JPS6320894A - Manufacture of sandwich board with electric circuit - Google Patents
Manufacture of sandwich board with electric circuitInfo
- Publication number
- JPS6320894A JPS6320894A JP61165277A JP16527786A JPS6320894A JP S6320894 A JPS6320894 A JP S6320894A JP 61165277 A JP61165277 A JP 61165277A JP 16527786 A JP16527786 A JP 16527786A JP S6320894 A JPS6320894 A JP S6320894A
- Authority
- JP
- Japan
- Prior art keywords
- electric circuit
- core material
- adhesive
- sandwich board
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000011162 core material Substances 0.000 claims description 32
- 239000000853 adhesive Substances 0.000 claims description 29
- 230000001070 adhesive effect Effects 0.000 claims description 29
- 239000000758 substrate Substances 0.000 claims description 19
- 239000007788 liquid Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 239000010410 layer Substances 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 2
- 238000007598 dipping method Methods 0.000 claims description 2
- 239000002356 single layer Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000011888 foil Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002990 reinforced plastic Substances 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は電気回路を有するサンドイッチ板の製造方法
に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a sandwich board having an electric circuit.
第６図は従来の電気回路を有するサンドイッチ板の一部
を切断した斜視図、第７図はその断面図、第８図は分解
斜視図である０図において、（１）は基板で、繊維強化
プラスチック（以下ＦＲＰという）、フッ素樹脂などか
らなる誘電体板（１ａ）と、誘電体板（ｌａ）の両面に
被着された銅箔などの金属系の箔材をエツチングして形
成した。電気回路（ｌｂ）とからなる、（２）は電気回
路（１ｂ）からの電界を遮蔽するための表皮で、金属ま
たは金属箔を有するＦＲＰなどの材料からなる。（３）
は基板（１）の電気回路（１ｂ）のない部分に対応して
基板（１）および表皮（２）間に挿入される芯材で、金
属または高分子化合物の薄材層のハニカムコアや高分子
発泡体などの材料からなる。（４）は基板（１）および
芯材（３）間、ならびに表皮（２）および芯材（３）間
を接着させるためのフィルム状接着剤で、基板（１）の
両面および表皮（２）の片面の全面に付着している。Fig. 6 is a partially cutaway perspective view of a conventional sandwich board having an electric circuit, Fig. 7 is a sectional view thereof, and Fig. 8 is an exploded perspective view. It was formed by etching a dielectric plate (1a) made of reinforced plastic (hereinafter referred to as FRP), fluororesin, etc., and a metal foil material such as copper foil adhered to both sides of the dielectric plate (la). (2) is a skin for shielding the electric field from the electric circuit (1b), and is made of metal or a material such as FRP with metal foil. (3)
is a core material inserted between the substrate (1) and the skin (2) corresponding to the part of the substrate (1) that does not have an electric circuit (1b), and is a core material that is made of a honeycomb core made of a thin layer of metal or polymer compound or a polymer. Made of materials such as molecular foam. (4) is a film adhesive for bonding between the substrate (1) and the core material (3), and between the skin (2) and the core material (3), and is used to bond both surfaces of the substrate (1) and the skin (2). It is attached to the entire surface of one side.
上記のような従来の電気回路を有するサンドイツチ板は
次のように製造されている。まず誘電体板（ｌａ）に設
けられた金属系の箔材をエツチングして電気回路（１ｂ
）を形成し、基板（１）を作る。そして基板（１）の両
面および表皮（２）の接着面側の全面に接着剤（４）を
付着させる０次に基板（１）の電気回路（１ｂ）以外の
部分の形状に芯材（３）を裁断する。A sandwich board having a conventional electric circuit as described above is manufactured as follows. First, the electric circuit (1b) is etched by etching the metal foil material provided on the dielectric plate (la).
) to make the substrate (1). Then, the adhesive (4) is applied to both sides of the substrate (1) and the entire surface of the adhesive side of the skin (2).Then, the core material (3) is applied to the shape of the portion of the substrate (1) other than the electric circuit (1b). ).
そして電気回路（１ｂ）上に芯材（３）が存在しないよ
うに、治具などを用いて、接着剤（４）が付着した表皮
（２）、芯材（３）、接着剤（４）が付着した基板（１
）。Then, using a jig or the like, remove the skin (2) to which the adhesive (4) is attached, the core material (3), and the adhesive (4) so that the core material (3) is not present on the electrical circuit (1b). Substrate (1
).
芯材（３）、接着剤（４）が付着した表皮（２）の順に
積層し、仮接着させてサンドイッチ化する。その後加熱
、加圧接着成形を行い、電気回路を有するサンドイッチ
板を製造する。The core material (3) and the skin (2) to which the adhesive (4) is attached are laminated in this order and temporarily bonded to form a sandwich. Thereafter, heating and pressure bonding molding is performed to produce a sandwich board having an electric circuit.
