JP3125338U - Electronic parts transport tape - Google Patents

Abstract

The present invention prevents an extremely small chip from adhering with an adhesive in accordance with a change in environment.
A tape-like mount 2 having a large number of through holes 51 for transporting a very small chip 8 is provided.
And a bottom cover tape 14 that forms the through hole 51 in the electronic component storage pocket 511 that opens to the other surface 2b of the mount 2 by being bonded to the one surface 2a of the mount 2 along the longitudinal direction thereof, A carrier tape 1 having a microchip 8 placed in an electronic component storage pocket 511 and a top cover tape 7 that closes an opening 511 a of the electronic component storage pocket 511.
[Selection] Figure 1

Description

  The present invention relates to an electronic component transport tape.

  Portable electric products such as video cameras and mobile phones are required to be small and light because they are carried around, and the demand is increasing. Accordingly, electronic components (hereinafter referred to as chips) mounted on the printed circuit boards of these electric products are becoming smaller year by year, and recently, extremely small chips such as “1005” and “0603” are frequently used.

  Usually, an automatic mounting machine is used to mount a microchip on a printed circuit board. In an automatic mounting machine, a large number of microchips are conveyed and supplied from a parts feeder by a dedicated tape called a carrier tape for conveying an electronic component.

  The carrier tape includes a base sheet that is a main tape portion, and a bottom cover tape and a top cover tape as chemical products that are attached to both sides of the mount.

  The mount is embedded with a very small chip. Therefore, the mount has at least the same thickness as the minimum chip. For embedding, a chip-sized through-hole is provided in the longitudinal direction of the mount, and a bottom cover tape is heat-sealed (taped) on one side of the mount on the back surface. It becomes a storage pocket to store.

  After the minimal chip is inserted into the storage pocket, the top cover tape is heat-sealed on the surface which is the other side of the mount, and as a result, a carrier tape in which the minimal chip is enclosed in the mount is completed. Such a carrier tape is wound up in a reel shape, set in a parts feeder, and sent out to the automatic mounting machine described above. Such a carrier tape feeding method is called a taping reel method.

  When the carrier tape is sent out to the automatic mounting machine by the taping reel method, the top cover tape is peeled off and then stored in the storage recess in the production line such as a circuit board on which the automatic mounting machine is installed. A very small chip is automatically sucked by an air nozzle and supplied to a desired location on a circuit board. Such a system is called an automatic incorporation system.

  By the way, the bottom cover tape has a hot melt adhesive applied to the entire surface for the taping. The softening temperature (melting temperature) of the hot melt adhesive is relatively low at 70 ° C. For this reason, when the inside of a container becomes high temperature, for example while transporting the carrier tape in which the minimum chip | tip is embed | buried with a container, it is possible that an adhesive agent melt | dissolves and adheres to a minimum chip | tip. Then, even if the minimal chip is adsorbed by the air nozzle in the automatic assembly system, the minimal chip cannot be adsorbed while adhering to the bottom cover tape, and as a result, there is a possibility that the supply of the minimal chip to the circuit board may be hindered.

In the present specification, for convenience of explanation, a tape in which the bottom cover tape is simply pasted to the mount and the microchip is not yet embedded in the electronic component storage pocket is referred to as an electronic component transport tape, A tape in which an extremely small chip is embedded in an electronic component storage pocket of an electronic component transport tape and the electronic component storage pocket is sealed with a top cover tape is referred to as a carrier tape.

  The present invention has been made in view of the above circumstances, and a problem to be solved is to provide a technology capable of stably supplying a very small chip to a circuit board regardless of changes in the environment. .

Therefore, the electronic device transport tape of the present invention employs the following means in order to solve the above-described problems.
That is, the electronic component transport tape of the present invention has a tape-like mount in which a number of through-holes are drilled in the longitudinal direction for transporting electronic components, and one of the front and back surfaces of the mount in the longitudinal direction. And a bottom cover tape that forms the through hole in an electronic component storage pocket that opens to the other surface of the mount, and the bottom cover tape is made of paper, and is attached to the mount. The adhesive is applied only on both edge sides of the mating surfaces.

  Here, the adhesive is preferably a paste made of a natural material such as natural paste and has a softening temperature (melting temperature) higher than 70 ° C. However, in general, an adhesive made of a natural material such as starch paste is permeable, and is usually not affected by temperature changes when the adhesive is dry.

