JP3129439U - Electronic parts transport tape - Google Patents

Abstract

The present invention provides an electronic component carrying tape that can keep the manufacturing cost of the electronic component carrying tape low and can efficiently accommodate the electronic component.
A carrier tape 1 includes a belt-like mount 3 having rectangular through holes 2a and 2b formed at a predetermined interval in the length direction at a substantially central portion in the width direction, and one surface 3a of the mount 3. Are attached to the bottom cover tape 5 that makes the through-hole 2 the bottomed storage pocket 4, the minimal chip 6 placed in the storage pocket 4, and the other surface 3 b of the mount 3, and the minimal chip 6 And a top cover tape 7 for closing the opening of the storage pocket 4 containing the.
[Selection] Figure 1

Description

  The present invention relates to an electronic component transport tape provided with a plurality of recesses for accommodating electronic components.

  In recent years, the reduction in size and weight of various mobile devices has been remarkable. As mobile devices become smaller and lighter, printed circuit boards used in mobile devices and various electronic components mounted on printed circuit boards also become smaller. Recently, ultra-small chips such as ultra-small multilayer ceramic capacitors such as 1005 size (1.0 mm × 0.5 mm) and 0603 size have been widely used.

  Such electronic components are often mounted on a printed circuit board by an automatic mounting machine. Electronic parts are delivered and shipped in a state where they are accommodated in a dedicated tape for transporting electronic parts called carrier tape.

  This carrier tape includes a strip-shaped substrate (mounting paper) that is a main tape portion, a top cover tape as a chemical product that is attached to the surface of the belt, and a bottom cover tape as a chemical product that is attached to the back surface of the substrate. It has.

  A storage pocket (through hole or recess) for storing an electronic component is formed in the base. The storage pockets are provided in a row at a predetermined interval in the carrier tape transport direction in the base.

The electronic component is accommodated in the carrier tape described above by a dedicated automatic mounting machine. The automatic mounting machine vacuum-sucks the electronic components supplied in an aligned state from the parts feeder with a suction nozzle (collet), releases the vacuum suction after being transferred directly above and inside the storage pocket, and puts the electronic components in the storage pocket. Insert.
Utility Model Registration No. 3125338

  By the way, the carrier tape as described above has a main width of 8 mm, but in recent years, the demand for a carrier tape having a width of 4 mm, which is half that width, has been increasing.

  This is because the size of the storage pocket provided on the base body is reduced with the miniaturization of the electronic component, and the ratio of the storage pocket area to the base board area is reduced. That is, as the size of the storage pocket becomes smaller, the blank space in the base body increases.

  Therefore, the width of the carrier tape was halved to 4 mm in order to eliminate the blank portion of the substrate as much as possible. Thereby, the reduction of the material cost required for the substrate and the saving of the material can be realized.

  However, the conventional automatic mounting machine for mounting electronic components on a carrier tape having a width of 8 mm does not meet the standards, and the electronic components cannot be mounted on a carrier tape having a width of 4 mm. Therefore, in order to mount an electronic component on a carrier tape having a width of 4 mm, a dedicated device must be introduced, resulting in an increase in manufacturing cost.

Then, this invention makes it a subject to provide the tape for electronic component conveyance which can hold an electronic component efficiently while suppressing the manufacturing cost of the tape for electronic component conveyance low.

  The present invention has been made in view of the above-mentioned matters, and the present invention is an electronic component transport tape including a band-shaped base body in which a concave storage pocket for storing an electronic component and a feed hole for transport are formed. The storage pockets are arranged in a plurality of rows at predetermined intervals along the longitudinal direction of one side of the base body, and the feed holes are predetermined along the longitudinal direction of the other side of the base body. It is characterized by being arranged in a row at intervals. That is, the electronic component transport tape of the present invention is provided with transport holes on one side in the longitudinal direction of the substrate, and a plurality of storage pockets on the opposite side.

  Thereby, there is no extra space in the base of the electronic component transport tape, and a large number of storage pockets can be provided, so that a large number of electronic components can be stored.

