JP2007076288A - Metal foil sheet for forming conductive pattern - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a metal foil sheet for forming a conductive patter capable of forming the conductive patter inexpensively and easily without requiring a separator. <P>SOLUTION: The metal foil sheet for forming the conductive sheet has a metal foil and the heat-sensitive adhesive layer containing a heat-sensitive resin formed on the metal foil. In a blocking resistance test for measuring the peel strength after the heat-sensitive adhesive layer and a polyethylene terephthalate (PET) film are bonded under pressure, the peel strength is 100 g/inch or below. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a metal foil sheet for forming a conductive pattern, which does not require a separator and can easily form a conductive pattern.

For example, an IC tag used for merchandise management has a conductive pattern such as an antenna on a substrate such as PET. Conventionally, when forming the antenna or the like, a method of forming a resist pattern on a metal foil such as aluminum or copper laminated on a base material and performing etching or the like has been performed.

  On the other hand, as another method for forming the antenna or the like, there is a method using a punching blade. Specifically, as shown in FIG. 5 (a), the metal foil sheet 13 having the metal foil 11 and the adhesive layer 12 and the base material 14 are superposed and heated as shown in FIG. 5 (b). The punching blade 15 is used to punch out and temporarily fix the metal foil sheet 13, and as shown in FIG. 5 (c), unnecessary portions are removed with a suction machine 16 and the like, as shown in FIG. 5 (d). This is a method of forming the antenna (conductive pattern) 18 shown in FIG. 5E by thermocompression bonding the temporarily fixed portion using a mold 17 or the like. This method has an advantage that an antenna or the like can be manufactured at low cost with a simple apparatus.

  Moreover, the said metal foil sheet | seat may be preserve | saved as a wound wound body instead of a sheet form from a viewpoint of improving storage property. At this time, since one surface of the metal foil sheet and the other surface may cause blocking, blocking is usually prevented by using a separator or the like. For example, Patent Document 1 discloses a method for manufacturing an antenna pattern using an adhesive layer having adhesiveness even at room temperature. When using such an adhesive layer, a metal foil sheet is used as a wound body. A separator was required. However, a metal foil sheet that does not require a separator has been desired from the viewpoint of producing a cheaper IC tag or the like.

JP 2003-037427 A

  This invention is made | formed in view of the said problem, and it aims at providing the metal foil sheet for electroconductive pattern formation which does not require a separator and can form an electroconductive pattern easily. Is.

  In the present invention, there is provided a metal foil sheet for forming a conductive pattern having a metal foil and a heat-sensitive adhesive layer formed on the metal foil and containing a heat-sensitive resin, the heat-sensitive adhesive layer and polyethylene Provided is a metal foil sheet for forming a conductive pattern, wherein the peel strength is 100 g / inch or less in a blocking resistance test in which peel strength is measured after pressure bonding with a terephthalate (PET) film.

  According to the present invention, when the heat-sensitive adhesive layer has a predetermined peel strength, it is possible to obtain a metal foil sheet for forming a conductive pattern that has excellent blocking resistance and does not require a separator. Moreover, by using such a conductive pattern forming metal foil sheet, a conductive pattern such as an antenna can be easily formed.

  Moreover, in the said invention, it is preferable that the said thermosensitive resin is a delayed tack-type thermosensitive resin. By using a delayed tack-type heat-sensitive resin, it is possible to provide a heat-sensitive adhesive layer that has low tackiness before thermocompression bonding and the like and greatly improves the tackiness during thermocompression bonding, and has excellent blocking resistance. This is because a metal foil sheet for forming an adhesive pattern can be obtained.

  Further, in the present invention, it has a metal foil and a heat-sensitive adhesive layer formed on the metal foil and containing a heat-sensitive resin, and the heat-sensitive resin is a delayed tack type heat-sensitive resin. A metal foil sheet for forming a conductive pattern is provided.

  According to the present invention, by using a delayed tack-type heat-sensitive resin, it is possible to provide a heat-sensitive adhesive layer that has low adhesiveness before thermocompression bonding and the like, and greatly improves the adhesiveness during thermocompression bonding. A metal foil sheet for forming a conductive pattern having excellent blocking properties can be obtained. Moreover, by using such a conductive pattern forming metal foil sheet, a conductive pattern such as an antenna can be easily formed.

  Moreover, in this invention, the metal foil sheet winding body formed by winding the said metal foil sheet for conductive pattern formation is provided.

  According to the present invention, by using the metal foil sheet for forming a conductive pattern, it is possible to suppress the occurrence of blocking without installing a separator. Sex patterns can be produced.