上記のような従来の製造方法では、接着剤（４）が基板
（１）の両面および表皮（２）の片面の全面に付着して
いるため、電気回路（１ｂ）上に誘電体とじて残り、こ
のため誘電体が増加し、電気回路（ｉｂ）を流れる電流
の電気的損失が大きいという問題点があった。また芯材
（３）を積層する際、基板（１）上の全面に接着剤（４
）が付着しているので、電気回路（１ｂ）を避けて芯材
（３）を配置することが困難であるという問題点があっ
た。In the conventional manufacturing method as described above, since the adhesive (4) is adhered to the entire surface of both sides of the substrate (1) and one side of the skin (2), it remains on the electric circuit (1b) as a dielectric. Therefore, there is a problem that the dielectric material increases and the electrical loss of the current flowing through the electric circuit (ib) is large. Also, when laminating the core material (3), the adhesive (4) is applied to the entire surface of the substrate (1).
) attached thereto, there was a problem in that it was difficult to arrange the core material (3) avoiding the electric circuit (1b).
このような点を避けるために、電気回路（１ｂ）上の接
着剤を除去すると、基板（１）に損傷を与えるおそれが
あり、また工数の増加につながるという問題点があった
。If the adhesive on the electric circuit (1b) is removed in order to avoid such a problem, there is a risk of damaging the substrate (1) and there is a problem in that it leads to an increase in the number of steps.
この発明はかかる問題点を解決するためになされたもの
で、基板の電気回路上に接着剤が存在せず、このため電
気的損失が小さいサンドイツチ板を１位置決め精度よく
製造することができる電気回路を有するサンドイッチ板
の製造方法を得ることを目的としている。This invention was made to solve this problem, and there is no adhesive on the electrical circuit of the board, so that it is possible to manufacture a sanderch board with low electrical loss with high positioning accuracy. The object of the present invention is to obtain a method for manufacturing a sandwich plate having the following properties.
この発明に係わる電気回路を有するサンドイッチ板の製
造方法は、電気回路を有する基板に、前記電気回路以外
の部分に位置する芯材を介して表皮を接着し一体化する
サンドイツチ板の製造方法において、芯材に液状の接着
剤を付着させて半硬化状態にした後、電気回路以外の部
分の形状に裁断して、前記基板の電気回路以外の部分に
接着するようにした製造方法である。A method for manufacturing a sandwich board having an electric circuit according to the present invention is a method for manufacturing a sandwich board in which a skin is bonded and integrated with a substrate having an electric circuit through a core material located in a portion other than the electric circuit. In this manufacturing method, a liquid adhesive is applied to the core material to bring it into a semi-cured state, and then the core material is cut into the shape of a portion other than the electric circuit, and then adhered to the portion of the substrate other than the electric circuit.
この発明による電気回路を有するサンドイッチ板の製造
方法においては、浸漬等により芯材に液状の接着剤を付
着させて半硬化状態にし、これを裁断して、基板の電気
回路以外の部分に接着し。In the method of manufacturing a sandwich board having an electric circuit according to the present invention, a liquid adhesive is applied to the core material by dipping or the like to make it into a semi-hardened state, and this is cut and adhered to the part of the board other than the electric circuit. .
その上に表皮を接着することにより、サンドイッチ板が
製造される。こうして製造さ、れたサンドイツチ板は電
気回路上には接着剤は存在せず、このため電気的損失が
小さく、かつ芯材の位置決め精度が高い。A sandwich board is produced by gluing a skin thereon. In the Sanderch board manufactured in this way, no adhesive is present on the electrical circuit, so electrical loss is small and the positioning accuracy of the core material is high.
第１図はこの発明の一実施例による電気回路を有するサ
ンドイツチ板の一部を切断した斜視図。FIG. 1 is a partially cutaway perspective view of a sanderch board having an electric circuit according to an embodiment of the present invention.
第２図はその断面図、第３図は分解斜視図、第４図は芯
材に液状の接着剤を付着させる状態を示す断面図、第５
図は液状の接着剤を半硬化させる状態を示す斜視図であ
る６図において、第６図ないし第８図と同一符号は同一
または相当部分を示すが、接着剤（４）は電気回路（１
ｂ）以外の部分に対応する部分に設けられた芯材（３）
に付着している。Fig. 2 is a sectional view, Fig. 3 is an exploded perspective view, Fig. 4 is a sectional view showing the state in which liquid adhesive is attached to the core material, and Fig. 5 is a sectional view of the core material.
In FIG. 6, which is a perspective view showing a state in which the liquid adhesive is semi-cured, the same reference numerals as in FIGS. 6 to 8 indicate the same or corresponding parts.
Core material (3) provided in the part corresponding to the part other than b)
is attached to.
