JP2003037136A - Method of manufacturing tab tape and laminated film for tab tape - Google Patents
Method of manufacturing tab tape and laminated film for tab tapeInfo
- Publication number
- JP2003037136A JP2003037136A JP2001221868A JP2001221868A JP2003037136A JP 2003037136 A JP2003037136 A JP 2003037136A JP 2001221868 A JP2001221868 A JP 2001221868A JP 2001221868 A JP2001221868 A JP 2001221868A JP 2003037136 A JP2003037136 A JP 2003037136A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- tab tape
- film
- metal foil
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体パッケージ
を実装する際に使用されるＴＡＢテープの製造方法およ
びＴＡＢテープ用積層フィルムに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a TAB tape used for mounting a semiconductor package and a laminated film for a TAB tape.
【０００２】[0002]
【従来の技術】半導体パッケージを実装する際、テープ
オートメーテッドボンディング方式（ＴＡＢ方式）で行
うことがあり、このＴＡＢ方式では、絶縁層と接着剤層
と配線層とを有して構成されるＴＡＢテープが使用され
る。このようなＴＡＢテープの製造方法としては、例え
ば、特開平９−１６２２４５号公報、特開平９−１８６
２０２号公報などに記載されている。2. Description of the Related Art When a semiconductor package is mounted, a tape automated bonding method (TAB method) is sometimes used. In this TAB method, a TAB having an insulating layer, an adhesive layer and a wiring layer is formed. Tape is used. As a method of manufacturing such a TAB tape, for example, JP-A-9-162245 and JP-A-9-186 are known.
No. 202, etc.
【０００３】特開平９−１６２２４５号公報記載のＴＡ
Ｂテープについて、図３を参照しながら説明する。な
お、図３は、ＴＡＢテープを長手方向に切断したときの
断面図である。このＴＡＢテープは、基材となる絶縁テ
ープ２１と接着剤層２２とが同じ幅で積層されており、
この絶縁テープ２１と接着剤層２２とを穿孔して、スプ
ロケット孔２３を設け、接着剤層２２の上に、めっき２
４が施された配線２５を有している。ところが、このよ
うなＴＡＢテープは、スプロケット孔２３が基材２１だ
けでなく、接着剤層２２にまで形成されているので、Ｔ
ＡＢテープを搬送する際に、スプロケットロールのピン
をスプロケット孔２３に挿入すると、接着剤層２２にピ
ンが接触し、ピンと接着剤層２２とが接着することがあ
った。ピンと接着剤層２２とが接着すると、抵抗とな
り、ＴＡＢテープの搬送が不良となることがあった。TA described in Japanese Patent Application Laid-Open No. 9-162245
The B tape will be described with reference to FIG. Note that FIG. 3 is a cross-sectional view of the TAB tape cut in the longitudinal direction. In this TAB tape, an insulating tape 21 as a base material and an adhesive layer 22 are laminated with the same width,
The insulating tape 21 and the adhesive layer 22 are perforated to form sprocket holes 23, and the plating layer 2 is formed on the adhesive layer 22.
4 has a wiring 25. However, in such a TAB tape, since the sprocket hole 23 is formed not only in the base material 21 but also in the adhesive layer 22, T
When the pin of the sprocket roll was inserted into the sprocket hole 23 when the AB tape was conveyed, the pin could come into contact with the adhesive layer 22 and the pin and the adhesive layer 22 might adhere to each other. When the pin and the adhesive layer 22 were adhered to each other, resistance was caused and the TAB tape could not be conveyed properly.