  Further, in the present invention, a heat-sensitive adhesive layer-forming coating solution used for forming the heat-sensitive adhesive layer of the conductive pattern-forming metal foil sheet, comprising a delayed tack-type heat-sensitive resin. A coating solution for forming a heat-sensitive adhesive layer is provided.

  According to this invention, the said metal foil sheet for electroconductive pattern formation can be easily obtained by using the coating liquid for heat-sensitive contact bonding layer formation.

  Further, in the present invention, a base material, a heat-sensitive adhesive layer formed on the base material in a pattern and containing a delayed tack-type heat-sensitive resin, and a conductive pattern formed on the heat-sensitive adhesive layer And a conductive pattern forming body characterized by comprising:

  According to the present invention, a conductive pattern forming body can be easily obtained by using the conductive pattern forming metal foil sheet.

  The metal foil sheet for forming a conductive pattern of the present invention has an effect that a conductive pattern can be easily formed.

  Hereinafter, the metal foil sheet for forming a conductive pattern, the rolled metal foil sheet, the coating solution for forming a heat-sensitive adhesive layer, and the conductive pattern forming body of the present invention will be described.

A. First, the metal foil sheet for forming a conductive pattern of the present invention (sometimes simply referred to as a metal foil sheet) will be described. The metal foil sheet for forming a conductive pattern of the present invention can be roughly divided into the following two modes depending on the properties of the heat-sensitive adhesive layer. Hereinafter, the metal foil sheet for forming a conductive pattern of the present invention will be described for each aspect.

A-1. First, the metal foil sheet for forming a conductive pattern according to the first aspect of the present invention will be described. The metal foil sheet for conductive pattern formation of this aspect is a metal foil sheet for conductive pattern formation having a metal foil and a heat-sensitive adhesive layer formed on the metal foil and containing a heat-sensitive resin, In a blocking resistance test in which the peel strength is measured after the heat-sensitive adhesive layer and the polyethylene terephthalate (PET) film are pressure-bonded, the peel strength is 100 g / inch or less.

  According to this aspect, when the heat-sensitive adhesive layer has a predetermined peel strength, it is possible to obtain a conductive pattern-forming metal foil sheet that is excellent in blocking resistance and does not require a separator. Moreover, by using such a conductive pattern forming metal foil sheet, a conductive pattern such as an antenna can be easily formed.

  Next, the metal foil sheet for conductive pattern formation of this aspect is demonstrated using drawing. For example, as shown in FIG. 1, the conductive pattern forming metal foil sheet 1 of this embodiment has a metal foil 2 and a heat-sensitive adhesive layer 3 formed on the metal foil 2 and containing a heat-sensitive resin. Is.

Moreover, the metal foil sheet for conductive pattern formation of this aspect has predetermined peeling strength in a blocking resistance test. The “blocking resistance test” in this embodiment means that a heat-sensitive adhesive layer of a metal foil sheet for forming a conductive pattern and a polyethylene terephthalate (PET) film having a thickness of 50 μm are subjected to a temperature of 25 ° C. and a pressure of 0.6 kgf / cm. ^A test piece is prepared by pressure bonding for ² hours at ² , and the test piece is a test for measuring the peel strength at a temperature of 25 ° C., a peel rate of 200 ± 20 mm / min, and 180 ° peel. The details of the measuring method shall be in accordance with JIS K6854-2.
The metal foil sheet for forming a conductive pattern according to this aspect is characterized in that the peel strength is 100 g / inch or less, preferably 30 g / inch or less, particularly preferably 10 g / inch or less. .
Hereinafter, each structure of the metal foil sheet for conductive pattern formation of this aspect is demonstrated.

1. Metal foil First, the metal foil used in this embodiment will be described. The metal foil used in this embodiment is processed with a punching blade or the like to form a conductive pattern when a conductive pattern forming body or the like described later is manufactured. Therefore, it is preferable that the metal foil used for this aspect is excellent in electroconductivity.

The material of the metal foil is not particularly limited as long as it has conductivity. For example, aluminum, copper, copper alloy, phosphor bronze, SUS, gold, gold alloy, nickel, nickel alloy, silver, Silver alloy, tin, tin alloy and the like can be mentioned, among which aluminum and copper are preferable. This is because the above materials are excellent in conductivity and inexpensive.
The thickness of the metal foil varies depending on the use of the metal foil sheet for forming a conductive pattern, and is specifically within a range of 0.1 to 50 μm, and particularly within a range of 5 to 40 μm. Is preferred. This is because if the thickness of the metal foil is too large, the service life of the punching blade may be shortened, and if the thickness of the metal foil is too small, the resulting conductive pattern becomes fragile.