上記の電気回路を有するサンドイツチ板は次のように製
造する。まず、誘電体板（１ａ）上に設けられた金属系
の箔材をエツチングして電気回路（１ｂ）を形成し、基
板（１）を作る０次に裁断前の芯材（３）を脱脂し、第
４図に示すように、液状の接着剤（４）を入れたタンク
（５）内に浸漬して、接着剤（４）を芯材（３）に、特
にその両面に付着させる。そして接着剤（４）を付着し
た芯材（３）を、第５図に示すように、支持体（６）で
支持して乾燥させ、接着剤（４）を半硬化状態にした後
、基板（１）の電気回路（１ｂ）以外の部分の形状に裁
断する１次いで電気回路（１ｂ）上に芯材（３）が存在
しないように、治具などを用いて、表皮（２）、接着剤
（４）が付着した芯材（３）、基板（１）、接着剤（４
）が付着した芯材（３）、表皮（２）の順に積層し、仮
接着させてサンドイッチ化する。その後加熱、加圧接着
成形を行い、電気回路を有するサンドイツチ板を製造す
る。A sanderch board with the above electric circuit is manufactured as follows. First, the metallic foil material provided on the dielectric plate (1a) is etched to form an electric circuit (1b), and the substrate (1) is made.Next, the core material (3) before cutting is degreased. Then, as shown in FIG. 4, the core material (3) is immersed in a tank (5) containing a liquid adhesive (4) to adhere the adhesive (4) to the core material (3), particularly to both surfaces thereof. Then, as shown in FIG. 5, the core material (3) to which the adhesive (4) is attached is supported by the support (6) and dried to bring the adhesive (4) into a semi-cured state. (1) Cut into the shape of the part other than the electrical circuit (1b). Next, use a jig or the like to cut the outer skin (2) and glue so that there is no core material (3) on the electrical circuit (1b). Core material (3) with adhesive (4) attached, substrate (1), adhesive (4)
) and the outer skin (2) are laminated in this order and temporarily adhered to form a sandwich. Thereafter, heating and pressure bonding are performed to produce a sandwich board with an electric circuit.
こうして製造された電気回路を有するサンドイッチ板は
、電気回路（１ｂ）上に接着剤（４）を有しないため、
電気的損失が小さい、このサンドイッチ板をたとえばア
ンテナのマイクロ波回路のサンドイッチ基板として使用
する場合には、電気回路（１ｂ）上に接着剤（４）がな
いため、高利得のアンテナを形成することができる。ま
た誘電体損を小さくすることができるため、電気回路（
ｔｂ）を長くすることが可能となり、大形アンテナの製
作も可能となる。Since the sandwich board with the electrical circuit produced in this way does not have the adhesive (4) on the electrical circuit (1b),
When this sandwich board with low electrical loss is used as a sandwich board for a microwave circuit of an antenna, for example, there is no adhesive (4) on the electrical circuit (1b), so it is difficult to form a high-gain antenna. Can be done. In addition, since dielectric loss can be reduced, electrical circuits (
tb) can be made longer, making it possible to manufacture a large antenna.
さらにサンドイッチ状にする際、電気回路（１ｂ）上に
接着剤（４）が存在しないため１．芯材（３）が位置決
めしやすく、その上芯材（３）等が積層しやすいため、
安価な製品が得られる。Furthermore, when forming the sandwich, 1. The core material (3) is easy to position, and the core material (3) etc. are easy to stack.
Cheap products can be obtained.
なお上記実施例では、２層の電気回路を有するサンドイ
ツチ板について示したが、単層または多層のサンドイツ
チ板においても、はぼ同様に製造することができ、上記
実施例と同様の効果を奏する。In the above embodiments, a sandwich board having a two-layer electric circuit is shown, but a single-layer or multilayer sandwich board can also be manufactured in the same manner as in the above embodiment, and the same effects as in the above embodiments can be obtained.
この発明は以上のように、芯材に液状の接着剤を付着し
て半硬化状態とした後、電気回路を除いた形状に裁断し
て仮接着し、加熱、加圧接着するようにしたので、電気
回路上に接着剤が存在せず。As described above, in this invention, after applying a liquid adhesive to a core material and making it into a semi-cured state, it is cut into a shape excluding the electric circuit, temporarily bonded, and then heated and pressure bonded. , without the presence of adhesive on the electrical circuit.
このため、電気的損失が小さいサンドイッチ板を位置決
め精度よく安価に製造することができる。Therefore, a sandwich plate with low electrical loss can be manufactured at low cost with high positioning accuracy.
