KR100720918B1 - The multifari-ousness pcb and method to printed circuit board - Google Patents

The multifari-ousness pcb and method to printed circuit board Download PDF

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Publication number
KR100720918B1
KR100720918B1 KR1020060001153A KR20060001153A KR100720918B1 KR 100720918 B1 KR100720918 B1 KR 100720918B1 KR 1020060001153 A KR1020060001153 A KR 1020060001153A KR 20060001153 A KR20060001153 A KR 20060001153A KR 100720918 B1 KR100720918 B1 KR 100720918B1
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KR
South Korea
Prior art keywords
substrate
release
pcb
composite
adhesive
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Application number
KR1020060001153A
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Korean (ko)
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안복만
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안복만
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4688Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/115Via connections; Lands around holes or via connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits

Abstract

The present invention relates to a method for manufacturing a release composite printed circuit board and a substrate thereof, and in particular, to form a substrate with different materials in one board, and to have a different number of circuit layers to be adopted in a variety of electronic devices, adhesives The present invention relates to a method for manufacturing a release and composite PCB, and a PCB for forming a release composite PCB which is more qualitatively subjected to a pre-drying step in order to prevent bubbles from forming as the (filler) is cured.
The present invention is to combine the metal substrate and the rigid substrate to each other to be made of a material of the release to each other, to provide various types of release, composite PCB.
Therefore, the release, composite PCB of the present invention is highly available because it can provide a variety of complex functionality.
In addition, in the present invention, the manufacturing method is simple and is actually used, it is possible to implement a multi-function PCB on a single PCB to reduce the cost, manufacturing time is short, it is possible to lighten, shorten the customer product.
Copper thin film, insulation layer, guide hole, circuit gap, substrate, plating layer, etc.

Description

The multifarious PCB and method to printed circuit board

1 is a view showing the first manufacturing process of the first embodiment of the manufacturing process of the present invention,

2 is a view showing the following manufacturing process of the first embodiment of the manufacturing process of the present invention;

3 is a view showing the last manufacturing process of the first embodiment of the manufacturing process of the present invention,

4 is a view showing the first manufacturing process of the second embodiment of the manufacturing process of the present invention,

5 is a view showing the following manufacturing process of the second embodiment of the manufacturing process of the present invention;

6 is a view showing the following manufacturing process of the second embodiment of the manufacturing process of the present invention;

7 is a view showing the last manufacturing process of the second embodiment of the manufacturing process of the present invention.

<Brief description of the major symbols in the drawing shown>

10; Copper foil 11; Insulation layer

12; Rigid substrate 15; Metal plate

17; Filler 18; Release Composite Board

21; Plating layer 50; plate

The present invention relates to a method for manufacturing a printed circuit board and a substrate thereof, and in particular, to form a substrate with different materials in one board, and to have a different number of circuit layers to be adopted to electronic devices of various functions, The present invention relates to a mold and composite PCB manufacturing method and a PCB substrate for allowing a PCB to be formed on a single board by performing a pre-drying step to prevent bubbles from being formed while the filler is cured.

Generally, it is used as the most basic component of many electronic products currently manufactured.

Recently, high-density multi-layer PCBs for thinner and simpler applications include electronic products such as mobile phones, laptops, palmtops, camcorders, ball grid arrays (BGA), chip scale packaging (CSP), and multi chip modules (MCM). It is widely used for package substrates for semiconductors.

Therefore, since the PCB is required to be lighter, thinner, and smaller, it is a situation to select a manufacturing method by build-up.

However, the conventional PCB substrate manufacturing method has many problems.

In other words, one board is manufactured with a substrate made of one material and the same circuit layer.

Therefore, it was difficult to revive complex functions, thin and short requirements, and integrated boards using connectors and cables after implementing boards for each function.

However, this method has been pointed out as a problem due to its heavy size, large size and high manufacturing cost.

The present invention, which solves the above problems, relates to a method for manufacturing a release and composite printed circuit board, and a substrate thereof. In particular, various substrates are manufactured by forming substrates of different materials and having different circuit layers in one board. To provide a thin, simple, complex functionalized, low-cost release, composite PCB manufacturing method and its PCB substrate for adoption in functional electronic devices.