【０００４】一方、特開平９−１８６２０２号公報記載
の製造方法について、図４を参照しながら説明する。な
お、図４は、ＴＡＢテープを長手方向に切断したときの
断面図である。この製造方法では、図４（ａ）に示すよ
うな、接着剤層３２を保護フィルム３１ａ，３１ｂで挟
み込んだ接着フィルムを用い、まず、第１剥離工程にお
いて、図４（ｂ）に示すように、接着剤層３２の一方の
面の保護フィルム３１ａを剥離する。次いで、絶縁フィ
ルムラミネート工程において、図４（ｃ）に示すよう
に、接着フィルムの接着剤層３２と、接着剤層３２より
幅広の絶縁フィルム３３とを、絶縁フィルム３３の両縁
部４１が接着剤層３２と重ならないように貼り合わせ
る。次いで、スプロケット孔形成工程において、図４
（ｄ）に示すように、絶縁フィルム３３の両縁部４１に
スプロケット孔３４を形成させる。次いで、第２剥離工
程において、図４（ｅ）に示すように、接着剤層３２の
他方の面の保護フィルム３１ｂを剥離し、次いで、銅箔
ラミネート工程において、図４（ｆ）に示すように、接
着剤層３２上に銅箔３５を貼り合わせる。次いで、配線
パターン形成工程において、図４（ｆ）に示すように、
銅箔３５をエッチングして配線パターンを形成して最終
的なＴＡＢテープを得る。On the other hand, the manufacturing method described in Japanese Patent Laid-Open No. 9-186202 will be described with reference to FIG. Note that FIG. 4 is a cross-sectional view of the TAB tape cut in the longitudinal direction. In this manufacturing method, as shown in FIG. 4A, an adhesive film in which the adhesive layer 32 is sandwiched by protective films 31a and 31b is used. First, in the first peeling step, as shown in FIG. The protective film 31a on one surface of the adhesive layer 32 is peeled off. Next, in the insulating film laminating step, as shown in FIG. 4C, the adhesive layer 32 of the adhesive film and the insulating film 33 wider than the adhesive layer 32 are bonded to both edge portions 41 of the insulating film 33. It is attached so as not to overlap the agent layer 32. Next, in the sprocket hole forming step, as shown in FIG.
As shown in (d), sprocket holes 34 are formed in both edge portions 41 of the insulating film 33. Next, in the second peeling step, as shown in FIG. 4 (e), the protective film 31b on the other surface of the adhesive layer 32 is peeled off, and then in the copper foil laminating step, as shown in FIG. 4 (f). Then, a copper foil 35 is attached onto the adhesive layer 32. Next, in the wiring pattern forming step, as shown in FIG.
The copper foil 35 is etched to form a wiring pattern to obtain a final TAB tape.
【０００５】このような製造方法により製造されたＴＡ
Ｂテープは、接着剤層３２が積層していない絶縁フィル
ム３３の両縁部４１にスプロケット孔３４を設けてい
る。そのため、特開平９−１６２２４５号公報記載の発
明のように、スプロケットロールのピンが接着剤層３２
に接触することがなく、ＴＡＢテープの搬送に不良が生
じることがなかった。しかしながら、製造工程におい
て、保護フィルム３１ａ，３１ｂをそれぞれ剥離する剥
離工程を２回有し、さらに銅箔ラミネート工程を有する
ため、工程が複雑であり、ＴＡＢテープ製造の生産性が
低い上に、ＰＥＴフィルムの消費量が多いので、コスト
も高かった。また、図４（ｆ）に示す工程では、銅箔３
５を接着剤槽２に貼り合わせるために、あらかじめ銅箔
３５を銅箔の巻取りロール（図示せず）からＴＡＢテー
プの所望とする幅に切断する必要があり、このことも工
程を複雑する原因となっており、ＴＡＢテープの生産性
を低下させていた。また、離型処理を施した、高価なＰ
ＥＴフィルムを使用する場合は、上述した製造方法にお
けるＰＥＴフィルムの消費量が多いため、さらにコスト
が高くなっていた。TA manufactured by such a manufacturing method
The B tape has sprocket holes 34 at both edges 41 of the insulating film 33 on which the adhesive layer 32 is not laminated. Therefore, as in the invention described in JP-A-9-162245, the pin of the sprocket roll has the adhesive layer 32.
There was no contact with the TAB tape, and there was no defect in the transport of the TAB tape. However, in the manufacturing process, the protective film 31a and the protective film 31b are each peeled twice, and since the copper foil laminating process is further included, the process is complicated, and the productivity of the TAB tape is low. Since the film consumption is high, the cost was high. In addition, in the step shown in FIG.
In order to attach 5 to the adhesive tank 2, it is necessary to previously cut the copper foil 35 from a copper foil winding roll (not shown) to a desired width of the TAB tape, which also complicates the process. This is a cause and reduces the productivity of the TAB tape. Also, an expensive P that has been subjected to mold release treatment
When the ET film is used, the cost is further increased due to the large consumption of the PET film in the manufacturing method described above.