2. Next, the heat-sensitive adhesive layer used in this embodiment will be described. The heat-sensitive adhesive layer used in this embodiment is formed on the above metal foil and contains a heat-sensitive resin.

(1) Heat-sensitive resin The heat-sensitive resin used in the heat-sensitive adhesive layer imparts adhesiveness to the heat-sensitive adhesive layer. In the present embodiment, the “heat-sensitive resin” is a general term for resins that exhibit a function as an adhesive when heated. Specific examples of such heat-sensitive resins include delayed tack-type heat-sensitive resins, thermosetting resins, and thermoplastic resins. Of these, delayed tack is preferable.

  Here, “delayed tack-type heat-sensitive resin” is a resin that is non-adhesive at room temperature, but develops adhesiveness by heating, and after adhesiveness is exhibited, adhesiveness persists even when the heating source is removed. It means something. Further, the “delay tack type heat sensitive resin” in the present invention is a concept including a resin composition. An example of a delayed tack type heat sensitive resin includes a binder resin having a relatively low glass transition temperature, a solid plasticizer, and, if necessary, particles of a tackifier. In this delayed tack-type heat-sensitive resin, the solid plasticizer is melted by heating, and thereby the binder resin is plasticized to exhibit adhesiveness. Examples of the solid plasticizer include dicyclohexylhexyl phthalate (Japanese Patent Laid-Open Nos. 61-9479, 7-278521, 7-145352, and 8-333565). . Further, as another example of the delayed tack type heat-sensitive resin, for example, as disclosed in JP-A-11-5960, a water-soluble resin component (component A) having a graft structure and a polymer having a low glass transition temperature are used. And a water-soluble emulsion type composition having the component (component B). This delayed tack-type heat-sensitive resin exhibits adhesiveness when the sea-island structure of the component A and the component B is reversed by heating. Further, examples of references for the delayed tack type heat sensitive resin include JP-A-11-228927, JP-A-2002-155264, JP-A-2002-317168, JP-A-2005-97353, and the like.

  The delayed tack type heat-sensitive resin used in this embodiment is not particularly limited as long as it can obtain a metal foil sheet having a desired peel strength in the above-described blocking resistance test, and is not commercially available. A delayed tack type heat sensitive resin or the like can be used. Specifically, Eco Brid (trade name, manufactured by Daicel Chemical Industries, Ltd.), Dick Seal (trade name, manufactured by Dainippon Ink & Chemicals, Inc.), Aron Tac (trade name, Toagosei Co., Ltd.), Heat Magic (product) Name, Toyo Ink Manufacturing Co., Ltd.).

Moreover, when the said thermosensitive resin is a thermosetting resin, the function as an adhesive agent is expressed because a thermosetting resin hardens | cures by heating. The thermosetting resin is not particularly limited as long as a metal foil sheet having a desired peel strength can be obtained in the above-described blocking resistance test. Specifically, the thermosetting resin is in an uncured state. And a thermosetting resin. The “uncured state” in this embodiment includes a state in which no curing has occurred and a state in which curing has occurred within a range that does not have substantial adhesiveness.
As such an uncured thermosetting resin, specifically, an uncured polyurethane resin, an uncured epoxy resin, an uncured phenol resin, an uncured urea resin, an uncured state In particular, an uncured polyurethane resin is preferable. Furthermore, the polyol component and the isocyanate component of the uncured polyurethane resin are not particularly limited, and general ones can be used.

Moreover, when the said thermosensitive resin is a thermoplastic resin, adhesiveness improves by heating, and the function as an adhesive agent is expressed by being cooled after that. The thermoplastic resin is not particularly limited as long as a metal foil sheet having a desired peel strength can be obtained in the above-described blocking resistance test. For example, olefin, ethylene-vinyl acetate Examples include copolymers, vinyl chloride-vinyl acetate copolymers, polyamides, polyesters, polystyrenes, acrylic resins, and other elastomers. The number average molecular weight of the thermoplastic resin is preferably in the range of 500 to 500,000, and more preferably in the range of 5,000 to 400,000.
Further, considering the elasticity and hardness of various base materials and the hardness and sharpness of various heating blades, the above-mentioned thermosensitive resin is at least two types of delayed tack type thermosensitive resin, thermosetting resin and thermoplastic resin. It may be a mixture of these.

(2) Heat-sensitive adhesive layer The heat-sensitive adhesive layer used in this embodiment contains the heat-sensitive resin. The heat-sensitive adhesive layer may further contain a dispersant, an organic filler, an inorganic filler, a metal adhesion improver, and the like.

