diagonal line on the length direction and Width of carrier band 10.According to such embodiment, also can reliably housing electronic parts 40 and cover strip 20 is suitably peeled off.In addition, when adjacent housing recess 12 Area comparison is to each other large, the shape of the pars intermedia 32 of present embodiment is on the Width and this both direction of length direction of carrier band 10, and the length being applicable to the junction making cover strip 20 and carrier band 10 increases.In addition, the shape of pars intermedia 32 also can be the polygonal shape beyond the quadrangle form in electronic component packing body 102,103.
Fig. 9 represents the electronic component packing body of the 4th embodiment of the present invention.In the electronic component packing body 104 of present embodiment, pars intermedia 32 is made up of two widget 32a.Each widget 32a is such as round-shaped.Two widget 32a configured separate on the Width of carrier band 10.According to such embodiment, also can reliably housing electronic parts 40 and cover strip 20 is suitably peeled off.By making two widget 32a configured separate on the Width of carrier band 10, the area of pars intermedia 32 can not be increased cover strip 20 is engaged more reliably with carrier band 10.Thereby, it is possible to reliably suppress the situation producing gap between carrier band 10 and cover strip 20.In addition, also pars intermedia 32 can be formed by the widget 32a of more than three.The shape of widget 32a, also can be round-shaped beyond shape.
Figure 10 represents the electronic component packing body of the 5th embodiment of the present invention.The electronic component packing body 105 of present embodiment, in the same manner as electronic component packing body 104, pars intermedia 32 is made up of two widget 32a.The elliptical shape that it is long axis direction that each widget 32a is such as formed as with the Width of carrier band 10.Two widget 32a configured separate on the length direction of carrier band 10.According to such embodiment, also can reliably housing electronic parts 40 and cover strip 20 is suitably peeled off.In addition, make two widget 32a configured separate on the length direction of carrier band 10, the region that cover strip 20 and carrier band 10 can be made thus to touch is the region more grown in the longitudinal direction.This can suppress to produce gap between carrier band 10 and cover strip 20, so preferably more reliably.In addition, when the area of pars intermedia 32 is constant, makes the structure of two widget 32a configured separate on the length direction of carrier band 10, there is the advantage that maximum peel resistance Fmax can be avoided to become larger value unreasonably.
Figure 11 and Figure 12 represents the variation in two wire portions 31.
Figure 11 represents the electronic component packing body of the 6th embodiment of the present invention.In the electronic component packing body 106 of present embodiment, each wire portion 31 is made up of multiple short-term parts 31a.Each short-term parts 31a is the shorter line extended along the length direction of carrier band 10.Multiple short-term parts 31a is the configuration of equal pitch ground along its length.The lengthwise location of two wire portion 31 formation multiple short-term parts 31a separately is each other consistent.In addition, preferred multiple short-term parts 31a gap is each other little of minimum peel resistance Fmin can be avoided to be the degree of 0 or extremely little value.It is continuous print shape in the longitudinal direction that present embodiment specify that wire portion 31 is not limited to.According to such embodiment, also can reliably housing electronic parts 40 and cover strip 20 is suitably peeled off.
Figure 12 represents the electronic component packing body of the 7th embodiment of the present invention.In the electronic component packing body 107 of present embodiment, each wire portion 31 is made up of multiple short-term parts 31a.And, be formed as the configuration that the lengthwise location of two wire portions 31 formation each other multiple short-term parts 31a is separately mutually different.According to such embodiment, also can reliably housing electronic parts 40 and cover strip 20 is suitably peeled off.
Can be understood by the explanation of these embodiments, the structure in two wire portions 31 in the structure of the pars intermedia 32 of electronic component packing body 101 ~ 105 and electronic component packing body 101,106,107, can realize various combination mutually.In addition, also can be the structure of pars intermedia 32 suitably configuration on the length direction of carrier band 10 of multiple kinds different in pars intermedia 32 by electronic component packing body 101 ~ 105.
Figure 13, Figure 14 represent other the mode for two wire portions 31 and pars intermedia 32.
Figure 13 represents the electronic component packing body of the 8th embodiment of the present invention.In the electronic component packing body 108 of present embodiment, each pars intermedia 32 is connected with two wire portions 31.Pars intermedia 32 is the band shape extended on the Width of carrier band 10 longlyer.The length direction two ends of pars intermedia 32 are connected respectively with two wire portions 31.According to such embodiment, also can reliably housing electronic parts 40 and cover strip 20 is suitably peeled off.In addition, become following form: on the length direction of carrier band 10, in the position that pars intermedia 32 exists, cover strip 20 engages with carrier band 10 on its whole width.Thereby, it is possible to more suitably prevent the situation that electronic unit 40 departs from from housing recess 12.