【０００６】[0006]
【発明が解決しようとする課題】本発明は、ＴＡＢテー
プの製造工程が簡素であり、生産性が高い上に、接着剤
層の保護フィルムの消費量が少なく、コストを低くでき
るＴＡＢテープの製造方法およびＴＡＢテープ用積層フ
ィルムを提供することを目的とする。DISCLOSURE OF THE INVENTION The present invention provides a TAB tape which has a simple TAB tape manufacturing process, high productivity, low consumption of a protective film for an adhesive layer, and low cost. It is an object to provide a method and a laminated film for a TAB tape.
【０００７】[0007]
【課題を解決するための手段】本発明のＴＡＢテープの
製造方法は、金属箔と、該金属箔上に形成された接着剤
層とを有し、前記接着剤層を保護する保護フィルムが貼
り合わされた積層フィルムから、保護フィルムを剥離す
る剥離工程と、前記接着剤層と、前記接着剤層より幅広
の絶縁フィルムとを、該絶縁フィルムの両縁部が接着剤
層と重ならないように貼り合わせるラミネート工程と、
前記絶縁フィルムの両縁部にスプロケット孔を形成させ
るスプロケット孔形成工程と、前記金属箔をエッチング
して配線パターンを形成する配線パターン形成工程とを
有することを特徴とする。その際、前記金属箔は、銅箔
であることが好ましい。また、本発明のＴＡＢテープ用
積層フィルムは、金属箔と、該金属箔上に形成された接
着剤層とを有し、前記接着剤層を保護する保護フィルム
が貼り合わされたものである。A method of manufacturing a TAB tape according to the present invention comprises a metal foil and an adhesive layer formed on the metal foil, and a protective film for protecting the adhesive layer is applied. A peeling step of peeling the protective film from the combined laminated film, the adhesive layer, and an insulating film wider than the adhesive layer are attached so that both edges of the insulating film do not overlap with the adhesive layer. A laminating process to match
The method is characterized by including a sprocket hole forming step of forming sprocket holes on both edges of the insulating film, and a wiring pattern forming step of etching the metal foil to form a wiring pattern. At that time, the metal foil is preferably a copper foil. Further, the laminated film for TAB tape of the present invention has a metal foil and an adhesive layer formed on the metal foil, and a protective film for protecting the adhesive layer is laminated.
【０００８】[0008]
【発明の実施の形態】以下、本発明を詳細に説明する。
はじめに、本発明のＴＡＢテープ用積層フィルム（以
下、積層フィルムと略す）の一例について図１を参照し
ながら説明する。図１に示す積層フィルム１１は、金属
箔１２と、金属箔１２上に形成された接着剤層１３とを
有し、接着剤層１３を保護する保護フィルム１４が貼り
合わされたものである。BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below.
First, an example of the laminated film for TAB tape of the present invention (hereinafter, abbreviated as laminated film) will be described with reference to FIG. The laminated film 11 shown in FIG. 1 has a metal foil 12 and an adhesive layer 13 formed on the metal foil 12, and a protective film 14 that protects the adhesive layer 13 is attached thereto.
【０００９】金属箔１２としては、導電性を有する箔状
のものであれば制限されず、例えば、銅箔、銅合金箔、
鉄−ニッケル合金箔が挙げられるが、中でも銅箔が好ま
しい。銅箔は安価であるので、最終的に得られるＴＡＢ
テープのコストが安くなる上に、取扱性に優れるので、
製造時の効率が向上する。The metal foil 12 is not limited as long as it has a conductive foil shape. For example, copper foil, copper alloy foil,
Examples of the iron-nickel alloy foil include copper foil. Since the copper foil is cheap, the TAB finally obtained
Since the cost of the tape is low and it is easy to handle,
Manufacturing efficiency is improved.
