JP2006199300A - Electronic component packaging band, and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a strip-shaped electronic component packaging band of an electronic component which is automatically mounted mainly on a wiring board or the like of various electronic instruments and used, and its manufacturing method in which dust or the like hardly enters in a housing part, and a reliably automatic mounting work is possible. <P>SOLUTION: Ingress of dust or the like into an accommodation part 11A is prevented by protruding a projecting part 12B having no hole or the like with a tip thereof having a substantially curved surface on a face opposite to an electronic component 2 on a lower side of a cover tape 12 to cover an upper opening part of the housing part 11A of a carrier tape 11, adhesion of the electronic component to the lower side of the cover tape 12 with oil is prevented, and an electronic component packaging band to be reliably and automatically mounted can be obtained. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention mainly relates to a band-shaped electronic component packaging band and a method of manufacturing the same for electronic components that are automatically mounted on wiring boards and the like of various electronic devices.

  In recent years, in various electronic devices, electronic components are automatically mounted on a wiring board and the like, and in electronic components such as switches and variable resistors, a strip-shaped packaging band in which electronic components are stored in a plurality of storage portions. More and more, so-called embossed tapes are being packaged and shipped.

  Such a conventional electronic component packaging band will be described with reference to FIG.

  FIG. 4 is a cross-sectional view of a conventional electronic component wrapping band. In FIG. 4, reference numeral 1 denotes a band-shaped carrier tape made of an insulating film, and a plurality of storage portions 1 </ b> A recessed in a substantially box shape are continuously formed at predetermined intervals. In addition, electronic parts 2 such as switches and variable resistors are housed in the same direction in these housing parts 1A.

  An insulating film strip cover tape 3 is attached to the upper surface of the carrier tape 1 so that the cover tape 3 covers the upper opening of the storage portion 1A to form an electronic component packaging strip.

  Further, such an electronic component wrapping band is wound and packed in a roll shape on a transport reel (not shown), and then stored and transported, and the electronic component 2 is placed on a wiring board (not shown) of the device. When this is automatically mounted, this transport reel is mounted on an automatic mounting machine (not shown).

  Then, after the belt-shaped electronic component packaging band is sent out from the transport reel by the automatic mounting machine and the cover tape 3 is peeled upward, the suction head (not shown) of the automatic mounting machine is removed from the storage portion 1A of the carrier tape 1. The electronic component 2 is grasped and taken out, placed on a predetermined position of the wiring board, and the electronic component 2 is mounted on the wiring board by reflow soldering or the like.

  When the cover tape 3 is peeled off from the carrier tape 1, if oil or the like adheres to the surface of the electronic component 2, the electronic component 2 sticks to the lower surface of the cover tape 3, and the electronic component 2 is electronically mounted during automatic mounting. In some cases, the automatic mounting work may be hindered, such as part 2 dropping off.

  Therefore, as shown in the cross-sectional view of FIG. 5, a plurality of opening protrusions 3B having a hole 3A in the center are formed on the lower surface of the cover tape 3, and electrons are not formed on the entire surface of the cover tape 3 but on the opening protrusion 3B having a small contact area. An electronic device that prevents the electronic component 2 from sticking to the lower surface of the cover tape 3 so that the automatic mounting operation is not hindered even when oil or the like adheres to the electronic component 2 so that the component 2 is in contact therewith. Parts wrapping bands are also considered.

As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
JP-A-4-31215

  However, in the conventional electronic component wrapping band, when the flat cover tape 3 is used, the electronic component 2 may stick to the automatic mounting work, and the lower surface of the cover tape 3 is prevented. In the case where the opening protrusion 3B is formed, dust or the like enters the storage portion 1A from the hole 3A of the opening protrusion 3B during transportation or the like, and enters the electronic component 2 such as a switch or a variable resistor, There was a problem that the operation of the component 2 may be hindered.

  The present invention solves such a conventional problem, and an object thereof is to provide an electronic component wrapping band in which dust or the like is unlikely to enter a storage unit and a reliable automatic mounting operation and a method for manufacturing the same. .

  In order to achieve the above object, the present invention has the following configuration.

  In the invention according to claim 1 of the present invention, an electronic component wrapping band is formed by forming a protruding portion having a substantially curved tip at the surface facing the electronic component on the lower surface of the cover tape. By forming a substantially curved protrusion without any gaps, dust can be prevented from entering the storage area, and electronic parts can be prevented from sticking to the underside of the cover tape due to oil, etc., enabling reliable automatic mounting work. It has the effect | action that an electronic component packaging band can be obtained.

  The invention according to claim 2 is the invention according to claim 1, wherein a protruding portion protruding upward is formed on the bottom surface of the carrier tape storage portion, and the electronic component is difficult to stick to the carrier tape side. Since the electronic components can be easily taken out from the storage portion during automatic mounting, the automatic mounting operation can be further ensured.

