CN107278062A - A kind of high frequency board manufacturing method of different plate mixed pressures - Google Patents
A kind of high frequency board manufacturing method of different plate mixed pressures Download PDFInfo
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- CN107278062A CN107278062A CN201710593847.9A CN201710593847A CN107278062A CN 107278062 A CN107278062 A CN 107278062A CN 201710593847 A CN201710593847 A CN 201710593847A CN 107278062 A CN107278062 A CN 107278062A
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- copper
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/065—Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides a kind of high frequency board manufacturing method of different plate mixed pressures, made from the high frequency plate and epoxy resin board of double-sided copper-clad, high frequency plate and the pressing medium of epoxy resin board are used as using not gummosis PP pieces, and the slot size on not gummosis PP pieces is specially designed, the problem of to solve slotted eye excessive glue, so as to improve the processing quality of product；In addition, the present invention also specially devises the lamination process drilled to high frequency plate；Moreover, pressing has the problem of plate is recessed after for being slotted in high frequency plate technique, it has been specifically designed pressing stack, three-in-one cushion pad etc. is used to solve the problem of fluting side plate material is recessed, and hot pressing formula is devised according to its step of pressing stack one, while using the extension cold pressing time further to reduce the problem of causing plate benging because of different plate harmomegathus coefficients difference；The filler that chemistry removing glue mode is removed is not easily passed through due to existing in high frequency plate, before being electroplated, plasma removing glue is first carried out, then using chemistry removing glue, fully cleaning, to effectively improve electroplating quality.
Description
Technical field
Field, more particularly to a kind of high frequency board manufacturing method of different plate mixed pressures are made the present invention relates to wiring board.
Background technology
With the development of mobile and data communication, mobile communications network is progressively developed from 4G to 5G, with regard to equipment structure and
Speech, has progressively abandoned the design structure of traditional indoor all-in-one, develops into existing volume smaller and tear that shifting is easy to receive open
Split-type structural of the sender in outdoor (ODU), modulation /demodulation and baseband interface (IDU) indoors.Particularly marine vessel leads to
The need for letter, the requirement for microwave telecommunication devices communication distance develops from short haul connection to long haul communication, drives microwave
The transmission capacity and interface mode of communication equipment also can with the development of network smooth upgrade, to reduce the investment of operator.
The need for reaching high-speed remote Distance Transmission signal, it is also required to as the PCB of the mother of electronic product using special type
High frequency, high-speed material makes.But this special material still belongs to the external monopolization stage at present, price is very expensive.To reach letter
Number transmission is complete, and cost-effective purpose, it will usually using the design of high frequency plate+common plate mixed pressure, for day
Position below line, in addition it is also necessary to which common plate discharge position is slotted, to reach that complete signal is transmitted.Due to high frequency plate and commonly
Plate, harmomegathus characteristic is different, and plate is bent, the more difficult to govern control of harmomegathus, and the plate of this type needs first to slot and pressed again in addition, but is pressed after fluting
Credit union have plate be recessed risk, and between high frequency plate and common plate PP pressing when, gummosis can more difficult to govern control, cause slotted eye
Surrounding has cull, influences the quality of product.
Current PCB producers are used by way of constantly adjusting pressing formula to expect to solve the above problems, and high
Temperature rise when resin properties in frequency plate require pressing is higher, and solidification temperature is higher, heating rate 3.2-4.2 DEG C/
More than 200 DEG C of min, solidification temperature ＞, thus pressing formula adjustment space it is limited and simple adjustment pressing formula produce effects very
It is micro-.