  Furthermore, according to the present invention, since the amount of electronic components accommodated around the length increases as compared with the conventional electronic component transport tape, the length of the electronic component transport tape can be shortened. Accordingly, according to the present invention, the manufacturing time of the electronic component transport tape can be shortened.

  Further, the storage pockets provided in adjacent rows according to the present invention can be configured to be shifted to positions that do not overlap each other in the short direction of the base.

  Thereby, the space of the substrate can be used efficiently. Furthermore, since the storage pockets are arranged alternately, the size of the storage pockets can be easily changed for each column.

  Since the sizes of the storage pockets can be made different for each row, a plurality of types (sizes) of electronic components can be conveyed together with one electronic component conveying tape. This eliminates the need to use an electronic component transport tape that matches the size and shape of the electronic component, thereby reducing the manufacturing cost and materials of the electronic component transport tape.

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to provide the electronic component conveyance tape which can hold down an electronic component efficiently while suppressing the manufacturing cost of the electronic component conveyance tape low.

  Hereinafter, the electronic component transport tape of the present embodiment (referred to as a carrier tape in the present embodiment) will be described with reference to the drawings.

Example 1
FIG. 1 shows a state in which an electronic component 6 is accommodated in the carrier tape 1 of this embodiment. The electronic component 6 according to this embodiment is a minimal IC chip (hereinafter referred to as a minimal chip).

  The carrier tape 1 has a belt-like mount (base) 3 having rectangular through holes 2 a and 2 b formed at predetermined intervals in the length direction, and one surface 3 a of the mount 3 at a substantially central portion in the width direction. The bottom cover tape 5 is bonded to the bottomed storage pocket 4 with the through holes 2a and 2b, the very small chip 6 placed in the storage pocket 4, and the other surface 3b of the mount 3 to be bonded to the minimal chip. And a top cover tape 7 that closes the opening of the storage pocket 4 containing 6. In addition, although the mount 3 and the bottom cover tape 5 in this embodiment are made of paper, they can be formed of a saturated polyester resin or polystyrene resin.

  As shown in FIG. 2, the through holes 2 a and 2 b according to the present embodiment are provided in two rows along the longitudinal direction of the mount 3 (the length direction of the tape). In the present embodiment, the first row and the second row are arranged from the side closer to the outer side of the longitudinal side of the mount 3, the first row of through holes is 2 a, and the second row of through holes is 2 b.

  Moreover, the through-hole 2a and the through-hole 2b are formed in a quadrangle having a horizontal A = 0.65 ± 0.03 mm and a vertical B = 1.15 ± 0.03 mm. Then, adjacent through holes 2a and 2a in the first row or between the through holes 2b and 2b in the second row are perforated in rows with an interval of C = 2.0 ± 0.05 mm. ing.

  Furthermore, although the first row of through holes 2a and the second row of through holes 2b are provided in parallel, the through holes 2a and the through holes 2b are arranged so as not to be in the same position. That is, the second row of through-holes 2b are provided at positions facing the space between the first row of through-holes 2a and the through-holes 2a.

  The mount 3 has a width D = 8.0 ± 0.1 mm and a thickness E = 0.42 ± 0.02 mm (see FIG. 3).

  The mount 3 is further formed with a feed hole 8 that engages with a tape feed claw (not shown) provided in the automatic mounting machine. The feed hole 8 is a round hole having a diameter F = 1.50 ± 0.1 mm. The center of the feed hole 8 is formed at a position G = 1.75 ± 0.1 mm away from the side edge of the mount 3, and adjacent feed holes are drilled with an interval of H = 2.5 ± 0.05 mm. Has been. The through holes 2a and 2b and the feed hole 8 are punched out at a predetermined interval along the length of the tape by a press die (not shown) composed of a die and a punch.

  Further, the bottom cover tape 5 extends along the longitudinal direction of the mount 3. The width of the bottom cover tape 5 may be a position that covers the lower part of the through holes 2a and 2b and does not cover the lower part of the feed hole 8. Specifically, the width is 5.3 ± 0.05 mm, the thickness is 0. It is formed to 04 ± 0.01 mm. Note that the bottom cover tape 5 may be composed of either a single layer or a plurality of layers, similarly to the mount 3.