  Although it does not limit as a material of the said organic filler, Specifically, resin etc. can be mentioned. Examples of the resin include polyolefin resins such as polyethylene and polypropylene; Teflon (registered trademark), polyflon PTFE (trade name, tetrafluoroethylene resin), and neoflon FEP (trade name, tetrafluoroethylene-hexafluoride). Fluorine resin such as propylene copolymer) and lubron (trade name, low molecular weight tetrafluoroethylene resin); styrene resin; epoxy resin; melamine resin; urea resin; acrylic resin; Polyimide resins; polyamide resins; polyester resins, and the like, and polyolefin resins are preferred. In this embodiment, among the polyolefin resins, polyethylene is particularly preferable. In this embodiment, a copolymer of the above resin can also be used. Further, the average particle diameter of the organic filler is not particularly limited, but the average particle diameter by the laser method is, for example, in the range of 1 to 15 μm, particularly in the range of 1.5 to 13 μm, particularly 2 to 2. It is preferable to be within the range of 10 μm. Further, the content of the organic filler in the heat-sensitive adhesive layer is not particularly limited, but for example, 0 parts by weight with respect to 100 parts by weight of the heat-sensitive resin (not including the filler) in the heat-sensitive adhesive layer. Within the range of 5 to 10 parts by weight, particularly preferably within the range of 0.8 to 5 parts by weight.

On the other hand, the material of the inorganic filler is not particularly limited. For example, SiO ₂ , Al ₂ O ₃ , Al ₂ O ₃ .2SiO ₂ .2H ₂ O (kaolin clay), CaCO ₃ , BaSO ₄ , TiO ₂ and the like, among SiO ₂ is preferred. Further, the average particle diameter of the inorganic filler is not particularly limited, but the average particle diameter by the laser method is, for example, in the range of 1 to 15 μm, particularly in the range of 1.5 to 10 μm, particularly 2 to 2. It is preferable to be in the range of 5 μm. Further, the content of the inorganic filler in the heat-sensitive adhesive layer is not particularly limited, but for example 100% by weight with respect to 100 parts by weight of the heat-sensitive resin (not including the filler) in the heat-sensitive adhesive layer. It is preferably in the range of 5 to 7 parts by weight, particularly in the range of 1 to 5 parts by weight.

  Moreover, as said metal adhesive improvement agent, phosphate ester, zinc, etc. can be mentioned, for example.

  Moreover, in this aspect, it is preferable that the average particle diameter of the said filler (an organic filler and an inorganic filler) is larger than the thickness of a thermosensitive resin layer. Specifically, as shown in FIG. 2, in the heat-sensitive adhesive layer 3 formed on the metal foil 2, the average particle diameter of the filler 4 is preferably larger than the thickness of the heat-sensitive resin layer 5. When the average particle size of the filler is larger than the thickness of the heat-sensitive resin layer, a part of the filler becomes a heat-sensitive adhesive layer exposed from the heat-sensitive resin layer, but this causes the metal foil sheet to adhere excessively to the substrate. Can be prevented. Therefore, for example, as shown in FIG. 5C described above, when the unnecessary portion of the metal foil sheet 13 is removed with a suction machine or the like, the metal foil sheet 13 and the base material 14 can be peeled off without any problem. . As shown in FIG. 5 (d), since thermocompression bonding is finally performed using the mold 17 or the like, even if the heat-sensitive adhesive layer has a part of the filler exposed from the heat-sensitive resin layer. Sufficient adhesion can be obtained.

  In addition, the thickness of the heat-sensitive adhesive layer is not particularly limited as long as it can be satisfactorily adhered to a substrate or the like. For example, the thickness is within a range of 0.01 to 10 μm, particularly 0.1 to 5 μm. It is preferable to be within the range, particularly within the range of 0.5 to 2 μm. If the thickness of the heat-sensitive adhesive layer is too large, it will be processed with a punching blade and then heat-bonded with a mold, etc. This is because a foil sheet may not be obtained, and if the thickness of the heat-sensitive adhesive layer is too small, good adhesiveness cannot be obtained.

  In addition, the heat-sensitive adhesive layer used in this embodiment exhibits a function as an adhesive by heating and adheres to a base material or the like, thereby forming a conductive pattern forming body and the like to be described later. In this embodiment, the heat-sensitive adhesive layer after bonding may be easily peeled off from the substrate by a peeling process. This is because the metal foil sheet and the base material can be easily peeled, whereby the base material can be reused.

  Specifically, after laminating a heat-sensitive adhesive layer of a metal foil sheet for forming a conductive pattern and a polyethylene terephthalate (PET) film having a thickness of 50 μm using a lami packer at around 100 ° C. and cooling to room temperature, It is preferable that aging is performed at 40 ° C. for 1 week to prepare a laminate, and the laminate is immersed in water all day and dried, and the peel strength is within the range of 30 g / inch to 3450 g / inch.

