CN105392306A - High-frequency blind slot circuit board and processing method thereof - Google Patents
High-frequency blind slot circuit board and processing method thereof Download PDFInfo
- Publication number
- CN105392306A CN105392306A CN201510850066.4A CN201510850066A CN105392306A CN 105392306 A CN105392306 A CN 105392306A CN 201510850066 A CN201510850066 A CN 201510850066A CN 105392306 A CN105392306 A CN 105392306A
- Authority
- CN
- China
- Prior art keywords
- opening
- circuit board
- adhesive layer
- blind slot
- high frequency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a high-frequency blind slot circuit board and a processing method thereof. The processing method comprises the steps of forming a first through opening in at least a circuit board; forming a second through opening in at least an adhesive layer, the second opening corresponding to and being greater than the first opening; overlaying the circuit board and the adhesive layer alternately, with the circuit board formed with the first opening disposed adjacent to the adhesive layer formed with the second opening; and pressing the circuit board along a direction perpendicular to a plane where the circuit board is positioned. The second opening is arranged to be greater than the first opening, so the effect of glue overflow on a blind slot can be avoided after pressing, and the product yield is therefore improved. For the high-frequency blind slot circuit board provided by the invention, the first opening has a greater size than that of the first opening, the glue overflow problem can be mitigated, and the product yield is improved.
Description
Technical field
The present invention relates to circuit board processing and manufacturing field, be specifically related to a kind of high frequency blind slot circuit board and processing method thereof.
Background technology
Along with electronics, communications industry are fast-developing, polytetrafluoroethylene (PTFE) wiring board itself has excellent electrical insulation capability, chemically stable and thermally-stabilised due to its material, makes it to become the requisite auxiliary products of high and new technology industry.Because circuit board is to the development trend of high density, high reliability, high frequency, part adopts blind slot design based on the high-frequency circuit panel products of polytetrafluoroethylene base material, so that mounting related components or electronic devices and components are fixed, improve overall product integrated level or reach the shielding action of signal.Circuit board blind slot in the class generally all will carry out welding component, utilizes blind slot to carry out welding and fixed product, therefore, has requirement strict especially to the size of blind slot, the degree of depth, shape.
In prior art, high frequency blind slot circuit board generally adopts two or multiple ptfe substrates are stacked presses together, because profile between layers and size are not identical, pressing is carried out after needing gong sky again with containing glue insulating barrier in position to be welded, thus the middle part formed has the circuit board of some cell bodies.But there is a lot of defect in said method, as:
(1) mobility containing glue insulating barrier is comparatively large, and glue amount of overflowing in the process of pressing is large, has a strong impact on the size of blind slot, outward appearance and follow-up welding step;
(2) because fluorine ion in ptfe substrate does not possess hydrophily, when the insulating material pressing using gel content larger, adhesion is not strong, easily causes the problem of the layering plate bursting in later stage use procedure;
(3) less containing glue isolation layer intensity, under the effect of stress, easily there is colloidal sol and dimensional tolerance larger problem during milling gong, affect product yield.
Summary of the invention
To be solved by this invention is the problem that existing high frequency blind slot circuit board product yield is low.
For solving the problems of the technologies described above, the embodiment of the present invention provides a kind of processing method of high frequency blind slot circuit board, comprises the following steps:
At least one layer circuit board is formed the first through opening;
At least one deck adhesive layer forms the second through opening, and the position of described second opening is corresponding with described first opening, and the opening of described second opening is greater than the opening of described first opening;
Alternately stacked described circuit board and described adhesive layer, the circuit board next-door neighbour being wherein formed with described first opening is formed with the adhesive layer placement of described second opening;
Along circuit board described in the direction pressing perpendicular to described circuit board place plane.
Preferably, the described step forming the second through opening at least one deck adhesive layer comprises:
Adhesive layer is arranged between two pieces of base plates;
On described adhesive layer, described second opening is offered through described first base plate and/or the second base plate;
Remove described first base plate and described second base plate.
Preferably, described first base plate is phenolic board, and described second base plate is epoxy resin board.
Preferably, after circuit board described in pressing, the opening of described second opening is more than or equal to the opening of described first opening.
Preferably, offer described second opening before be also included in described adhesive layer technique edges the step of location hole is set.
Preferably, also comprise and patterning is carried out to the described circuit board of each layer, form the step of circuit.
