JPH11150368A - Manufacture of flex rigid wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a flex rigid wiring board, wherein an unfinished board can be easily handled in a manufacturing process, and liquid can be restrained from permeating into the wiring board through a slit in a process where a circuit pattern is formed. SOLUTION: A first process where a pair of rigid boards 17 with a slit 16 provided at a boundary between the boards 17 are bonded to each surface of a flexible board 13, a second process where a sealing material 19 is filled in the slit 16 of the rigid boards 17 each bonded to the surfaces of the flexible board 13, a third process where a conductor circuit pattern is formed on the rigid boards 17 where sealing material 17 is filled in the slit 16, and a fourth process where a rigid board disused part 21 as a non-product part of the rigid board 17 is removed from the slit 16 of the rigid boards 17 where the circuit patterns are formed to expose a part of the flexible board 13.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a flex-rigid wiring board comprising a rigid portion for mounting an electric component and a bendable flexible portion.

[0002]

2. Description of the Related Art Generally, a flex-rigid wiring board is
As shown in FIG. 6, two relatively rigid rigid portions 1 on which electric components are mounted are electrically connected by a flexible portion 2 which has a soft property and can be bent. Since this flex-rigid wiring board has a bendable flexible portion 2, it is possible to attach the rigid portions 1 in a relatively free state, for example, it is possible to attach the rigid portions 1 in a three-dimensional arrangement. It has become something.

[0003] In manufacturing such a flex-rigid wiring board, first, components are laminated on both sides of a flexible substrate in the order of a coverlay film, an adhesive sheet, and a rigid substrate, and these components are integrated by hot pressing. Thereafter, a circuit pattern of a conductor layer is formed on each rigid substrate, and unnecessary rigid substrate portions, which are non-product portions, are removed in a final step, and a portion of the flexible substrate is exposed at the center. And
In order to efficiently remove unnecessary rigid substrates,
A method is generally adopted in which a slit is provided in advance between a product part and a non-product part on a rigid substrate, and the slit is used as a trigger for removing work.

[0004]

However, in this conventional manufacturing method, in the step of forming a circuit pattern of a conductor layer on each rigid substrate, the liquid material penetrates from the slit into the joint between the rigid substrate and the flexible substrate. In some cases, resulting in defective products.
Further, the semi-finished product substrate in the manufacturing process has a low rigidity due to the slits provided in the rigid substrate and may be damaged, so that it is difficult to handle in the manufacturing process.

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and enables a semi-finished product substrate to be easily handled in a manufacturing process and a slit in a process of forming a circuit pattern. Provided is a method for manufacturing a flex-rigid wiring board capable of suppressing the penetration of a liquid agent from the board.

[0006]

In order to achieve the above object, a method for manufacturing a flex-rigid wiring board according to the present invention comprises:
A pair of rigid substrates divided into a first substrate region and a second substrate region and provided with a slit at a boundary portion between the first substrate region and the second substrate region are joined to both surfaces of the flexible substrate. And filling the sealing material into the slits of each of the rigid substrates bonded to both surfaces of the flexible substrate, and forming a circuit of the conductor layer on each of the rigid substrates filled with the sealing material in the slits. A step of forming a pattern, and a step of removing one of the substrate regions from the position of the slit of each of the rigid substrates on which the circuit pattern is formed to expose a part of the flexible substrate.

According to the method for manufacturing a flex-rigid wiring board of the present invention, after a pair of rigid boards are joined to both sides of a flexible board, a sealing material is filled in a slit provided in each rigid board to close the slit. Therefore, in a subsequent step, for example, a step of forming a circuit pattern of a conductor layer on each rigid board, it is possible to suppress penetration of a liquid agent from a slit into a joint portion between the flexible board and the rigid board, and it is possible to reduce defective products. Generation can be suppressed. In addition, the semi-finished substrate in the process after the slit is closed with the sealing material has high rigidity and reduces the possibility of breakage due to handling, so that handling is easy.

[0008]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view showing a flex-rigid wiring board according to an embodiment of the present invention, and FIG. 2 is a perspective view showing components for producing the same.

In this flex-rigid wiring board, as shown in FIG. 1, two relatively hard rigid portions 11 on which electric components are mounted are electrically connected by a flexible portion 12 which has a soft property and can be bent. Connected and configured.

As shown in FIG. 2, the flex-rigid wiring board has a laminated structure in which different parts are successively overlapped on both surfaces of a flexible substrate 13 at the center. The flexible substrate 13 and the flexible substrate 1
Coverlay film 14 interposed so as to completely cover 3
And a boundary between an adhesive sheet 15 in which a portion compatible with the flexible portion 12 is cut out and covers the outside of the coverlay film 14 and a product portion to be the rigid portion 11 and a non-product portion to be finally removed. It is manufactured by a rigid substrate 17 provided with a slit 16 in a portion.

Next, a method for manufacturing a flex-rigid wiring board comprising such components will be described.