  In this embodiment, the polyethylene terephthalate (PET) film side after the laminate is immersed in water at 85 ° C. for 15 minutes or after the laminate is immersed in an aqueous solution having an alkali concentration of 1.5% for 15 minutes. The residual amount of the heat sensitive resin is preferably 1300 ppm or less, and more preferably 20 ppm or less.

3. Metal foil sheet for conductive pattern formation The metal foil sheet for conductive pattern formation of this aspect is provided with the metal foil sheet and the heat-sensitive adhesive layer. Although it does not specifically limit as a use of the metal foil sheet for conductive pattern formation, For example, it can use as a member for antenna formation, a member for wiring formation, a member for electrode formation, etc. Specifically, IC tag antenna; IC card antenna; flexible printed circuit board wiring; membrane switch electrode; electromagnetic wave shielding pattern; heat seal connector wiring terminal for flat panel display; wiring connecting display panel scanning electrode driver and display unit; Wiring connecting display panel signal electrode driver and display; Gate electrode wiring, source electrode wiring, drain electrode wiring of TFT of active matrix display panel; Back electrode of passive matrix display panel; Source electrode wiring of organic transistor element, gate electrode It can be used for wiring, drain electrode wiring;

4). Next, the manufacturing method of the metal foil sheet for conductive pattern formation of this aspect is demonstrated. The method for producing the conductive pattern forming metal foil sheet of the present embodiment is not particularly limited as long as it is a method capable of obtaining the conductive pattern forming metal foil sheet. For example, a method of preparing a heat-sensitive adhesive layer-forming coating solution containing the heat-sensitive resin, applying it to a metal foil, and drying it may be mentioned.

  In addition, the method for applying the coating solution for forming the heat-sensitive adhesive layer is not particularly limited, and examples thereof include a spray method and a printing method. Among these, the printing method is preferable. Examples of such a printing method include a gravure printing method, an ink jet printing method, a flexographic printing method, a screen printing method, and the like. Of these, a gravure printing method is preferable.

A-2. Next, the metal foil sheet for forming a conductive pattern of the second aspect of the present invention will be described. The metal foil sheet for forming a conductive pattern of this aspect has a metal foil and a heat-sensitive adhesive layer formed on the metal foil and containing a heat-sensitive resin, and the heat-sensitive resin is a delayed tack-type heat-sensitive material. It is a characteristic resin.

According to this aspect, by using the delayed tack-type heat-sensitive resin, it is possible to provide a heat-sensitive adhesive layer that has low tackiness before performing thermocompression bonding and the like, and greatly improves the tackiness during thermocompression bonding. A metal foil sheet for forming a conductive pattern having excellent blocking properties can be obtained. Therefore, for example, when a metal foil sheet is wound to produce a metal foil sheet wound body, a separator is not required, and a cheaper metal foil sheet for forming a conductive pattern can be obtained. Furthermore, since the delayed tack-type heat-sensitive resin has strong adhesiveness due to heating, for example, during thermocompression bonding, the temporarily fixed conductive pattern can be prevented from shifting, and an accurate conductive pattern can be obtained. it can. In addition, delayed tack-type heat-sensitive resin does not become brittle like cured thermosetting resin even after the adhesiveness is developed by heating, and exhibits flexibility so that it can follow bending, etc. A conductive pattern having excellent properties can be obtained. In addition, the delayed tack type heat-sensitive resin is known to have a long so-called pot life, and has an advantage of excellent handleability when producing a conductive pattern forming body.
Hereinafter, each structure of the metal foil sheet for conductive pattern formation of an aspect is demonstrated.

1. Metal foil First, the metal foil used in this embodiment will be described. The metal foil used in this embodiment is processed with a punching blade or the like to form a conductive pattern when a conductive pattern forming body or the like described later is manufactured. Since such a metal foil is the same as the content described in “A-1. Metal foil sheet for forming conductive pattern of the first aspect”, description thereof is omitted here.

2. Next, the heat-sensitive adhesive layer used in this embodiment will be described. The heat-sensitive adhesive layer used in this embodiment is formed on the above metal foil and contains a delayed tack type heat-sensitive resin. Such a heat-sensitive adhesive layer is the same as that described in “A-1. Metal foil sheet for forming a conductive pattern of the first aspect”, and thus the description thereof is omitted here.