The embodiment of the present invention also provides a kind of high frequency blind slot circuit board, comprising:
The stacked multilayer circuit board be arranged alternately and adhesive layer;
First opening, is formed at least on circuit board described in one deck;
Second opening, be formed in be close to described first opening at least adhesive layer described in one deck on, the position of described second opening is corresponding with described first opening, and the opening of described second opening is not less than the opening of described first opening.
Preferably, described first opening and described second opening are polygon, the monolateral length 0.2mm ~ 0.4mm larger than the monolateral length of described first opening of described second opening.
Preferably, at least adhesive layer described in one deck is the pure glued membrane of thermosetting.
More preferably, the thickness of the pure glued membrane of described thermosetting is 15 μm ~ 25 μm, and the pure glued membrane of described thermosetting is at least one in epoxy jelly membrane, polyacrylic acid glued membrane, polyimides glued membrane, phenolic aldehyde glued membrane, urea-formaldehyde glue film; The substrate of the described circuit board of each layer is ptfe substrate.
The technique scheme of the embodiment of the present invention has the following advantages compared to existing technology:
The processing method of a kind of high frequency blind slot circuit board 1, described in the embodiment of the present invention, comprises the following steps: at least one layer circuit board, form the first through opening; At least one deck adhesive layer forms the second through opening, and the position of described second opening is corresponding with described first opening, and described second opening is greater than described first opening; Alternately stacked described circuit board and described adhesive layer, the circuit board next-door neighbour being wherein formed with described first opening is formed with the adhesive layer placement of described second opening; Along circuit board described in the direction pressing perpendicular to described circuit board place plane.By described second opening is set to be greater than described first opening, described in pressing during circuit board, effectively avoid adhesive layer deformation to overflow the impact of glue on opening, thus improve product yield.
The processing method of a kind of high frequency blind slot circuit board 2, described in the embodiment of the present invention, adopt the pure glued membrane of thermosetting as adhesive layer, when curing temperature is higher than 150 DEG C, the pure glued membrane of thermosetting not only can have each described circuit board of effective adhesive as adhesive, avoids the generation of plate bursting problem; Meanwhile, the pure glued membrane cured strength of described thermosetting is large, not easily produces deformation, ensure that the yield of product in follow-up mechanical processing process.In addition, the pure latex film property of thermosetting is stablized, and the deformation quantity in bonding processes is minimum, effectively improves product yield.
3, a kind of high frequency blind slot circuit board described in the embodiment of the present invention, the first opening be formed at least circuit board described in one deck is not more than the second opening be formed at least adhesive layer described in one deck being close to described first opening, without glue problem of overflowing.
Accompanying drawing explanation
In order to make content of the present invention be more likely to be clearly understood, below according to a particular embodiment of the invention and by reference to the accompanying drawings, the present invention is further detailed explanation, wherein
Fig. 1 is the processing method flow chart of high frequency blind slot circuit board described in the embodiment of the present invention;
Fig. 2 is the structural representation of first circuit board described in the embodiment of the present invention;
Fig. 3 is the lamination method of the pure glued membrane of thermosetting described in the embodiment of the present invention;
Fig. 4 is the processing method of the second opening described in the embodiment of the present invention;
Fig. 5 is high frequency blind slot press fit of circuit boards pre-structure schematic diagram described in the embodiment of the present invention;
Fig. 6 is structural representation after high frequency blind slot press fit of circuit boards described in the embodiment of the present invention;
In figure, Reference numeral is expressed as: 1-first circuit board, 2-second circuit board, 3-tertiary circuit plate, 4-the 4th circuit board, 51-first adhesive layer, 52-second adhesive layer, 53-the 3rd adhesive layer, 6-first opening, 7-second opening, 8-first base plate, 9-second base plate, the pure glue-line of 10-thermosetting.
Embodiment
In order to make the object, technical solutions and advantages of the present invention clearly, below in conjunction with accompanying drawing, embodiments of the present invention are described in further detail.
The present invention can implement in many different forms, and should not be understood to be limited to embodiment set forth herein.On the contrary, provide these embodiments, make the disclosure to be thorough and complete, and design of the present invention fully will be conveyed to those skilled in the art, the present invention will only be limited by claim.In the accompanying drawings, for clarity, the size in layer and region and relative size can be exaggerated.