Therefore, the present invention is a method of manufacturing a PCB substrate composed of a release material, the first step: sandwiching the insulating layer between the copper film, and press the integrated to produce a rigid substrate, one guide each in the corner portion Drilling a hole; Second step: cutting the inside of the rigid substrate into a polygonal shape to form an insertion space; Step 3: forming a metal substrate by cutting the metal substrate in the same shape as the insertion space of the rigid substrate; Step 4: inserting the cut metal substrate into an insertion space of the rigid substrate, and filling an adhesive into an outer gap to form a release composite substrate; Step 5: exposing the release composite substrate at 80-200 ° C. for 40-80 minutes to cure the adhesive; Step 6: flattening the adhesive protruding from the release composite substrate; A seventh step: forming a plating layer on the outer circumferential surface of the hole and the upper portion of the rigid substrate by forming a hole penetrating the upper and lower sides of the rigid substrate of the release composite substrate; Eighth step: circuit forming step of corroding a circuit GAP in the form of a circuit on a copper thin film constituting the top and bottom of the rigid substrate; The ninth step is to provide a method of manufacturing a release and composite PCB, which comprises a step of processing a surface of a plated substrate and processing an external shape to form a printed circuit board.
In another aspect, the present invention provides a method for manufacturing a PCB substrate composed of a release material, the first step: drilling a plurality of guide holes are formed in each of the four corners of the flat metal substrate; Second step: cutting the inside of the metal substrate into a polygonal shape to produce a metal substrate having an insertion space; A third step: forming a hole by sandwiching an insulating layer between the copper thin films, forming a hole in an integrated state, and plating again to form a plating layer; Step 4: forming a rigid substrate cut into the same shape as the insertion space, inserting the cut rigid substrate into an insertion space of the metal substrate, and filling a gap with an adhesive to form a release composite substrate; ; Step 5: exposing the release composite substrate at 80-200 ° C. for 40-80 minutes to cure the adhesive; Step 6: flattening the adhesive protruding from the release composite substrate; A seventh step: forming a circuit to corrode a circuit GAP in the form of a circuit on a copper thin film constituting the rigid substrate; Eighth step: To provide a method for manufacturing a release, composite PCB to form a printed circuit board consisting of the steps of processing the surface of the plated substrate, processing the appearance.

delete

In addition, the present invention is to provide a PCB substrate that is manufactured through the above-described manufacturing method in the release, composite PCB.

The present invention relates to a method for manufacturing a mold release, composite PCB, which will be described in detail with reference to FIGS. 1 to 7.

The present invention is similar to the conventional one in that the PCB substrate manufacturing method and the PCB substrate.

However, it is a great feature in that it is formed of different materials and different circuit layers in the same board constituting the board, and thus there is a great feature in that a multifunctional composite, small, and lightweight electronic product can be realized. It will be described in detail together.

In addition, the present invention is used in two embodiments prior to the detailed description of the present invention.

That is, in FIGS. 1 to 3, a rigid composite substrate surrounding the outer part is formed, and a metal substrate is incorporated in the inside thereof, and the composite substrate is a release composite substrate. 4 to 6 show a release composite substrate formed by forming a metal substrate surrounding the outer portion and having a rigid substrate incorporated therein.

Therefore, both embodiments will be described in detail based on this order.

First, the present invention provides a rigid substrate 12 by sandwiching the insulating layer 11 between the copper thin film 10, compressing and integrating the same, and forming one guide hole 13 at each corner. Go through the steps of drilling.

That is, while preparing the copper foil film 10 is formed into a film, it is positioned up and down (shown in the first drawing of Figure 1).

At this time, the copper thin film 10 is of the same size, the shape having the same thickness or may be positioned up and down the copper thin film 10 of different thickness.

In addition, while pressing the copper thin film 10 and the insulating layer 11 at a high temperature and high pressure, the insulating layer 11 is melted and fused with the copper thin film 10 so as to be integrated with each other as shown in FIG. .