【００１０】接着剤層１３を形成する接着剤としては、
エポキシ樹脂、フェノール樹脂、マレイミド樹脂、ポリ
アミド、ＳＢＲ、ＮＢＲ、ポリエステル、ポリイミド、
ポリウレタン、ポリビニルアセタール、ポリスチレン、
アクリル樹脂が挙げられ、これらを単独または併用して
用いることができる。これらの接着剤は溶剤に分散させ
て使用することができる。接着剤を分散させる溶剤とし
ては、例えば、トルエン、キシレンなどの芳香族炭化水
素類、メタノール、エタノール、イソプロパノール、ブ
タノールなどのアルコール類、アセトン、メチルエチル
ケトン、メチルイソブチルケトンなどのケトン類などが
挙げられる。接着剤層１３の厚さは、３〜５０μｍであ
り、好ましくは６〜２０μｍである。接着剤層１３の厚
さが３μｍ未満であると、絶縁フィルム１５を接着でき
ないことがあり、５０μｍを超えると、必要以上に厚く
なるので、コストが高くなる。As an adhesive for forming the adhesive layer 13,
Epoxy resin, phenol resin, maleimide resin, polyamide, SBR, NBR, polyester, polyimide,
Polyurethane, polyvinyl acetal, polystyrene,
Acrylic resins are mentioned, and these can be used alone or in combination. These adhesives can be used by dispersing them in a solvent. Examples of the solvent in which the adhesive is dispersed include aromatic hydrocarbons such as toluene and xylene, alcohols such as methanol, ethanol, isopropanol and butanol, and ketones such as acetone, methyl ethyl ketone and methyl isobutyl ketone. The thickness of the adhesive layer 13 is 3 to 50 μm, preferably 6 to 20 μm. If the thickness of the adhesive layer 13 is less than 3 μm, the insulating film 15 may not be bonded, and if it exceeds 50 μm, the thickness becomes unnecessarily large, resulting in high cost.
【００１１】保護フィルム１４としては、接着剤層１３
を保護するとともに、離型性を有していれば特に制限さ
れず、例えば、ポリエチレン、ポリプロピレン、ポリエ
チレンテレフタレートなどのポリエステル、ポリエチレ
ンナフタレートなどのフィルム、表面に離型処理が施さ
れたフィルムが挙げられる。保護フィルム１４の厚さ
は、３〜１２５μｍであり、好ましくは８〜７５μｍで
ある。保護フィルム１４の厚さが３μｍ未満であると、
接着剤層１３を保護できない恐れがあり、１２５μｍを
超えると、接着剤層１３の保護には過剰な厚さであり、
最終的に得られるＴＡＢテープのコストが高くなる上
に、取扱性が悪くなる。As the protective film 14, the adhesive layer 13 is used.
It is not particularly limited as long as it has releasability as well as protecting, and examples thereof include polyesters such as polyethylene, polypropylene and polyethylene terephthalate, films such as polyethylene naphthalate, and films having a surface subjected to a release treatment. To be The protective film 14 has a thickness of 3 to 125 μm, preferably 8 to 75 μm. When the thickness of the protective film 14 is less than 3 μm,
There is a possibility that the adhesive layer 13 cannot be protected. If it exceeds 125 μm, the adhesive layer 13 has an excessive thickness for protection,
The cost of the finally obtained TAB tape is high and the handleability is poor.
【００１２】このような積層フィルム１１は、巻回した
ロール状で輸送したり保管したりする。また、必要に応
じて、巻回したロールは所定の幅に切断してもよい。Such a laminated film 11 is transported or stored in a wound roll form. Further, if necessary, the wound roll may be cut into a predetermined width.
【００１３】上述した積層フィルム１１にあっては、金
属箔１２と、金属箔１２上に形成された接着剤層１３と
を有し、接着剤層１３を保護する保護フィルム１４が貼
り合わされており、保護フィルム１４を剥離して接着剤
層１３を露出させ、この接着剤層１３とＴＡＢテープの
絶縁フィルムとを貼り合わすことにより、接着剤層１３
を介して絶縁フィルム上に金属箔１２が形成されたＴＡ
Ｂテープを容易に作製できる。The above-mentioned laminated film 11 has a metal foil 12 and an adhesive layer 13 formed on the metal foil 12, and a protective film 14 for protecting the adhesive layer 13 is laminated. The protective film 14 is peeled off to expose the adhesive layer 13, and the adhesive layer 13 and the insulating film of the TAB tape are attached to each other to form the adhesive layer 13.
TA in which the metal foil 12 is formed on the insulating film via
The B tape can be easily manufactured.