The content of the invention
In view of the above-mentioned problems, the present invention provides a kind of high frequency board manufacturing method of different plate mixed pressures, this can be effectively improved
The processing quality of product, comprises the following steps:
A. the high frequency plate that a two sides is covered with L1 layers of copper, L2 layers of copper respectively is provided, a two sides is covered with L3 layers of copper, L4 layers of copper respectively
Epoxy resin board, not gummosis PP pieces；
B. sawing sheet, drilling are carried out to the high frequency plate, epoxy resin board, then to the L2 layers of copper and asphalt mixtures modified by epoxy resin on high frequency plate
L3 layers of copper on fat plate enters row line making, the inspection of line；When the circuit for carrying out L2 layers of copper makes, correspondence is designed at L1 layers of copper
On the predeterminated position of antenna etch no copper region unit；After the circuit of L2 layers of copper completes, brown is carried out to L2 layers of copper；
On epoxy resin board with without the corresponding position groove milling hole of copper region unit, the slotted eye on epoxy resin board is with corresponding without copper
The geomery of region unit is consistent, and through L3 layers of copper, L4 layers of copper；Then brown is carried out to L3 layers of copper；
Sawing sheet, drilling are carried out to the not gummosis PP pieces；On not gummosis PP pieces with without the corresponding position groove milling hole of copper region unit,
Not the slotted eye on gummosis PP pieces than corresponding without the unilateral big 0.1-0.3mm of copper region unit；
C. according to L1 layers of copper, high frequency plate, L2 layers of copper, not gummosis PP pieces, L3 layers of copper, epoxy resin board, L4 layers of copper order, from
Up to stack gradually and pressed down；In L2 layers of copper without copper region unit with not gummosis PP pieces and epoxy resin board
Control deep trouth of the corresponding slot formation from L4 layers of copper to L2 layers of copper；
D. after the completion of pressing, L1 layers of copper, L4 layers of copper is ground, drill, electroplated, then row line is entered to L1 layers of copper, L4 layers of copper
Making, the inspection of line, the making of completion antenna when row line makes is being entered to L1 layers of copper.
It is preferred that, in stepb, when being drilled to high frequency plate, phenolic resin plate is laminated on high frequency plate two sides, and
Fold an aluminium flake again on the phenolic resin plate being laminated in above high frequency plate, then carry out Drilling operation.
It is preferred that, when carrying out step C, before pressing, below L4 layers of copper, from top to bottom stack gradually three-in-one slow
Rush material, steel plate, brown paper；Above L1 layers of copper, aluminium flake, steel plate, brown paper are stacked gradually from the bottom to top, then pressed.
Further, the three-in-one fender in the middle of two mould release membrances folder one fender is overlapping is made.
Further, in step C, when being pressed, hot pressing is first carried out, then be cold-pressed；The hot pressing includes 9 sections
Formula, the corresponding pressing pressure of every section of formula be followed successively by 70psi, 200psi, 350psi, 420psi, 420psi, 420psi,
420psi, 240psi, 140psi, the corresponding pressing-in temp of every section of formula be followed successively by 120 DEG C, 140 DEG C, 160 DEG C, 180 DEG C, 220
DEG C, 220 DEG C, 220 DEG C, 180 DEG C, 140 DEG C, the corresponding pressing time of every section of formula be followed successively by 5min, 5min, 5min, 5min,
8min、50min、120min、15min、10min。
Further, carry out first being vacuumized during hot pressing, pumpdown time 3min reaches 50mBar.
Further, the cold pressing is to be pressed at normal temperatures, pressing time 1.5 hours.
It is preferred that, the high frequency plate is hydrocarbon tie-plate material or ceramic tie-plate material or hydrocarbon ceramic mixed stocker plate.
It is preferred that, in step D, before being electroplated to L1 layers of copper, L4 layers of copper, a plasma removing glue is first carried out, then enter
Row once or secondary levels chemistry removing glue, to ensure electroplating quality.
It is preferred that, in addition to step E, carried out after the completion of step D anti-welding, word, surface treatment, shaping, test, FQC,
Packaging, is made high frequency panel products;Carry out super roughening or sandblasting before anti-welding to handle copper face, it is ensured that anti-welding adhesion.