However, the insulating layer 11 used in the first step of the present invention, it is preferable that a material of epoxy, aramid or polyimide-based selectively.

All of these materials are highly insulating and can be applied to pcb substrates to increase the effectiveness of the insulation.

Next, one guide hole 13 is drilled into each of the four corners of the integrated copper thin film 10 and the insulating layer 11, and the copper thin film 10 positioned up and down is accurately stacked. Perforations are performed in the state to provide a criterion in later work.

Therefore, by matching with the guide hole 13, it is possible to match the exact position of the circuit and the like formed on the substrate.

In addition, as a next step, a second step: the inside of the rigid substrate 12 is cut out into a polygonal shape to form an insertion space 14.

As shown in the third drawing of FIG. 1, the interior of the rigid substrate 12 having several layers is cut to form the insertion space 14.

By the way, although the insertion space 14 is shown in the form of a quadrangular shape in the drawing, in practice, this shape is not important in the present invention.

That is, the insertion space 14 formed in any shape in the form of a polygon may be provided.

Next, a third step: The metal substrate A is cut to form the metal substrate 15 in the same shape as the insertion space 14 of the rigid substrate 12.

In this case, aluminum, copper, and stainless steel may be used as the metal substrate 15.

The metal substrate 15 is preferably formed in the same shape as the insertion space 14.

In the next step, the fourth step: inserting the cut metal substrate 15 into the insertion space 14 of the rigid substrate 12, and filling the adhesive (= filler: 17) in the outer gap (gap). To form a release composite substrate 18.

That is, as shown in the first drawing of FIG. 2, the metal substrate 15 cut in the previous step is inserted into the insertion space 14 of the rigid substrate 12.

In other words, the plates of different heterogeneities are bonded to each other.

In order to secure the fastening of the plates, the adhesive 17 is filled in the interview area with the inner circumferential surface of the insertion space 14 formed between the outer circumferential surface of the metal substrate 15 and the rigid substrate 12.

By the way, the adhesive 17 may be selectively used epoxy, polyimide, aramid, general resin, or a heat dissipation resin, these also characterized by high insulation effect.

And as a method of filling the adhesive 17 can be used in many ways.

In the present invention, the filling method of the adhesive 17 is used as follows.

That is, the adhesive 17 may be filled in the interview portion through silk printing, or a roll peeling technique, a dispensing technique, or a spray technique may be used.

Here, the silk printing method is a method of putting the adhesive 17 on the silk composed of the net like a silk screen method and pushing it into the rubber. In the case of the roll peeling method, the adhesive 17 is placed on the roll to the top and bottom of the substrate. By rolling, the adhesive 17 is pushed in.

In the dispensing method, the adhesive 17 is put into a syringe or the like and the adhesive 17 is squeezed into the interview portion, and the spraying method is sprayed and sprayed.

Meanwhile, the present invention undergoes the fifth step: exposing the release composite substrate 18 to 80-200 ° C. for 40-80 minutes to cure the adhesive 17.

The temperature and time described above may vary somewhat depending on the type of the adhesive 17, but the temperature and time are optimal values calculated by the applicant of the present invention through a number of experiments.

In other words, the adhesive 17 must be cured in this manner so that both kinds of plates can achieve a firm bond and fulfill their intended role.

However, in the present invention, it is more preferable to go through the step of pre-drying, that is, before the step of curing the adhesive 17.

That is, the condition is to go through the step of pre-drying having a time of drying for 5 to 60 minutes at about 60-80 ℃.

At this time, the pre-drying step is a step that goes through to prevent the bubbles in the interior of the adhesive (17).

In other words, after the step of filling the adhesive 17 of the fourth step, it is preferable to produce a form having a time of 5-60 minutes at 60-80 ° C. as a predrying step.

That is, this step prevents the phenomenon that bubbles are generated inside the adhesive 17, which may be generated when it is just cured.

It provides a framework that can be cured safely to predrying for a suitable time at a suitable temperature.

In the next step, the present invention undergoes a sixth step: flattening the adhesive 17 protruding from the release composite substrate 18.