  According to a third aspect of the present invention, there is provided a belt-like cover tape comprising: a first rotating body having a plurality of protrusions formed on the outer periphery at predetermined intervals; and a second rotor having a hole corresponding to the protrusion formed on the outer periphery. After sandwiching between the rotating body and rotating the first and second rotating bodies to form a substantially curved protrusion on the cover tape, the electronic component is housed on the upper surface of the belt-like carrier tape. The electronic component wrapping band according to claim 1 is manufactured by covering the upper opening of the storage portion so as to cover the storage portion, and a protrusion can be formed by a simple method, and dust or the like enters the storage portion. It is possible to realize an electronic component wrapping band capable of preventing the problem and performing a reliable automatic mounting operation.

  As described above, according to the present invention, it is possible to obtain an advantageous effect that it is possible to obtain an electronic component wrapping band capable of preventing dust and the like from entering a storage unit and performing a reliable automatic mounting operation and a manufacturing method thereof. .

  Hereinafter, an embodiment of the present invention will be described with reference to FIGS.

  In addition, the same code | symbol is attached | subjected to the part of the structure same as the structure demonstrated in the term of the prior art, and detailed description is simplified.

(Embodiment)
FIG. 1 is a cross-sectional view according to an embodiment of the present invention, FIG. 2 is a plan view thereof, in which 11 is a belt-like carrier tape made of an insulating film such as polystyrene, and a plurality of recesses that are substantially box-shaped. The storage portion 11A is continuously formed at a predetermined interval in the longitudinal direction.

  A plurality of protrusions 11B projecting upward and a recess 11C at the center of the bottom surface are formed on the bottom surface of the storage portion 11A, and feed holes 11D are formed at predetermined intervals in the width direction end of the carrier tape 11. Is formed.

  And in these accommodating parts 11A, electronic parts 2 such as switches and variable resistors whose terminal parts and operation parts protrude from the side surfaces are accommodated in the same direction.

  Reference numeral 12 denotes a belt-like cover tape made of an insulating film such as polyethylene terephthalate. The cover tape 12 covers the upper opening of the storage portion 11A and is provided on both sides with a thermocompression-bonding adhesive layer on the lower surface. It is affixed on the upper surface of the carrier tape 11 by the seal portion 12A.

  Further, a plurality of protrusions 12B having a substantially curved tip are formed on the surface of the lower surface of the cover tape 12 facing the electronic component 2 with a slight gap from the upper surface of the electronic component 2 to form an electronic component packaging band. It is configured.

  In other words, in the electronic component wrapping band of the present invention, there is no hole or the like in the protrusion 12B formed to protrude from the lower surface of the cover tape 12, and this cover tape 12 opens the upper opening of the storage portion 11A of the carrier tape 11 on both sides. Since it is affixed and covered by the seal part 12A, the entry of dust or the like into the storage part 11A in which the electronic component 2 is stored is prevented.

  Next, a method for manufacturing the electronic component packaging band having such a configuration will be described with reference to the process diagram of FIG.

  In the drawings, the enlargement ratio is partially changed as necessary so that the configuration of each part can be easily understood.

  In the figure, reference numeral 13 denotes a first rotating body having projections 13A provided at predetermined intervals on the outer periphery, and 14 denotes a second rotating body having holes 14A corresponding to the projections 13A formed on the outer periphery. The rotating body 13 and the second rotating body 14 are opposed to each other so that the protrusion 13A and the hole 14A on the outer periphery are engaged with each other, and are arranged to be rotatable in synchronization with each other.

  Then, the strip-shaped tape material fed from the left direction passes between the outer circumferences of the first rotating body 13 and the second rotating body 14 while being sandwiched between the protrusions 13A and the hole portions 14A as they rotate. Then, the belt-like cover tape 12 is produced in which the protruding portions 12B having a substantially curved tip are protruded at a predetermined interval.

  At this time, the thickness of the cover tape 12 is about 50 μm to 70 μm, and the substantially curved projection 12B is formed at a height of 0.1 mm to 0.3 mm from the surface of the cover tape, and the projection 12B. Are formed so as to face at least two of the upper surfaces of the electronic component 2.

  Here, if the height of the protrusion 12B is lower than 0.1 mm, the protrusion 12B is liable to be crushed, so that the protrusion is difficult to maintain. If the height exceeds 0.3 mm, the protrusion 12B is easily broken and the cover tape 12 Is likely to occur.

  That is, it is preferable that the ratio of the height of the protrusion 12B with respect to the thickness of the cover tape 12 is usually between 1.5 times and 6 times, preferably between 2 times and 4 times.

  As a method of forming such a protrusion 12B on the cover tape 12, it is formed by passing a tape material intermittently with a feeder or the like between a vertically moving punch and a corresponding concave receiving portion. Although there is a method, as described above, the method of forming the protrusion 12B by passing the tape material between the first and second rotating bodies 13 and 14 as described above does not require a complicated feeding device. In addition, the protrusion 12B can be easily formed continuously at a high speed.

  Then, the cover tape 12 thus formed with the protrusion 12B is sent downward and sent from the right direction, and a small electronic component 2 such as a detection switch is placed in a predetermined direction in the storage portion 11A. On the upper surface of the stored carrier tape 11, the tip of the protrusion 12 </ b> B is placed so as to face the electronic component 2.