Since the adhesive is not applied to the entire surface of the bottom cover tape but is applied only to the side edges, the absolute amount of the adhesive is small. Therefore, since there is no excess adhesive, even if the adhesive is melted, it is possible to suppress the adhesion of the adhesive to the minimal chip as much as possible.
Therefore, even if the environment surrounding the electronic component transport tape becomes high temperature, it is possible to prevent the adhesive from melting and adhering to the microchip.
Since the mount and the bottom cover tape are made of paper, it is possible to save the trouble of separating them when disposing them.

  Therefore, when the tiny chip is sucked by the air nozzle, the tiny chip adheres to the tape with the adhesive, and the tiny chip cannot be sucked by the air nozzle, which causes a problem in supplying the tiny chip to the circuit board. This problem can be solved effectively.

The specific example of the carrier tape 1 which concerns on this invention with reference to FIGS. 1-6 is shown.
The carrier tape 1 has a strip-shaped mount 2 having a large number of rectangular through-holes 51 formed at predetermined intervals in the length direction at a substantially central portion in the width direction (see FIG. 4), and one surface 2 a of the mount 2. A bottom cover tape 4 which is bonded to form the through hole 51 as a bottomed storage pocket 511 (see FIGS. 1, 3 and 6), a minimal chip 8 placed in the storage pocket 511 (see FIG. 1), and a mount 2 and a top cover tape 7 that closes the opening 511a of the storage pocket 511 containing the microchip 8 (see FIGS. 1 to 3).

  The mount 2 is made of paper and has a thickness dimension of about 0.42 ± 0.02 mm and a width dimension of about 8.0 ± 0.1 mm. And it has many tape feed holes 6 other than the said through hole 51 (refer FIGS. 1-6). The through hole 51 and the tape feed hole 6 are punched out by a press die (not shown) composed of a die and a punch. Both holes 5 and 6 are formed at regular intervals along the length direction of the tape.

The through hole 51 has a horizontal dimension of 0.65 ± 0.03 mm and a vertical dimension of 1.15 ± 0.03.
It has a size of mm and is drilled with an interval of about 2.0 ± 0.05 mm between adjacent through holes 51.
The tape feed hole 6 is a round hole having a diameter of about 1.50 + 0.1 mm, the center of which is formed at a position 1.75 ± 0.1 mm away from the side edge of the mount 2, and the adjacent tape feed hole 6 The hole 6 is perforated with a gap of about 4.0 ± 0.05 mm.

  When the carrier tape 1 is wound up in a reel shape and attached to the parts feeder, the tape feed hole 6 of the mount 2 is locked with a tape feed claw (not shown) provided in the parts feeder. Then, the carrier tape 1 wound in a reel shape is fed out from the parts feeder by moving the tape feeding claw in this state.

  The mount 2 made of paper is not particularly limited as long as it has a self-supporting property. For example, those made of a paper material capable of maintaining its form, such as Japanese paper, crepe paper, synthetic paper, mixed paper, and composite paper, are preferable. A resin, metal, or the like may be mixed. The mount 2 may be composed of a single layer or a multilayer.

  Both the through hole 51 and the tape feed hole 6 can be formed simultaneously by punching, or the other hole can be formed before or after forming either hole.

  The bottom cover tape 4 is made of paper like the mount 2 and extends along the longitudinal direction of the mount 2. The width dimension is set so as to extend from one edge of the bottom cover tape 4 to the vicinity of the tape feed hole 6. Specifically, the thickness dimension is about 0.04 ± 0.01 mm and the width dimension is about 5.3 ± 0.05 mm.

  Further, the bottom cover tape 4 is applied with an adhesive 3 made of a natural material such as starch glue only on both sides of the mating surface 4 a with the mount 2, and the bottom cover tape 4 is bonded to the mount 2 by the adhesive 3. . Further, the adhesive material 3 having a softening temperature (melting temperature) higher than 70 ° C. is used. However, an adhesive made of a natural material such as starch paste is permeable and is usually not affected by temperature changes when the adhesive is dry.

  Furthermore, the application width of the adhesive 3 is about 1 ± 0.5 mm. As long as the coating width is the same, even if the adhesive 3 is melted, the melted adhesive 3 does not reach the minimum chip 8 in the through-hole 51 and still has a sufficient adhesive force. The coating amount is determined to the extent that it can be secured. For example, it is 520 mmg / m.