3. Metal foil sheet for conductive pattern formation The metal foil sheet for conductive pattern formation of this aspect is provided with the metal foil sheet and the heat-sensitive adhesive layer. About the use etc. of the metal foil sheet for conductive pattern formation, since it is the same as that of what was described in "A-1. Metal foil sheet for conductive pattern formation of a 1st aspect", description here is abbreviate | omitted. In this embodiment, the peel strength in the blocking resistance test described above is preferably 100 g / inch or less, more preferably 30 g / inch or less, and even more preferably 10 g / inch or less.
About the manufacturing method of the metal foil sheet for conductive pattern formation of this aspect, since it is the same as that of what was described in "A-1. Metal foil sheet for conductive pattern formation of a 1st aspect", description here Omitted.

B. Next, the metal foil sheet wound body of the present invention will be described. The wound metal foil sheet of the present invention is formed by winding the conductive pattern forming metal foil sheet.

  According to the present invention, by using the metal foil sheet for forming a conductive pattern, it is possible to suppress the occurrence of blocking without installing a separator. Sex patterns can be produced.

  Next, the wound metal foil sheet of the present invention will be described with reference to the drawings. For example, as shown in FIG. 3, the metal foil sheet winding body 6 of the present invention is obtained by winding a metal foil sheet 1 for forming a conductive pattern.

In addition, although the metal foil sheet winding body of the present invention is formed by winding a metal foil sheet, the metal foil sheet is described in the above “A. Metal foil sheet for forming a conductive pattern”. Since this is the same as that described above, description thereof is omitted here.
Moreover, the diameter of the metal foil sheet winding body of this invention is not specifically limited. Since the diameter of the wound body depends on the core diameter, the film thickness, and the number of windings, it is preferable to appropriately determine the diameter of the metal foil sheet wound body according to the film thickness and the like. Further, if the diameter of the metal foil sheet winding body is too large, the pressure inside the metal foil sheet winding body may increase, and blocking may occur inside the winding body. It should be noted that if the diameter is too small, it is necessary to frequently replace the metal foil sheet winding body when manufacturing a conductive pattern forming body or the like, and work efficiency is reduced.

C. Next, the coating liquid for forming a heat-sensitive adhesive layer of the present invention will be described. The coating solution for forming a heat-sensitive adhesive layer of the present invention is a coating solution for forming a heat-sensitive adhesive layer used for forming a heat-sensitive adhesive layer of a metal foil sheet for forming a conductive pattern, and is a delayed tack type. A heat-sensitive resin is contained.

  According to this invention, the said metal foil sheet for electroconductive pattern formation can be easily obtained by using the coating liquid for heat-sensitive contact bonding layer formation.

  About the kind etc. of the delayed tack type heat sensitive resin used for this invention, since it is the same as that of the content described in "A. Metal foil sheet for electroconductive pattern formation", description here is abbreviate | omitted.

  The heat-sensitive adhesive layer-forming coating solution of the present invention usually contains a solvent. The solvent is not particularly limited as long as it can satisfactorily disperse the delayed tack-type heat sensitive resin. For example, methyl ethyl ketone, methyl isobutyl ketone, toluene, methyl acetate, ethyl acetate, propyl acetate Butyl acetate, butyrolactone, methoxybutyl acetate, cyclopentanone, cyclohexanone, n-hexane, ethyl lactate, xylene, propylene glycol monomethyl ether acetate, or a mixture of one or more of the above, among which methyl ethyl ketone, methyl isobutyl A mixture of one or more of ketone, toluene, ethyl acetate and cyclohexanone is preferred. Moreover, the heat-sensitive adhesive layer-forming coating solution of the present invention may contain the above-described additives and the like as necessary.

The solid content concentration in the heat-sensitive adhesive layer-forming coating solution is not particularly limited as long as a desired heat-sensitive adhesive layer can be obtained. It is preferably within the range of 30% by mass.
Moreover, it does not specifically limit as a viscosity of the coating liquid for heat-sensitive adhesive layer formation, For example, it is preferable to exist in the range of 5-1000 cP, especially in the range of 10-100 cP.

D. Next, the conductive pattern formed body of the present invention will be described. The conductive pattern forming body of the present invention was formed on a base material, a heat-sensitive adhesive layer formed in a pattern on the base material, and containing a delayed tack-type heat-sensitive resin, and the heat-sensitive adhesive layer. And a conductive pattern.

  According to the present invention, a conductive pattern forming body can be easily obtained by using the conductive pattern forming metal foil sheet.