Figure 14 represents the electronic component packing body of the 9th embodiment of the present invention.In the electronic component packing body 109 of present embodiment, each pars intermedia 32 is connected with any one in two wire portions 31.Pars intermedia 32 is the band shape extended on the Width of carrier band 10 longlyer.Any one in the length direction two ends of pars intermedia 32, is connected with any one of two wire portions 31.Further, in the present embodiment, adjacent pars intermedia 32 is connected from wire portions mutually different in two wire portions 31.Thus, multiple pars intermedia 32 becomes jagged configuration.According to such embodiment, also can reliably housing electronic parts 40 and cover strip 20 is suitably peeled off.
Electronic component packing body of the present invention, is not limited to above-mentioned embodiment.The concrete structure of each several part of electronic component packing body of the present invention, freely can carry out various design modification.
Claims (16)
1. an electronic component packing body, is characterized in that, comprising:
Carrier band, it has interarea and configuration spaced apart in the longitudinal direction and respectively since multiple housing recess that described interarea caves in;
Be accommodated in multiple electronic units of described multiple housing recess respectively; With
With the cover strip that the mode covering described multiple housing recess engages with described interarea,
The junction surface of described carrier band and described cover strip, comprising: clip described multiple housing recess configured separate on the Width of described carrier band, and 2 wire portions that the described length direction of each leisure extends; And the multiple pars intermedias between described housing recess adjacent respectively,
The peel resistance of the maxima and minima of peel resistance when described cover strip being peeled off continuously from described carrier band along described length direction is less than more than 1.0 2.0 than α.
2. electronic component packing body as claimed in claim 1, is characterized in that:
Described peel resistance ratio is more than 1.4.
3. electronic component packing body as claimed in claim 1 or 2, is characterized in that:
Described peel resistance ratio is less than 1.8.
4. electronic component packing body as claimed any one in claims 1 to 3, is characterized in that:
Described each pars intermedia is round-shaped.
5. electronic component packing body as claimed any one in claims 1 to 3, is characterized in that:
Described each pars intermedia is polygonal shape.
6. electronic component packing body as claimed any one in claims 1 to 3, is characterized in that:
Described each pars intermedia comprises multiple widget.
7. the electronic component packing body according to any one of claim 1 to 6, is characterized in that:
Described each wire portion is continuous print shape on described length direction.
8. the electronic component packing body according to any one of claim 1 to 6, is characterized in that:
Described each wire portion is included in multiple short-term parts of configuration spaced apart on described length direction.
9. the electronic component packing body according to any one of claim 1 to 8, is characterized in that:
Described each pars intermedia and described two linear parts from.
10. the electronic component packing body according to any one of claim 1 to 8, is characterized in that:
Described each pars intermedia is with only separated from one another with any one mode be connected in described two wire portions.
11. electronic component packing bodies according to any one of claim 1 to 8, is characterized in that:
Described each pars intermedia is separated from one another in the mode be connected with described two wire portion both sides.
12. electronic component packing bodies according to any one of claim 1 to 11, is characterized in that:
Described cover strip has substrate layer and the knitting layer of mutual lamination.
13. electronic component packing bodies as claimed in claim 12, is characterized in that:
Described knitting layer forms described junction surface by thermo-compressed.
14. electronic component packing bodies as described in claim 12 or 13, is characterized in that:
Described substrate layer comprises transparent resin.
15. electronic component packing bodies according to any one of claim 1 to 14, is characterized in that:
Described carrier band comprises the resin sheet being implemented the embossing for the formation of described multiple housing recess and having processed.
16. electronic component packing bodies according to any one of claim 1 to 15, is characterized in that:
Described housing recess is rectangular shape when overlooking.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310576997.0A CN104648816A (en) | 2013-11-18 | 2013-11-18 | Electronic component packaging body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310576997.0A CN104648816A (en) | 2013-11-18 | 2013-11-18 | Electronic component packaging body |
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| CN104648816A true CN104648816A (en) | 2015-05-27 |
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| CN201310576997.0A Pending CN104648816A (en) | 2013-11-18 | 2013-11-18 | Electronic component packaging body |
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| CN113195373A (en) * | 2018-12-20 | 2021-07-30 | 株式会社村田制作所 | Electronic component string |
| US11164763B2 (en) | 2018-06-28 | 2021-11-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Carrier tape system and methods of using carrier tape system |
| CN114007954A (en) * | 2019-06-21 | 2022-02-01 | 株式会社村田制作所 | Electronic component housing container, electronic component string, method for manufacturing electronic component housing container, and method for manufacturing electronic component string |
| CN111315288B (en) * | 2017-11-10 | 2024-04-23 | 日东电工株式会社 | Attached biosensor |
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Application publication date: 20150527 |