First, as shown in FIG. 2, a flexible substrate 13 is arranged at the center, and the components are successively stacked on both surfaces of the flexible substrate 13 in the order of a coverlay film 14, an adhesive sheet 15, and a rigid substrate 17. Then, these are temporarily press-bonded and integrated to form a semi-finished product substrate 18. The slits 16 of the rigid substrate 17 located on both surfaces of the semi-finished substrate 18 are filled with a thermosetting sealing material 19 from a nozzle 20 of, for example, a liquid precision metering device, and the semi-finished substrate 18 is hot-pressed. In this step, the slit 16 is closed by the cured material of the sealing material 19, so that the semi-finished substrate 18 has high rigidity, and is less likely to be damaged by handling in the subsequent steps, and is easy to handle. Become. Next, a circuit pattern of a conductor layer is formed on each rigid board 17 of the semi-finished board 18 which is hot-pressed and completely integrated. At this time, a liquid material is used. However, since the slit 16 of the rigid substrate 17 is closed with the cured material of the sealing material 19, the liquid material is supplied from the slit 16 to the joint portion between the rigid substrate 17 and the flexible substrate 13. The possibility of seepage is greatly reduced. Next, as shown in FIG. 4, the semi-finished product substrate 18 on which the circuit pattern is formed is
Cut to the desired contour. Finally, as shown in FIG. 5, the rigid substrate removing portion 21 which is a non-product portion is removed by using the slit 16 as a trigger, and the flexible portion 12 of the flexible substrate 13 is exposed. Thereby, the flex-rigid wiring board is completed.

As described above, according to the method for manufacturing a flex-rigid wiring board of the present embodiment, the semi-finished substrate 1
8 each slit 1 of each rigid substrate 17 located on both sides
6 is filled with a thermosetting sealing material 19, and the semi-finished substrate 18 is hot-pressed to cure the sealing material 19 and close the slit 16. In the process of forming a circuit pattern, etc., the flexible substrate 1
It is possible to suppress the penetration of the liquid agent into the joint between the rigid substrate 3 and the rigid substrate 17, and it is possible to suppress the occurrence of defective products. In addition, the semi-finished substrate 18 in the process after the slit 16 is closed with the cured material of the sealing material 19 has high rigidity and reduces the possibility of breakage due to handling, so that it is easy to handle.

The present invention is not limited to the manufacturing method of this embodiment. For example, when the flex-rigid wiring board to be manufactured is particularly thick, that is, when the rigid substrate 17 is thick, Before removing the rigid substrate removing portion 21 which is a non-product portion in the final step, a cut may be made in the surface of the cured sealing material 19 so that the rigid substrate removing portion 21 can be easily removed.

In addition, as a material of the flex-rigid wiring board that can be used in the present embodiment, general materials that have been conventionally used can of course be used as they are. For example, as the rigid substrate 17, glass polyimide, an epoxy-based composite, etc., and as the flexible substrate 13,
Examples thereof include a polyester film and a polyimide film.

The thermosetting sealing material 19 to be filled in the slit 16 has a practically minimum adhesiveness and fluidity and does not adversely affect the characteristics of the manufactured flex-rigid wiring board. If so, there is no particular limitation. In addition, as long as the slit 16 can be closed, a resin or the like that is cured by aging can be used.

[0018]

As described above, according to the method for manufacturing a flex-rigid wiring board of the present invention, after a pair of rigid boards are joined to both sides of a flexible board, a seal is provided in a slit provided in each rigid board. Since the material is filled and the slit is closed, in a subsequent step, for example, a step of forming a circuit pattern of the conductor layer on each rigid substrate,
It is possible to suppress penetration of the liquid agent from the slit into the joint between the flexible substrate and the rigid substrate, and it is possible to suppress the occurrence of defective products. In addition, the semi-finished product in the process after the slit is closed with the sealing material has high rigidity and reduces the possibility of breakage due to handling, so that handling is easy.

[Brief description of the drawings]

FIG. 1 is a sectional view of a flex-rigid wiring board of the present invention.

FIG. 2 is a diagram showing components of the flex-rigid wiring board of FIG. 1;

FIG. 3 is a view showing a state in which a slit of a semi-finished product substrate is filled with a thermosetting sealing material.

FIG. 4 is a perspective view showing a state when the semi-finished product substrate is cut into a desired outer shape.

FIG. 5 is a cross-sectional view illustrating a state where a rigid substrate removing portion, which is a non-product portion, is removed.

FIG. 6 is a cross-sectional view showing a conventional flex-rigid wiring board;

[Explanation of symbols]

 11 Rigid part 12 Flexible part 13 Flexible substrate 14 Coverlay film 15 Adhesive sheet 16 Slit 17 Rigid substrate 18 Semi-finished substrate 19 Sealing material 21 Rigid Substrate removal section

Claims (1)

[Claims] 1. A pair of rigid substrates divided into a first substrate region and a second substrate region and provided with a slit at a boundary portion between the first substrate region and the second substrate region are provided. Bonding to both surfaces of the substrate; filling sealing material in the slits of the rigid substrates bonded to both surfaces of the flexible substrate; each of the rigid substrates filling the sealing material in the slits Forming a circuit pattern of a conductor layer on the rigid substrate, and removing any one of the substrate regions from the positions of the slits of the rigid substrate on which the circuit pattern is formed to expose a part of the flexible substrate. A method for manufacturing a flex-rigid wiring board.