The invention provides a kind of high frequency board manufacturing method of different plate mixed pressures, high frequency plate from double-sided copper-clad and
Epoxy resin board is made, and using not gummosis PP pieces as high frequency plate and the pressing medium of epoxy resin board, design is special
Making programme, and the slot size on not gummosis PP pieces is improved, the problem of to solve slotted eye excessive glue, reduction product
Manufacture difficulty, improves the processing quality of product；In addition, the present invention also specially devises the stacking work drilled to high frequency plate
Skill, is effectively reduced drilling burr, improves borehole accuracy；Moreover, plate is had for being pressed after being slotted in high frequency plate technique
The problem of material depression, pressing stack is specifically designed, has used three-in-one cushion pad etc. to solve the problem of fluting side plate material is recessed,
And hot pressing formula is further devised according to the material processing characteristics of its pressing stack and high frequency plate, while using extension cold pressing
The method of time, is further avoided in temperature-fall period the problem of different plate harmomegathus coefficients are different causes plate benging；By
Exist in high frequency plate and not easily pass through the filler that chemistry removing glue mode is removed, before being electroplated, first carry out plasma removing glue,
Chemistry removing glue, fully cleaning, to effectively improve electroplating quality are used again.By the improvement of above-mentioned preparation method, carry on the whole
High yield quality.
Brief description of the drawings
Fig. 1 is the high frequency board manufacturing method embodiment pressing stack schematic diagram for the different plate mixed pressures that the present invention is provided.
Embodiment
The technology contents of the present invention are understood for convenience of those skilled in the art, below in conjunction with the accompanying drawings and embodiment is to this hair
It is bright to be described in further detail.
When making the high frequency plate for the different plate mixed pressures communicated, specifically using following steps:
A. a high frequency plate and an epoxy resin board are selected, high frequency plate two sides is covered with L1 layers of copper, L2 layers of copper, epoxy resin respectively
Plate two sides is covered with L3 layers of copper, L4 layers of copper respectively；Hydrocarbon tie-plate material or ceramic tie-plate material may be selected in high frequency plate or hydrocarbon ceramics are mixed
Syzygy plate；The preferred FR-4 plates of epoxy resin board.
B. sawing sheet, drilling are carried out to high frequency plate, epoxy resin board;, need to be in height when carrying out Drilling operation to high frequency plate
Frequency plate two sides be laminated phenolic resin plate, and on the phenolic resin plate of boring direction again fold one layer of aluminium flake, then carry out drilling plus
Work, to improve drilling burr, improves drilling hole position precision.Special parameter need to be used according to bore diameter during drilling, such as following table institute
Show.
Then row line making, the inspection of line are entered to the L3 layers of copper in the L2 layers of copper and epoxy resin board on high frequency plate；
When the circuit for carrying out L2 layers of copper makes, the predeterminated position for the antenna that correspondence is designed in L1 layers of copper etches no copper region unit；
After the circuit of L2 layers of copper completes, brown is carried out to L2 layers of copper；
On epoxy resin board with without the corresponding position groove milling hole of copper region unit, the slotted eye on epoxy resin board is with corresponding without copper
The geomery of region unit is consistent, and through L3 layers of copper, L4 layers of copper；Then brown is carried out to L3 layers of copper；
Sawing sheet, drilling are carried out to not gummosis PP pieces；With without the corresponding position groove milling hole of copper region unit, not flowing on not gummosis PP pieces
Slotted eye on glue PP pieces than corresponding without the unilateral big 0.15mm of copper region unit, to prevent excessive glue during pressing；
To high frequency plate, epoxy resin board, not the working process of gummosis PP pieces can independently carry out, can also carry out successively, it is right
L2 layers of copper, the brown of L3 layers of copper are preferably carried out simultaneously, and brown can improve the adhesion subsequently pressed.
C. according to L1 layers of copper 1, not high frequency plate a, L2 layers of copper 2, gummosis PP pieces b, L3 layers of copper 3, epoxy resin board c, L4 copper
The order of layer 4, stacks gradually and is pressed from top to bottom；In L2 layers of copper without copper region unit 21 with located at not gummosis PP pieces b
With control deep trouth d of the corresponding slot formation from L4 layers of copper 4 to L2 layers of copper 2 on epoxy resin board c, control deep trouth d is corresponding to be located at L1
The lower section of antenna predeterminated position in layers of copper 1, in order to improve antenna performance, reaches complete signal transmission.
Before pressing, below L4 layers of copper 4, three-in-one fender 6, steel plate 71, brown paper are from top to bottom stacked gradually
81；Above L1 layers of copper, aluminium flake 5, steel plate 72, brown paper 82 are stacked gradually from the bottom to top, complete to carry out again after this pressing stack
Pressing, pressing stack is as shown in Figure 1.Three-in-one fender in the middle of two mould release membrances folder one fender is overlapping is made.