Next, the electroconductive pattern formation body of this invention is demonstrated using drawing. FIG. 4 is a schematic plan view showing an example of the conductive pattern forming body of the present invention. More specifically, an example of a non-contact data carrier conductive member such as an IC tag or an IC card is shown. As shown in FIG. 4, the conductive pattern forming body 7 of the present invention is formed in a pattern shape on a base material 8 and the base material 8 and includes a heat-sensitive adhesive layer (not shown) containing a delayed tack type heat-sensitive resin. And a conductive pattern 9 formed on the heat-sensitive adhesive layer.
Hereinafter, each structure of the electroconductive pattern formation body of this invention is demonstrated.

1. Base material First, the base material used for this invention is demonstrated. The base material used in the present invention is a support for a heat-sensitive adhesive layer and a conductive pattern described later. The material of the base material varies depending on the use of the conductive pattern and the like, and specific examples include resin, paper, magnetic material, and glass. Furthermore, examples of the resin include polyethylene, polypropylene, cyclopolyolefin, polyvinyl chloride, polyvinylidene chloride, polyvinyl alcohol, polyethylene terephthalate, polycarbonate, triacetyl cellulose, nylon, polystyrene, ethylene-vinyl acetate copolymer, ethylene- Vinyl alcohol copolymer, triacetate, polyethersulfone, cellophane, ethylene-acrylic acid copolymer, ethylene-methacrylic acid copolymer, saponified ethylene-vinyl acetate copolymer, ethylene-α-olefin copolymer elastomer Acid-modified polyolefin, styrene-butadiene-acrylonitrile copolymer, polyamine, polysulfone, polyacetal, polymethylmethacrylate, polyphenylene oxide, Polyphenylene sulfide, polyurethane, polybutadiene terephthalate, polyimide, Boriarireto, polyether ether ketone, acrylonitrile - butadiene - styrene resin (ABS resin) and the like. Examples of the paper include synthetic paper, printing / information paper, wrapping paper, Japanese paper such as calligraphy paper, cardboard base paper, paperboard board, and the like. Moreover, as said magnetic body, a ferrite etc. can be mentioned, for example.
Moreover, the film thickness of the base material used for this invention is not specifically limited, According to the use etc. of an electroconductive pattern formation body, it selects suitably.

2. Next, the heat-sensitive adhesive layer used in the present invention will be described. The heat-sensitive adhesive layer used in the present invention is formed in a pattern on the above-mentioned base material and contains a delayed tack type heat-sensitive resin. In the present invention, the shape of the pattern of the heat-sensitive adhesive layer usually matches the shape of the conductive pattern described later.

  As the delayed tack-type heat-sensitive resin used for the heat-sensitive adhesive layer, the same as described in the above “A. Metal foil sheet for forming a conductive pattern” can be used. Omitted. In addition, the heat-sensitive adhesive layer may contain the above-described additives and the like.

3. Next, the conductive pattern used in the present invention will be described. The conductive pattern used in the present invention is formed on the heat-sensitive adhesive layer. The shape of the said conductive pattern is not specifically limited, According to the use etc. of the conductive pattern formation body of this invention, it selects suitably. For example, when the conductive pattern formed body of the present invention is used as a conductive member for a non-contact type data carrier such as an IC tag or an IC card, the shape of the conductive pattern, specifically, a spiral shape pattern or a bar shape pattern , A pad shape pattern, a cross shape pattern, and the like. These are determined in consideration of the communication frequency band used.

  The line width of the conductive pattern varies depending on the use of the conductive pattern forming body of the present invention. For example, the conductive pattern forming body of the present invention is not a non-IC tag, IC card or the like. When used as a conductive member for a contact data carrier, specifically, it is preferably within a range of 0.01 to 20 mm, and more preferably within a range of 0.05 to 10 mm.

4). Conductive pattern forming body The conductive pattern forming body of the present invention has the above-mentioned base material, heat-sensitive adhesive layer and conductive pattern. The use of the conductive pattern forming body of the present invention is not particularly limited, and examples thereof include non-contact data carrier conductive members such as IC tags and IC cards, wiring with substrates, electrodes with substrates, and the like. be able to. Moreover, it can use also for what was described in "A. Metal foil sheet for conductive pattern formation".

5. Next, the manufacturing method of the electroconductive pattern formation body of this invention is demonstrated. The method for producing a conductive pattern forming body of the present invention is not particularly limited as long as it is a method capable of obtaining the above-described conductive pattern. For example, the method using the said metal foil sheet for conductive pattern formation is mentioned. Specifically, the heat-sensitive adhesive layer of the metal foil sheet for forming a conductive pattern and a base material are overlapped to form a laminate for a conductive pattern forming body, and a punching blade is used. A cutting step for forming a cut of a conductive pattern in the conductive pattern forming metal foil sheet of the laminate for a conductive pattern forming body, and the conductivity other than a region that becomes a conductive pattern after the cutting step. The method etc. which have the removal process which removes the metal foil sheet for pattern formation, and the thermocompression-bonding process of thermocompression-bonding the area | region used as the said electroconductive pattern can be mentioned. Specifically, the method shown in FIG.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and that exhibits the same effects. Are included in the technical scope.