That is, as shown in the third drawing of FIG. 2, since the adhesive 17 is in a liquid state, the adhesive 17 may not be filled exactly at the interview sites between the substrates.

There is no choice but to keep the projecting state slightly upward as in the second view of FIG.

Therefore, the surface of the substrate copper thin film 10 is processed to be flat.

This process is referred to as a flattening process in the present invention.

Next step 7: forming a hole 20 penetrating the top and bottom of the rigid substrate 12 of the release composite substrate 18 and plated on the outer circumferential surface of the hole 20 and the upper portion of the rigid substrate 12 (21) is formed.

That is, as shown in the second and third drawings of FIG. 3, in this step, the hole 20 may be drilled by using a drill in such a manner as to form the hole 20 in the rigid substrate 12, and a mechanical drill and general biasing processing may be used. Various methods may be used.

However, the hole 20 formed by the drill is preferably processed in a state that the inner circumferential surface is a little neat.

After all, an important point in this step is that the hole 20 is formed between the upper copper foil film 10 and the lower copper foil film 10 as shown in the drawing where electricity is required to flow.

And then plating is achieved.

That is, copper plating is performed to conduct electricity between the upper and lower copper thin films 10. In this case, both an electroless plating method and an electrolytic plating method may be used as a method of coating the copper film.

Then, as shown in the second drawing of FIG. 3, the inner circumferential surface of the hole 20 also has a plating layer 21 formed thereon, so as to achieve energization between the two layers, and to the outside of the copper thin film 10 forming the upper and lower surfaces of the substrate. The plating layer 21 which is a separate copper film is formed.

Meanwhile, the present invention is subjected to the eighth step: forming a circuit to corrode the circuit GAP 25, which becomes the shape of a circuit, on the copper thin film 10 constituting the top and bottom of the rigid substrate 12.

That is, the circuit GAP 25 is corroded to the plating layers 21 formed on the upper and lower portions of the rigid substrate 12 (third view in FIG. 3).

If the circuit is designed, the circuit GAP 25 is formed by corroding the surface of the copper thin film 10 in the developed state by photographing and exposing the circuit.

Therefore, the plating layer 21 has a plurality of circuit GAPs 25 formed at necessary portions to form a single circuit board.

Next, the ninth step of the present invention is to process the surface of the plated substrate and to process the external shape to form a printed circuit board. The first embodiment of the present invention ends.

After that, the existing printed circuit board manufacturing process and method are completed in the same way.

In other words, the process of wiping the surface of the substrate clean is also necessary, and the process of trimming the external shape and the cutting process of cutting the appropriate part may be used.

And the present invention can also be used in the second embodiment as shown in Figs.
That is, the substrate holding the outline is a metal substrate, the plate inserted in the insertion space therein is a rigid substrate.

The manufacturing method is, of course, almost the same as in the first embodiment described above, but only in the position of the substrate.

That is, in the second embodiment, in the method of manufacturing a PCB substrate composed of a release material, the first step: forming a plurality of guide holes 51 in each of four corner portions of the flat metal substrate 50. Go through the steps of drilling.

As shown in the first and second drawings of FIG. 4, the metal substrate 50 is prepared and guide holes 51 are formed in four corner portions of the metal substrate 50.

The second step is to cut out the inside of the metal substrate 50 into a polygonal shape to produce a metal substrate 53 having an insertion space 52.

That is, as shown in the third drawing of FIG. 4, the center portion of the metal plate 50 is cut to manufacture the metal substrate 53, which is a plate having the insertion space 52 formed therein.

At this time, the shape of the insertion space 52 is preferably manufactured in the form of a polygon as in the first embodiment described above.

In the present invention, the third step: sandwiching the insulating layer 55 between the copper thin film 54, forming a hole 56 in a state of being integrated by pressing, and then plated again to form a plated layer 60 to the rigid substrate 61 goes through the steps to produce.

That is, as shown in FIG. 5, the copper thin film 54 is positioned up and down, and is welded integrally in a state in which the insulating layer 55 is sandwiched therein.

Then, a plurality of holes 56 are formed to penetrate the upper and lower sides, and the plating layer 60 is formed on the upper surface of the copper layer in an electrolytic and electroless manner.