Wherein brown paper plays a part of compensator or trimmer pressure, uniformly transfer heat, can ensure that pressing is smooth using steel plate, thickness of slab is equal
It is even.May be such that the heat conduction of the side is accelerated using aluminium flake in high frequency plate side so that high frequency plate and epoxy resin board it is heated
Produce difference, thus improve high frequency plate and epoxy resin board when carrying out hot pressing because caused by harmomegathus coefficient is different plate face it is curved
Qu Wenti；Using the heat transfer efficiency of three-in-one fender, on the one hand reduction epoxy resin board side, another aspect mould release membrance is played
The effect of isolation production plate at high temperature, and fender plays effective filling effect.Three-in-one fender must be put during pressing
In the one side of fluting, during pressing, fender, which can be packed into slotted eye, forms support, so that depression problem is avoided, and three-in-one buffering
The mould release membrance flat smooth on material surface, it is easy to install during pre- folded pressing stack, also it is easy to remove after the completion of pressing.
For the pressing stack, when being pressed, hot pressing is first carried out；The hot pressing includes 9 sections of formulas, according to high frequency plate
The heating rate required by resin properties in material combines pressing in 3.2-4.2 DEG C/min, more than 200 DEG C of solidification temperature ＞
The design of folded structure, the corresponding pressing pressure of every section of formula be followed successively by 70psi, 200psi, 350psi, 420psi, 420psi,
420psi, 420psi, 240psi, 140psi, the corresponding pressing-in temp of every section of formula be followed successively by 120 DEG C, 140 DEG C, 160 DEG C, 180
DEG C, 220 DEG C, 220 DEG C, 220 DEG C, 180 DEG C, 140 DEG C, the corresponding pressing time of every section of formula be followed successively by 5min, 5min, 5min,
5min、8min、50min、120min、15min、10min；Also need to vacuumize before hot pressing, pumpdown time 3min reaches
50mBar。
It is cold-pressed after the completion of hot pressing, cold pressing is to be pressed at normal temperatures, pressing time 1.5 hours, compared to generalIt is logicalRing
The wiring board that oxygen resin plate is made, the cold pressing time significantly extends, and improves high frequency plate and epoxy resin board after cooling because of harmomegathus
Plate face buckling problem caused by coefficient is different.
D. after the completion of pressing, L1 layers of copper, L4 layers of copper is ground, drill, electroplated, then L1 layers of copper, L4 layers of copper are carried out
Circuit is made, the inspection of line, and the making of completion antenna when row line makes is being entered to L1 layers of copper.L1 layers of copper, L4 layers of copper are carried out
Before plating, a plasma removing glue is first carried out, the filler that chemistry removing glue mode removes is fully clear by being not easily passed through in high frequency plate
It is clean, then carry out once or secondary levels chemistry removing glue, to ensure electroplating quality.
E. anti-welding, word, surface treatment, shaping, test, FQC, packaging are carried out after the completion of step D, the production of high frequency plate is made
Product;Carry out super roughening or sandblasting before anti-welding to handle copper face, it is ensured that anti-welding adhesion.
It is the specific implementation of the present invention above, it describes more specific and detailed, but can not therefore be interpreted as
Limitation to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, not departing from this hair
On the premise of bright design, various modifications and improvements can be made, these obvious alternative forms belong to the present invention's
Protection domain.