【００１４】次に、本発明のＴＡＢテープの製造方法の
一例について図２を参照しながら説明する。本発明の製
造方法は、上述した積層フィルム１１を用いることを特
徴としている。なお、図２は、ＴＡＢテープの長手方向
と垂直方向に切断したときの断面図であり、本発明のＴ
ＡＢテープの製造工程を示す。Next, an example of the method of manufacturing the TAB tape of the present invention will be described with reference to FIG. The manufacturing method of the present invention is characterized by using the above-mentioned laminated film 11. Note that FIG. 2 is a cross-sectional view of the TAB tape taken in a direction perpendicular to the longitudinal direction, which shows the T of the present invention.
The manufacturing process of an AB tape is shown.
【００１５】この製造方法では、まず、剥離工程におい
て、図２（ａ）に示すように、積層フィルム１１の保護
フィルム１４を剥離する。そして、図２（ｂ）に示すよ
うに、保護フィルム１４を剥離して露出した積層フィル
ム１１の接着剤層１３と、接着剤層１３よりも幅広の絶
縁フィルム１５とを貼り合わせる。この貼り合わせの
際、両縁部２０において、接着剤層１３と絶縁フィルム
１５とが重ならないように貼り合わせる。すなわち、貼
り合わせ後、両縁部２０では、接着剤層１３と絶縁フィ
ルム１５とは積層していない。なお、ここで、両縁部２
０とは、絶縁フィルム１５を長手方向に対し垂直に切断
し、その断面を見たときの左右の縁部のことをいう。In this manufacturing method, first, in the peeling step, the protective film 14 of the laminated film 11 is peeled off as shown in FIG. Then, as shown in FIG. 2B, the adhesive layer 13 of the laminated film 11 exposed by peeling off the protective film 14 and the insulating film 15 wider than the adhesive layer 13 are bonded together. At the time of this attachment, the adhesive layer 13 and the insulating film 15 are attached so as not to overlap each other at both edge portions 20. That is, after the bonding, the adhesive layer 13 and the insulating film 15 are not laminated on the both edge portions 20. In addition, here, both edges 2
0 means the left and right edges when the insulating film 15 is cut perpendicularly to the longitudinal direction and its cross section is viewed.
【００１６】次いで、図２（ｃ）に示すように、絶縁フ
ィルム１５の両縁部２０を垂直に穿孔して、スプロケッ
ト孔１６を形成する。次いで、図２（ｄ）に示すよう
に、金属箔１２に、フォトレジスト１７を塗布し、乾燥
させる。そして、図２（ｅ）に示すように、硬化したフ
ォトレジスト１７を、パターンが形成されているフォト
マスク１８でマスクし、紫外線を照射して露光する。次
いで、水酸化カリウム水溶液で現像した後、図２（ｆ）
に示すように、金属箔１２をエッチング液によってエッ
チングして配線パターンを形成させる。次いで、図２
（ｇ）に示すように、水酸化ナトリウム水溶液によって
フォトレジスト残留物を剥離した後、配線パターンの上
に、ソルダーレジストインクを塗布し、硬化させる。次
いで、図２（ｈ）に示すように、配線パターン上に保護
層となる金属めっき１９を形成させて、最終的なＴＡＢ
テープを得る。なお、本発明においては、前記スプロケ
ット孔形成工程とラミネート工程との順序が入れ替わっ
てもよい。すなわち、あらかじめ両縁部にスプロケット
孔を形成した絶縁フィルムを用意し、この絶縁フィルム
に積層フィルムの接着剤層を貼り合わせ、図２（ｃ）に
示すような、絶縁フィルム１５の両縁部２０にスプロケ
ット孔１６が形成された積層体を得てもよい。Next, as shown in FIG. 2C, both edges 20 of the insulating film 15 are vertically perforated to form sprocket holes 16. Next, as shown in FIG. 2D, a photoresist 17 is applied to the metal foil 12 and dried. Then, as shown in FIG. 2E, the hardened photoresist 17 is masked by a photomask 18 having a pattern formed thereon, and ultraviolet rays are irradiated to expose the photoresist. Then, after developing with an aqueous solution of potassium hydroxide, FIG.
As shown in, the metal foil 12 is etched with an etching solution to form a wiring pattern. Then, FIG.
As shown in (g), after removing the photoresist residue with an aqueous sodium hydroxide solution, a solder resist ink is applied on the wiring pattern and cured. Then, as shown in FIG. 2 (h), a metal plating 19 to be a protective layer is formed on the wiring pattern, and the final TAB is formed.