Below in conjunction with accompanying drawing 1-5, the execution mode of the embodiment of the present invention is described in further detail.
Embodiment
The present embodiment provides a kind of processing method of high frequency blind slot circuit board, and as shown in Figure 1, the method comprises the following steps:
S1, as shown in Figure 2, at least one layer circuit board forms the first opening 6 of this circuit board through.The present embodiment preferably forms the first opening 6 on first circuit board 1 and second circuit board 2, but on other circuit boards, form opening be also feasible.First opening 6 can pass through etching technics, is formed on first circuit board 1 and second circuit board 2; Preferably, the substrate of each described circuit board 1,2,3,4 is ptfe substrate.
As convertible embodiment of the present invention, also comprise and patterning is carried out to each described circuit board 1,2,3,4, form the step of circuit.Form the step of circuit to comprise: sawing sheet, boring, heavy copper, plating, dry film, etching, detect, at least one offered in blind slot, gong limit.
As the preferred embodiments of the present invention, the work flow of first circuit board 1 and second circuit board 2 comprises and carrying out successively: sawing sheet, boring, plating, etching, detection (AOI), offer the steps such as blind slot; The work flow of tertiary circuit plate 3 and the 4th circuit board 4 comprises and carrying out successively: the step such as sawing sheet, boring, heavy copper, dry film, plating, etching, detection (AOI).
S2, as shown in Figure 3, at least one deck adhesive layer forms the second opening 7, second opening corresponding with the first opening 6, and the openings of sizes of the second opening 7 is greater than the openings of sizes of the first opening 6.In the present embodiment, the second adhesive layer 52 forms the second opening 7, but on other adhesive layers, form opening be also feasible.
More preferably, the opening shape of the first opening 6 and the second opening 7 is polygon, and the present embodiment is quadrangle, and the monolateral length of the second opening 7 is than the monolateral large 0.2mm ~ 0.4mm of the first opening 6.
Preferably, in the present embodiment, be conventional adhesive layer at the first adhesive layer 51 and the 3rd adhesive layer 53, be formed directly into first circuit board 1 with on the contact-making surface of second circuit board 2.Second adhesive layer 52 is preferably the pure glued membrane of thermosetting, second adhesive layer 52 is formed the second opening 7, the pure film thickness of thermosetting is 15 μm ~ 25 μm, and the pure glued membrane of thermosetting is preferably at least one in epoxy jelly membrane, polyacrylic acid glued membrane, polyimides glued membrane, phenolic aldehyde glued membrane, urea-formaldehyde glue film; The present embodiment, is preferably the epoxy jelly membrane that thickness is 20 μm.
As convertible embodiment of the present invention, at least one deck adhesive layer near the first opening 6 is the pure glued membrane of thermosetting, then all can realize the object of inventing, belong to protection scope of the present invention.
Preferably, in the present embodiment, the forming step of the second opening 7 comprises:
S21, as shown in Figure 3, be arranged between the first base plate 8 and the second base plate 9 by stacked for pure for some thermosetting glue-line 10, form the pure glued membrane of thermosetting, i.e. the second adhesive layer 52.
As shown in Figure 4, location hole is set at the technique edges of the second adhesive layer 52, offers the second opening 7 through first end 8 with on the second adhesive layer 52; Certainly, on the second adhesive layer 52, offer the second opening 7 through first end 8 and/or the second base plate 9, all can realize object of the present invention, belong to protection scope of the present invention.
S22, remove the first base plate 8 and the second base plate 9, obtain the second adhesive layer 52 offering the second opening 7.
Preferably, the first base plate 8 is phenolic board, and the second base plate 9 is epoxy resin board.
S3, as shown in Figure 5, described adhesive layer 51,52,53 is stackedly arranged between each described circuit board 1,2,3,4, and contraposition is carried out to the first opening 6 and the second opening 7, namely along the vertical direction of described high frequency blind slot circuit board place plane, the second opening 7 projection cover the projection of the first opening 6 on described high frequency blind slot circuit board corresponding with it.
Preferably, the projection centre of the first opening 6 that the projection of the second opening 7 on described high frequency blind slot circuit board is corresponding with it on described high frequency blind slot circuit board overlaps.