Therefore, the plating layer 60 is formed on the inner circumferential surface of the hole 56 and the upper and lower portions of the copper thin film 54.

Next, according to the present invention, a rigid substrate 61 cut into the same shape as the insertion space 52 is manufactured, and the cut rigid substrate 61 is inserted into the insertion space 52 of the metal substrate 53. ) And inserts the adhesive 64 into the gap to form the release composite substrate 66.

That is, the rigid substrate 61 manufactured in the above-described third step is cut out into a suitable shape and inserted into the insertion space 52 located inside the metal substrate 53.

Then, the adhesive (= filler: 64) is filled in the interview portion, and its material and properties are the same as in the first embodiment described above.

Meanwhile, the present invention undergoes the fifth step: exposing the release composite substrate 66 to 80-200 ° C. for 40-80 minutes to cure the adhesive 64.

Of course, this step is also the same as that of the first embodiment described above, and it is more preferable to go through the step of predrying before this step.

The sixth step is to planarize the adhesive 64 protruding from the release composite substrate 66.

In addition, a seventh step: a circuit forming step of corroding the circuit GAP 77 that forms a circuit in the copper thin film 10 forming the upper and lower portions of the rigid substrate 61 is performed.

This step is also produced by borrowing the steps of the circuit formation of the first embodiment described above as it is.

On the other hand, the eighth step: processing the surface of the plated substrate, and processing the outer shape to form a printed circuit board to form a PCB substrate manufacturing method of the present invention is finished.

Meanwhile, although the present invention has been described in detail above, the insulating layers 11 and 55 sandwiched between the copper thin films 10 and 54 are preferably epoxy, aramid or polyimide materials.

In the above-described embodiments, the adhesives 17 and 64 of the fourth step may be selectively used of epoxy, polyimide, aramid, general resin, or heat radiation resin.

In addition, in the present invention, after the fourth step of filling the adhesives 17 and 64 to form the release composite substrates 18 and 66, the drying time is 5-60 minutes at 60-80 ° C. as a pre-drying step. desirable.

Lastly, the present invention is also subject to the claims of a PCB substrate manufactured through all the above-described manufacturing method.

As described above, the present invention is to provide a PCB substrate of various circuit forms by combining a metal substrate and a rigid substrate to be made of a different material from each other.

Therefore, the PCB substrate of the present invention is highly applicable.

In addition, the present invention is a simple manufacturing method is simple, thin, shortened in actual use, the cost is reduced, the production time is short, the product is light, light and implemented in a thin.

Claims (6)