  Further, the bottom cover tape 5 is coated with an adhesive 9 made of a natural material such as starch paste on both side edges of the mating surface 5a with the mount 3. The adhesive 9 includes additives such as an antioxidant, an ultraviolet absorber, a rust inhibitor, a softener surfactant, an antistatic agent, a filler, a coupling agent, and a crosslinking agent in addition to starch as a main component. It is. The bottom cover tape 5 is bonded to the mount 3 by the adhesive 9.

  In addition, although the softening temperature (melting temperature) of the adhesive material 9 of a present Example uses what is higher than 70 degreeC, the adhesive material which consists of natural materials, such as starch paste, has permeability, and an applicable adhesive material has it. In the dry state, it is not normally affected by temperature changes. In this way, the use of a natural material for the adhesive 9 can give consideration to the environment.

  Further, as shown in FIG. 1, the application width of the adhesive 9 of this embodiment is I = 1 ± 0.5 mm, and the application amount is 520 mmg / m. Even if the adhesive material 9 is melted by this coating width and coating amount, the melted adhesive material 9 does not reach the minimum chip accommodated in the through holes 2a and 2b, and still has sufficient adhesion. Power can be secured.

Further, if the adhesive 9 is colored, the state of the adhesive 9 after the bottom cover tape 5 is pasted to the mount 3 can be visually observed. Therefore, the portion where the adhesive 9 is not sufficiently applied to the mount 3 is removed. It can be recognized relatively easily. Further, by coloring the adhesive 9, it is possible to mechanically detect that the amount of adhesion is not uniform using a color identification sensor (color sensor).

  The top cover tape 7 extends so as to be parallel to the bottom cover tape 5 along the longitudinal direction of the mount. The top cover tape 7 is heat sealed and attached to the mount 3. That is, the mount 3 is sandwiched between the top cover tape 7 and the bottom cover tape 5.

  Furthermore, the top cover tape 7 is made of a material (made of resin) having transparency to the extent that the accommodated minimal chip 6 can be visually recognized from the outside. The top cover tape 7 may be formed of an opaque material (for example, paper). In this case, an adhesive similar to the adhesive 9 of the bottom cover tape 5 can be used.

  In addition, the top cover tape 7 may contain conventional additives (for example, an antistatic agent, an oxidizing agent, a coupling agent, etc.) as necessary.

  Further, the minimal chip 6 fitted into the storage pocket 4 (through holes 2a, 2) is slightly larger than the through holes 2a, 2b (storage pocket 4).

  As described above, in the carrier tape 1 of the present embodiment, the first row of the through holes 2 a and the second row of the through holes 2 b are provided in parallel on the mount 3. That is, the mount 3 according to the present embodiment provided further through holes in the blank space. Therefore, it is possible to increase the accommodation amount per length of the miniature chip as compared with the conventional carrier tape in which one row of through holes is provided for one mount.

  This also makes it possible to effectively use the surface area of the current tape when miniaturizing electronic components such as microchips. This eliminates the need to manufacture a carrier tape having a width of 4 mm, thereby reducing the manufacturing cost required for the carrier tape having a width of 4 mm and the cost of introducing an automatic mounting machine dedicated to the carrier tape having a width of 4 mm. In order to mount the micro chip 6 on the carrier tape 1 of this embodiment, the suction nozzle is used for the first row and the second row, and the method is the same as the conventional method.

  Furthermore, reducing the blank space of the mount 3 reduces the amount of use of the bottom cover tape 5, the top cover tape 7 and the adhesive 9 in addition to the mount 3, and can give excellent consideration to the environment. . Accordingly, according to the carrier tape 1 of the present embodiment, the manufacturing cost can be reduced.