Get the tape. In the present invention, the order of the sprocket hole forming step and the laminating step may be exchanged. That is, an insulating film having sprocket holes formed at both edges is prepared in advance, and an adhesive layer of a laminated film is attached to this insulating film, and both edges 20 of the insulating film 15 as shown in FIG. You may obtain the laminated body in which the sprocket hole 16 was formed in.
【００１７】接着剤層１３に絶縁フィルム１５を貼り合
わせる方法としては特に制限されず、ロールラミネート
法などの従来公知のラミネート方法を適用できる。ま
た、積層フィルム１１の接着剤層１２を貼り合わせる絶
縁フィルム１５としては、耐熱性が高く、絶縁性を有し
ていれば特に制限されないが、例えば、ポリイミド、ポ
リエーテルイミド、ポリフェニレンサルファイド、ポリ
エーテルエーテルケトン、ポリエステル、芳香族ポリア
ミド、エポキシ樹脂−ガラスクロス、エポキシ樹脂−ポ
リイミド−ガラスクロスなどのフィルムが挙げられる。
絶縁フィルム１５の厚さは、２５〜１８８μｍであり、
好ましくは５０〜１２５μｍである。絶縁フィルム１５
の厚さが２５μｍ未満であると、絶縁性が不十分となる
恐れがある上に、絶縁フィルム１５の取扱性が悪い場合
がある。また、１８８μｍを超えても、絶縁フィルム１
５の取扱性が悪い場合がある。また、絶縁フィルム１５
の幅は従来のＴＡＢテープと同様に、３５ｍｍ，４８ｍ
ｍ，７０ｍｍである。The method for attaching the insulating film 15 to the adhesive layer 13 is not particularly limited, and a conventionally known laminating method such as a roll laminating method can be applied. The insulating film 15 to which the adhesive layer 12 of the laminated film 11 is attached is not particularly limited as long as it has high heat resistance and insulating properties, and examples thereof include polyimide, polyetherimide, polyphenylene sulfide, and polyether. Examples of the film include ether ketone, polyester, aromatic polyamide, epoxy resin-glass cloth, and epoxy resin-polyimide-glass cloth.
The thickness of the insulating film 15 is 25 to 188 μm,
It is preferably 50 to 125 μm. Insulating film 15
If the thickness is less than 25 μm, the insulating property may be insufficient and the handleability of the insulating film 15 may be poor. Moreover, even if it exceeds 188 μm, the insulating film 1
The handling property of 5 may be poor. In addition, the insulating film 15
Width is 35mm, 48m, same as conventional TAB tape
m, 70 mm.
【００１８】また、スプロケット孔１６の形成方法とし
ては特に制限されず、例えば、金型によるパンチングに
よって形成する方法などが挙げられる。また、金属めっ
き１９を形成させる方法としては、無電解めっき、電解
めっきのいずれであってもよい。また、めっきの種類と
しては、例えば、スズ、はんだ、金などが挙げられる。The method of forming the sprocket holes 16 is not particularly limited, and examples thereof include a method of forming the sprocket holes 16 by punching with a die. The method of forming the metal plating 19 may be either electroless plating or electrolytic plating. Moreover, examples of the type of plating include tin, solder, and gold.
【００１９】上述したＴＡＢテープの製造方法にあって
は、金属箔１２と、金属箔１２上に形成された接着剤層
１３とを有し、接着剤層１３を保護する保護フィルム１
４が貼り合わされた積層フィルム１１から、保護フィル
ム１４を剥離する剥離工程と、積層フィルム１１の接着
剤層１３と、接着剤層１３より幅広の絶縁フィルム１５
とを、絶縁フィルム１５の両縁部２０が接着剤層１３と
重ならないように貼り合わせるラミネート工程と、絶縁
フィルム１５の両縁部２０にスプロケット孔１６を形成
させるスプロケット孔形成工程と、金属箔１２をエッチ
ングして配線パターンを形成する配線パターン形成工程
とを有する。すなわち、このＴＡＢテープの製造方法で
は、金属箔１２と、金属箔１２上に形成された接着剤層
１３とを有し、接着剤層１３を保護する保護フィルム１
４が貼り合わされた積層フィルム１１を用いているの
で、保護フィルム１４の剥離工程は１回でよく、かつ金
属箔を接着剤層にラミネートする金属箔ラミネート工程
を有さなくてもよく、さらに、あらかじめ銅箔の巻取り
ロールからＴＡＢテープの所望とする幅に銅箔を切断す
る必要がないため、ＴＡＢテープを容易に作製できる。
そのため、ＴＡＢテープの製造工程が簡素化されて、生
産性が向上する上に、保護フィルム１４の使用量を少な
くできるので、ＴＡＢテープのコストを低くできる。ま
た、金属箔１２は、銅箔であると、最終的に得られるＴ
ＡＢテープのコストが安くなる上に、かつ取扱性に優れ
るので、製造時の効率が向上する。In the above-mentioned TAB tape manufacturing method, the protective film 1 has the metal foil 12 and the adhesive layer 13 formed on the metal foil 12, and protects the adhesive layer 13.