  Thereafter, the overlapped cover tape 12 and carrier tape 11 pass through a sealing device 15 provided with a heater (not shown), a press punch (not shown), etc., and the seal portion 12A on the lower surface of the cover tape 12 is thermocompression bonded. As a result, an electronic component packaging band in which the cover tape 12 is attached to the upper surface of the carrier tape 11 in which the electronic component 2 is stored in the storage portion 11A is completed.

  Further, such an electronic component wrapping band is wound and packed in a roll shape on a transport reel (not shown), and then stored and transported, and the electronic component 2 is placed on a wiring board (not shown) of the device. When this is automatically mounted, this transport reel is mounted on an automatic mounting machine (not shown).

  Then, after the belt-shaped electronic component packaging band is sent out from the transport reel by the automatic mounting machine and the cover tape 12 is peeled upward, the suction head (not shown) of the automatic mounting machine is removed from the storage portion 11A of the carrier tape 11. The electronic component 2 is grasped and taken out, placed on a predetermined position of the wiring board, and the electronic component 2 is mounted on the wiring board by reflow soldering or the like.

  At this time, the substantially curved projection 12B of the cover tape 12 faces the top surface of the electronic component 2, and the area where the projection 12B and the top surface of the electronic component 2 are in contact with each other is small. Even when oil or the like is attached to the cover tape 12, the electronic component 2 is not attached to the cover tape 12 when the cover tape 12 is peeled off from the carrier tape 11, and reliable automatic mounting on the wiring board is possible.

  Further, the lower surface of the electronic component 2 abuts against the protrusion 11B on the bottom surface of the storage portion 11A, and since the contact area is also small, the bottom surface of the storage portion 11A and the electronic component 2 are difficult to stick. It is easier to remove from the storage portion 11A.

  As described above, according to the present embodiment, the protrusion 12B having no hole or the like on the surface facing the electronic component 2 on the lower surface of the cover tape 12 is formed so as to protrude to the storage portion 11A. In addition to preventing the intrusion of dust and the like and preventing the electronic component from sticking to the lower surface of the cover tape 12 by oil or the like, an electronic component packaging band capable of performing a reliable automatic mounting operation can be obtained.

  Note that the electronic component 2 such as a switch or a variable resistor has a movable portion such as an operation unit as compared with a passive component such as a semiconductor or a capacitor. If it penetrates into the inside, it is considered that the operation of these movable parts may be hindered. Therefore, in such a mechanical component, it is particularly important to prevent dust during transportation and storage.

  In addition, by forming a protruding portion 11B that protrudes upward on the bottom surface of the storage portion 11A of the carrier tape 11, the lower surface of the electronic component 2 abuts on the protruding portion 11B and the contact area becomes small. The electronic component 2 can be easily taken out from the storage portion 11A during automatic mounting, and the automatic mounting operation can be made more reliable.

  Further, by forming the recess 11C at the approximate center of the bottom surface of the storage portion 11A, even if the protrusion 11B is deformed or crushed, the contact area with the lower surface of the electronic component 2 can be reduced. It becomes.

  Between the first rotating body 13 having a plurality of protrusions 13A formed on the outer periphery at predetermined intervals and the second rotating body 14 having a hole portion 14A corresponding to the protrusion 13A formed on the outer periphery, a belt-like shape is formed. By sandwiching the cover tape 12 and rotating the first and second rotating bodies 13 and 14 to form a substantially curved projection 12B on the cover tape 12, an electronic component packaging band can be formed in a simple manner. Can be produced.

  The electronic component wrapping band and the method for manufacturing the same according to the present invention have the effect that dust and the like are difficult to enter in the storage portion and can be surely automatically mounted, and are mainly used for wiring boards of various electronic devices. This is useful for electronic parts that are automatically mounted on a device.

Sectional drawing of the electronic component packaging band by one embodiment of this invention Plan view Process diagram showing the manufacturing method Sectional view of a conventional electronic component packaging band Cross section

Explanation of symbols

2 Electronic parts 11 Carrier tape 11A Storage part 11B, 12B Protrusion part 11C Concave part 11D Feed hole 12 Cover tape 12A Seal part 13 First rotary body 13A Projection 14 Second rotary body 14A Hole part 15 Sealing device

Claims (3)

A band-shaped carrier tape in which electronic components are stored in a plurality of storage portions formed in a substantially box-like shape at predetermined intervals, and a belt-shaped cover tape that covers the upper opening of the storage portion and is attached to the carrier tape An electronic component wrapping band comprising a protrusion having a substantially curved tip on the surface of the lower surface of the cover tape facing the electronic component. The electronic component packaging band according to claim 1, wherein a protrusion projecting upward is formed on a bottom surface of the storage portion of the carrier tape. A band-shaped cover tape is sandwiched between a first rotating body in which a plurality of protrusions are formed on the outer periphery at predetermined intervals, and a second rotating body in which holes corresponding to the protrusions are formed on the outer periphery, After the first and second rotating bodies are rotated to form a substantially curved protrusion on the cover tape, this is formed on the upper surface of the band-shaped carrier tape on the upper opening of the storage section in which the electronic components are stored The manufacturing method of the electronic component packaging band of Claim 1 stuck so that it may cover.

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