  Further, since the through hole 2a and the through hole 2b of the present embodiment are arranged at positions shifted from each other in the short direction of the mount 3, the margin of the mount 3 can be eliminated uniformly. Thereby, the strength of the mount 3 can be made uniform. As shown in FIG. 4, the through hole 2 a and the through hole 2 b may be provided at positions that overlap each other in the short direction of the mount 3. By arranging the through holes 2a and the through holes 2b so as not to shift the positions in the short direction, the electronic components can be mounted without shifting the mounting pitch of the suction nozzles when mounting the electronic components.

(Other embodiments)
As shown in FIG. 5, the carrier tape of this aspect is characterized in that the first row of through holes 2a and the second row of through holes 2b are different in size. In addition, since the carrier tape 1 of this aspect is the structure substantially the same as the carrier tape 1 of embodiment mentioned above, the same code | symbol is attached | subjected to the same structure and description is simplified.

According to the carrier tape 1 of this aspect, two types of electronic components can be accommodated in one type of carrier tape.

  Although not shown, the same effect as described above can be obtained even when the first row of through holes 2a and the second row of through holes 2b are changed in shape.

(Example 2)
The carrier tape of the present embodiment is characterized in that the storage pocket 4 is a bottomed press pocket as shown in FIGS. In addition, since the carrier tape 1 of this aspect is the structure substantially the same as the carrier tape 1 of Example 1 mentioned above, the same code | symbol is attached | subjected to the same structure and description is simplified.

  The base 3 of the carrier tape 1 of this embodiment is a chemical product such as saturated polyester resin or polyethylene resin. The storage pocket 4 provided in the base 3 is formed in a concave shape having a bottom portion 4a. In addition, the storage pocket 4 of the present embodiment is formed by a heating press or mold molding.

  The minimal chip 6 is stored in the storage pocket 4 by being placed on the bottom 4a. The storage pockets 4 in this embodiment are provided in two rows along the longitudinal direction of the base 3 (the length direction of the tape), and the storage pockets 4 in the respective rows are arranged so as to be staggered. Suppose that

  By using the base 3 as a chemical product like the carrier tape 1 of the present embodiment, the storage pocket 4 can be formed by heating press or die molding. That is, it is not necessary to cut or cut the base 3 in order to form the concave portion of the storage pocket 4.

  Thereby, since dust is not generated when the storage pocket 4 is formed, the cost required for processing the dust can be reduced and environmental safety can be improved.

  The storage pockets 4 according to the present embodiment have been described as being provided in two rows with respect to the longitudinal direction of the base 3, and the storage pockets in each row are alternately arranged. As described above, the present invention can also be applied to storage pockets in the case where the storage pockets in each row are provided at the same position or storage pockets in which the sizes of the storage pockets in each row are different.

  The present invention is not limited to the illustrated examples described above, and various changes can be made without departing from the scope of the present invention.

1 is an overall perspective view of a carrier tape of Example 1. FIG. 3 is a plan view of a mount according to Embodiment 1. FIG. It is XX sectional drawing in FIG. 6 is a plan view of a mount in another form of Example 1. FIG. 6 is a plan view of a mount of another embodiment of Example 1. FIG. 6 is a plan view of a base according to Example 2. FIG. It is ZZ sectional drawing in FIG.

Explanation of symbols

1 Carrier tape (electronic parts transport tape)
2a, 2b Through hole 3 Mount (base)
3a Surface 3b Surface 4 Storage pocket 5 Bottom cover tape 5a Surface 6 Minimal chip (electronic component)
7 Top cover tape 8 Feed hole 9 Adhesive

Claims (3)

An electronic component transport tape comprising a concave storage pocket for storing an electronic component and a belt-like substrate on which a feed hole for transport is formed,
The storage pockets are arranged in a plurality of rows at predetermined intervals along the longitudinal direction of one side of the base body,
The electronic component transport tape according to claim 1, wherein the feed holes are arranged in a line at a predetermined interval along a longitudinal direction of the other side of the base.   2. The electronic component transport tape according to claim 1, wherein the storage pockets provided in adjacent rows are shifted from each other in a position where they do not overlap each other in the short direction of the base.   The electronic component transport tape according to claim 1, wherein the storage pocket has a different storage pocket size for each row.

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