Peeling step of peeling the protective film 14 from the laminated film 11 having the four laminated thereon, the adhesive layer 13 of the laminated film 11, and the insulating film 15 wider than the adhesive layer 13.
And laminating step so that both edges 20 of the insulating film 15 do not overlap the adhesive layer 13, a sprocket hole forming step of forming sprocket holes 16 in both edges 20 of the insulating film 15, and a metal foil. 12 is etched to form a wiring pattern. That is, in this TAB tape manufacturing method, the protective film 1 having the metal foil 12 and the adhesive layer 13 formed on the metal foil 12 and protecting the adhesive layer 13 is provided.
Since the laminated film 11 in which 4 is bonded is used, the peeling step of the protective film 14 may be performed once, and the metal foil laminating step of laminating the metal foil on the adhesive layer may not be included. Since it is not necessary to previously cut the copper foil from the copper foil winding roll to the desired width of the TAB tape, the TAB tape can be easily manufactured.
Therefore, the manufacturing process of the TAB tape is simplified, the productivity is improved, and the amount of the protective film 14 used can be reduced, so that the cost of the TAB tape can be reduced. Further, when the metal foil 12 is a copper foil, the T finally obtained
Since the cost of the AB tape is low and the AB tape is easy to handle, the efficiency in manufacturing is improved.
【００２０】[0020]
【発明の効果】本発明のＴＡＢテープの製造方法によれ
ば、ＴＡＢテープの製造工程が簡素化されて、生産性が
向上する上に、保護フィルムの使用量を少なくできるの
で、ＴＡＢテープのコストを低くできる。また、本発明
のＴＡＢテープ用積層フィルムによれば、積層フィルム
の接着剤層とＴＡＢテープの絶縁フィルムとを貼り合わ
すことにより、接着剤層を介して絶縁フィルム上に金属
箔が形成されたＴＡＢテープを容易に作製できる。According to the method of manufacturing a TAB tape of the present invention, the manufacturing process of the TAB tape is simplified, the productivity is improved, and the amount of the protective film used can be reduced. Can be lowered. Further, according to the laminated film for a TAB tape of the present invention, by bonding the adhesive layer of the laminated film and the insulating film of the TAB tape to each other, the TAB in which the metal foil is formed on the insulating film via the adhesive layer The tape can be easily manufactured.
【図１】 本発明のＴＡＢテープ用積層フィルムの一例
を示す断面図である。FIG. 1 is a cross-sectional view showing an example of a laminated film for TAB tape of the present invention.
【図２】 本発明のＴＡＢテープの製造方法における製
造工程の一例を示す断面図である。FIG. 2 is a cross-sectional view showing an example of a manufacturing process in a method for manufacturing a TAB tape according to the present invention.
【図３】 従来のＴＡＢテープの一例を示す断面図であ
る。FIG. 3 is a cross-sectional view showing an example of a conventional TAB tape.
【図４】 従来のＴＡＢテープの製造方法における製造
工程の一例を示す断面図である。FIG. 4 is a cross-sectional view showing an example of a manufacturing process in a conventional TAB tape manufacturing method.