Claims (10)
1. a kind of high frequency board manufacturing method of different plate mixed pressures, comprises the following steps:
A. the high frequency plate that a two sides is covered with L1 layers of copper, L2 layers of copper respectively is provided, a two sides is covered with L3 layers of copper, L4 layers of copper respectively
Epoxy resin board, not gummosis PP pieces；
B. sawing sheet, drilling are carried out to the high frequency plate, epoxy resin board, then to the L2 layers of copper and asphalt mixtures modified by epoxy resin on high frequency plate
L3 layers of copper on fat plate enters row line making, the inspection of line；When the circuit for carrying out L2 layers of copper makes, correspondence is designed at L1 layers of copper
On the predeterminated position of antenna etch no copper region unit；After the circuit of L2 layers of copper completes, brown is carried out to L2 layers of copper；
On epoxy resin board with without the corresponding position groove milling hole of copper region unit, the slotted eye on epoxy resin board is with corresponding without copper
The geomery of region unit is consistent, and through L3 layers of copper, L4 layers of copper；Then brown is carried out to L3 layers of copper；
Sawing sheet, drilling are carried out to the not gummosis PP pieces；On not gummosis PP pieces with without the corresponding position groove milling hole of copper region unit,
Not the slotted eye on gummosis PP pieces than corresponding without the unilateral big 0.1-0.3mm of copper region unit；
C. according to L1 layers of copper, high frequency plate, L2 layers of copper, not gummosis PP pieces, L3 layers of copper, epoxy resin board, L4 layers of copper order, from
Up to stack gradually and pressed down；In L2 layers of copper without copper region unit with not gummosis PP pieces and epoxy resin board
Control deep trouth of the corresponding slot formation from L4 layers of copper to L2 layers of copper；
D. after the completion of pressing, L1 layers of copper, L4 layers of copper is ground, drill, electroplated, then row line is entered to L1 layers of copper, L4 layers of copper
Making, the inspection of line, the making of completion antenna when row line makes is being entered to L1 layers of copper.
2. the high frequency board manufacturing method according to different plate mixed pressures described in claim 1, it is characterised in that：In stepb, it is right
When high frequency plate is drilled, phenolic resin plate is laminated on high frequency plate two sides, and in the phenolic aldehyde being laminated in above high frequency plate
An aluminium flake is folded on resin plate again, Drilling operation is then carried out.
3. the high frequency board manufacturing method according to different plate mixed pressures described in claim 1, it is characterised in that：Carrying out step C
When, before pressing, below L4 layers of copper, from top to bottom stack gradually three-in-one fender, steel plate, brown paper；In L1 layers of copper
Top, stacks gradually aluminium flake, steel plate, brown paper, then pressed from the bottom to top.
4. the high frequency board manufacturing method according to different plate mixed pressures described in claim 3, it is characterised in that：The three-in-one buffering
Material in the middle of two mould release membrances folder one fender is overlapping is made.
5. the high frequency board manufacturing method according to different plate mixed pressures described in claim 3, it is characterised in that：In step C, enter
During row pressing, hot pressing is first carried out, then be cold-pressed；The hot pressing includes 9 sections of formulas, the corresponding pressing pressure of every section of formula according to
Secondary is 70psi, 200psi, 350psi, 420psi, 420psi, 420psi, 420psi, 240psi, 140psi, every section of formula pair
The pressing-in temp answered is followed successively by 120 DEG C, 140 DEG C, 160 DEG C, 180 DEG C, 220 DEG C, 220 DEG C, 220 DEG C, 180 DEG C, 140 DEG C, every section
The corresponding pressing time of formula is followed successively by 5min, 5min, 5min, 5min, 8min, 50min, 120min, 15min, 10min.
6. the high frequency board manufacturing method according to different plate mixed pressures described in claim 5, it is characterised in that：Carry out needing elder generation during hot pressing
Vacuumized, pumpdown time 3min reaches 50mBar.
7. the high frequency board manufacturing method according to different plate mixed pressures described in claim 5, it is characterised in that：The cold pressing is normal
Temperature is lower to be pressed, pressing time 1.5 hours.
8. the high frequency board manufacturing method according to different plate mixed pressures described in claim 1, it is characterised in that：The high frequency plate
For hydrocarbon tie-plate material or ceramic tie-plate material or hydrocarbon ceramic mixed stocker plate.
9. the high frequency board manufacturing method according to different plate mixed pressures described in claim 1, it is characterised in that：In step D, it is right
Before L1 layers of copper, L4 layers of copper are electroplated, a plasma removing glue is first carried out, then is carried out once or secondary levels chemistry removing glue, with
Ensure electroplating quality.