S4, as shown in Figure 6, pressing is carried out to each described circuit board 1,2,3,4 of stacked setting and described adhesive layer 51,52,53 in direction along vertical described high frequency blind slot circuit board place plane, there is deformation in the second opening 7, be preferably so that the size of the second opening 7 equals the first opening 6, obtain described high frequency blind slot circuit board, the size of certain second opening 7 is also feasible slightly larger than the first opening 6.
The openings of sizes of described second opening 7 is set to the openings of sizes being greater than described first opening 6, described in pressing during circuit board, effectively avoids adhesive layer deformation to overflow the impact of glue on opening, thus improve product yield.
The present embodiment also provides a kind of high frequency blind slot circuit board, and this high frequency blind slot circuit board comprises the stacked multilayer circuit board and adhesive layer that are arranged alternately; First opening, is formed at least on circuit board described in one deck; Second opening, be formed in be close to described first opening at least adhesive layer described in one deck on, the position of described second opening is corresponding with described first opening, and the openings of sizes of described second opening is not less than the openings of sizes of described first opening.
For Fig. 6, describe the high frequency blind slot circuit board of the present embodiment in detail, high frequency blind slot circuit board in Fig. 6 comprises four-layer circuit board, i.e. first circuit board 1, second circuit board 2, tertiary circuit plate 3, the 4th circuit board 4, bondd by adhesive layer between adjacent two layers circuit board, i.e. the first adhesive layer 51, second adhesive layer 52, the 3rd adhesive layer 53, it will be appreciated by those skilled in the art that less or more circuit board is also feasible.
In figure 6, the first opening 6 is formed on first circuit board 1 and second circuit board 2; Second opening 7 is formed in high frequency blind slot circuit board on the adhesive layer 52 of the first opening 6, and the second opening 7 is corresponding with the first opening 6, and the opening of the second opening 7 is not less than the opening of the first opening 6.Fig. 6 is only just for example, and those skilled in the art can select arbitrarily the position of the first opening and the second opening, as long as these two openings are next-door neighbour's.Preferably, the substrate of each described circuit board 1,2,3,4 is ptfe substrate; At least one deck in adhesive layer 51,52,53 is the pure glued membrane of thermosetting.
The thickness of the pure glued membrane of described thermosetting is 15 μm ~ 25 μm, and the pure glued membrane of described thermosetting is at least one in epoxy jelly membrane, polyacrylic acid glued membrane, polyimides glued membrane, phenolic aldehyde glued membrane, urea-formaldehyde glue film.
Because the second adhesive layer 52 adopts the pure glued membrane of thermosetting, when curing temperature is higher than 150 DEG C, the pure glued membrane of thermosetting not only can have each described circuit board 1,2,3,4 of effective adhesive as binding agent, avoids the generation of plate bursting problem; Meanwhile, the pure glued membrane cured strength of thermosetting is very large, not easily produces deformation, ensure that the yield of product in follow-up mechanical processing process.In addition, the pure latex film property of thermosetting is stablized, and the second adhesive layer 52 ductile deformation amount in bonding processes is minimum, and can reduce excessive glue problem, product yield is high.
Obviously, above-described embodiment is only for clearly example being described, and the restriction not to execution mode.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all execution modes.And thus the apparent change of extending out or variation be still among protection scope of the present invention.
Claims (10)
1. a processing method for high frequency blind slot circuit board, is characterized in that, comprises the following steps:
At least one layer circuit board is formed the first through opening;
At least one deck adhesive layer forms the second through opening, and the position of described second opening is corresponding with described first opening, and the opening of described second opening is greater than the opening of described first opening;
Alternately stacked described circuit board and described adhesive layer, the circuit board next-door neighbour being wherein formed with described first opening is formed with the adhesive layer placement of described second opening;
Along circuit board described in the direction pressing perpendicular to described circuit board place plane.
2. the processing method of high frequency blind slot circuit board according to claim 1, is characterized in that, the described step forming the second through opening at least one deck adhesive layer comprises:
Adhesive layer is arranged between two pieces of base plates;
On described adhesive layer, described second opening is offered through described first base plate and/or the second base plate;
Remove described first base plate and described second base plate.
3. the processing method of high frequency blind slot circuit board according to claim 2, is characterized in that, described first base plate is phenolic board, and described second base plate is epoxy resin board.
4. the processing method of the high frequency blind slot circuit board according to any one of claim 1-3, is characterized in that, after circuit board described in pressing, the opening of described second opening is more than or equal to the opening of described first opening.