第１図はこの発明の一実施例による電気回路を有するサ
ンドイッチ板の一部を切断した斜視図、第２図はその断
面図、第３図は分解斜視図、第４図は芯材に液状の接着
剤を付着させる状態を示す断面図、第５図は液状の接着
剤を半硬化させる状態を示す斜視図、第６図は従来の電
気回路を有するサンドイツチ板の一部を切断した斜視図
、第７図はその断面図、第８図は分解斜視図である。
各図中、同一符号は同一または相当部分を示し。
（１）は基板、（１ａ）は誘電体板、（１ｂ）は電気回
路、（２）は表皮、（３）は芯材、（４）は接着剤であ
る。FIG. 1 is a partially cutaway perspective view of a sandwich board having an electric circuit according to an embodiment of the present invention, FIG. 2 is a sectional view thereof, FIG. 3 is an exploded perspective view, and FIG. 5 is a perspective view showing a state in which liquid adhesive is semi-cured; FIG. 6 is a partially cutaway perspective view of a conventional sanderch board having an electric circuit. , FIG. 7 is a sectional view thereof, and FIG. 8 is an exploded perspective view thereof. In each figure, the same reference numerals indicate the same or corresponding parts. (1) is a substrate, (1a) is a dielectric plate, (1b) is an electric circuit, (2) is a skin, (3) is a core material, and (4) is an adhesive.
Claims (3)
分に位置する芯材を介して表皮を接着し一体化するサン
ドイッチ板の製造方法において、芯材に液状の接着剤を
付着させて半硬化状態にした後、電気回路以外の部分の
形状に裁断して、前記基板の電気回路以外の部分に接着
することを特徴とする電気回路を有するサンドイッチ板
の製造方法。(1) In a method for manufacturing a sandwich board in which a skin is bonded and integrated with a substrate having an electric circuit through a core material located in a portion other than the electric circuit, a liquid adhesive is attached to the core material to form a half. 1. A method for manufacturing a sandwich board having an electric circuit, which comprises curing the substrate, cutting it into the shape of a portion other than the electric circuit, and adhering it to the portion of the substrate other than the electric circuit.
あることを特徴とする特許請求の範囲第１項記載の電気
回路を有するサンドイッチ板の製造方法。(2) A method for manufacturing a sandwich board having an electric circuit according to claim 1, wherein the sandwich board is a single-layer, two-layer or multi-layer sandwich board.
とを特徴とする特許請求の範囲第１項または第２項記載
の電気回路を有するサンドイッチ板の製造方法。(3) A method for manufacturing a sandwich board having an electric circuit according to claim 1 or 2, wherein the adhesive is attached to the core material by dipping.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61165277A JPS6320894A (en) | 1986-07-14 | 1986-07-14 | Manufacture of sandwich board with electric circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61165277A JPS6320894A (en) | 1986-07-14 | 1986-07-14 | Manufacture of sandwich board with electric circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6320894A true JPS6320894A (en) | 1988-01-28 |
Family
ID=15809272
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61165277A Pending JPS6320894A (en) | 1986-07-14 | 1986-07-14 | Manufacture of sandwich board with electric circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6320894A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0673462A (en) * | 1992-06-23 | 1994-03-15 | Nkk Corp | Device for cooling metal strip |
| JPH0681047A (en) * | 1992-06-23 | 1994-03-22 | Nkk Corp | Device for cooling metal strip |
| JPH06116655A (en) * | 1992-06-23 | 1994-04-26 | Nkk Corp | Method for cooling metal strip |
| JPH06340914A (en) * | 1993-06-01 | 1994-12-13 | Nkk Corp | Device for gas-cooling metal strip |
| JPH06340913A (en) * | 1993-06-01 | 1994-12-13 | Nkk Corp | Gas-cooling device for metal strip |
| JPH0711346A (en) * | 1993-06-22 | 1995-01-13 | Nkk Corp | Device for cooling of strip metal with gas |
| JPH0711345A (en) * | 1993-06-22 | 1995-01-13 | Nkk Corp | Device for cooling strip metal |
-
1986
- 1986-07-14 JP JP61165277A patent/JPS6320894A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0673462A (en) * | 1992-06-23 | 1994-03-15 | Nkk Corp | Device for cooling metal strip |
| JPH0681047A (en) * | 1992-06-23 | 1994-03-22 | Nkk Corp | Device for cooling metal strip |
| JPH06116655A (en) * | 1992-06-23 | 1994-04-26 | Nkk Corp | Method for cooling metal strip |
| JPH06340914A (en) * | 1993-06-01 | 1994-12-13 | Nkk Corp | Device for gas-cooling metal strip |
| JPH06340913A (en) * | 1993-06-01 | 1994-12-13 | Nkk Corp | Gas-cooling device for metal strip |
| JPH0711346A (en) * | 1993-06-22 | 1995-01-13 | Nkk Corp | Device for cooling of strip metal with gas |
| JPH0711345A (en) * | 1993-06-22 | 1995-01-13 | Nkk Corp | Device for cooling strip metal |
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