10. the high frequency board manufacturing method according to different plate mixed pressures described in claim 1, it is characterised in that：Also include step E,
Anti-welding, word, surface treatment, shaping, test, FQC, packaging are carried out after the completion of step D, high frequency panel products are made;Before anti-welding
Carry out super roughening or sandblasting to handle copper face, it is ensured that anti-welding adhesion.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710593847.9A CN107278062B (en) | 2017-07-20 | 2017-07-20 | A kind of high frequency board manufacturing method of difference plate mixed pressure |
| PCT/CN2017/094434 WO2019014956A1 (en) | 2017-07-20 | 2017-07-26 | Method for manufacturing high-frequency board by mixing and pressing different board materials |
| KR1020197010096A KR102175303B1 (en) | 2017-07-20 | 2017-07-26 | Method for manufacturing high frequency substrate in which different plate materials are mixed and compressed |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710593847.9A CN107278062B (en) | 2017-07-20 | 2017-07-20 | A kind of high frequency board manufacturing method of difference plate mixed pressure |
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| CN107278062A true CN107278062A (en) | 2017-10-20 |
| CN107278062B CN107278062B (en) | 2019-07-02 |
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| CN201710593847.9A Active CN107278062B (en) | 2017-07-20 | 2017-07-20 | A kind of high frequency board manufacturing method of difference plate mixed pressure |
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| Country | Link |
|---|---|
| KR (1) | KR102175303B1 (en) |
| CN (1) | CN107278062B (en) |
| WO (1) | WO2019014956A1 (en) |
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| CN115038260A (en) * | 2022-07-06 | 2022-09-09 | 诚亿电子（嘉兴）有限公司 | Method for manufacturing high-frequency PCB with asymmetric stacking design |
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| CN107896426A (en) * | 2017-10-20 | 2018-04-10 | 泰州市博泰电子有限公司 | A kind of preparation method for high-frequency high-speed PVD composite mixed pressure wiring boards |
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| CN109005645A (en) * | 2018-08-30 | 2018-12-14 | 广合科技（广州）有限公司 | A kind of production method of the double electric thick gold finger of PCB |
| CN110337201A (en) * | 2019-06-14 | 2019-10-15 | 珠海崇达电路技术有限公司 | A method of improving mixed-compression board pressing cavity |
| CN110337201B (en) * | 2019-06-14 | 2021-11-16 | 珠海崇达电路技术有限公司 | Method for improving mixed pressing plate pressing cavity |
| CN111132474A (en) * | 2019-12-27 | 2020-05-08 | 广东科翔电子科技股份有限公司 | High-frequency board and laminating method thereof |
| CN110831355A (en) * | 2020-01-13 | 2020-02-21 | 智恩电子(大亚湾)有限公司 | Preparation method of printed circuit board of 5G base station coupler |
| CN110831355B (en) * | 2020-01-13 | 2020-04-10 | 智恩电子(大亚湾)有限公司 | Preparation method of printed circuit board of 5G base station coupler |
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| CN111182732B (en) * | 2020-02-28 | 2023-01-10 | 四川锐宏电子科技有限公司 | High-frequency mixing and laminating process |
| CN112218433A (en) * | 2020-09-30 | 2021-01-12 | 生益电子股份有限公司 | Mixed-compression PCB (printed circuit board) glue removing process |
| CN112218433B (en) * | 2020-09-30 | 2021-10-26 | 生益电子股份有限公司 | Mixed-compression PCB (printed circuit board) glue removing process |
| CN112261791A (en) * | 2020-11-02 | 2021-01-22 | 生益电子股份有限公司 | Glue removing method for mixed-compression PCB |
| CN112261791B (en) * | 2020-11-02 | 2021-10-26 | 生益电子股份有限公司 | Glue removing method for mixed-compression PCB |
| CN114286542A (en) * | 2021-12-06 | 2022-04-05 | 龙南骏亚柔性智能科技有限公司 | Laminating method of OLED circuit board |
| WO2023184725A1 (en) * | 2022-03-30 | 2023-10-05 | 生益电子股份有限公司 | Printed circuit board and manufacturing method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190049817A (en) | 2019-05-09 |
| CN107278062B (en) | 2019-07-02 |
| WO2019014956A1 (en) | 2019-01-24 |
| KR102175303B1 (en) | 2020-11-06 |
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