  Further, if the adhesive 3 is colored, the state of the adhesive 3 after the bottom cover tape 4 is bonded to the mount 2 can be visually checked, so that the adhesive 3 is not sufficiently applied to the mount 2 Can be found relatively easily. Further, it is possible to mechanically detect that the adhesion amount is not uniform by using a color identification sensor (color sensor) by the coloring.

  Similarly to the mount 2, the bottom cover tape 4 may be composed of a single layer or multiple layers, and the thickness can be appropriately selected within a range in which the mechanical strength, handling properties, etc. are not impaired, for example, about 40 μm. It is.

  Further, the bottom cover tape 4 may be provided with conventional additives, for example, antioxidants, ultraviolet absorbers, softeners, rust inhibitors, inorganic particles, conductive metal powders, organic conductive polymer agents, if necessary. A coupling agent such as titanium or silane may be added. Furthermore, the bottom cover tape 4 is a paper (neutral paper) made under neutral and weakly alkaline conditions having a hydrogen ion index of 7.0 to 8.0, and even if it has little fading and excellent storage stability. Good.

  The adhesive 3 of the bottom cover tape 4 includes additives such as antioxidants, ultraviolet absorbers, rust inhibitors, softeners, surfactants, antistatic agents, fillers, coupling agents, and crosslinking agents. It may be.

  The microchip 8 can be exemplified by a precision small component such as an IC chip. The size is slightly larger than the through-hole 51 (storage pocket 511), and is a degree of an interference fit that can be sufficiently adsorbed by the air nozzle of the automatic insertion system described in the prior art. In addition, since it is known per se about how to put the microchip 8 in the storage pocket 511, the description is omitted because it is originally included. Further, in the drawing, in order to clearly show the existence of the storage pocket 511 and the minimum chip 8 put in the storage pocket 511, the minimum chip 8 is shown smaller than the through hole 51 (storage pocket 511).

  The top cover tape 7 also extends parallel to the bottom cover tape 4 along the longitudinal direction of the mount 2. The top cover tape 7 is also heat-sealed and bonded to the mount 2, and the mount 2 is sandwiched by the top cover tape 7 and the bottom cover tape 4.

  Furthermore, it is preferable that the top cover tape 7 has transparency enough to allow the stored minimal chip 8 to be visually recognized from the outside, since the presence of the minimal chip 8 can be confirmed from the outside. Therefore, the top cover tape 7 may be preferably formed of a transparent or translucent plastic film or sheet. However, the top cover tape 7 does not have to be particular about it, and may be made of paper and opaque like the bottom cover tape 4. In the case of paper, an adhesive 3 similar to the adhesive 3 of the bottom cover tape 4 can be used.

  If necessary, the top cover tape 7 may be provided with conventional additives such as antistatic agents, antioxidants, ultraviolet absorbers, softeners, rust inhibitors, inorganic particles, conductive metal powders, organic conductive high additives. A molecular agent, a coupling agent, etc. may be contained.

Next, the effect of such a carrier tape 1 is demonstrated.
The bottom cover tape 4 is bonded to the mount 2 using the adhesive 3 so as to cover the bottom surface of the through hole 51 formed in the mount 2, thereby constituting the electronic component transport tape 14 (FIG. 1). 3, 6). The storage pocket 511 is defined by the adhesion as described above.

  The bottom surface of the storage pocket 511 is the surface of the fabric of the bottom cover tape 4 and there is no adhesive layer there (in FIG. 6, the adhesive is attached to the bottom cover tape 4 between the mount 2 and the bottom cover tape 4). It is shown in a state where there is a gap as much as the agent 3 is applied, but in reality, such a gap is so fine that it can be ignored.)

  Therefore, in the carrier tape 1, the minimal chip 8 stored in the storage pocket 511 is not placed on or placed on the adhesive layer as in the prior art, so the minimal chip 8 does not contact the adhesive layer ( (See FIGS. 3 and 6).

  Further, the adhesive 3 used is an adhesive made of a natural material such as starch paste, which is permeable and is not affected by temperature changes when the adhesive is dry. Therefore, the adhesive material 3 of the carrier tape 1 can be effectively prevented from melting and adhering to the minimal chip 8.