１１…積層フィルム、１２…金属箔、１３…接着剤層、
１４…保護フィルム、１５…絶縁フィルム、１６…スプ
ロケット孔、２０…両縁部11 ... Laminated film, 12 ... Metal foil, 13 ... Adhesive layer,
14 ... Protective film, 15 ... Insulating film, 16 ... Sprocket hole, 20 ... Both edges
Claims (3)
剤層とを有し、前記接着剤層を保護する保護フィルムが
貼り合わされた積層フィルムから、保護フィルムを剥離
する剥離工程と、 前記積層フィルムの接着剤層と、前記接着剤層より幅広
の絶縁フィルムとを、該絶縁フィルムの両縁部が接着剤
層と重ならないように貼り合わせるラミネート工程と、 前記絶縁フィルムの両縁部にスプロケット孔を形成させ
るスプロケット孔形成工程と、 前記金属箔をエッチングして配線パターンを形成する配
線パターン形成工程とを有することを特徴とするＴＡＢ
テープの製造方法。1. A peeling step of peeling a protective film from a laminated film having a metal foil and an adhesive layer formed on the metal foil and having a protective film for protecting the adhesive layer attached thereto. A laminating step of adhering the adhesive layer of the laminated film and an insulating film wider than the adhesive layer so that both edges of the insulating film do not overlap the adhesive layer, both edges of the insulating film And a sprocket hole forming step of forming a sprocket hole in the portion, and a wiring pattern forming step of etching the metal foil to form a wiring pattern.
Tape manufacturing method.
する請求項１に記載のＴＡＢテープの製造方法。2. The method of manufacturing a TAB tape according to claim 1, wherein the metal foil is a copper foil.
剤層とを有し、前記接着剤層を保護する保護フィルムが
貼り合わされたことを特徴とするＴＡＢテープ用積層フ
ィルム。3. A laminated film for a TAB tape, which comprises a metal foil and an adhesive layer formed on the metal foil, and a protective film for protecting the adhesive layer is attached thereto.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001221868A JP3854479B2 (en) | 2001-07-23 | 2001-07-23 | TAB tape manufacturing method and laminated film for TAB tape |
| KR10-2002-0042719A KR100485270B1 (en) | 2001-07-23 | 2002-07-20 | Manufacturing method for TAB tape and layered film for the same |
| TW091116220A TWI226652B (en) | 2001-07-23 | 2002-07-22 | Manufacturing method for TAB tape and layered film for the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001221868A JP3854479B2 (en) | 2001-07-23 | 2001-07-23 | TAB tape manufacturing method and laminated film for TAB tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003037136A true JP2003037136A (en) | 2003-02-07 |
| JP3854479B2 JP3854479B2 (en) | 2006-12-06 |
Family
ID=19055465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001221868A Expired - Fee Related JP3854479B2 (en) | 2001-07-23 | 2001-07-23 | TAB tape manufacturing method and laminated film for TAB tape |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3854479B2 (en) |
| KR (1) | KR100485270B1 (en) |
| TW (1) | TWI226652B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100815274B1 (en) | 2007-07-12 | 2008-03-20 | 김영준 | Color metal sticker, manufacturing method thereof and potable electronic equipment using the same |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4138824B2 (en) * | 2006-07-06 | 2008-08-27 | 河村産業株式会社 | Method for producing plastic film-conductor metal foil laminate |
| KR100797675B1 (en) * | 2007-01-02 | 2008-01-23 | 삼성전기주식회사 | Adhesive tape of transporting jig for substrate |
| KR100967053B1 (en) * | 2007-12-27 | 2010-06-29 | 주식회사 포스코 | Laser processing apparatus |
| CN110690124A (en) * | 2019-11-14 | 2020-01-14 | 江苏上达电子有限公司 | Manufacturing method of packaging substrate for improving residual copper in edge curling |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0529097B1 (en) * | 1991-03-12 | 2003-01-15 | Sumitomo Bakelite Company Limited | Method of manufacturing two-layer tab tape |
-
2001
- 2001-07-23 JP JP2001221868A patent/JP3854479B2/en not_active Expired - Fee Related
-
2002
- 2002-07-20 KR KR10-2002-0042719A patent/KR100485270B1/en not_active IP Right Cessation
- 2002-07-22 TW TW091116220A patent/TWI226652B/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100815274B1 (en) | 2007-07-12 | 2008-03-20 | 김영준 | Color metal sticker, manufacturing method thereof and potable electronic equipment using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100485270B1 (en) | 2005-04-25 |
| KR20030011562A (en) | 2003-02-11 |
| TWI226652B (en) | 2005-01-11 |
| JP3854479B2 (en) | 2006-12-06 |
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