5. the processing method of the high frequency blind slot circuit board according to any one of claim 1-4, is characterized in that, the technique edges being also included in described adhesive layer before offering described second opening arranges the step of location hole.
6. the processing method of the high frequency blind slot circuit board according to any one of claim 1-5, is characterized in that, also comprises and carries out patterning to the described circuit board of each layer, forms the step of circuit.
7. a high frequency blind slot circuit board, is characterized in that, comprising:
The stacked multilayer circuit board be arranged alternately and adhesive layer;
First opening, is formed at least on circuit board described in one deck;
Second opening, be formed in be close to described first opening at least adhesive layer described in one deck on, the position of described second opening is corresponding with described first opening, and the opening of described second opening is not less than the opening of described first opening.
8. high frequency blind slot circuit board according to claim 7, is characterized in that, described first opening and described second opening are polygon, the monolateral length 0.2mm ~ 0.4mm larger than the monolateral length of described first opening of described second opening.
9. high frequency blind slot circuit board according to claim 7, is characterized in that, at least adhesive layer described in one deck is the pure glued membrane of thermosetting.
10. high frequency blind slot circuit board according to claim 9, it is characterized in that, the thickness of the pure glued membrane of described thermosetting is 15 μm ~ 25 μm, and the pure glued membrane of described thermosetting is at least one in epoxy jelly membrane, polyacrylic acid glued membrane, polyimides glued membrane, phenolic aldehyde glued membrane, urea-formaldehyde glue film; The substrate of the described circuit board of each layer is ptfe substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510850066.4A CN105392306A (en) | 2015-11-27 | 2015-11-27 | High-frequency blind slot circuit board and processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510850066.4A CN105392306A (en) | 2015-11-27 | 2015-11-27 | High-frequency blind slot circuit board and processing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105392306A true CN105392306A (en) | 2016-03-09 |
Family
ID=55424015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510850066.4A Pending CN105392306A (en) | 2015-11-27 | 2015-11-27 | High-frequency blind slot circuit board and processing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105392306A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107278062A (en) * | 2017-07-20 | 2017-10-20 | 胜宏科技（惠州）股份有限公司 | A kind of high frequency board manufacturing method of different plate mixed pressures |
| CN111182732A (en) * | 2020-02-28 | 2020-05-19 | 四川锐宏电子科技有限公司 | High-frequency mixing and laminating process |
| CN113950205A (en) * | 2020-07-16 | 2022-01-18 | 深南电路股份有限公司 | Processing method of circuit board, processing method of copper-clad plate and circuit board |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1410700B1 (en) * | 2000-10-20 | 2007-12-12 | Silverbrook Research Pty. Limited | Integrated circuit carrier with recesses |
| CN202721895U (en) * | 2012-08-27 | 2013-02-06 | 深圳市迅捷兴电路技术有限公司 | Stepped structure of high-frequency stepped plate |
| CN103179792A (en) * | 2013-03-08 | 2013-06-26 | 深圳崇达多层线路板有限公司 | Stepped slot lateral side evenness improving method |
| CN103200772A (en) * | 2013-03-01 | 2013-07-10 | 广东生益科技股份有限公司 | Printed circuit board (PCB) with high computer telephone integration (CTI) and manufacturing method thereof |
| CN103648235A (en) * | 2013-12-07 | 2014-03-19 | 广东达进电子科技有限公司 | Manufacturing method of aluminum-based circuit board |
| CN103687314A (en) * | 2013-12-07 | 2014-03-26 | 广东达进电子科技有限公司 | Novel manufacturing method of aluminum-substrate circuit board |
| CN103770400A (en) * | 2014-01-09 | 2014-05-07 | 鹤山东力电子科技有限公司 | 3D (three-dimensional) metal-based copper-clad plate |
-
2015
- 2015-11-27 CN CN201510850066.4A patent/CN105392306A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1410700B1 (en) * | 2000-10-20 | 2007-12-12 | Silverbrook Research Pty. Limited | Integrated circuit carrier with recesses |