Even if the carrier tape 1 is exposed to a high temperature and the adhesive 3 is softened during transportation and storage of the carrier tape 1, the adhesive 3 adheres to the entire surface of the bottom cover tape 4. It is not applied, but is applied only to both side edges thereof, so that the absolute amount of the adhesive 3 is small. That is, since there is no excess adhesive, it can be suppressed as much as possible that the adhesive reaches the minimum chip 8 even if it is melted.

  As described above, in the carrier tape 1, the minimal chip 8 stored in the storage pocket 511 is not attached or adhered to the bottom cover tape 4 due to the influence of the adhesive 3 of the bottom cover tape 4. Is in a free state. Therefore, in the state where the top cover tape 7 is peeled off from the carrier tape 1, the minimum chip 8 can be easily sucked to attract the minimum chip 8 with the air nozzle, so that the takeout property of the minimum chip 8 is improved.

  Further, when the bottom cover tape 4 is made of a highly transparent material, the housed minimal chip 8 can be viewed from the outside. For this reason, it is possible to easily perform an appearance inspection such as the shape and quantity of the accommodated microchip 8.

Furthermore, since the mount 2 and the bottom cover tape 4 are made of paper, it is possible to save time and labor for sorting them.
In addition, it can be said that the adhesive is environmentally friendly because it is an adhesive made of a natural material.

  Furthermore, by coloring the adhesive 3, the state of the adhesive after the bottom cover tape 4 is bonded to the mount 2 can be visually observed. For this reason, a defective part of adhesion can be easily found. It is also possible to mechanically detect that the amount of adhesion is not uniform using a color identification sensor (color sensor) due to the coloring, and in this case, the discrimination power is improved.

  When the through hole 51 and the tape feed hole 6 are punched into the mount 2, the microchip 8 is then attached to the electronic component transport tape 14 by providing the electronic component transport tape 14 to which the bottom cover tape 4 is bonded. For the mounting manufacturer that forms the carrier tape 1 by attaching the top cover tape 7 and then attaching the top cover tape 7 to the storage pocket 511, the carrier including the minimal chip 8 is simply attached to the storage pocket 511. Since the tape 1 can be formed, workability is improved.

It should be noted that the present invention is not limited to the illustrated examples described above, and it is needless to say that various modifications can be made without departing from the scope of the present invention.
For example, a small precision component such as an IC chip is exemplified as an item that enters the electronic component storage pocket 511, but there is no need to be particularly concerned as long as it can enter the electronic component storage pocket 511 and be conveyed by the carrier tape 1.

1 is an overall perspective view of a carrier tape according to the present invention. It is a top view of FIG. FIG. 3 is a cross-sectional view of FIG. 2. It is a top view of only a mount. It is a cross-sectional view of FIG. It is a cross-sectional view of the tape for electronic component conveyance formed by affixing a bottom cover tape on a mount.

Explanation of symbols

1 Carrier tape 2 (Mount)
2a (one side)
2b (the other side)
3 Adhesive 4 (Bottom cover tape)
4a Matching surface with mount 5 (through hole)
6 Feeding hole 7 Top cover tape 8 Minimal chip (electronic component)
14 Electronic component transport tape 51 Through hole 511 Electronic component storage pocket 511a Opening of electronic component storage pocket

Claims (5)

A tape-shaped mount with a number of through holes drilled in the longitudinal direction for transporting electronic components;
A bottom cover tape that forms the through hole in an electronic component storage pocket that opens on the other surface of the mount by being pasted along the longitudinal direction on one surface of the front and back surfaces of the mount,
The bottom cover tape is made of paper, and an adhesive is applied only to both edge sides of the mating surface with the mount.   The electronic component transport tape according to claim 1, wherein the adhesive is colored. By sticking along the longitudinal direction to one surface of the front and back surfaces of the tape-shaped mount having a number of through holes drilled in the longitudinal direction for transporting electronic components, the other surface side of the mount A bottom cover tape that forms an open electronic component storage pocket,
The bottom cover tape is made of paper, and an adhesive is applied only to both edge sides of the mating surface with the mount.   The bottom cover tape according to claim 3, wherein the adhesive is colored. The electronic component transport tape according to claim 1 or 2,
An electronic component placed in the electronic component storage pocket of the electronic component transport tape;
A carrier tape having a top cover tape for closing the opening of the electronic component storage pocket.

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