  1. In the manufacturing method of a PCB substrate composed of a release material,
    Sandwiching the insulating layer 11 between the copper thin films 10, compressing and integrating the same to form a rigid substrate 12, and drilling one guide hole 13 in each corner portion;
    Cutting the inside of the rigid substrate 12 into a polygonal shape to form an insertion space 14;
    Cutting the metal substrate (A) in the same shape as the insertion space (14) of the rigid substrate (12) to form a metal substrate (15);
    The cut metal substrate 15 is inserted into the insertion space 14 of the rigid substrate 12, and the adhesive 17 is filled in the gap between the insertion space 14 and the metal substrate 15. To form a release composite substrate (18);
    Predrying the adhesive (17) filled in the gap at 60-80 ° C. for 5-60 minutes;
    Exposing the release composite substrate 18 at 80-200 ° C. for 40-80 minutes to cure the adhesive 17;
    Flattening the adhesive 17 protruding above the release composite substrate 18;
    Forming a hole 20 penetrating the top and bottom of the rigid substrate 12 of the release composite substrate 18 and plating to form a plating layer 21 on the outer circumferential surface of the hole 20 and the upper portion of the rigid substrate 12 Steps;
    A circuit forming step of corroding the circuit GAP 25, which becomes a shape of a circuit, on the copper thin film 10 constituting the rigid substrate 12 above and below;
    Process for processing the surface of the plated substrate, and processing the outer shape to form a printed circuit board, characterized in that the release, composite PCB manufacturing method.
  2. In the manufacturing method of a PCB substrate composed of a release material,
    Perforating a plurality of guide holes 51 respectively formed at four corner portions of the flat metal substrate 50;
    Manufacturing a metal substrate 53 in which the inside of the metal substrate 50 is cut into a polygonal shape to form an insertion space 52;
    Manufacturing a rigid substrate 61 by inserting the insulating layer 55 between the copper thin films 54, forming a hole 56 in a state of being integrally pressed, and plating again to form a plating layer 60; ;
    The rigid substrate 61 cut out in the same shape as the insertion space 52 is manufactured, and the cut rigid substrate 61 is inserted into the insertion space 52 of the metal substrate 53, and the insertion space ( Filling the gap 64 between the 52 and the rigid substrate 61 to form a release composite substrate 66;
    Predrying the adhesive (17) filled in the gap at 60-80 ° C. for 5-60 minutes;
    Exposing the release composite substrate (66) at 80-200 ° C. for 40-80 minutes to cure the adhesive (64);
    Flattening the adhesive (64) projecting onto the release composite substrate (66);
    A circuit forming step of corroding the circuit GAP 77 forming a circuit in the copper thin film 10 constituting the rigid substrate 61 above and below;
    Process for processing the surface of the plated substrate, and processing the outer shape to form a printed circuit board, characterized in that the release, composite PCB manufacturing method.
  3. The method according to claim 1 or 2,
    The insulating layers 11 and 55 sandwiched between the copper thin films 10 and 54 are
    Epoxy, aramid or polyimide-based material is a release, composite PCB manufacturing method characterized in that it is used selectively.
  4. The method according to claim 1 or 2,
    The adhesives 17 and 64 of the fourth step, respectively,
    Epoxy-based, polyimide-based, aramid-based, general resin, or a heat-dissipating resin can be used selectively release, composite PCB manufacturing method characterized in that.
  5. delete
  6. In mold release, composite PCB,
    Release, composite PCB, characterized in that produced through the manufacturing method of claim 1 or 2.
KR1020060001153A 2006-01-05 2006-01-05 The multifari-ousness pcb and method to printed circuit board KR100720918B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101197782B1 (en) 2010-05-11 2012-11-06 엘지이노텍 주식회사 Embedded PCB and Manufacturing method of the same
KR101208604B1 (en) 2011-05-25 2012-12-06 안복만 Heat dissipating circuit board and method for manufacturing the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0370194A (en) * 1989-08-09 1991-03-26 Risho Kogyo Co Ltd Manufacture of multilayer circuit substrate for mounting electronic component
US5877940A (en) * 1993-12-02 1999-03-02 Teledyne Industries Inc. Fabrication multilayer combined rigid/flex printed circuit board
KR19990041806U (en) * 1998-05-26 1999-12-27 이형도 Board Bonding Device of Release Material
KR20000058396A (en) * 2000-05-15 2000-10-05 김영배 Compound structure of substrate and the method which using junction glue
JP2004179309A (en) * 2002-11-26 2004-06-24 New Japan Radio Co Ltd Heat dissipating structure for printed circuit board and method for manufacturing the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0370194A (en) * 1989-08-09 1991-03-26 Risho Kogyo Co Ltd Manufacture of multilayer circuit substrate for mounting electronic component
US5877940A (en) * 1993-12-02 1999-03-02 Teledyne Industries Inc. Fabrication multilayer combined rigid/flex printed circuit board
KR19990041806U (en) * 1998-05-26 1999-12-27 이형도 Board Bonding Device of Release Material
KR20000058396A (en) * 2000-05-15 2000-10-05 김영배 Compound structure of substrate and the method which using junction glue
JP2004179309A (en) * 2002-11-26 2004-06-24 New Japan Radio Co Ltd Heat dissipating structure for printed circuit board and method for manufacturing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101197782B1 (en) 2010-05-11 2012-11-06 엘지이노텍 주식회사 Embedded PCB and Manufacturing method of the same
KR101208604B1 (en) 2011-05-25 2012-12-06 안복만 Heat dissipating circuit board and method for manufacturing the same

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