| CN202721895U (en) * | 2012-08-27 | 2013-02-06 | 深圳市迅捷兴电路技术有限公司 | Stepped structure of high-frequency stepped plate |
| CN103200772A (en) * | 2013-03-01 | 2013-07-10 | 广东生益科技股份有限公司 | Printed circuit board (PCB) with high computer telephone integration (CTI) and manufacturing method thereof |
| CN103179792A (en) * | 2013-03-08 | 2013-06-26 | 深圳崇达多层线路板有限公司 | Stepped slot lateral side evenness improving method |
| CN103648235A (en) * | 2013-12-07 | 2014-03-19 | 广东达进电子科技有限公司 | Manufacturing method of aluminum-based circuit board |
| CN103687314A (en) * | 2013-12-07 | 2014-03-26 | 广东达进电子科技有限公司 | Novel manufacturing method of aluminum-substrate circuit board |
| CN103770400A (en) * | 2014-01-09 | 2014-05-07 | 鹤山东力电子科技有限公司 | 3D (three-dimensional) metal-based copper-clad plate |
Non-Patent Citations (1)
| Title |
|---|
| 李恒德: "《现代材料科学与工程辞典》", 31 August 2001, 山东科学技术出版社 * |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107278062A (en) * | 2017-07-20 | 2017-10-20 | 胜宏科技（惠州）股份有限公司 | A kind of high frequency board manufacturing method of different plate mixed pressures |
| CN107278062B (en) * | 2017-07-20 | 2019-07-02 | 胜宏科技（惠州）股份有限公司 | A kind of high frequency board manufacturing method of difference plate mixed pressure |
| CN111182732A (en) * | 2020-02-28 | 2020-05-19 | 四川锐宏电子科技有限公司 | High-frequency mixing and laminating process |
| CN111182732B (en) * | 2020-02-28 | 2023-01-10 | 四川锐宏电子科技有限公司 | High-frequency mixing and laminating process |
| CN113950205A (en) * | 2020-07-16 | 2022-01-18 | 深南电路股份有限公司 | Processing method of circuit board, processing method of copper-clad plate and circuit board |
| CN113950205B (en) * | 2020-07-16 | 2024-03-22 | 深南电路股份有限公司 | Circuit board processing method, copper-clad plate processing method and circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP3082385B1 (en) | Rigid-flexible circuit board having flying-tail structure and method for manufacturing same | |
| JP2007165888A (en) | Printed-circuit substrate in which electron devices are built, and its manufacturing method | |
| CN107835561B (en) | Circuit board containing electromagnetic wave shielding film and manufacturing method thereof | |
| WO2014162478A1 (en) | Component-embedded substrate and manufacturing method for same | |
| TWI606769B (en) | Method for manufacturing rigid-flexible printed circuit board | |
| US20180146554A1 (en) | Wiring substrate and method for manufacturing same | |
| TWI712346B (en) | Multilayer circuit board and method of manufacturing the same | |
| CN103179790A (en) | Mixed-compressing printed circuit board and manufacture method thereof | |
| US7238891B2 (en) | Circuit board with at least one rigid and at least one flexible area and process for producing rigid-flexible circuit boards | |
| CN105392306A (en) | High-frequency blind slot circuit board and processing method thereof | |
| US9362248B2 (en) | Coreless package structure and method for manufacturing same | |
| US9793218B2 (en) | Method for manufacturing device embedded substrate, and device embedded substrate | |
| CN101534613B (en) | Method for manufacturing circuit board with offset structure | |
| KR20030085211A (en) | Method for manufacturing a flexible printed circuit board with double side | |
| CN110012616B (en) | Manufacturing method of rigid-flex board | |
| KR100643334B1 (en) | Chip embedded pcb and the method for manufacturing the same | |
| JP2007088140A (en) | Assembled printed wiring board | |
| CN103717016A (en) | Layered prevention technology of multilayer high-frequency electrosilvering circuit board | |
| KR101167533B1 (en) | PCB panel and method for manufacturing the same | |
| TWI461135B (en) | Method for fabricating circuit board | |
| JP5221682B2 (en) | Printed circuit board and manufacturing method thereof | |
| KR100704927B1 (en) | Pcb using paste bump and method of manufacturing thereof | |
| KR100720918B1 (en) | The multifari-ousness pcb and method to printed circuit board | |
| CN106332444A (en) | Circuit board and fabrication method thereof | |
| CN106604545B (en) | Method for manufacturing copper foil substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160309 |
|
| RJ01 | Rejection of invention patent application after publication |