Hereinafter, the present invention will be specifically described with reference to examples.
[Example 1]
ECOBRID TM-120 (trade name, manufactured by Daicel Chemical Industries, Ltd.) is coated with a Miyabar # 8 on an aluminum metal foil having a thickness of 11 μm, and dried by blowing a dryer, whereby a heat-sensitive adhesive layer having a thickness of 1 μm. The metal foil sheet for conductive pattern formation provided with this was obtained.

[Evaluation]
The metal foil sheet for forming a conductive pattern obtained in Example 1 was subjected to tackiness evaluation, blocking resistance test, and tensile strength test.

(Tackiness evaluation)
Touch the heat-sensitive adhesive layer of the metal foil sheet for forming a conductive pattern with a rubber gloved hand and feel adhesiveness when you release it. No sex ”. In Example 1, it was “no tackiness”.

(Blocking resistance test)
Using a blocking tester (ASTM D-395, manufactured by Tester Sangyo Co., Ltd.)
A test piece is prepared by pressure-bonding a heat-sensitive adhesive layer of a conductive pattern forming metal foil sheet and a polyethylene terephthalate (PET) film having a thickness of 50 μm at a temperature of 25 ° C. and a pressure of 0.6 kgf / cm ² for 5 hours. Then, the test piece was peeled off under the conditions of a temperature of 25 ° C., a peeling speed of 200 ± 20 mm / min, and a 180 ° peeling, and it was evaluated whether the metal foil sheet and the PET film could be easily peeled off. In addition, the case where a metal foil sheet and a PET film can be easily peeled is indicated by ◯, the case where some metal adhesion can be removed without any problem, and the case where adhesion is strong and difficult to remove is indicated by ×. In Example 1, the evaluation was “◯”.

(Tensile strength test)
A heat-sensitive adhesive layer of a metal foil sheet for forming a conductive pattern and a polyethylene terephthalate (PET) film having a thickness of 50 μm were laminated at around 100 ° C. using a lami packer. After cooling to room temperature, aging was performed at 40 ° C. for 1 week, and then the tensile strength per inch width at a temperature of 25 ° C. was measured according to the peel strength test method of the adhesive according to JIS K6854-2. In Example 1, the tensile strength was 600 g / inch.

It is a schematic sectional drawing which shows an example of the metal foil sheet for conductive pattern formation of this invention. It is explanatory drawing explaining the positional relationship of the average particle diameter of a filler, and the film thickness of a thermosensitive resin layer. It is a perspective view which shows an example of the metal foil sheet winding body of this invention. It is a schematic plan view which shows an example of the electroconductive pattern formation body of this invention. It is explanatory drawing explaining the manufacturing method of the electroconductive pattern using a punching blade.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Metal foil sheet for conductive pattern formation 2 ... Metal foil 3 ... Heat-sensitive adhesive layer 4 ... Filler 5 ... Heat-sensitive resin layer 6 ... Metal foil sheet winding body 7 ... Conductive pattern formation body 8 ... Base material 9 ... Conductive pattern

Claims (6)

A metal foil sheet for forming a conductive pattern having a metal foil and a heat-sensitive adhesive layer formed on the metal foil and containing a heat-sensitive resin,
A metal for forming a conductive pattern, wherein the peel strength is 100 g / inch or less in a blocking resistance test in which peel strength is measured after pressure-bonding the heat-sensitive adhesive layer and a polyethylene terephthalate (PET) film. Foil sheet.   The metal foil sheet for forming a conductive pattern according to claim 1, wherein the heat-sensitive resin is a delayed tack-type heat-sensitive resin.   Conductive pattern formation comprising a metal foil and a heat-sensitive adhesive layer formed on the metal foil and containing a heat-sensitive resin, wherein the heat-sensitive resin is a delayed tack type heat-sensitive resin Metal foil sheet.   A metal foil sheet wound body obtained by winding the conductive pattern forming metal foil sheet according to any one of claims 1 to 3.   A heat-sensitive adhesive layer-forming coating solution used for forming a heat-sensitive adhesive layer of a metal foil sheet for forming a conductive pattern, comprising a delayed tack-type heat-sensitive resin. Layer forming coating solution. It has a base material, a heat-sensitive adhesive layer formed in a pattern on the base material and containing a delayed tack-type heat-sensitive resin, and a conductive pattern formed on the heat-sensitive adhesive layer. A conductive pattern forming body.

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